With Bonding Patents (Class 29/603.06)
  • Publication number: 20150015990
    Abstract: A head stack assembly includes at least one head gimbal assembly and a flexible printed circuit assembly. A flexure tail of the head gimbal assembly includes a row of first bonding pads, a first dual stage actuator pad and a first dummy pad arranged at two sides of said row of first bonding pads, and the first dual stage actuator pad and the first dummy pad are connected together via a jumping lead. The flexible printed circuit assembly includes at least one row of second bonding pads, at least one second dual stage actuator pad and at least one second dummy pad arranged for connecting with the row of first bonding pads, the first dual stage actuator pad and the first dummy pad respectively. The connection way between the head gimbal assembly and the flexible printed circuit assembly is simple, thereby less cross talk is generated on the preamplifier.
    Type: Application
    Filed: September 10, 2013
    Publication date: January 15, 2015
    Applicant: SAE Magnetics (H.K.) Ltd.
    Inventors: Sidney Shen Kuang Chou, Jackie Ka Yip Wong, Shu Deng, Xin Zhong, Lu Xiao
  • Publication number: 20140168813
    Abstract: Approaches to a mass balanced flexure gimbal assembly for controlling the sway mode of the loadbeam portion of the suspension of a head gimbal assembly (HGA) of a hard-disk drive (HDD). The sway mode of concern is that which is excited when a head slider is actuated by a plurality of piezo actuation devices of a secondary actuation system. A suspension includes a mass attached to the suspension flexure and configured for balancing a moment force about the gimbal, about which a slider rotates when microactuated. The mass is located on the side of the slider opposing the side on which the piezo actuation devices are mounted, to counteract the mass of the piezo devices.
    Type: Application
    Filed: December 19, 2012
    Publication date: June 19, 2014
    Applicant: HGST NETHERLANDS B.V.
    Inventors: KATHRYN TAO, STEPHEN WILLIAMS
  • Patent number: 8667667
    Abstract: A disk drive includes a disk drive base comprising a first metal material. The disk drive base may include a first opening and a first attachment feature to which a head actuator assembly pivot may be attached. A motor support may be embedded in the first opening in the disk drive base. The motor support consists of a second metal material having a damping coefficient higher than that of the first metal material. A rotary spindle may be attached to the motor support, and a disk may be attached to the rotary spindle.
    Type: Grant
    Filed: January 13, 2011
    Date of Patent: March 11, 2014
    Assignee: Western Digital Technologies, Inc.
    Inventors: Diep L. Nguyen, Jifang Tian, Hongqi Li
  • Patent number: 8635764
    Abstract: A system is provided that increases the spindle stiffness of a disk drive while optimizing power consumption. A multipurpose bearing provides axial stiffness and enhanced stiffness against radial and pitch loads applied to the spindle. When used in combination with a journal bearing, conventional thrust bearings may be eliminated without sacrificing overall stiffness. As a result, the height of the disk drive may be reduced, thereby making the system desirable to be used in smaller electronic devices.
    Type: Grant
    Filed: March 30, 2010
    Date of Patent: January 28, 2014
    Assignee: Seagate Technology LLC
    Inventors: Diep Nguyen, Hamid Salehizadeh
  • Patent number: 8533934
    Abstract: A method of assembling a hard disk drive comprises steps of: sealing an interface of the base and the cover of an enclosed housing with an infrared-transmissive tape; filling the enclosed housing with a desired gaseous medium; optionally, testing the hard disk drive; and, optionally; re-working the hard disk drive. Preferably, the enclosed housing is free of rubber gasket materials between the base and the cover. A hermetically sealed hard disk drive of the invention comprises: a housing comprising a base and a cover; and disk drive components enclosed within the housing for facilitating reading and recording of data at any desired location on at least one disk contained within the housing, wherein the hard disk drive is free of rubber gasket materials between the base and the cover.
    Type: Grant
    Filed: April 28, 2011
    Date of Patent: September 17, 2013
    Assignee: entrotech, inc.
    Inventors: James E. McGuire, Jr., Andrew C. Strange
  • Patent number: 8453315
    Abstract: A method for manufacturing a perpendicular magnetic disk 100 that includes a step of forming, on a base 110, a granular magnetic layer 160 in which a grain boundary portion is formed by segregation of a non-magnetic substance containing an oxide as a main component around magnetic particles containing a CoCrPt alloy grown in a columnar shape as a main component. The method also includes a step of forming an auxiliary recording layer 180 that contains a CoCrPtRu alloy as a main component and has a film thickness of 1.5 to 4 nm above the granular magnetic layer, and a step of heating the base formed with the auxiliary recording layer in a temperature range of 210 to 250° C.
    Type: Grant
    Filed: March 24, 2011
    Date of Patent: June 4, 2013
    Assignee: WD Media (Singapore) Pte, Ltd.
    Inventors: Takenori Kajiwara, Tokichiro Sato
  • Patent number: 8448329
    Abstract: An integrated lead head suspension flexure including a plurality of integrated leads each including at least one lead portion unbacked by the flexure spring metal layer and configured to be substantially inline with the general plane of the spring metal layer. The leads are disposed on a dielectric layer including an unbacked dielectric layer portion having a surface positioned between the major surfaces of the spring metal layer.
    Type: Grant
    Filed: September 7, 2010
    Date of Patent: May 28, 2013
    Assignee: Hutchinson Technology Incorporated
    Inventors: Alexander J. Rice, Mark A. Miller, Gregory J. VanHecke, Lance Nevala
  • Publication number: 20130070369
    Abstract: A suspension includes a flexure and a plurality of electrical traces formed on the flexure. Each electrical trace has a trace body and a bonding pad arranged for connecting with a slider, and the bonding pad is a free end before connecting with the slider and is capable of bending to the trace body flexibly, and the bonding pad includes a trace body layer and a solder layer formed on the trace body layer, thereby the bonding pads of the electrical traces connecting with the slider by reflowing the solder layer. The present invention uses no extra solder balls, so as to reduce the manufacturing cost and the corresponding apparatus cost. The invention also discloses a manufacturing method of a suspension, and a connecting method for a suspension and a slider.
    Type: Application
    Filed: September 21, 2011
    Publication date: March 21, 2013
    Applicant: SAE Magnetics (H.K.) Ltd.
    Inventors: Shen kuang sidney CHOU, Chi hung Yuen, Yan bin Wang, Shu ming Zhang, Bin Zhao, Ming liang Lin
  • Patent number: 8336193
    Abstract: Provided is a process for making a magnetic recording medium having a magnetically partitioned magnetic recording patterns, which comprises the following three steps (1), (2) and (3), conducted in this order: (1) a step of forming a magnetic layer on a non-magnetic substrate; (2) a step of removing surface layer portions of regions for magnetically partitioning the magnetic layer; and (3) a step of exposing the thus-exposed regions of the magnetic layer, from which the surface layer portions have been removed, to a reactive plasma or a reactive ion, to modify the magnetic characteristics of the regions of magnetic layer, whereby a magnetic recording pattern is formed which are magnetically partitioned by the regions of magnetic layer having the modified characteristics. Thus, a magnetic recording medium having an enhanced recording density and minimizing letter bleeding at writing can be made with a high efficiency.
    Type: Grant
    Filed: July 24, 2008
    Date of Patent: December 25, 2012
    Assignee: Showa Denko K.K.
    Inventors: Masato Fukushima, Akira Sakawaki, Akira Yamane
  • Patent number: 8307538
    Abstract: A method for manufacturing an head gimbal assembly (HGA) according to the present invention is comprised of: a step for preparing a thin film piezoelectric actuator including a first piezoelectric laminate having a first piezoelectric layer, and a second piezoelectric laminate having a second piezoelectric layer; a step for preparing a suspension; a fixing step for fixing the thin film piezoelectric actuator to the suspension; a first repolarization treatment step for performing repolarization treatment to the first piezoelectric layer after the fixing step; and a second repolarization treatment step for performing repolarization treatment to the second piezoelectric layer after the fixing step.
    Type: Grant
    Filed: March 1, 2010
    Date of Patent: November 13, 2012
    Assignees: TDK Corporation, SAE Magnetics (H.K.) Ltd.
    Inventor: Kenjiro Hata
  • Patent number: 8296929
    Abstract: Multi-layer ground plane structures and methods of manufacture for integrated lead suspension flexures. A flexure in accordance with one embodiment of the invention includes an insulating layer, a plurality of traces on the insulating layer and a stainless steel base layer on the side of the insulating layer opposite the traces. The stainless steel base layer includes one or more void portions with voids in the base layer opposite the insulating layer from the traces and one or more backed portions with the base layer backing the traces. A plurality of patterned and transversely-spaced first conductive ground planes are located opposite the insulating layer from the traces at the void portions and backed portions of the stainless steel base layer. A continuous gold second conductive ground plane is located opposite the insulating layer and the first ground planes from the side of the insulating layer adjacent to the traces at the void portions and backed portions of the stainless steel base layer.
    Type: Grant
    Filed: March 18, 2011
    Date of Patent: October 30, 2012
    Assignee: Hutchinson Technology Incorporated
    Inventors: Reed T. Hentges, Kurt C. Swanson, Peter F. Ladwig, Lance Nevala
  • Patent number: 8276256
    Abstract: A method of assembling a head stack assembly (HSA) includes securing a flex cable to an actuator including an actuator arm having a side slot with a slot end. A first head gimbal assembly (HGA) is attached to the actuator arm. The first HGA includes a first laminated flexure having a first flexure tail with a first raised region that includes an out-of-plane bend. The first raised region is squeezed while inserting the first flexure tail partially within the side slot with the first raised region adjacent the slot end. The first raised region is allowed to expand into contact with the side slot adjacent the slot end. The first flexure tail is electrically connected to the flex cable.
    Type: Grant
    Filed: October 20, 2011
    Date of Patent: October 2, 2012
    Assignee: Western Digital Technologies, Inc.
    Inventors: Yiduo Zhang, Tzong-Shii Pan, Yih-Jen D. Chen
  • Patent number: 8250736
    Abstract: A magnetic recording medium which does not easily cause a material containing Fe or Co to corrode is disclosed. The method for manufacturing a magnetic recording medium 122 includes a process of forming a magnetic layer 30 on a non-magnetic substrate 10, a process of forming a recessed area 65 in the magnetic layer 30, a process of forming a corrosion-resistant film 60 to cover an exposure surface 65c of the recessed area 65, and a process of forming a magnetic recording pattern made of the magnetically separated magnetic layer 30 by forming a non-magnetic layer 40 to fill in the recessed area 65.
    Type: Grant
    Filed: October 27, 2009
    Date of Patent: August 28, 2012
    Assignee: Showa Denko K.K.
    Inventors: Masato Fukushima, Shinichi Ishibashi, Akira Yamane
  • Patent number: 8225485
    Abstract: A method of manufacturing a head suspension includes a punching process, a positioning process, and an affixing process. An objective part on the head suspension to which a damper 73 is affixed includes a discontinuous section 72. The punching process punches a damper material into the damper 73 whose shape corresponds to the shape of the objective part excluding the discontinuous section 72. The positioning process positions the damper 73 to the objective part so that the damper 73 avoids and surrounds the discontinuous section 72, and the affixing process affixes the damper 73 to the objective part. The method secures a uniform damping effect among manufactured head suspensions and improves the yield of dampers and head suspensions without deteriorating the functions and performances of the head suspensions.
    Type: Grant
    Filed: June 16, 2009
    Date of Patent: July 24, 2012
    Assignee: NHK Spring Co., Ltd.
    Inventors: Akira Umebayashi, Hiroshi Kawamata
  • Patent number: 8205323
    Abstract: In a manufacturing method for a head gimbal assembly, before mounting a slider on a suspension, coating films each made of solder are formed on respective terminals of a plurality of leads to be connected to a plurality of electrode pads of the slider. After mounting the slider on the suspension, the coating films are heated with laser light to thereby melt the solder, with the respective terminals of the plurality of leads in contact with the corresponding electrode pads via the respective coating films, whereby the terminals are electrically and physically connected to the electrode pads.
    Type: Grant
    Filed: December 22, 2009
    Date of Patent: June 26, 2012
    Assignee: TDK Corporation
    Inventor: Hitoshi Iwama
  • Patent number: 8161626
    Abstract: A suspension for supporting a magnetic head is provided with a load beam formed of a thin-plate spring. A recess for accommodating a damper is formed in the load beam. The damper is affixed to a bottom surface of the recess.
    Type: Grant
    Filed: February 12, 2010
    Date of Patent: April 24, 2012
    Assignee: NHK Spring Co., Ltd.
    Inventor: Yoichi Ikeji
  • Patent number: 8156633
    Abstract: An HSA transport comb includes an alignment pin extending from the comb body into a tooling hole of the actuator arm, and a separator finger in contact with a suspension assembly of an HGA with the transport comb in a second angular orientation with respect to the actuator arm, but not in a first angular orientation. The transport comb includes a restraining tower extending into a mass-reduction opening of the actuator arm. The restraining tower includes a first lobe that fits within the mass-reduction opening with the transport comb in the first angular orientation, but not with the transport comb in the second angular orientation. The restraining tower also includes a first neck that fits within the mass-reduction opening with the transport comb in either angular orientation, and has a neck height that is greater than the actuator arm thickness.
    Type: Grant
    Filed: March 12, 2008
    Date of Patent: April 17, 2012
    Assignee: Western Digital Technologies, Inc.
    Inventor: Gregory G. Foisy
  • Patent number: 8151440
    Abstract: A method for manufacturing a head suspension is capable of suppressing the dispersion in the vibration control effect of a head suspension and improve productivity, the manufacturing method includes a step of punching, by use of a hollow punch having a tooth portion at a distal end thereof, a vibration damper piece out from a base material having a vibration damper provided detachably on a liner through an attaching surface, to hold the vibration damper piece on a hollow internal surface of the punch, a step of positioning the punch holding the vibration damper piece on an objective portion of a semi-finished head suspension, and a step of attaching, by use of an extruding implement, the vibration damper piece on the objective portion with the attaching surface through extruding the vibration damper piece from the punch.
    Type: Grant
    Filed: January 16, 2009
    Date of Patent: April 10, 2012
    Assignee: NHK Spring Co., Ltd.
    Inventors: Kunihiro Tsutsumi, Tsuyoshi Amemiya
  • Patent number: 8082657
    Abstract: A method for manufacturing a magnetic write head that allows the location of the flare point of a write pole to be accurately located relative to the air bearing surface. The method includes the construction of a lapping guide having an edge feature that is easily and accurately located relative to the flare point of the write pole. This edge feature provides an abrupt change in electrical resistance across the lapping guide at a point when lapping should be terminated. And, since this feature can accurately located relative to the flare point, this provides an easily discernable ending point for lapping.
    Type: Grant
    Filed: December 30, 2008
    Date of Patent: December 27, 2011
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Edward Hin Pong Lee, Vladimir Nikitin, Michael Ming Hsiang Yang, Yuan Yao
  • Patent number: 8082656
    Abstract: A method for manufacturing a disk drive head suspension having a plated load point dimple. A photoresist mask having an opening with load point-defining side walls and a load point diameter is formed over a planar portion of a spring metal member. Metal is plated onto the spring metal member in the opening to form a load point having the load point diameter on the planar portion of the spring metal member.
    Type: Grant
    Filed: September 4, 2007
    Date of Patent: December 27, 2011
    Assignee: Hutchinson Technology Incorporated
    Inventors: Zachary A. Pokornowski, Michael W. Davis
  • Patent number: 8033008
    Abstract: A defect inspection is performed for each of glass substrates by a surface defect detector. The distance from the center of the glass substrate to a detected defect, as a radius of a nonmagnetic region to be formed circular, is recorded along with an ID assigned to the glass substrate. Such defect information is recorded in a defect list using a printer or recorded in an RFID tag using an RFID writer. The defect list or the RFID tag is attached to a glass-substrate case. Each glass substrate and its defect information are in one-to-one correspondence and are provided to a customer as a magnetic disk manufacturer. Based on the obtained defect information, the customer manufactures magnetic disks each being a discrete track recording medium having the nonmagnetic region formed at the position where the defect is present.
    Type: Grant
    Filed: January 15, 2008
    Date of Patent: October 11, 2011
    Assignees: Hoya Corporation, Hoya Glass Disk (thailand) Ltd.
    Inventors: Hiroshi Takeda, Ken-ichi Nishimori, Tomotaka Yokoyama, Tadashi Tomonaga
  • Patent number: 8013271
    Abstract: To improve the quality of the products that are manufactured by soldering, through enabling highly reliable soldering while suppressing damages to the bonding targets caused due to the soldering. Provided is a soldering method for bonding each of bonding pads formed in respective bonding targets with solder. The method comprises: a bonding target placing step for placing each of bonding targets to a bonding position; a soldering step for placing solder between each of the bonding pads formed in each of the bonding targets, and for performing soldering by irradiating a heating beam to the solder; and a bonding target heating step for heating at least one of the bonding targets, which is executed before the soldering step and/or simultaneously with the soldering step.
    Type: Grant
    Filed: January 29, 2008
    Date of Patent: September 6, 2011
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Hiroshi Fukaya, Satoshi Yamaguchi
  • Patent number: 7987582
    Abstract: A micro-actuator to which no head slider is adhesively bonded is mounted on a suspension. The head slider is adhesively bonded to the micro-actuator mounted on the suspension. Before the head slider adheres to the micro-actuator, an electrical connecting work of the slider is completed, and a characteristic test is carried out. If the head slider is judged as being normal as a result of the characteristic test, the head slider concerned is bonded to the micro-actuator by the adhesive.
    Type: Grant
    Filed: January 31, 2006
    Date of Patent: August 2, 2011
    Assignee: SAE Magnetic (H.K.) Ltd.
    Inventor: Satoshi Yamaguchi
  • Patent number: 7984545
    Abstract: Approaches for helping to decrease the amount of inactive gas necessary for reflow to interconnect connection terminals of a head slider and a suspension. Inactive gas is blown from a nozzle of a reflow apparatus toward interconnection joints of a head slider and a suspension. The head slider is bonded onto a gimbal tongue. The nozzle comprises a duct through which the inactive gas passes and a porous member fitted in an ejection outlet of the tube. Placing the porous member close to the head slider achieves effective reduction of oxygen concentration around solder balls.
    Type: Grant
    Filed: July 25, 2008
    Date of Patent: July 26, 2011
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Yuhsuke Matsumoto, Tatsumi Tsuchiya, Hideto Imai, Tamaki Ushimoto
  • Patent number: 7926167
    Abstract: A method to assemble a disk drive having a spindle that includes a hub. At least one disk is placed on the hub. A clamp is fastened to the hub by a plurality of threaded fasteners. Each of the plurality of threaded fasteners is initially tightened. After initial tightening, an initial couple imbalance of the spindle is determined. After the initial couple imbalance is determined, a first selected threaded fastener of the plurality of threaded fasteners is selected and rotated by a first amount of rotation that is significantly different from a second amount of rotation of a second selected threaded fastener of the plurality of threaded fasteners. The selection and rotation of the first selected threaded fastener of the plurality of fasteners is determined based on the initial couple imbalance of the spindle.
    Type: Grant
    Filed: August 8, 2008
    Date of Patent: April 19, 2011
    Assignee: Western Digital Technologies, Inc.
    Inventors: Michael K. Liebman, Antony Tuyen Nguyen, Thomas Anthony Tacklind, August L. Klerks, Amir Norton
  • Patent number: 7929257
    Abstract: A magnetic thin film has a pinned layer whose magnetization direction is fixed with respect to an external magnetic field, a free layer whose magnetization direction is changed according to the external magnetic field, and a spacer layer which is sandwiched between said pinned layer and said free layer. Sense current is configured to flow in a direction that is perpendicular to film surfaces of said pinned layer, said spacer layer, and said free layer. Said spacer layer has a CuZn metal alloy which includes an oxide region, said oxide region consisting of an oxide of any of Al, Si, Cr, Ti, Hf, Zr, Zn, and Mg.
    Type: Grant
    Filed: February 23, 2007
    Date of Patent: April 19, 2011
    Assignee: TDK Corporation
    Inventors: Takahiko Machita, Tomohito Mizuno, Yoshihiro Tsuchiya, Daisuke Miyauchi, Shinji Hara
  • Patent number: 7921542
    Abstract: Certain example embodiments relate to a manufacturing method for a disk drive unit. At least one head gimbal assembly having first terminal pads is provided. A controlling circuit for controlling the at least one head gimbal assembly is provided, with the controlling circuit having second terminal pads to connect with the first terminal pads. The at least one head gimbal assembly is disposed in a motor base. The controlling circuit is disposed in the motor base. The at least one head gimbal assembly and the controlling circuit are tightened to the motor base such that the first and second terminal pads are face-to-face and have an electrical touch contact therebetween.
    Type: Grant
    Filed: January 6, 2005
    Date of Patent: April 12, 2011
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: YiuSing Ho, GuoHong Lu, CanHua Chen
  • Patent number: 7921543
    Abstract: A method of manufacturing a disk drive is disclosed. After installing at least one disk into a base, a media cover is coupled to the base, wherein the media cover covers at least a portion of the disk. After coupling the media cover to the base, a head coupled to an actuator arm and a voice coil motor for rotating the actuator arm about a pivot is installed into the base. After installing into the base the head coupled to the actuator arm and the voice coil motor, the media cover is removed from the base. After removing the media cover from the base, a HDA cover is coupled to the base to form a head disk assembly (HDA).
    Type: Grant
    Filed: November 2, 2009
    Date of Patent: April 12, 2011
    Assignee: Western Digital Technologies, Inc.
    Inventors: Suwan Trongjitwikrai, Pranee Thonghara, Chanidapa Tangjitwatanakorn, Komgrit Sungkhaphong
  • Patent number: 7918013
    Abstract: A system and method for the production level screening of low flying magnetic heads in the manufacture of disk drive head disk assemblies (HDAs) is disclosed. A test disk is provided and has a plurality of bumps extending from at least one surface thereof to a predetermined height between 2 and 12 nanometers. The test disk is rotated to fly a head of a head gimbal assembly selected from the group adjacent the surface of the test disk. An interaction of the head with one or more of the plurality of bumps may be sensed and the head gimbal assembly may be screened out from the group in response to the sensing of the interaction.
    Type: Grant
    Filed: March 11, 2008
    Date of Patent: April 5, 2011
    Assignee: Western Digital (Fremont), LLC
    Inventors: Victor K. F. Dunn, Ciuter Chang
  • Patent number: 7900341
    Abstract: A high yield in a manufacture of an HDD having a high recording density and using a patterned medium by a trench-like or a dot-like pattern is realized. In this HDD manufacturing method, a magnetic field size (writing and reading) of a head in a head manufacturing process is measured in a head unit inspection process. According to the result of the measurement, the head is classified into a plurality of groups in a head classifying process. In a patterned medium manufacturing process, a plurality of types of the patterned media which are designed so as to correspond to the classified head groups are manufactured. In an HDD assembly process, the HDD is manufactured by combining the plurality of head groups and the plurality of patterned media following a predetermined rule.
    Type: Grant
    Filed: January 29, 2009
    Date of Patent: March 8, 2011
    Assignee: Hitachi, Ltd.
    Inventor: Yoshiteru Katsumura
  • Patent number: 7891079
    Abstract: A bending apparatus of a head gimbal assembly includes a suction unit configured to attract the head gimbal assembly, a movement unit configured to move a long tail connected to a terminal part, a stopper against which the moved long tail is butted, a transmission type optical sensor configured to detect that the long tail is positioned to the stopper, a tail holder configured to hold a part of the long tail on a work table, a roller configured to compress the terminal part against the tail holder and to bend the terminal part relative to the long tail at a right angle, and a controller configured to control, based on a detection result of the transmission type optical sensor, a movement of the tail holder to the work table and a movement of the roller to the tail holder.
    Type: Grant
    Filed: June 23, 2009
    Date of Patent: February 22, 2011
    Assignee: Toshiba Storage Device Corporation
    Inventors: Hiroshi Nozawa, Yukio Kato
  • Patent number: 7893534
    Abstract: A thermally insulating bonding pad for solder reflow is described. The bonding pad includes a structure. The structure forms the bonding pad. The bonding pad further includes an insulator formed on the structure. The insulator is configured to be interposed between the structure and a substrate of a component onto which said bonding pad is to be disposed. The bonding pad provides thermal insulation for said substrate when said bonding pad is subject to a solder reflow process being performed thereon.
    Type: Grant
    Filed: August 10, 2007
    Date of Patent: February 22, 2011
    Assignee: Hitachi Global Storage Technologies, Netherlands, B.V.
    Inventors: Toshiki Hirano, Haruhide Takahashi, Tatsumi Tsuchiya
  • Patent number: 7882616
    Abstract: In one embodiment, a method can include providing first and second intermediate structures, each having first and second surfaces. Also, the method can include placing the first surface of the first intermediate structure adjacent to the first surface of the second intermediate structure, such that the first and second intermediate structures are in a stacked relationship. Additionally, the method can include simultaneously removing at least a portion of each of the second surfaces of the first and second intermediate structures while in the stacked relationship. Furthermore, the method can include forming a plating layer on each of the first and second surfaces of each of the first and second intermediate structures. Moreover, the method can include forming a magnetic layer on the second surface but not the first surface of each of the first and second intermediate structures.
    Type: Grant
    Filed: August 29, 2005
    Date of Patent: February 8, 2011
    Assignee: Seagate Technology LLC
    Inventor: Joseph Allen
  • Patent number: 7845067
    Abstract: A method for assembling an actuator assembly includes providing a first housing portion and a second housing portion; providing a coil, a pole piece, a magnet, and a completed beam; positioning the coil, pole piece, magnet, and completed beam between the housing portions; and coupling the housing portions together.
    Type: Grant
    Filed: July 8, 2008
    Date of Patent: December 7, 2010
    Assignee: International Business Machines Corporation
    Inventor: David Harper
  • Patent number: 7841065
    Abstract: A load beam having a bent rail, a suspension that includes the load beam, and a related method for manufacturing a load beam. The method includes providing the load beam before the bent rail is formed, and coining the load beam at a location where the bend will occur in the rail.
    Type: Grant
    Filed: May 24, 2007
    Date of Patent: November 30, 2010
    Assignee: Magnecomp Corporation
    Inventor: Leroy Dwayne Wielenga
  • Patent number: 7832082
    Abstract: A method for manufacturing an integrated lead suspension component. One or more first conductive ground planes are formed on a stainless steel base layer. One or more second conductive ground planes, including portions on the surface of the first conductive ground planes, are formed at void portions and backed portions of the stainless steel base layer. The material of the second conductive ground planes is non-reactive to a first etchant. An insulating layer is formed on the second ground planes on the side opposite the stainless steel base layer and on the stainless steel base layer. Traces are formed on the insulating layer. Voids are formed in void portions of the stainless steel base layer using the first etchant and the second conductive ground planes at the void portions as etch stops.
    Type: Grant
    Filed: October 10, 2006
    Date of Patent: November 16, 2010
    Assignee: Hutchinson Technology Incorporated
    Inventors: Reed T. Hentges, Kurt C. Swanson, Peter F. Ladwig
  • Patent number: 7805827
    Abstract: In one embodiment of the present invention, a method of producing a magnetic head slider comprises the steps of forming, on the air bearing surface of the slider, an air bearing surface overcoat, removing the surface region from a hard amorphous carbon film by the irradiation with an ion beam which is tilted with respect to a normal to the air bearing surface, and forming a rail in the air bearing surface on which the air bearing surface overcoat has been formed. A high density and covering performance are obtained when the angle of irradiating the ion beam is not smaller than about 60 degrees from a normal to the air bearing surface of the magnetic head slider and when the acceleration voltage for the ion beam is not higher than about 300 V in the step of removing part of the air bearing surface overcoat.
    Type: Grant
    Filed: July 12, 2006
    Date of Patent: October 5, 2010
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Nobuto Yasui, Hiroshi Inaba, Shinji Sasaki, Kazuhito Miyata
  • Patent number: 7774923
    Abstract: A method of fabricating a cartridge for an optical data storage disc includes attaching a plastic shell and a sheet metal cover plate. The shell includes lateral walls and a floor that together define a disc cavity and a plurality of assembly posts. The sheet metal cover plate includes a plurality of holes. To attach the cover plate to the shell, the assembly posts are inserted into the holes, and the ends of the assembly posts are heated to form mushroom caps which hold the cover plate against the shell. The optical disc is housed in the disc cavity, with the data side of the disc facing the cover plate. A sheet metal shutter is wrapped around an edge of the cartridge and over the shell and cover plate.
    Type: Grant
    Filed: November 1, 2007
    Date of Patent: August 17, 2010
    Assignee: Vmedia Research, Inc.
    Inventors: Steven B. Volk, Gregory Dimitri Volan, Rene D. Kumar Anirudhan, PK Bala
  • Patent number: 7774922
    Abstract: A method for manufacturing disk drive head suspension components includes supporting the components from carrier strips and/or other components by tab regions consisting substantially of a polyimide insulating layer. The components are detabbed by severing the insulating layer at the tab regions.
    Type: Grant
    Filed: February 22, 2007
    Date of Patent: August 17, 2010
    Assignee: Hutchinson Technology Incorporated
    Inventors: Mark M. Kiviahde, Jacob D. Bjorstrom, Ryan D. Kariniemi
  • Patent number: 7757379
    Abstract: A suspension assembly for a hard disk drive includes at least two spring extensions that couple to a proximal portion of a load beam. These spring extensions are disposed by a vertical offset and couple to the load beam on opposite sides of a longitudinal axis of the load beam. The method for operating a disk drive apparatus includes following by a suspension assembly from a reference position to a second position a vertical movement of a rotating disk. The suspension assembly is predisposed to move from the reference position to the second position by the vertical offset. A read/write head coupled to the suspension assembly is in closer alignment to a selected track during the vertical movement in the second position than if the first and second spring extensions were disposed to be co-planar.
    Type: Grant
    Filed: July 31, 2008
    Date of Patent: July 20, 2010
    Assignee: Magnecomp Corporation
    Inventors: Martin John McCaslin, Khampon Sittipongpanich, Sitthipong Footrakul, Visit Thaveeprungsriporn
  • Patent number: 7739785
    Abstract: Embodiments of the present invention provide a head gimbal assembly manufacturing method which can attach another magnetic head slider to a suspension to be reused without addition of solder. According to one embodiment of the present invention, a head gimbal assembly (HGA) is attached to a jig. Both sides of a portion close to the rear end of a magnetic head slider are gripped with hot tweezers heated at about 200° C. They are heated for about four seconds while applying force in a direction of peeling off the magnetic head slider from gimbals, thus removing the magnetic head slider from the gimbals. When another magnetic head slider is attached to the suspension, an adhesive adhered to the gimbals is removed and another adhesive is applied to the gimbals. The back of another magnetic head slider is pressed to the adhesive, whereby the magnetic head slider is fixed to the gimbals. Next, the solder fillet left on the gimbals is irradiated with laser beams to be melted and joined to an electric terminal.
    Type: Grant
    Filed: June 26, 2007
    Date of Patent: June 22, 2010
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Kenjirou Watanabe, Yoshio Uematsu, Yousuke Fukumoto, Yohtaroh Ichimura
  • Patent number: 7730604
    Abstract: A method for assembling a disk drive includes providing a head stack assembly (HSA), providing a shipping comb for assembling the disk drive, inserting a comb pin of the shipping comb into a locating holes in a HSA to assemble the shipping comb with the HSA together, positioning the HSA and shipping comb on a base cover of the disk drive, installing the HSA on the base cover via a bearing device thereof, rotating the assembled HSA and shipping comb to park the HSA on the ramp and aligning the comb pin with the securing hole, pushing the comb pin into a securing hole to lock the HSA in the base cover, assembling a latch device and a top voice coil magnet on the base cover, and rotating out the shipping comb to a position where the shipping comb is not interfered with the disk drive.
    Type: Grant
    Filed: December 19, 2008
    Date of Patent: June 8, 2010
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Ho Yiusing, Canhua Chen, Qinping Zhao, Shenghe Yang
  • Patent number: 7694410
    Abstract: A new fixture which is capable of holding an HAS throughout all processes so that Quasi-Static Test can be done before swaging. Also, a process for testing the HAS by means of the fixture. An embodiment method may include loading head gimbal assemblies and an actuator using an automatic loading machine; in-line dressing of the head gimbal assemblies; ultrasonic bonding of the head gimbal assemblies; testing said head gimbal assemblies in-line while quasi-static; and if an head gimbal assemblies fails to pass the testing, rejecting and reworking in-line; in-line coating of the head gimbal assemblies; ultra-violet curing of the head gimbal assemblies; in-line swaging said head gimbal assemblies and actuator to form an head stack assemblies; and visual checking and unloading of said head stack assemblies.
    Type: Grant
    Filed: November 24, 2004
    Date of Patent: April 13, 2010
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Takehiro Kamigama, Huegung Wang, Yiusing Ho, Chunkau Leung, Waikong Cheung, Shinji Misawa, Jinsuo Sun, Wenxin Chang
  • Patent number: 7681302
    Abstract: A system and method are disclosed for improving suspension-to-slider attachment in a hard disk drive. A slider having a number of bond pads on its leading edge and a number of bond pads on its trailing edge is to be coupled to a suspension flexure having a number of leading bond pads and a number of trailing bond pads. The slider is to be coupled to the suspension flexure at the leading bond pads and the trailing bond pads by a method such as gold ball, solder ball, or solder bump bonding.
    Type: Grant
    Filed: January 27, 2003
    Date of Patent: March 23, 2010
    Assignee: SAE Magnetics (H. K.) Ltd.
    Inventor: Takehiro Kamigama
  • Patent number: 7673381
    Abstract: A method of manufacturing a head suspension includes forming a rigid part chain product where the rigid parts are provided continuously, including forming a plate-like framework for formation of the rigid part including formation margins for formation of the rails and forming a deformable part along a longitudinal curve of each formation margin and forming the rails by bending the formation margins to rise, forming a resilient member chain product where the resilient members are provided continuously, forming the flexures, forming the bases, and a stacking and coupling step stacking and coupling the rigid part chain product, the resilient member chain product, the bases, and the flexures, to form a stacked set, and cutting and separating respective head suspensions from the stacked set.
    Type: Grant
    Filed: May 8, 2006
    Date of Patent: March 9, 2010
    Assignee: NHK Spring Co., Ltd.
    Inventors: Kenichi Takikawa, Masao Hanya, Noriyuki Saito
  • Patent number: 7661187
    Abstract: The present invention relates to providing the manufacturing method for a magnetic disk drive that includes the process steps of detecting and processing in a simplified way the defective sectors causing a reading error at low operating environmental temperatures. In one example, defective sectors are detected by read/write testing at high operating environmental temperatures from, for example, 40° C. to 65° C. Reading the data written on the defective sectors makes it obvious that the gain in a high-frequency band is reduced. After test data has been written onto each sector, the filtering coefficient of an FIR element that is set for a data-reading system is changed from the optimum value. The frequency gain is thus reduced. Next, the test data is read and the sectors that have caused a reading error are registered as defectives.
    Type: Grant
    Filed: December 5, 2005
    Date of Patent: February 16, 2010
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Masato Taniguchi, Michio Nakajima, Kaoru Umemura
  • Patent number: 7650685
    Abstract: A method of manufacturing a head suspension for a hard disk drive includes a rigid part chain product manufacturing step forming a rigid part chain product where rigid parts are provided continuously, a flexure manufacturing step forming the flexure integrated with the resilient part and the reinforcing parts, a base manufacturing step forming the base, a stacking and coupling step stacking and connecting the rigid part chain product, the resilient part chain product, the bases, and the flexures, to form the stacked set, and a cutting step cutting and separating respective head suspensions from a stacked set.
    Type: Grant
    Filed: May 8, 2006
    Date of Patent: January 26, 2010
    Assignee: NHK Spring Co., Ltd.
    Inventors: Hajime Tada, Masao Hanya, Kenichi Takikawa, Eiji Watadani
  • Patent number: 7640649
    Abstract: A method which enables easy removal of a magnetic head slider soldered to a suspension and easy reuse of the removed parts. In the method for removing the magnetic head slider, heat is applied to a suspension to which at least a part of the magnetic head slider is joined by solder so as to remove the magnetic head slider from the suspension. The heating is locally applied to the junction area of the magnetic head slider and the suspension, which is joined by the solder.
    Type: Grant
    Filed: August 9, 2005
    Date of Patent: January 5, 2010
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Hiroshi Fukaya, Satoshi Yamaguchi
  • Patent number: 7624495
    Abstract: A lubricant is applied to swage contact surfaces in a disk drive of the type including a suspension arm connected to an actuator arm by a swaging process. A preferred thin film lubricant may be applied to the contact surfaces by immersion and draining, immersion and raising the part out of the solution, localized spraying, or various deposition processes. Application of the lubricant reduces chipping during de-swaging, particularly with nickel plated metal components. Application of the lubricant has also shown to improve gram load uniformity, reduce adverse distortion to the actuator assembly and reduces torque out retention values. Improved gram load uniformity enhances overall disk drive functioning, reduced distortion preserves intended attitude and flatness of the actions for assembly and reduced torque out retention values improves reworkability of the disk drive.
    Type: Grant
    Filed: January 18, 2006
    Date of Patent: December 1, 2009
    Assignee: Maxtor Corporation
    Inventors: Mark S. Crowder, Richard E. Rupp, Jr., John McCrandall
  • Patent number: 7619856
    Abstract: Embodiments of the invention provide a head gimbal assembly (HGA) provided with a solder ball connecting structure suitable for the re-utilization of a suspension assembly. In one embodiment, the HGA includes lead wires provided at front ends thereof with lead pads and also includes slider pads capable of being connected to the lead pads by solder ball bonding with the use of solder balls. Respective grooves formed in the surfaces of the slider pads inhibit the solder balls from rotating and moving over the surfaces of the slider pads and the lead pads before the radiation of a laser beam.
    Type: Grant
    Filed: December 22, 2005
    Date of Patent: November 17, 2009
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Yuhsuke Matsumoto, Tatsushi Yoshida, Noriyuki Saiki, Yukihiro Isono, Hideo Yamakura