Obtaining Plural Product Pieces From Unitary Workpiece Patents (Class 29/412)
-
Patent number: 7065867Abstract: A hermetic sealing method, which is capable of preventing oxidation of a micro-electromechanical system (MEMS) and sealing the MEMS at a low temperature. A low temperature hermetic sealing method having a passivation layer includes depositing a junction layer, a wetting layer, and a solder layer on a prepared lid frame, depositing a first protection layer for preventing oxidation on the solder layer and forming a lid, preparing a package base on which a device is disposed, and in which a metal layer and a second protection layer are formed around the device, and assembling the lid and the package base, heating, and sealing them. The protection layer is laminated on the solder layer that is formed by the lid, thereby preventing oxidation without using a flux. The low temperature hermetic sealing method having a passivation layer is suitable for sealing a device, such as the MEMS, which is sensitive to heat, water and other by-products.Type: GrantFiled: November 14, 2002Date of Patent: June 27, 2006Assignee: Samsung Electronics Co., Ltd.Inventors: Woon-bae Kim, Hyung-jae Shin, Chang-ho Cho, Seung-goo Kang
-
Patent number: 7055231Abstract: A shutter manufacturing method provides a coated manufactured wood substrate sheet. A plurality of attached shutter components are identified. The attached shutter components are configured edge-to-edge and end-to-end so as to comprise the substrate sheet. The attached shutter components are separated into a plurality of prefinished shutter components, and the prefinished shutter components are incorporated into a shutter assembly.Type: GrantFiled: July 17, 2003Date of Patent: June 6, 2006Inventor: David Blachley
-
Patent number: 7036200Abstract: A separate shaped backing piece is fabricated for each section of the design, and a piece of fabric (or other flexible material) appropriate for that section is placed over the front of the piece and wraps around its borders. The backing pieces are cut or otherwise formed from a relatively stiff material such as a sheet of cardboard or plastic. A piece of fabric is preferably stretched over each stiff backing piece and the edges of the fabric are preferably secured to its rear, although in other embodiments the fabric may be loosely draped in folds or pleats, and/or a layer of padding may be placed between the fabric and the backing to provide a softer, three-dimensional effect. The otherwise visible front face of the backing piece is completely covered by the fabric, with no visible seams. The individual fabric-covered backing pieces may then assembled into the desired design. A computer may be used to assist in the selection and fabrication of the various design elements.Type: GrantFiled: October 4, 2002Date of Patent: May 2, 2006Inventor: Anastazja Fabrige
-
Patent number: 7036205Abstract: A plurality of motors are assembled. A plurality of part-sized stators are provided. Each of the part-sized stators is a split portion of a full-sized stator which has been previously split. The full-sized stator includes a printed circuit board with a plurality of coils. Each part-sized stator is inserted into a respective motor.Type: GrantFiled: February 25, 2003Date of Patent: May 2, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shinji Fukushima, Kazuei Yagi
-
Patent number: 7025054Abstract: A method of cutting a rare-earth alloy with a wire saw, obtained by fixing abrasive grains on a core wire with a resin layer, includes the step of moving the wire saw while a portion of the rare-earth alloy being machined with the wire saw is immersed in a coolant, which is mainly composed of water and has a surface tension of about 25 mN/m to about 60 mN/m at about 25° C., thereby cutting the rare-earth alloy. In the wire saw, an average distance between two of the abrasive grains, which are adjacent to each other in a length direction, is about 150% to less than about 400% of the average grain size of the abrasive grains, an average height of portions of the abrasive grains, protruding from the surface of the resin layer, is about 70% or less of the average grain size of the abrasive grains, and a thickness deviation percentage of the resin layer with respect to the core wire is about 40%.Type: GrantFiled: February 26, 2003Date of Patent: April 11, 2006Assignee: Neomax Co., Ltd.Inventors: Sadahiko Kondo, Akira Miyachi, Hazime Ishida
-
Patent number: 7020941Abstract: A method for manufacturing a multilayer ceramic capacitor includes the steps of forming a ceramic slurry, forming ceramic green sheets from the ceramic slurry, printing internal electrode patterns on the ceramic green sheets, generating a laminated body by stacking the ceramic green sheets provided with the internal electrode patterns printed thereon, dicing the laminated body to thereby form chip-shaped ceramic bodies and sintering the chip-shaped ceramic bodies. The ceramic slurry includes a glass component containing one or more additive elements selected from the group consisting of Mn, V, Cr, Mo, Fe, Ni, Cu and Co.Type: GrantFiled: November 6, 2003Date of Patent: April 4, 2006Assignee: Taiyo Yuden Co., Ltd.Inventors: Hirokazu Chazono, Hisamitsu Shizuno, Hiroshi Kishi
-
Patent number: 6978545Abstract: A vehicle frame assembly includes a first vehicle frame component that is formed by deforming a closed channel structural member to have a relatively small end portion and a relatively large end portion. A member is provided having first and second ends. The relatively large end portion of the closed channel structural member is secured to the first end portion of the member to form the first vehicle frame component. A plurality of second vehicle frame components are provided. The first vehicle frame component and the plurality of second vehicle frame components are secured together to form the vehicle frame assembly.Type: GrantFiled: January 27, 2004Date of Patent: December 27, 2005Assignee: Dana CorporationInventor: Richard A. Marando
-
Patent number: 6968616Abstract: A nozzle plate is manufactured by providing a material plate and a punch. The material plate is punched by the punch to form a provisional nozzle orifice hole on the material plate. The punching is repeated such that the provisional holes formed by a given punch are arranged in line. A bulged portion which is bulged on a back side of the material plate is removed to form the completed nozzle orifice.Type: GrantFiled: December 2, 2002Date of Patent: November 29, 2005Assignee: Seiko Epson CorporationInventors: Takashi Nakamura, Nagamitsu Takashima, Tatsuo Furuta
-
Patent number: 6968603Abstract: A piezoelectric/electrostrictive device includes a pair of mutually opposing thin plate sections, a movable section, and a fixing section for supporting the thin plate sections and the movable section. Piezoelectric/electrostrictive elements are arranged on at least one thin plate section of the pair of thin plate sections. A hole is formed by both inner walls of the pair of thin plate sections, an inner wall of the movable section, and an inner wall of the fixing section. The piezoelectric/electrostrictive device further includes at least one beam section extending from the inner wall of the movable section to the inner wall of the fixing section.Type: GrantFiled: April 15, 2002Date of Patent: November 29, 2005Assignee: NGK Insulators, Ltd.Inventors: Yukihisa Takeuchi, Tsutomu Nanataki, Koji Kimura
-
Patent number: 6957486Abstract: In order to provide a device for the production of gasket layers for single or multiple layered gaskets from one respective gasket layer section of a starting material comprising several continuous gasket layer sections, comprising a follow-on combination tool with several machining stations which follow one another along a direction of feed and in which the gasket layer sections are machined during operating cycles, wherein at least one of the machining stations is designed as a station for cutting outer contour lines, in which facing outer contour lines of two adjacent gasket layers are cut by means of a tool for cutting outer contour lines, and a feeding device, by means of which the gasket layer sections are moved further along the direction of feed by a feed distance v between two operating cycles, with which the outer contour lines of the gasket layers are cut with less resources and the starting material can be better utilized it is suggested that the tool for cutting outer contour lines be designed suType: GrantFiled: June 26, 2001Date of Patent: October 25, 2005Assignee: Elring Klinger AGInventor: Wolfgang Fritz
-
Patent number: 6928711Abstract: Organizational system for compact spaces. A sheet version has pre-perforations formed thereon, for allowing different sized walls and/or floors to be separated therefrom. The sheet can have side indentations along its edges. Corner connectors can be originally supplied where individual connectors each have four prong prongs/tabs of flat triangular shapes arranged approximately ninety degrees from one another in a cross-shape. Walls/floors can be attached to one another by inserting the prongs/tabs into the side indentations of other walls/floors. The prongs/tabs can separated from the others depending on whether an installer wishes to use a connector to attach two walls/floors together, three walls/floors together or four walls/floors together. Floor panels can be used for the walls. The system can make customized compartments for drawers, under-the-counter spaces, shelves, storage boxes/containers for clothing, tools, various accessories, and the like, having various heights, lengths, widths and sizes.Type: GrantFiled: December 16, 2002Date of Patent: August 16, 2005Inventor: Susan Sunka
-
Patent number: 6922879Abstract: An acceleration sensor includes a piezoelectric element and support frames for supporting the ends of the piezoelectric element in the longitudinal direction. The piezoelectric element is formed by stacking an even number of piezoelectric layers greater than or equal to four layers. Electrodes are provided in between the layers and on the front and back faces of the piezoelectric element. The interlayer electrodes including a segmented electrode and lead electrodes are alternately stacked with the piezoelectric layers therebetween. The interlayer electrode in the middle in the thickness direction is a segmented electrode. The piezoelectric layers are polarized in the thickness direction so that charge having the same polarity is extracted from the electrodes when the acceleration is applied. Also, the center portion and both end portions of each piezoelectric layer are polarized in opposite directions.Type: GrantFiled: October 27, 2003Date of Patent: August 2, 2005Assignee: Murata Manufacturing Co., Ltd.Inventor: Mitsugu Ogiura
-
Patent number: 6915547Abstract: A piezoelectric/electrostrictive (P/E) device includes at least one actuator section secured to thin plate sections with an adhesive. The actuator section includes a multilayered member including at least three actuator films, each of which include a P/E layer and electrode films. One or more holes or recesses are formed in portions of the thin plate sections on which the P/E elements are formed. The electrode films contact upper and lower surfaces of respective P/E layers and alternately extend to opposite surfaces thereof. End surface electrodes electrically connect an electrode film that contacts one of the P/E layers and an electrode film that contacts another one of the P/E layers. The end surface electrodes are electrically connected to terminals which are provided on a surface of an outermost layer of the P/E layers, and which are separated from one another by a predetermined distance.Type: GrantFiled: August 1, 2002Date of Patent: July 12, 2005Assignee: NGK Insulators, Ltd.Inventors: Yukihisa Takeuchi, Kazuyoshi Shibata, Masahiko Namerikawa
-
Patent number: 6912761Abstract: A method of producing a piezoeIectric resonator includes the steps of forming first to third internal electrodes by printing an electrically conductive paste onto a green sheet, punching out portions of the green sheet having the first to third internal electrodes formed thereon, so that at least three types of green sheets are punched out with a location of the internal electrode serving as a reference location, in which the first sheet is punched out by shifting a punching location by a first shift amount in a first direction with respect to the reference location, the second sheet is punched out by shifting a punching location by the first shift amount in a direction opposite to the first direction, and the third sheet is punched out at the reference location, forming a layered body by stacking the punched out green sheets, and forming a unit by cutting the layered body.Type: GrantFiled: October 12, 2002Date of Patent: July 5, 2005Assignee: Murata Manufacturing Co., Ltd.Inventors: Toshiyuki Yasugi, Yuji Fujino, Shoichi Kawabata, Mamoru Ogawa
-
Patent number: 6907656Abstract: A method for manufacturing thermal heads comprises providing a substrate having a first surface, a second surface opposite the first surface, heaters disposed on the first surface, and pairs of electrodes disposed on the first surface, the electrodes of each pair of electrodes being disposed in spaced-apart, confronting relation to each other. A driver IC is mounted on each of the electrodes. The driver ICs are then encapsulated with a resin. Grooves are formed in at least one of the first surface and the second surface of the substrate so that the electrodes of each pair of electrodes are disposed symmetrically with respect to one of the grooves. The substrate is then cut along the grooves to form individual thermal heads each having a heater, at least one of the driver ICs for providing a drive signal to drive the heater, and a sealing element formed by the resin for protecting the driver IC.Type: GrantFiled: January 14, 2000Date of Patent: June 21, 2005Assignee: Seiko Instruments Inc.Inventors: Yoshiaki Saita, Osamu Takizawa
-
Patent number: 6901654Abstract: Improved coils and clamps for variable reluctance sensors are disclosed. A method of fabricating a discrete coil involves providing a conductor wound in a coil on a tube. The coil has a coil outer surface that has insulation. A window is opened in the insulation on the coil outer surface to expose conductor of the coil for a contact. A movable core is provided within the tube for adjusting inductance of the coil. In one embodiment, the coil and tube are diced into small coils after the windows for each coil are opened. Another aspect the invention is a clamp comprising an elastic material, a shape memory alloy, and an apparatus for activating the shape memory alloy. The clamp holds the moveable core in its peak position. When the alloy is activated it changes shape and provides a force on the elastic material to change clamping state for resetting the transducer. The coils and clamps can be used for a variety of purposes in addition to the variable reluctance sensors.Type: GrantFiled: January 10, 2001Date of Patent: June 7, 2005Assignee: Microstrain, Inc.Inventors: Steven W. Arms, Michael J Hamel, Steven Ward Mundell, Christophor Pruyn Townsend
-
Patent number: 6898834Abstract: A method of reclaiming non-wine affected oak wood from a stave removed from a wine barrel or cask. The wine affected wood is removed as by sawing, the remaining non-wine affected wood is sawn into battens, dressed, straightened and toasted. The reclaimed oak battens can then be immersed in wine.Type: GrantFiled: March 3, 2003Date of Patent: May 31, 2005Assignee: Westbridge Pty LtdInventor: Peter Warren
-
Patent number: 6898831Abstract: A surface acoustic wave device includes interdigital transducer (IDT) electrode and reflectors disposed on a piezoelectric substrate. Each of the IDT electrode and the reflectors has a multi-layer film structure including at least one layer (high specific gravity metal component containing layer) including as a major component a metal with a specific gravity of at least about 15 and having a film-thickness of at least about 10 nm, and at least one layer (low specific gravity metal component containing layer) including as a major component a metal with a specific gravity of up to about 10 and a volume resistivity as a bulk value (at about 20° C.) of up to about 10×10?8 ?·m, and having a film-thickness of at least about 10 nm.Type: GrantFiled: September 6, 2002Date of Patent: May 31, 2005Assignee: Murata Manufacturing Co., Ltd.Inventor: Takashi Iwamoto
-
Patent number: 6892432Abstract: A method for manufacturing a nanotube cartridge including the steps of: adhering numerous nanotubes to a surface of a holder, disposing a knife edge at an inclination to the surface of the holder so that the knife edge is raised with its tip end being in contact with the surface of the holder, and collecting the nanotubes to near the tip end of the knife edge by moving the knife edge in a direction opposite from the tip end with the tip end being kept in contact with the surface, thus allowing the nanotubes to be arranged on the tip end of the knife edge with the nanotubes protruding from the tip end. When adhering the nanotubes to the holder surface, nanotubes are merely put in a vessel, the holder is placed in the vessel, and then the vessel is vibrated.Type: GrantFiled: December 7, 2001Date of Patent: May 17, 2005Assignees: Daiken Chemical Co., Ltd.Inventors: Yoshikazu Nakayama, Seiji Akita, Takayoshi Kishida, Akio Harada
-
Patent number: 6886247Abstract: Methods to singulate circuit forming regions of a circuit board substrate assembly includes providing a plurality of circuit forming regions including at least one pair of adjacent circuit forming regions separated by at least one opening defined in substrate material between each pair of adjacent circuit forming regions. At least a portion of interconnection regions along singulation axes are removed to singulate the circuit forming regions.Type: GrantFiled: December 2, 2003Date of Patent: May 3, 2005Assignee: Micron Technology, Inc.Inventors: Zane Drussel, Derek Hinkle
-
Patent number: 6886232Abstract: In a method for producing wiper arm and a wiper arm produced by the method a tongue for a rotary angle limiting is punched on a hinge part and correlates with a recess in the hinge part.Type: GrantFiled: December 19, 2001Date of Patent: May 3, 2005Assignee: Robert Bosch GmbHInventor: Peter Kessler
-
Patent number: 6883215Abstract: A piezoelectric/electrostrictive device includes a pair of mutually opposing thin plate sections, a movable section, and a fixation section for supporting the thin plate sections and the movable section. One or more piezoelectric/electrostrictive elements are arranged on the pair of thin plate sections. A hole is formed by both inner walls of the pair of thin plate sections, an inner wall of the movable section, and an inner wall of the fixation section. At least one thin plate section of the pair of thin plate sections is previously bent in a direction to make mutual approach so that it has an inwardly convex configuration to the hole.Type: GrantFiled: November 5, 2003Date of Patent: April 26, 2005Assignee: NGK Insulators, Ltd.Inventors: Yukihisa Takeuchi, Tsutomu Nanataki, Koji Kimura
-
Patent number: 6874222Abstract: Methods of manufacturing an antenna are presented. The antenna is capable of being mounted on a printed circuit board. In accordance with the method, the design dimension of a unitary piece of material are selected according to an operating wavelength. The unitary piece of material is stamped out from a larger section of material according to the design dimensions to form an antenna. The unitary piece of material includes a circular area and a stem area. The circular area has a center and an outer region. The stem area has a first end and a second end. The first end is joined with the center. The unitary piece is bendable at the first end and the center.Type: GrantFiled: February 13, 2003Date of Patent: April 5, 2005Assignee: Atheros, Inc.Inventors: Jovan E. Lebaric, Andy Dao
-
Patent number: 6854172Abstract: A process for producing implants made of a bioresorbable metal, particularly magnesium alloys or zinc alloys, in which the material properties of the magnesium or the zinc are changed and the processing and utilization properties are improved by combining process steps for adjusting the properties of the material and subsequent machining. In this way it is possible to produce thin-walled tubular implants, particularly blood vessel support stents, from bioresorbable magnesium or zinc alloys, which are readily deformable without the risk of fracture during implantation.Type: GrantFiled: February 20, 2003Date of Patent: February 15, 2005Assignee: Universitaet HannoverInventors: Volker Kaese, Arne Pinkvos, Heinz Haferkamp, Matthias Niemeyer, Friedrich-Wilhelm Bach
-
Patent number: 6848153Abstract: A method of manufacture of a surface acoustic wave device which includes a step of applying a photosensitive film resist on a substrate and forming a photosensitive film resist layer over at least a portion of a surface of the substrate; a step of forming acoustic absorbers only at the two sides orthogonal to the direction of the surface acoustic wave transmission; a step of placing in a package a surface acoustic wave element obtained by cutting and dividing the substrate and electrically connecting a connection electrode of the surface acoustic wave element with an external terminal of the package; and a step of sealing an opening of the package with a lid, wherein the main surface of the acoustic absorbers is formed parallel to the surface of the substrate.Type: GrantFiled: December 10, 2002Date of Patent: February 1, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shigeru Tsuzuki, Kunihiro Fujii, Masahiro Takada, Satoshi Matsuo, Takafumi Koga, Kozo Murakami
-
Publication number: 20040261240Abstract: In manufacturing a link plate for a roller chain, a band of sheet steel is intermittently forwarded along a path past series of dies, including rough punching dies and shaving dies. The punching dies and corresponding shaving dies are located symmetrically on opposite sides of an intermediate location along the path. The intermediate location coincides with a location at which the lateral deviation of the band reverses. Consequently, the outer peripheral surfaces of the plate and the inner peripheral surfaces of the connecting pin holes, both being formed by rough punching, are brought into very close alignment with the shaving dies.Type: ApplicationFiled: March 30, 2004Publication date: December 30, 2004Inventors: Toshifumi Satou, Masatoshi Chadou
-
Patent number: 6832425Abstract: A gasket singulation apparatus for separating one gasket from a web-connected stack of gaskets includes a mandrel for receiving the web-connected stack and an arrangement of cylinders which are used to support the web-connected stack of gaskets and to pull one gasket away from the remainder of the web-connected stack so as to singulate that one gasket. A first plurality of cylinders are used to support the web-connected stack. A second plurality of cylinders are used to pierce any connecting material between the gasket to be singulated and the remainder of the stack. Once the web material is pierced, cylinder movement is effected so as to pull the selected gasket away from the stack, allowing any connecting material to sever and thereby singulate one gasket from the stack. Once the gasket is singulated, various insertion mechanisms are disclosed for inserting the singulated gasket into a pail lid groove.Type: GrantFiled: November 12, 2002Date of Patent: December 21, 2004Assignee: Rieke CorporationInventors: Dale W. Taylor, Johnny M. Hickman
-
Patent number: 6826816Abstract: A method of manufacturing multiple dimension transducer arrays of multiple layer elements from modules is provided. A plurality of multiple layer strips are formed. The strips are separate, such as an elongated strip corresponding in size to one row of elements. Connections between the electrodes of various layers or separate connections from the various electrodes to a bottom of the strip are formed on the separate multiple layer strips. The separate strips are then aligned within a frame and bonded together. The resulting sheet of multiple layer transducer material is then diced to form elements. Due to the previous interconnection of electrodes, each element includes electrical connections for each of the layer electrodes, avoiding the need for vias or high aspect ratio sputtering.Type: GrantFiled: September 18, 2002Date of Patent: December 7, 2004Assignee: Siemens Medical Solutions USA, Inc.Inventors: Charles D. Emery, Martina Vogt, Stephen C. Englund
-
Patent number: 6820316Abstract: A composite blade, in which there is an essentially plate-like blade component with a composite-construction and retention members arranged in its rear part is intended to be installed in a special blade holder with the retention members remaining in the throat of the blade holder. The retention members are formed of a profiling arranged as a lateral extension of the blade component. The profiling extends essentially over the entire length of the blade and is of the same piece as the blade component.Type: GrantFiled: February 5, 2001Date of Patent: November 23, 2004Assignee: Metso Paper, Inc.Inventor: Ilkka Rata
-
Patent number: 6817072Abstract: A method of producing a piezoelectric/electrostrictive (P/E) device includes the steps of providing a first substrate, securing metal plates to the first substrate to form a second substrate, and subjecting the second substrate to at least one cuffing treatment to form one of the movable section and the fixation section. The metal plates define the thin plate sections and one of the movable and fixation sections has mutually opposing end surfaces, a distance between which is not less than a length of the movable section.Type: GrantFiled: October 25, 2002Date of Patent: November 16, 2004Assignee: NGK Insulators, Ltd.Inventors: Yukihisa Takeuchi, Kazuyoshi Shibata, Masahiko Namerikawa
-
Publication number: 20040211048Abstract: A system and method for preventing operational and manufacturing imperfections in piezoelectric micro-actuators by physically and electrically isolating conductive layers of the piezoelectric material.Type: ApplicationFiled: May 24, 2004Publication date: October 28, 2004Inventors: Minggao Yao, Masashi Shiraishi
-
Patent number: 6807722Abstract: A manufacturing method is provided for manufacturing a head material including: a plurality of rows of head-to-be sections to be thin-film magnetic heads; an inter-row cutting section provided to be a position at which adjacent ones of the rows are to be separated; and an intra-row cutting section provided to be a position at which adjacent ones of the head-to-be sections in each of the rows are to be separated. The method includes the steps of: providing a detection element to be used for detecting an amount of processing when specific processing is performed on the head material; an electrode for electrically connecting the detection element to an external device; and a conductor for electrically connecting the electrode to the detection element; and forming the electrode in the inter-row section.Type: GrantFiled: May 29, 2001Date of Patent: October 26, 2004Assignee: TDK CorporationInventors: Yoshitaka Sasaki, Hiroyuki Itoh
-
Publication number: 20040181928Abstract: A blade handle mounting fixture (224) is disclosed. A wafer (130) is positioned on the fixture (224). This wafer (130) includes a plurality of cutting blades (56). Blade handles (24) may be mounted on each of the various cutting blades (56) while the wafer (130) is positioned on the fixture (224). Thereafter, the wafer (130) may be removed and transferred to a blade separation fixture (300). Here the blades (56), with handles (24) having been previously mounted thereon, are separated from the wafer (130).Type: ApplicationFiled: March 17, 2003Publication date: September 23, 2004Inventors: Norman Frank Smith, Samuel Lee Miller, Murray Steven Rodgers
-
Patent number: 6787382Abstract: A method for singulating a substrate containing semiconductor components is performed using a nest for holding the substrate, a prestage alignment base for aligning the substrate during a prestage alignment step, and a vacuum cutting base for holding the nest and the substrate during a cutting step. The prestage alignment base includes locator pins configured to engage locator openings on the substrate to align the substrate on the nest. As the cutting base does not include the locator pins, the cutting step can be performed without saw scrap collecting on the locator pins. A system for performing the method includes the nest and the prestage alignment base having the locator pins configured to engage the locator openings on the substrate. The system also includes the sawing base which includes pedestals with vacuum conduits for holding the substrate stationary on the nest for sawing.Type: GrantFiled: August 30, 2001Date of Patent: September 7, 2004Assignee: Micron Technology, Inc.Inventors: Jason C. Wing, Gregory M. Chapman
-
Publication number: 20040168852Abstract: A linkage assembly (140) is used for mechanically coupling an armature (124) and a diaphragm (118) of a balanced receiver (100), the linkage assembly (140) formed from a first linkage member (822) displaced from a strip of stock material (800) relative to the plane of the stock material (800) and a second linkage member (826) displaced from the strip (800) relative to the plane. The first and second linkage members (822, 826) are then joined while secured to the strip (800). At least one severable connecting member (870a-c) securing the linkage member to the strip (800) is severed to release the linkage member from the strip for assembly of the linkage member into the receiver. A method of forming a three-dimensional structure from flat stock is used to form the linkage assembly (140).Type: ApplicationFiled: November 21, 2003Publication date: September 2, 2004Inventors: Mekell Jiles, David Earl Schafer
-
Publication number: 20040159358Abstract: A honeycomb body is produced with a number of sheet layers, of which at least a part are at least partly structured sheet layers, which lend the honeycomb the property of permitting fluid to flow through the same as a result of the structure thereof. The honeycomb body has a given, continuous, free volume in the interior thereof, for receiving a measuring probe. The method includes selecting a section of a sheet strip from a feed roll, identifying the sheet layer and reading a corresponding hole position and a corresponding hole boundary from a memory, generating a hole with the hole boundary in the sheet layer at the given hole position before the further preparation of the honeycomb body, and winding, stacking and/or entwining of several such pre-prepared sections to give a honeycomb structure, such that a free volume for a measuring probe is formed from the individual holes.Type: ApplicationFiled: August 26, 2003Publication date: August 19, 2004Inventor: Rolf Bruck
-
Patent number: 6772491Abstract: A manufacturing method for a ceramic oscillator capable of controlling the oscillation frequency with a high accuracy is disclosed. In this method, a mother substrate is polarized, electrodes in discrete ceramic oscillator units are formed, the mother substrate is cut into discrete ceramic oscillator units, an outer package is applied to each of the ceramic oscillators, and thus a ceramic oscillator as a finished product is achieved. Herein, the polarization processing for the mother substrate is executed by finishing the application of a high DC voltage, when the antiresonant frequency fa of the mother substrate in a thickness vibration mode is measured while the voltage is applied to the mother substrate, and the antiresonant frequency fa which is being measured has reached a target value of the antiresonant frequency of the mother substrate during polarization corresponding to a target oscillation frequency of the ceramic oscillator as a finished product.Type: GrantFiled: December 20, 2001Date of Patent: August 10, 2004Assignee: Murata Manufacturing Co., Ltd.Inventors: Naoki Fujii, Hiroshi Tomohiro, Mikio Nakajima, Keiichi Kami
-
Patent number: 6772496Abstract: The invention concerns a drip irrigation conduits (1) comprising a tube (2) designed to be connected to a pressurised water source. The tube is provided with two lateral lips (3a, 3b) superposed on each other and are formed integral with said tube. The conduit (1) further comprises, at intervals, flow cavities allowing water to trickle through (11) communicating the tube (2) inside with outside environment. The invention is characterised in that a strip (4) is fixed in sealed manner between the lips (3a, 3b), and the cavities.Type: GrantFiled: November 8, 2002Date of Patent: August 10, 2004Assignee: Swisscab S.A.Inventor: Bruno Buluschek
-
Patent number: 6769158Abstract: A piezo-electric printhead is formed from a first piezo-electric actuator disposed parallel to a second piezo-electric actuator. The first and second piezo-electric actuators have a shared inner electrode disposed between them, a first control electrode disposed on an outside surface of the first piezo-electric actuator and a second control electrode disposed on an outside surface of the second piezo-electric actuator. The actuators are formed from a block having a piezo-electric layer disposed on a ceramic base, in which the piezo-electric layer has two parallel, distinct electrode patterns embedded therein in the form of a metal paste.Type: GrantFiled: September 4, 2002Date of Patent: August 3, 2004Assignee: Illinois Tool Works, Inc.Inventors: Jean-Marie Gutierrez, Hongsheng Zhang
-
Publication number: 20040139601Abstract: A method for cutting a wafer. The method includes the steps of: providing a first protection layer; providing a wafer, which comprises a top surface, a bottom surface mounted to the first protection layer, a plurality of semiconductor chips, and saw streets formed between adjacent semiconductor chips on the top surface of the wafer; providing a second protection layer to cover the top surface of the wafer so as to protect the top surface of the wafer; provide a cutter to cut the wafer into a plurality of individual semiconductor chips along the saw streets on the top surface of the wafer; and removing the first protection layer and second protection layer on each semiconductor chip. Thus, it is possible to prevent the waste chips generated during the cutting process from contaminating each semiconductor chip.Type: ApplicationFiled: January 16, 2003Publication date: July 22, 2004Inventor: Simon Shiau
-
Patent number: 6757976Abstract: A method for manufacturing an alloy wheel for automobiles, the alloy wheel including a rim part having a portion running in and out from a rim flange to a drop center, and a disc part fitted in the rim part is disclosed. The method comprising forging of an alloy billet to obtain a cup-shaped preform, flowforming of the preform to obtain a seamless tube, cutting of the seamless tube into unit tubes, primary roll forming of the unit tube to obtain a preliminarily shaped unit tube, secondary roll forming of the preliminarily shaped unit to obtain a final shaped rim part, and attaching a disc part to the rim part.Type: GrantFiled: February 4, 2002Date of Patent: July 6, 2004Assignee: ASA Co. Ltd.Inventor: Jeong-Hoon Baek
-
Patent number: 6757947Abstract: A method for a parallel manufacturing of a plurality of piezoelectric actuators and a corresponding piezoelectric actuator utilize a plurality of thin foils composed of an unfired piezoelectric ceramic material which stacked one over another. On surface of foils, an electrode is provided for each actuator. For contacting electrodes, first and second connecting openings are provided. Electrodes have cut-outs which surround either first or second connecting openings. An electrically conductive paste is introduced into connecting openings. The stacked arrangement is fired and split up into the individual actuators. As internal electrodes, the electrodes are insulated from the surroundings.Type: GrantFiled: May 2, 2002Date of Patent: July 6, 2004Assignee: Robert Bosch GmbHInventors: Dieter Seipler, Walter Röthlingshöfer, Susumu Nishigaki
-
Patent number: 6757954Abstract: A method for manufacturing a colored plastic cutting board with anti-bacteria effect is disclosed. A pressing machine has material suppliers for supplying plastic material from an opening. The lower anti-bacteria layer and the middle supporting plate are outputted from an output. The lower anti-bacteria layer and the middle supporting plate are placed upon a substrate. Then they are transferred to be under a roller; and then a printing film is coated upon a top surface of the middle supporting plate. The printing film is printed with pattern. Then the cutting board is transferred to another pressing device which feeds a top transparent protecting layer upon the printing film. Then, the substrate is sent to a punching device for being punched so as to form a cutting board which has a fixed shape. Thereby, the process of printing and anti-bacteria can be performed continuously.Type: GrantFiled: July 22, 2002Date of Patent: July 6, 2004Inventor: Cheng-Cher Sei
-
Publication number: 20040111858Abstract: A method and apparatus for assembling a first thermoformed workpiece, such as a tab closure, to a second thermoformed workpiece, such as a lid.Type: ApplicationFiled: September 18, 2003Publication date: June 17, 2004Applicant: DART CONTAINER CORPORATIONInventors: Ralph William MacKenzie, Tyler James DeLong, Ryan P. Gingras
-
Patent number: 6748639Abstract: A method of producing a dispensing device for coatable products, such as adhesives, wherein a sleeve-shaped element, a pedestal with a spindle, a piston for receiving the product, and a closure cap are produced by injection moulding, and the thus-produced parts are subsequently assembled, comprising the steps of injection-moulding the piston and the spindle together as a single body in a common injection-moulding process, wherein the piston and spindle are formed to be separable for assembly after injection-moulding.Type: GrantFiled: May 27, 2003Date of Patent: June 15, 2004Assignee: Henkel Kommanditgesellschaft auf AktienInventors: Christian Hemming, Bernd Peters, Werner Hoeve
-
Publication number: 20040109235Abstract: A batched process for producing optical components for use in fiber-optic networks. The process involves creating optical substrate blocks with thin-film filters on at least one surface of the of the substrate blocks. Other surfaces on the blocks are finely polished such the several blocks may be fused together at the polished surfaces. By placing the blocks such that the thin-film filters on adjacent blocks are diagonally opposed and then fusing together adjacent blocks, the blocks connected in this manner can perform various optical functions. Some of the optical components that can be formed using this process include power taps, optical add/drop modules, multiplexers, and demultiplexers.Type: ApplicationFiled: November 26, 2003Publication date: June 10, 2004Inventors: Johnny Zhong, Yin Zhang, Steve Wang, Kevin Zhang
-
Patent number: 6745446Abstract: Mechanical parts and other objects are produced from a specific computer-assisted design by successive steps including producing pieces of the part or object in elementary layers or strata, building up the collection of layers, and assembling the layers. The layers are derived from previous decomposition of the part or object along specific planes, and one or several steps. At least a portion of one of the layers is turned over (by 180°) after one of its surfaces has been machined, and another surface is machined after the layer has been turned over.Type: GrantFiled: August 21, 2001Date of Patent: June 8, 2004Assignee: C.I.R.T.E.S. (Centre d'Ingenierie de Recherche et de Transfert de l'Esstin a Saint-Die)Inventor: Claude Barlier
-
Patent number: 6742233Abstract: The invention is a brake disk and a method of producing the same. The brake disk has at least one friction ring which can be engaged by a brake shoe on at least one side. The friction ring is divided into at least two ring segments having mutually facing end areas configured to be coupled with one another adjacent a junction and separation area. A separation gap is formed between the mutually facing end areas, which mesh with one another. At least one connection device is positioned in the junction and separation area for coupling the ring segments together.Type: GrantFiled: May 10, 2002Date of Patent: June 1, 2004Assignee: Knorr-Bremse Systeme Für Schienenfahrzeuge GmbHInventor: Xaver Wirth
-
Publication number: 20040088851Abstract: A microphone assembly comprises a microphone, a connector secured to the underside of the microphone. A gasket has a sound collecting hole and is secured on the upper surface of the microphone.Type: ApplicationFiled: October 31, 2003Publication date: May 13, 2004Inventors: Megumi Horiuchi, Tsutomu Ojima
-
Patent number: 6722030Abstract: A method is provided for manufacturing a saw filter in which a carrier plate 10 that can be separated into base plates 2 is respectively provided with interconnects in the base plate regions A and these are contacted to the active structures of SAW chips 1 in flip-chip technique. A metal foil 3 or plastic film 4 is placed onto the chip-equipped carrier plate 10 and, for example, is pressure and heat treated such that it envelopes each chip 1 (except for the chip surface facing toward the carrier plate 10) and lies hermetically tight on the carrier plate surface in regions between the chips.Type: GrantFiled: November 13, 2000Date of Patent: April 20, 2004Assignee: EPCOS AGInventors: Alois Stelzl, Hans Krueger, Peter Demmer