Multitrack Heads Having Integral Holding Means Patents (Class 29/603.19)
  • Publication number: 20100064507
    Abstract: A method of manufacturing a magnetic head that includes a reproducing head, a recording head, and an isolation film for magnetically isolating the reproducing head and the recording head from each other. The method includes the steps of: forming the reproducing head; forming the recording head; and forming the isolation film. The isolation film is formed by stacking a plurality of insulating films formed by chemical vapor deposition.
    Type: Application
    Filed: November 16, 2009
    Publication date: March 18, 2010
    Applicant: TDK Corporation
    Inventors: Yoshitaka Sasaki, Tohru Inoue
  • Patent number: 7591064
    Abstract: A method is presented for fabrication of a tape medium read head having a unitary formation of multiple elements for reading multi-track data from a magnetic tape. The method includes providing a continuous substrate layer, and forming a sensor material layer on the continuous substrate layer. Photoresist material is deposited on the sensor material layer, and is patterned to form masks which provide protected areas and exposed areas of the sensor material layer. Exposed areas of the sensor material layer are shaped to form sensors from the protected areas of the sensor material layer. Electrical lead materials are deposited between and adjacent to the sensors, and the masks are removed.
    Type: Grant
    Filed: July 20, 2005
    Date of Patent: September 22, 2009
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventor: Ian Robson McFadyen
  • Patent number: 7356909
    Abstract: A method is provided for forming a CPP MTJ or GMR read sensor in which the free layer is self-stabilized by a magnetization in a circumferential vortex configuration. This magnetization permits the pinned layer to be magnetized in a direction parallel to the ABS plane, which thereby makes the pinned layer directionally more stable as well. The lack of lateral horizontal bias layers or in-stack biasing allows the formation of closely configured shields, thereby providing protection against side-reading. The vortex magnetization is accomplished by first magnetizing the free layer in a uniform vertical field, then applying a vertical current while the field is still present.
    Type: Grant
    Filed: September 29, 2004
    Date of Patent: April 15, 2008
    Assignee: Headway Technologies, Inc.
    Inventors: Tai Min, Pokang Wang, Min Li, Otto Vogeli
  • Patent number: 7275302
    Abstract: A method of forming a disc pack for use in a disc drive is provided. The method includes forming at least one alignment feature between an inner diameter and an outer diameter of each of a plurality of discs. The at least one alignment feature of a first disc of the plurality of discs and the at least one alignment feature of a second disc of the plurality of discs are utilized to substantially vertically align servo patterns on the first disc with servo patterns on the second disc. A disc pack having discs that include alignment features for aligning servo patterns on the discs is also provided.
    Type: Grant
    Filed: December 9, 2003
    Date of Patent: October 2, 2007
    Assignee: Seagate Technology LLC
    Inventor: Hwaliang Ng
  • Patent number: 6646829
    Abstract: An object of the invention is to facilitate processing and to obtain sliders as many as possible when the sliders for thin-film magnetic heads are manufactured through the use of a circular-plate-shaped wafer in which a plurality of rows of sections to be the sliders are aligned. The circular-plate-shaped wafer includes the rows of the sections to be the sliders aligned in one orientation. Each of the sections to be the sliders includes a thin-film magnetic head element. Three types of slider materials having different widths are cut out from the wafer. Each of the three types of slider materials includes rows of the sections to be the sliders. Processing including lapping is performed on a surface to be medium facing surfaces of each of the three types of slider materials. The materials are then separated to form slider aggregates each of which includes one of the rows of the sections to be the sliders. Rails are formed in a surface to be the medium facing surfaces of the slider aggregates.
    Type: Grant
    Filed: November 15, 2002
    Date of Patent: November 11, 2003
    Assignee: TDK Corporation
    Inventors: Yoshitaka Sasaki, Akinori Koyama, Hiroyuki Itoh
  • Patent number: 6513229
    Abstract: An object of the invention is to facilitate processing and to obtain sliders as many as possible when the sliders for thin-film magnetic heads are manufactured through the use of a circular-plate-shaped wafer in which a plurality of rows of sections to be the sliders are aligned. The circular-plate-shaped wafer includes the rows of the sections to be the sliders aligned in one orientation. Each of the sections to be the sliders includes a thin-film magnetic head element. Three types of slider materials having different widths are cut out from the wafer. Each of the three types of slider materials includes rows of the sections to be the sliders. Processing including lapping is performed on a surface to be medium facing surfaces of each of the three types of slider materials. The materials are then separated to form slider aggregates each of which includes one of the rows of the sections to be the sliders. Rails are formed in a surface to be the medium facing surfaces of the slider aggregates.
    Type: Grant
    Filed: March 31, 2000
    Date of Patent: February 4, 2003
    Assignee: TDK Corporation
    Inventors: Yoshitaka Sasaki, Akinori Koyama, Hiroyuki Itoh
  • Patent number: 6446326
    Abstract: The method comprises the steps of: forming an integrated device including a microactuator in a semiconductor material wafer; forming an immobilization structure of organic material on the wafer; simultaneously forming a securing flange integral with the microactuator and electrical connections for connecting the integrated device to a read/write head; bonding a transducer supporting the read/write head to the securing flange; connecting the electrical connections to the read/write head; cutting the wafer into dices; bonding the microactuator to a suspension; and removing the immobilization structure.
    Type: Grant
    Filed: May 5, 1999
    Date of Patent: September 10, 2002
    Assignee: STMicroelectronics S.r.l.
    Inventors: Ubaldo Mastromatteo, Bruno Murari, Benedetto Vigna, Sarah Zerbini