Abstract: A chip component includes a substrate that has a first surface and a second surface on a side opposite to the first surface, a plurality of wall portions that are formed on a side of the first surface by using a part of the substrate, that have one end portion and one other end portion, and that are formed of a plurality of pillar units, a support portion that is formed around the wall portions by using a part of the substrate and that is connected to at least one of the end portion and the other end portion of the wall portions, and a capacitor portion formed by following a surface of the wall portion, in which each of the pillar units includes a central portion and three convex portions that extend from the central portion in three mutually different directions in a plan view and in which the wall portion is formed by a connection between the convex portions of the pillar units that adjoin each other.

Abstract: Systems, methods, techniques and apparatuses of a semiconductor control system are disclosed. One exemplary embodiment is a method for protecting a semiconductor switch comprising receiving a first voltage during a second blanking period following a first blanking period; determining whether a short circuit fault is occurring by comparing the first voltage to a fast detection threshold corresponding to a first value of a drain-source voltage of the semiconductor switch; if a short circuit is not occurring: receiving a second voltage after the second blanking period ends; determining whether a short circuit fault is occurring by comparing the second voltage to a slow detection threshold corresponding to a second value of the drain-source voltage; and if a short circuit fault is occurring, opening the semiconductor switch, wherein the first value of the drain-source voltage is greater than the second value of the drain-source voltage.

Abstract: A method for producing a film capacitor, the method including a sealing material supplying step of supplying a curable sealing material 30a to an element accommodating space 20a in which a film capacitor element 10 having a rolled body 12 is accommodated; and a curing step of curing the sealing material 30a in a state in which the rolled body 12 is embedded in the sealing material 30a, in which at the time of initiating the sealing material supplying step, the rolled body 12 is not fixed by the sealing material 30a, and in the sealing material supplying step, the sealing material 30a is supplied to the element accommodating space 20a without curing the sealing material 30a, from the beginning of the supply of the sealing material 30a to the element accommodating space 20a until the rolled body 12 is embedded in the sealing material 30a.

Abstract: The present invention is directed to a multilayer ceramic capacitor comprising a first external terminal disposed along a first end, a second external terminal disposed along a second end that is opposite the first end, and an active electrode region containing alternating dielectric layers and active electrode layers. At least one of the electrode layers comprises a first electrode and a second electrode. The first electrode is electrically connected with the first external terminal and has a first electrode arm comprising a main portion and a step portion. The main portion has a lateral edge extending from the first end of the multilayer capacitor and the step portion has a lateral edge offset from the lateral edge of the main portion. The second electrode is electrically connected with the second external terminal.

Abstract: A moisture-sensitive film formed from a resin composition and containing a polyimide resin component. The polyimide resin component comprises a fluorinated polyimide resin. The polyimide resin component comprises a phthalimide ring and a benzene ring different from a benzene ring included in the phthalimide ring. Based on a total amount of the polyimide resin component, the benzene ring different from the benzene ring included in the phthalimide ring has a mass fraction W (Be) and the phthalimide ring has a mass fraction W (PhI) satisfying the following formula: W (PhI)/W (Be)?1.2.

Abstract: A film capacitor including a first dielectric film, a second dielectric film, a first internal electrode, a second internal electrode, a first external electrode, and a second external electrode. The first internal electrode includes a first connection portion, a first main electrode portion contiguous with the first connection portion and thinner than the first connection portion, and a first thin film portion extending from the first main electrode portion and thinner than the first main electrode portion. The second internal electrode includes a second connection portion and a second main electrode portion contiguous with the second connection portion and thinner than the second connection portion. The first main electrode portion opposes the second main electrode portion with the first dielectric film interposed therebetween and does not oppose the second connection portion, and the first thin film portion opposes the second connection portion with the first dielectric film interposed therebetween.

Abstract: A multilayer electronic component includes: a body including first and second dielectric layers alternately disposed in a first direction; and external electrodes disposed on opposing end surfaces, respectively. A first internal electrode exposed to a first end surface and a first dummy pattern spaced apart from the first internal electrode and exposed to a second end surface are disposed on the first dielectric layer. A second internal electrode exposed to the second end surface and a second dummy pattern spaced apart from the second internal electrode and exposed to the first end surface are disposed on the second dielectric layer. The first and second internal electrodes include first and second main portions, respectively, and the first main portion and the second main portion are arranged in a staggered manner in a width direction.

Abstract: A wet capacitor is provided, and the use of an insulation fluid composition in such a capacitor. The capacitor includes a package of a metal foil and a polymeric insulating film, or of a metallized polymeric film, wherein the insulation composition includes a synthetic or natural aromatic oil and a polymer. The insulation composition is configured to undergo a thermo-reversible oil-to-gel transition at a predefined gel-point temperature. Further, methods of producing such wet capacitors are provided, optionally including additional filling materials, and methods of sealing leaks in such capacitors.

Abstract: Embodiments disclosed herein facilitates the monitoring of direct ultraviolet B (UVB) radiation exposure by a person via a system having a sensor (such as Lanthanum doped lead zirconate titanate (PLZT) thin-film sensors or other ferroelectric-based sensors) sensitive to UVB radiation. The system beneficially provides current real-time dosage information associated with Vitamin D production by the person as well as real-time indication of safe exposure and/or harmful exposure to current UVB radiation conditions while also, in some embodiments, takes into consideration a person's age, skin type and sensitivity, body surface area exposed.

Abstract: A winding-type capacitor package structure and a method of manufacturing the same are provided. The winding-type capacitor package structure includes a winding assembly, a package assembly, a conductive assembly, and a bottom carrier frame. The winding assembly includes a positive winding conductive foil and a negative winding conductive foil. The winding assembly is enclosed by the package assembly. The package assembly includes a casing structure and a filling body received inside the casing structure. The casing structure has an inner rough surface. The bottom carrier frame is disposed on a bottom portion of the casing structure. The filling body includes a plurality of layered structures, and each of the layered structure is connected between the winding assembly and the casing structure. Therefore, the filling body including the layered structures can be limited inside the casing structure through friction force provided by the inner rough surface.

Abstract: Apparatuses and methods for arranging compensation capacitors are described. An example apparatus includes: a first conductive layer including a portion; a second conductive layer: a contact coupled to the portion of the first conductive layer; a third conductive layer between the first conductive layer and the second conductive layer, coupled to the contact; one or more capacitor elements wherein each capacitor element of the one or more capacitor elements includes one end coupled to the second conductive layer and another end coupled to the third conductive layer.

Abstract: A winding capacitor package structure and a method of manufactured the same are provided. The winding capacitor package structure includes a winding assembly, a package assembly, a conductive assembly, and a bottom carrier frame. The winding assembly includes a winding positive foil and a winding negative foil. The winding assembly is enclosed by the package assembly. The package assembly includes a casing structure and a filling body received inside the casing structure. The casing structure includes a main casing for enclosing the filling body and a retaining body inwardly bent from a bottom side of the main casing. The filling body includes a plurality of layered structures, and each of the layered structure is connected between the winding assembly and the casing structure. Therefore, the filling body including the layered structures can be retained and limited inside the casing structure through the retaining body.

Abstract: A multilayer ceramic electronic component includes a multilayer body and an external electrode on each of both end surfaces of the multilayer body. The external electrode includes an underlying electrode layer and a plating layer that is disposed on the underlying electrode layer. The underlying electrode layer includes Ni as a first metal component, Sn as a second metal component, and a ceramic material, and includes an alloy portion that is provided around the ceramic material and includes an alloyed Ni defining the first metal component and an alloyed Sn defining the second metal component.

Abstract: A multilayer ceramic capacitor includes: a multilayer structure in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, the plurality of internal electrode layers being alternately exposed to a first edge face and a second edge face of the multilayer structure, wherein: a concentration of Mo with respect to a main component ceramic of an end margin region and a side margin region is lower than a concentration of Mo with respect to a main component ceramic of the dielectric layers in the multilayer structure.

Abstract: A multi-layer ceramic electronic component includes a ceramic body and an external electrode, the ceramic body including a protective portion and a functional portion, the protective portion including an end surface facing in a first direction, circumferential surfaces connected to the end surface and extending in the first direction, and a ridge that includes a recess extending along the first direction and connects the circumferential surfaces, the functional portion being disposed inside the protective portion, the external electrode including a base film covering the end surface, an intermediate film formed on the base film, and a surface film formed on the intermediate film, the base film including a first covering portion formed on the end surface, second covering portions formed on the circumferential surfaces, and a third covering portion formed on the recess and spaced apart from at least one second covering portion, the intermediate film continuously covering the first, second, and third covering po

Abstract: A multilayer ceramic capacitor includes a laminate and an external electrode. The laminate includes a central layer portion in which first and second internal electrode layers are alternately laminated with a dielectric ceramic layer therebetween, a peripheral layer portion sandwiching the central layer portion in a lamination direction, and a side margin sandwiching the central layer portion and the peripheral layer portion in a width direction. When viewing the laminate and the first external electrode through a cross-section parallel to the width direction and the lamination direction at a central portion in a length direction of the first external electrode, W1>R1 is satisfied and T1>R1 is satisfied.

Abstract: A method for manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet, forming a plurality of internal electrode patterns on a main surface of the ceramic green sheet, applying a ceramic paste above the main surface of the ceramic green sheet, stacking a plurality of the ceramic green sheets, pressing the plurality of stacked ceramic green sheets, and cutting the plurality of pressed ceramic green sheets. The ceramic paste at least partially overlaps end portions of the internal electrode patterns, and a stepped region is provided on the ceramic green sheet. When cutting the ceramic green sheets in a first direction, the cutting is performed at a position of the stepped region between two of the internal electrode patterns adjacent to each other in a second direction.

Abstract: A multilayer capacitor includes a body including a multilayer structure in which a plurality of dielectric layers are provided and a plurality of internal electrodes are stacked with the dielectric layer interposed therebetween and external electrodes disposed outside the body and connected to the plurality of internal electrodes. The body includes a high resistance portion disposed in at least one region between the dielectric layer and the internal electrode and inside the dielectric layer and having electric resistance higher than electric resistance of the internal electrode, and the high resistance portion and the plurality of internal electrodes include the same metal component and the same metal oxide component.

Abstract: A method for making a three-dimensional (3-D) module includes the steps of: A) forming a laminate of alternate ceramic tape layers and internal electrode layers on a substrate; B) etching said laminate to form first and second capacitor stacks at said first and second locations; C) firing said first and second capacitor stacks integrally; D) forming first and second pairs of external electrodes on said first and second capacitor stacks, respectively.

Abstract: A thermistor has a thermistor element, a protective film, and an electrode portion. The protective film is formed of a SiO2 film having a film thickness in a range of 50 nm or more and 1000 nm or less. The protective film is formed in contact with the thermistor element. Alkali metal is unevenly distributed in a region including an interface between the thermistor element and the protective film.

Abstract: A multilayer ceramic electronic component includes a multilayer body including two major surfaces opposite to each other in a layer stacking direction, two side surfaces opposite to each other in a widthwise direction orthogonal or substantially orthogonal to the layer stacking direction, and two end surfaces opposite to each other in a lengthwise direction orthogonal or substantially orthogonal to the layer stacking direction and the widthwise direction, and external electrodes provided on the two end surfaces. A method for manufacturing the multilayer ceramic capacitor component includes preparing a plurality of multilayer bodies, stacking the plurality of multilayer bodies via a binder, rotating the plurality of multilayer bodies by about 90° with the lengthwise direction defining and functioning as an axis of rotation, and providing a side gap portion; and removing the binder from the multilayer body provided with the side gap portion.

Abstract: A multilayer ceramic capacitor includes a multilayer body in which dielectric layers are layered, first internal electrode layers extending to opposing end surfaces of the multilayer body, second internal electrode layers extending to opposing side surfaces of the multilayer body, first and second external electrodes connected to the first internal electrode layers and provided on the respective opposing end surfaces, and third and fourth external electrodes connected to the second internal electrode layers and provided on the respective opposing side surfaces. A number of the first internal electrode layers is larger than a number of the second internal electrode layers, at least two first internal electrode layers are successively layered, and a thickness of the second internal electrode layers is larger than a thickness of the first internal electrode layers.

Abstract: A ceramic electronic component includes a body, including a dielectric layer and an internal electrode. The dielectric layer includes a plurality of dielectric grains, and at least one of the plurality of dielectric grains has a core-dual shell structure having a core and a dual shell. The dual shell includes a first shell, surrounding at least a portion of the core, and a second shell, surrounding at least a portion of the first shell. The dual shell includes different types of rare earth elements R1 and R2, and R2S1/R1S1 is 0.01 or less and R2S2/R1S1 is 0.5 to 3.0, where R1S1 and R1S2 denote concentrations of R1 included in the first shell and the second shell, respectively, and R2S1 and R2S2 denote concentrations of R2 included in the first shell and the second shell, respectively.

Abstract: The present invention provides a leadless stacked ceramic capacitor. the capacitor body are respectively provided with internal electrode terminals. The part forms an electrical connection with the external electrodes, and a plurality of multilayer ceramic capacitors are vertically stacked, and the two adjacent external electrodes are cured to form an adhesive interface by polymer conductive adhesive, and the polymer conductive adhesive includes 75%˜85% metal powder and 15%˜25% viscose provide support strength and conductive channels.

Abstract: A method of producing a multi-layer ceramic electronic component includes: producing a multi-layer unit including ceramic layers that are laminated in a first direction, internal electrodes that are disposed between the ceramic layers, and a side surface that faces in a second direction orthogonal to the first direction, the internal electrodes being exposed on the side surface; sintering the multi-layer unit; and forming a side margin on the side surface of the sintered multi-layer unit.

Abstract: The present invention provides a dielectric composition having high relative permittivity and insulation resistance at high temperature. The dielectric composition includes a main component expressed by a compositional formula (Sr1-x, Cax)m(Ti1-yHfy)O3-?N?, in which 0<x?0.15, 0<y?0.15, 0.90?m?1.15, and 0<??0.05 are satisfied.

Abstract: A multilayer ceramic capacitor includes a capacitive element including a ceramic layer, a first internal electrode layer, and a second internal electrode layer, the capacitive element including a first and second principal surfaces, first and second side surfaces, and first and second end surfaces. The first and second internal electrode layers respectively extend to the first and second end surfaces, at least a portion of each of the first and second end surfaces are covered with a conductor layer, a portion of the conductor layer is covered with an insulating portion, at least a portion of the conductor layer and at least a portion of the insulating portion are covered with the underlayer external electrode layer when viewed from the first end surface and the second end surface, and at least a portion of the underlayer external electrode layer is covered with a plating layer.

Abstract: A multilayer capacitor includes a body including a plurality of dielectric layers, an active region and upper and lower cover regions; first and second internal electrodes disposed with the dielectric layer interposed therebetween in the active region to be alternately exposed through both end surfaces of the body; and first and second external electrodes disposed on both ends of the body and connected to the first and second internal electrodes, respectively. The body further includes a buffer layer including first and second dummy electrodes disposed on a lower surface of the lower cover region to be spaced apart from each other in a length direction of the body, and a groove is recessed in a lower surface of the buffer layer.

Abstract: A multilayer ceramic electronic component includes a ceramic body having a capacitance forming portion in which first and second internal electrodes are alternately laminated with respective dielectric layers interposed therebetween, and first and second external electrodes respectively disposed on surfaces of the ceramic body. The first and second internal electrodes are respectively exposed to surfaces of the ceramic body, and first and second protrusions, each including a carbon compound, are respectively disposed on end portions of the first and second internal electrodes exposed to the surfaces of the ceramic body.

Abstract: A multilayer ceramic electronic component includes a multilayer body, and an external electrode layer including a foundation electrode layer which is a fired layer. The multilayer body includes an inner layer portion including ceramic layers and inner conductive layers, and outer layer portions each including the ceramic layers. The foundation electrode layer includes an inner layer electrode portion adjacent to the inner layer portion and outer layer electrode portions respectively adjacent to the outer layer portions. The outer layer electrode portions respectively include high-content regions and low-content regions in order from an end surface of the multilayer body. The content of metal in the high-content regions is higher than the content of metal in the low-content regions.

Abstract: An electronic module includes a module substrate has an upper surface and a lower surface. The module substrate has a package pad array having package contact pads at the upper surface. The module substrate has a socket pad array having socket contact pads at the upper surface. The module substrate has guide pin locating pads associated with the socket pad array. The electronic module has an electronic package coupled to the package contact pads at the package pad array. The electronic module has guide pins surface mounted to the guide pin locating pads. The electronic module has a socket assembly coupled to the module substrate. The socket assembly has a socket housing holding socket contacts. The socket contacts are coupled to the socket contact pads at the socket pad array. The socket frame including pockets receiving the guide pins to locate the socket assembly relative to the module substrate.

Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes having different sizes to each other, and having first and second surfaces of the first and second internal electrodes, opposing each other in a stacking direction, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces and connected to the third and fourth surfaces, and opposing each other; and first and second external electrodes.

Abstract: A multilayer electronic component includes a body in which internal electrodes including Ni and Sn and dielectric layers are alternately disposed, and external electrodes disposed on a surface of the body, connected to the internal electrodes, and including Cu and Sn, wherein the internal electrodes include an alloy including Ni, Cu, and Sn in a region in contact with the external electrodes, and Sn in an amount that satisfies the following formula: 1<C2/C1<13.5 in which C1 is the content of Sn of the internal electrodes at a central portion of the body and C2 is the content of Sn of the internal electrodes at a point 2 ?m away from a point at which the internal electrode and the external electrode are in contact with each other in an inward direction of the body.

Abstract: A non-contact fiber permeability measurement system includes a mold device, a fluid supplying device, a capacitance detecting device and a permeability converting device. The mold device includes an upper plate, a lower plate and a fluid inlet. The lower plate is parallel to and disposed below the upper plate for forming an accommodating space disposing a measured fibrous fabric insulated against the upper plate and the lower plate. The fluid inlet is disposed through the upper plate. The fluid supplying device is connected to the mold device and for providing a fluid perfused from the fluid inlet into the accommodating space. The capacitance detecting device is electrically connected to the upper plate and the lower plate. The permeability converting device is electrically connected to the capacitance detecting device and for receiving the capacitance detected via the capacitance detecting device to convert the capacitance to a permeability.

Abstract: An electronic component includes an electronic component main body having a mounting surface with first and second baked electrodes located thereon at locations spaced apart from one another. A recess extends into the electronic component main body in the area between the first and second baked electrodes. The recess extends over at least a part of at least one of the first and second baked electrodes.

Abstract: A capacitive digital isolator circuit includes: a signal emitting module; a signal receiving module; and a capacitive isolation module. The signal emitting module includes an edge Pulse-Coding modulator circuit, which modulates an input signal to generate a pair of differential modulated signals based on the input signal and transmits the pair of differential modulated signals to the signal receiving module. Each of the pair of differential modulated signals has twelve high-frequency pulses when the input signal has a rising edge and has six high-frequency pulses when the input signal has a falling edge. The signal receiving module includes an ultra-low power consumption high-speed comparator, a timer and a pulse counter. An output signal of the pulse counter has a rising edge when the pulse number of the comparator output signal is larger than nine and a falling edge when the pulse number is equal to or smaller than nine.

Abstract: A hot swap battery module uses a smart chip and an ideal diode controller to control a power transistor so as to implement a multi-step charge or discharge. Consequently, battery modules which have different voltages or battery capacities can be immediately connected in parallel. When the hot swap battery module is hot swapped, the hot swap battery module also can avoid an excessive charge current or discharge current to damage itself.

Abstract: A Ti—Zr alloy in powder form is described. Sintered pellets containing the Ti—Zr alloy powder of the present invention, as well as capacitor anodes, are further described.

Abstract: The present invention is directed to an EMI feedthrough filter terminal assembly. The EMI feedthrough filter terminal assembly comprises: a feedthrough filter capacitor having a plurality of first electrode layers and a plurality of second electrode layers, a first passageway therethrough having a first termination surface conductively coupling the plurality of first electrode layers, a second termination surface conductively coupling the plurality of second electrode layers; a feedthrough ferrule conductively coupled to the feedthrough filter capacitor via the second termination surface; at least one conductive terminal pin extending through the passageway in conductive relation with the plurality of first electrode layers; an insulator fixed to the feedthrough ferrule for conductively isolating the conductive terminal pin from the feedthrough ferrule; and a laminated insulative layer between the insulator and the feedthrough filter capacitor.

Abstract: A pressure sensor device in a pressure sensor module includes a membrane that is conductive and deformable under pressure, fixed electrodes each including an electrode surface opposed to the membrane, and a dielectric film disposed on the electrode surface of each of the fixed electrodes. The fixed electrodes are disposed in a direction from the center of the membrane toward an outer portion.

Abstract: A method for equipping a film material with at least one electrically conductive conductor structure, wherein a dispersion containing metallic nanoparticles in the form of a conductor structure is applied to a thermostable transfer material and the metallic nanoparticles are sintered to form an electrically conductive conductor structure. The electrically conductive conductor structure of sintered metallic nanoparticles is then transferred from the thermostable transfer material to the non-thermostable film material. A method for producing a laminate material using the film material using at least one electrically conductive conductor structure, and to the corresponding film material and laminate material are described.

Abstract: A multilayer ceramic electronic component includes a ceramic body including pluralities of first and second internal electrodes alternately disposed to face each other with respective dielectric layers interposed therebetween. First and second external electrodes are disposed on external surfaces of the ceramic body and are respectively electrically connected to the first and second external electrodes. A first dummy electrode is disposed in a margin portion of the ceramic body adjacent the first internal electrode in a third direction, and a second dummy electrode is disposed in a margin portion of the ceramic body adjacent the second internal electrode in the third direction. A distance (Ld) between the first and second dummy electrodes in a second direction, and a length (Lm) of each margin portion between one of the first and second internal electrodes and an external surface of the ceramic body in the second direction, satisfy Ld?Lm.

Abstract: The present invention relates to a method for cancelling effects of changes in interconnection capacitances on capacitive sensor readings, and an apparatus configure to perform such method. The sensor readings are provided by a capacitive sensor connected with an interface circuitry. The interface circuitry has at least two interconnections comprising a sensor interconnection and a compensating interconnection. The method comprises obtaining a total sensor capacitance value from the capacitive sensor, and obtaining a total compensating interconnection capacitance value from the compensating interconnection, calculating a compensated sensor capacitance value by reducing the obtained total compensating interconnection capacitance value multiplied with a weight coefficient from the obtained total sensor capacitance value and providing at an output of the interface circuitry an electrical signal corresponding to the compensated sensor capacitance value.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and a plurality of internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween; and an external electrode, wherein the ceramic body comprises an active portion including a plurality of internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween to form capacitance and a cover portion formed in upper and lower portions of the active portion, wherein a plurality of internal electrodes in the upper region and the lower region of the active portion is disposed inwardly of an outer side surface of the ceramic body to be spaced apart by a predetermined distance from the body portion, and the plurality of internal electrodes in the central region of the active portion and the internal electrodes having the same polarities are connected to each other via vias.

Abstract: In a stepwise structure formed in a multilayer coil component, a difference occurs in a shrinkage amount between a maximum film thickness portion in which the number of layers is large and a minimum film thickness portion in which the number of layers is small due to portions different in the number of layers of coil parts (that is, upper coil part, lower coil part, and connecting part) adjacent to each other like the maximum film thickness portion and the minimum film thickness portion, readily causing a crack by an inner stress due to the difference in the shrinkage amount. In a multilayer coil component according to the present disclosure, a stress relaxation part overlapping with a maximum film thickness portion whose shrinkage amount is large is provided to relax inner stress in a stepwise structure, resulting in prevention of a crack.

Abstract: A method of manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet containing a ceramic powder and forming an internal electrode pattern on the ceramic green sheet using a conductive paste containing conductive metal particles and an additive. A ceramic laminate is formed by stacking the ceramic green sheets on which the internal electrode pattern is formed. A ceramic body including dielectric layers and internal electrodes is formed by sintering the ceramic laminate. An average number of conductive metal particles in the internal electrode pattern in a thickness direction is more than 2 and 5 or less.

Abstract: A multilayer capacitor includes a capacitor body including first and sixth surfaces; including an active region including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with the dielectric layers interposed therebetween, and cover regions disposed on an upper surface and a lower surface of the active region; and having one end of each of the first and second internal electrodes exposed through the third and fourth surfaces, respectively; and first and second external electrodes respectively disposed on the third and fourth surfaces of the capacitor body. Each of the cover regions has a plurality of holes.

Abstract: A winder includes a winding mechanism, a chamber housing the winding mechanism, at least one vacuum pump, and a product case. The winding mechanism is configured to wind a belt-shaped raw film around a winding core. The belt-shaped raw film is composed of a plurality of electrodes and a plurality of separating films. The at least one vacuum pump is configured to suck air into the chamber. The product case is configured to house a plurality of winding products each formed by winding the raw film with use of the winding mechanism disposed in the chamber.

Abstract: A multilayer electronic component includes: a capacitor body having first to sixth surfaces, and including first and second internal; first and second external electrodes including first and second connection portions and first and second band portions; and a connection terminal including first and second land portions disposed on the first and second band portions, respectively, and having first and second cut-out portions, respectively. First and second solder accommodating portions are provided by the first and second cut-out portions in lower portions of the first and second band portions, respectively, and, 0.2?SA1/BW1?0.5 and 0.2?SA2/BW2?0.5 which in BW1 is an area of the first band portion, SA1 is an area of the first solder accommodating portion, BW2 is an area of the second band portion, and SA2 is an area of the second solder accommodating portion.

Abstract: A ceramic multi-layer component and a method for producing a ceramic multi-layer component are disclosed. In an embodiment a ceramic multi-layer component includes a stack with ceramic layers and electrode layers arranged between them, wherein the ceramic layers and the electrode layers are arranged above one another along a stacking direction, wherein at least one first electrode layer extends along a first main extension direction from a first end region to a second end region of the first electrode layer, and wherein the at least one first electrode layer has a current-carrying capacity that decreases along the first main extension direction.