Abstract: The present disclosure provides a power conversion device. The power conversion device includes the multi-level power factor correction circuit, the at least one output capacitor, the at least one input capacitor group, the first resonant conversion circuit and the second resonant conversion circuit. The at least one input capacitor group includes the first input capacitor and the second input capacitor. The at least one output capacitor is connected to an output part of the multi-level power factor correction circuit. The at least one input capacitor group is connected to the at least one output capacitor in parallel. The second input capacitor is connected to the first input capacitor in series. The input part of the first resonant conversion circuit is connected to first input capacitor in parallel. The input part of the second resonant conversion circuit is connected to the second input capacitor in parallel.

Abstract: A system and method of using electrochemical additive manufacturing to add interconnection features, such as wafer bumps or pillars, or similar structures like heatsinks, to a plate such as a silicon wafer. The plate may be coupled to a cathode, and material for the features may be deposited onto the plate by transmitting current from an anode array through an electrolyte to the cathode. Position actuators and sensors may control the position and orientation of the plate and the anode array to place features in precise positions. Use of electrochemical additive manufacturing may enable construction of features that cannot be created using current photoresist-based methods. For example, pillars may be taller and more closely spaced, with heights of 200 ?m or more, diameters of 10 ?m or below, and inter-pillar spacing below 20 ?m. Features may also extend horizontally instead of only vertically, enabling routing of interconnections to desired locations.

Abstract: In a coil 5 of a multilayer coil component 1, an end portion 6a of a turn 6 closest to a side surface 2e in the facing direction of the side surface 2e and a side surface 2f is connected to a first external electrode 3 and an end portion 11a of a turn 11 closest to the side surface 2f in the facing direction of the pair of side surfaces 2e and 2f is connected to a second external electrode 4. The area at which the turn 6 faces the second external electrode 4 and the area at which the turn 11 faces the first external electrode 3 are smaller than the area at which turns 7, 8, 9, and 10 other than the turn 6 and the turn 11 face the first external electrode 3 or the second external electrode 4.

Abstract: Methods for making layered materials and layered materials including high atomic number metals and metal alloys adhered to surfaces are provided. Such surfaces may be oxygen or hydroxyl rich surfaces. Certain methods include depositing a tie down layer of a first metal or metal alloy particles onto a first surface of base material and depositing a high atomic number metal or metal alloy layer onto the first surface after depositing the tie down layer, wherein particles comprising the high atomic number metal or metal alloy layer have a higher atomic number than the first metal or metal alloy particles.

Abstract: An axial alignment assembly (100) comprising a first body and a second body. The first body has a substantially cylindrical outer jacket, and has a first alignment axis. The second body comprises a substantially cylindrical inner jacket, and has a second alignment axis. The second body is positioned with respect to said first body in so that said inner jacket faces said outer jacket and in between said inner jacket and said outer jacket a substantially annular recess is formed. The axial alignment assembly further comprises a plurality of resilient elements that are positioned within said annular recess, wherein each resilient element is in contact with said outer jacket of said first body and with said inner jacket of said second body. Each resilient element exerts a force onto said outer jacket and onto said inner jacket for aligning said first alignment axis and said second alignment axis.

Abstract: A multilayer coil component includes a multilayer body that is formed of laminated insulating layers and that contains a coil, and a first outer electrode and a second outer electrode that are electrically connected to the coil. The coil is formed of coil conductors. The first outer electrode covers a part of a first end surface of the multilayer body, extends from the first end surface, and covers a part of a first main surface thereof. The second outer electrode covers a part of a second end surface of the multilayer body, extends from the second end surface, and covers a part of the first main surface. A lamination direction of the multilayer body and an axial direction of the coil are parallel to a mounting surface. Determination marks are formed on surfaces of the multilayer body at locations at which the first and second outer electrodes are formed.

Abstract: A sensor coil assembly comprises a positioning sensor comprising a wound coil formed by a first conductive wire segment wound around a longitudinal axis. The first conductive wire segment can include a first coil end and a second coil end. A second conductive wire segment can extend from the first coil end of the first conductive wire segment. The second conductive wire segment can be wound around a first bobbin. A third conductive wire segment can extend from the second coil end of the first conductive wire segment. The third conductive wire segment can be wound around a second bobbin.

Abstract: A controller of an isolated switching converter having a primary and secondary switch, the controller includes a valley detection circuit for providing a valley pulse signal in response to valleys of a resonant voltage, a pulse frequency modulation circuit for providing a pulse frequency modulation signal based on a feedback signal indicative of an output voltage, a primary on enable circuit for providing a primary on enable signal based on the pulse frequency modulation signal and valley pulse signal, a secondary logic circuit for generating a secondary control signal to control the secondary switch based on a primary off detection signal, a zero cross detection signal and the primary on enable signal, and a primary logic circuit for generating a primary control signal to control the primary switch based on a synchronous signal electrically isolated from the primary on enable signal.

Abstract: An induction heating type cooktop includes a cover plate that is coupled to a top of a case and that includes an upper plate configured to seat an object to be heated, a working coil disposed inside the case and configured to heat the object, an insulator disposed between a bottom surface of the upper plate and the working coil, and a thin film that is disposed on at least one of a top surface of the upper plate or the bottom surface of the upper plate and that includes a plurality of sub-films that are arranged about a central portion of the thin film. An outer boundary of one of the plurality of sub-films is positioned radially outward of an outer boundary of another of the plurality of sub-films relative to the central portion of the thin film.

Abstract: A circuit breaker pole for low voltage or medium voltage operation includes: a main body section; a first end section; and a second end section. The first end section is fixedly connectable to a wall of an enclosure. The second end section is fixedly connectable to the wall of the enclosure.

Abstract: Provided is a coil component that includes a coil part having a planar coil that includes a winding section and an insulating section covering the winding section, and a magnetic resin layer including a magnetic filler and configured to cover the coil part. The magnetic resin layer has a first magnetic resin layer that is in contact with the coil part and a second magnetic resin layer that is laminated on the first magnetic resin layer. The second magnetic resin layer constitutes a principal surface of the magnetic resin layer, and a maximum particle size of the magnetic filler contained in the second magnetic resin layer is larger than that of the magnetic filler contained in the first magnetic resin layer.

Abstract: An electronic component 100 includes: a circuit board module 104 which is composed of a plurality of layers, and in which a primary circuit 120 and secondary circuits 122, 124 are each formed using wring patterns of a first layer L1 to an eighth layer L8; and a magnetic core 106 which magnetically couples the primary circuit 120 and the secondary circuits 122, 124. The circuit board module 104 includes: a primary winding 120b and secondary windings 122b, 124b which are formed spirally around the magnetic core 106; and a third layer L3 and a sixth layer L6 interposed between a fourth layer L4 of the primary winding 120b and a second layer L2 of the secondary winding 122b and between a fifth layer L5 of the primary winding 120b and a seventh layer L7 of the secondary winding 124b.

Abstract: Disclosed is a method for manufacturing an MSO coil, comprising: a pressing step of forming a bent surface on a part of a unit coil layer, which has a ring shape such that both ends thereof face each other, thereby endowing both ends of the unit coil layer with a height difference; a fixing step of connecting and fixing a plurality of unit coil layers to each other, each unit coil layer having the bent surface formed thereon, such that the first end of both ends of a unit coil layer having the bent surface formed thereon contacts the second end of both ends of another unit coil layer having the bent surface formed thereon; and a bonding step of bonding connection parts defined by contact of the first and second ends of each of the plurality of unit coil layers that are connected and fixed to each other.

Abstract: A coil component is disclosed. The coil component includes a body having one surface and the other surface opposing each other, and a plurality of wall surfaces connecting one surface and the other surface to each other; a coil part embedded in the body and having both ends exposed to both end surfaces of the plurality of wall surfaces of the body, opposing each other; an insulating layer covering one surface of the body; and first and second external electrodes disposed on both end surfaces of the body, respectively, to extend onto the insulating layer, and including a bonded conductive layer disposed on the insulating layer, and an external conductive layer disposed on the bonded conductive layer, respectively.

Abstract: A ceramic electronic device includes a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, the plurality of internal electrode layers being exposed to at least one of a first end face and a second end face of the multilayer chip, the first end face being opposite to the second end face, external electrodes respectively provided on the first end face and the second end face, and a water repellent agent that is provided on at least one face of four faces of a rectangular parallelepiped shape of the multilayer chip other than the first and second end faces, is spaced from the first and second external electrodes, and extends in a direction intersecting with a direction in which the external electrodes face with each other.

Abstract: Methods/structures of forming embedded inductor structures are described. Embodiments include forming a first interconnect structure on a dielectric material of a substrate, selectively forming a magnetic material on a surface of the first interconnect structure, forming an opening in the magnetic material, and forming a second interconnect structure in the opening. Build up layers are then formed on the magnetic material.

Abstract: This disclosure relates generally to substrates having three dimensional (3D) inductors and methods of manufacturing the same. In one embodiment, the 3D inductor is a solenoid inductor where the exterior edge contour of the winding ends is substantially the same and substantially aligned with the exterior edge contour of the exterior edge contour of conductive vias that connect the windings. In this manner, there is no overhang between the windings and the conductive vias. In another embodiment of the 3D inductor, via columns connect connector plates. The via column attachment surfaces of each of the conductive vias in each of the columns is the same and substantially aligned. In this manner, carrier pads are not needed and there is no overhand between the conductive vias.

Abstract: A magnet (7) for use in an apparatus (1) for performing magnetic resonance imaging (MRI) of a patient's head is an asymmetric magnet (7) comprising a plurality of coils (45, 46, 47) that are aligned along a cylindrical axis (29) to provide a magnetic field on the cylindrical axis (29). The magnet (7) has a patient end (23) arranged to be positioned adjacent or against a patient's shoulders with the patient's shoulders outside the magnet (7). The magnet has a recess (27) for receipt of the patient's head and extending into the magnet (7) from the patient end (23). The magnet (7) is configured to provide an imaging volume (35) that is positioned along the cylindrical axis (29) of the magnet (7) in the recess (27), and at least a major part of the imaging volume (35) has a substantially linear non-zero magnetic field gradient along the cylindrical axis (29).

Abstract: An inductor includes: a body including a support member including a through-hole and a via hole, an insulator disposed on the support member and including a first opening exposing portions of the support member, and a coil pattern disposed in the first opening, and including a plurality of layers including a seed layer in contact with the support member; and an external electrode disposed on an external surface of the body and electrically connected to the coil pattern. The support member may have a multilayer structure of at least first and second insulating layers, and the via hole may penetrate through both of the first and second insulating layers.

Abstract: An assembly with a secondary coil arranged on a coil carrier for a field device is described, wherein the field device comprises an electronics and an inductive interface connected to the electronics, and wherein the assembly can be used in the field device such that the field device can be connected via its interface to an inductive interface of a superordinate unit such that the secondary coil of the assembly, with a primary coil of the inductive interface of the superordinate unit, form a transformer for transmitting data and/or energy, which makes it possible to reduce the dimensions of field devices equipped with it and also contributes to increased operational safety, in that an assembly circuit formed by the secondary coil and at least one electronic component connected to the secondary coil via lines connected to it and arranged on the coil carrier is arranged on the coil carrier.

Abstract: An inductor may be fabricated comprising a magnetic material layer and an electrically conductive via or trace extending through the magnetic material layer, wherein the magnetic material layer comprises dielectric magnetic filler particles within a carrier material. Further embodiments may include incorporating the inductor of the present description into an electronic substrate and may further include an integrated circuit device attached to the electronic substrate and the electronic substrate may further be attached to a board, such as a motherboard.

Abstract: First internal conductors are separated from each other in a first direction. Each of the first internal conductors includes a coil portion and a pad portion having a width larger than a width of the coil portion. The pad portions adjacent to each other in the first direction are connected to each other via a through-hole conductor and overlap each other when viewed from the first direction. When viewed from the first direction, each of the coil portions includes a first portion not overlapping the pad portion adjacent in the first direction and a second portion overlapping a part of the pad portion adjacent in the first direction. A second internal conductor is disposed on the same layer as the second portion and is positioned to overlap a portion of the pad portion adjacent in the first direction not overlapping the second portion when viewed from the first direction.

Abstract: In an exemplary embodiment, a coil component includes: a drum core 10 having a winding shaft 12 and a pair of flange parts 14a, 14b; and a coil 30 constituted by a conductive wire 34 with insulating sheath 38 being wound around the winding shaft 12, forming one or more layers 32 in a direction which crosses an axial direction of the winding shaft 12; wherein the conductive wire 34 is exposed to and faces, at each of the one or more layers 32, a void 64 formed between the flange part 14a and the flange part 14b, wherein the void 64 is present at each of the one or more layers 32 in succession from one end to the other end of the conductive wire 34 as viewed in the axial direction of the winding shaft 12.

Abstract: An inductor is formed in an IC device packaging structure. The structure includes an encapsulating material, with a ferromagnetic core in the encapsulation material. A plurality of metal layers are provided in the encapsulation material forming an inductor coil extending around the ferromagnetic core so as to form an inductor.

Abstract: A magnetic coupling coil component includes: a main body including a first region, a second region disposed on a top side of the first region, and a third region disposed on a bottom side of the first region; a top-side coil conductor provided in the second region of the main body and wound around a coil axis extending in a top-bottom direction; and a bottom-side coil conductor provided in the third region of the main body and wound around the coil axis. The top-side coil conductor includes a plurality of top-side conductive patterns, and the plurality of top-side conductive patterns include a first top-side conductive pattern which is positioned closest to the first region among the plurality of top-side conductive patterns, and a number of turns of the first top-side conductive pattern is larger than an average of numbers of turns of the plurality of top-side conductive patterns.

Abstract: Methods for selective deposition, and structures thereof, are provided. Material is selectively deposited on a first surface of a substrate relative to a second surface of a different material composition. A passivation layer is selectively formed from vapor phase reactants on the first surface while leaving the second surface without the passivation layer. A layer of interest is selectively deposited from vapor phase reactants on the second surface relative to the passivation layer. The first surface can be metallic while the second surface is dielectric, or the second surface is dielectric while the second surface is metallic. Accordingly, material, such as a dielectric, can be selectively deposited on either metallic or dielectric surfaces relative to the other type of surface using techniques described herein. Techniques and resultant structures are also disclosed for control of positioning and shape of layer edges relative to boundaries between underlying disparate materials.

Abstract: The invention relates to a method for producing an electromagnetic valve assembly (10), a planar metal sheet (12), which has through-slots (16) extending parallel to a longitudinal axis (14) of the sheet, and a disc (18), which has disc projections (22) that are complementary in shape to the through-slots (16), being provided, the disc projections (22) being engaged with the through-slots (16), and a coil housing (38) then being formed by the planar metal sheet (12) being shaped by non-overlapping roller-deforming along the longitudinal axis (14) of the sheet, around a circumference (20) of the disc (18). The invention further relates to an electromagnetic valve assembly (10) which has been produced in particular by means of such a method.

Abstract: A coil component includes a plurality of conductor layers constituted of a first conductor layer to a fourth conductor layer that includes a function layer and a coil layer wound around an axis center; and a covering portion that is formed of an insulative resin, integrally covers the plurality of conductor layers, and is interposed between conductor layers adjacent to each other. The coil layer and the function layer of the plurality of conductor layers have substantially the same shape in a plan view. The fourth conductor layer has a connection conductor layer connecting the coil layer and the function layer to each other. A conductor layer having no connection conductor layer among the plurality of conductor layers has a protrusion portion corresponding to the connection conductor layer at a position overlapping the connection conductor layer in a plan view.

Abstract: A device includes a polymer. A device die is disposed in the polymer. A passive device includes three Through Assembly Vias (TAVs) penetrating through the polymer, wherein the TAVs are coupled in series. A Redistribution Line (RDL) is underlying the polymer. The RDL electrically couples a first one of the TAVs to a second one of the TAVs.

Abstract: A coil conductive wire has a coil part wound around a pillar part, and flat-shaped connection end parts provided at respective ends of the coil part. Terminal electrodes are electrically connected to the connection end parts, each of which terminal electrodes has an electrode layer and a conductive layer covering the electrode layer. Each connection end part has a first principle face connected to a surface of the electrode layer, a second principle face projecting from a surface of the conductive layer, and a side face. The conductive layer has a flat area, and a skirt area provided between the flat area and the side face and sloping onto the side face. The thickness of the flat area is smaller than that of each connection end part, while the thickness of the skirt area decreases in the direction away from the side face.

Abstract: A cage with a fastening system (1) in a magnetic resonance device (MRD) is disclosed, said cage in an MRD comprising (a) M pole pieces (45) (M?2); (b) N side magnets (20) (N?2), said side magnets substantially enclosing said pole pieces and thereby defining a magnetic envelope and enclosed volume therein; (c) N side walls (10), said side walls substantially enclosing said side magnets; (d) P face walls (30) (P?2); and (e) a plurality of fastening rods (100); wherein each of said fastening rods physically interconnects at least one pair of side walls, passing through at least one of said side magnets and at least one of said pole pieces.

Abstract: A laminated circuit board includes a base having a first surface, and a second surface on an opposite side from the first surface, a first metal layer provided in the base and including a first electrode exposed from the first surface, and a second metal layer provided in the base and including a second electrode exposed from the second surface. The first metal layer includes an inductor electrically connected to the first electrode, and the first electrode and the second electrode are bonded and electrically connected to each other.

Abstract: A self-powering tamper detection system architecture includes a power source, a tamper detector configured to identify a tamper event, a tamper switch electrically connected to the power source and mechanically connected to the tamper detector, a tamper controller configured to produce a tamper response when the tamper event is identified, and program memory configured to store program data. The tamper detector is configured to mechanically actuate the tamper switch when a tamper event occurs, and the tamper response provides a disruption of the program data. The tamper detector and the tamper switch can include printed circuit board and embedded transformer, whereby the embedded transformer includes an axially-moveable ferromagnetic core.

Abstract: An inductor or transformer with the inductor can include one or more windings split into strands along a radial path of the winding and provide for a more uniform current distribution across a width of the winding. The winding(s) can comprise twisting components as twistings or strand crossings located at various locations along the winding. The twisting components span the winding along a winding width with a connector or crossing strand and change a position of one strand to another at points that different strands of the winding are cut or spliced.

Abstract: A manufacturing method of a coil component for forming a coil-assembly body in which a coil is mounted on a magnetic-body core, comprising the steps of: inputting the coil-assembly body and an admixture containing a magnetic powder and a resin into a container; applying pressure onto the admixture which is inputted into the container; depressurizing an air pressure of an environment, in which the admixture is placed, to become a negative-pressure lower than the atmospheric pressure at least during the pressurizing process in the step of applying pressure; applying vibration onto the admixture and filling the admixture in the container at least during the depressurizing process in the step of depressurizing; and curing the resin contained in the admixture for the integrated object of the admixture and the coil-assembly body which passed through the step of depressurizing and the step of applying vibration.

Abstract: The method for producing the electric module comprises: securing at least one first electrical component (108, 110) to a first plate (102); then assembling each first electrical component (108, 110) to an electrical connection bar (104) to which at least one second component (120) is already secured.

Abstract: A coil electronic component includes a magnetic body that includes a substrate and a coil part. The coil part includes patterned insulating films disposed on a surface of the substrate and a plating layer formed between the patterned insulating films by plating and having a thickness greater than or equal to its width measured parallel to the surface of the substrate. The plating layer may be formed in a single plating operation, and may have a thickness of 200 ?m or more.

Abstract: Co-fired integrated circuit devices and methods for fabricating and integrating such on a workpiece are disclosed herein. An exemplary method includes forming a first passive device and a second passive device over a carrier substrate. The first passive device and the second passive device each include at least one material layer that includes a co-fired ceramic material. The carrier substrate is removed after performing a co-firing process to cause chemical changes in the co-fired ceramic material. The first passive device may include a conductive loop disposed between a first magnetic layer and a second magnetic layer. The first magnetic layer, the second magnetic layer, or both includes a co-fired ceramic magnetic material. The second passive device may include a first conductive layer and a second conductive layer separated by a dielectric layer. The first conductive layer, the second conductive layer, or both includes a co-fired ceramic conductive material.

Abstract: An inductor structure includes a first curve metal component, a second curve metal component, and a connection component. The first curve metal component is disposed on a layer. The layer is located at a first plane, the first curve metal component is located at a second plane, and the first plane is perpendicular to the second plane. The second curve metal component is disposed on the layer. The second curve metal component is located at the second plane. The connection component is coupled to the first curve metal component and the second curve metal component.

Abstract: An electronic component having a multilayer body that includes a plurality of insulating layers that are stacked on top of one another; a plurality of first coils that are arranged inside the multilayer body in a stacking direction of the multilayer body and are electrically connected to each other; a plurality of second coils that are arranged inside the multilayer body in the stacking direction of the multilayer body and are electrically connected to each other; an inner ground electrode that is provided inside the multilayer body and is arranged between two of the first coils, which face each other in the stacking direction; and a ground terminal that is connected to the inner ground electrode.

Abstract: A coil component includes: a body; and external electrodes disposed on an external surface of the body. The coil part may include a first coil layer and a second coil layer connected to the first coil layer, each of the first and second coil layers may include a plurality of coil patterns, the plurality of coil patterns of the first coil layer may include a first connection coil pattern physically connected to the second coil layer, the plurality of coil patterns of the second coil layer may include a second connection coil pattern physically connected to the first connection coil pattern, and an upper surface of the first connection coil pattern may come into direct contact with a lower surface of the second connection coil pattern.

Abstract: An inductor device includes at least two wires and at least two switches. Each of the at least two wires includes an opening, and the openings are disposed correspondingly to each other. One of the at least two switches is coupled to two terminals of the opening of one of the at least two wires. Another one of the at least two switches is coupled to one terminal of the opening of the one of the at least two wires and one terminal of the opening of another one of the at least two wires in an interlaced manner. If the one of the at least two switches is turned on, one of the at least two wires forms an inductor; if another one of the at least two switches is turned on, both of the at least two wires form the inductor.

Abstract: A sensor package includes a semiconductor die including at least one current sensor. The semiconductor die includes a first pass through hole extending from one side of the semiconductor die to an opposite side of the semiconductor die. The semiconductor package further includes a second pass through hole extending from one side of the sensor package to an opposite side of the sensor package. The second pass through hole is aligned with the first pass through hole and is configured to receive a current-carrying conductor. The at least one current sensor senses current flow in the current-carrying conductor received in the second pass through hole. An end of the current-carrying conductor is coupled to a terminal on a circuit board in the sensor package.

Abstract: There are provided a chip electronic component and a manufacturing method thereof, and more particularly, a chip electronic component having an internal coil structure capable of preventing the occurrence of short-circuits between coil portions and having a high aspect ratio (AR) by increasing a thickness of a coil as compared to a width of the coil, and a manufacturing method thereof.

Abstract: A capacitor component includes a body including a dielectric layer and an internal electrode and an external electrode disposed on the body. The external electrode includes an electrode layer connected to the internal electrode, a plating layer disposed on the electrode layer, and a secondary phase material disposed at a boundary between the plating layer and the electrode layer. The secondary phase material contains sulfur (S).

Abstract: A method for manufacturing an electronic component is provided. The method includes: placing an air-core coil in a mold; placing a mixture of a metal magnetic material and a thermosetting resin into the mold so as to embed the air-core coil in the mixture; after placing the mixture, applying a pressure to the placed mixture so that a shape of the placed mixture conforms to the air-core coil and the mold; and after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened, wherein a viscosity of the mixture is 1,000 to 1,000,000 mPa·s at room temperature.

Abstract: A method of producing electrical coils includes preparing a plurality of coil layers. Each coil layer is prepared by printing an electrically conductive coil pattern on a layer substrate. Each coil pattern includes an inner end at a first via through the substrate at a point radially inside the coil pattern, and an outer end at a second via through the substrate at a point radially outside the coil pattern. The method also includes joining the coil layers into a stack and electrically connecting successive coil patterns of the plurality of coil layers to one another through the vias to form a conductive coil extending through the stack.

Abstract: In a method, control computer and magnetic resonance (MR) apparatus for generating MR recordings of an examination object, first magnetic MR data are acquired in a first recording region inside a homogeneity volume of the scanner of the MR apparatus, and second MR raw data are acquired in a second recording region outside the homogeneity volume. First image data are reconstructed on the basis of the first MR raw data and second image data are reconstructed on the basis of the second MR raw data. The first image data and the second image data are combined to form combination image data, which cover a region that extends in the first recording region and in the second recording region.

Abstract: A magnetic body constituted by magnetic grains bonded together via oxide film, which magnetic grains contain a Fe—Si-M soft magnetic alloy (where M is a metal element more easily oxidized than Fe) that contains sulfur atoms (S). The magnetic body preferably contains 0.004 to 0.012 percent by weight of S, 1.5 to 7.5 percent by weight of Si, and 2 to 8 percent by weight of metal M.

Abstract: A printed wiring board comprises a sheet-shaped core base material containing a magnetic material, a coil disposed inside the core base material, and an external circuit layer disposed on at least one of first and second surfaces of the core base material opposite to each other.