Abstract: A circuit arrangement can be used for adapting the electroacoustic properties of an electroacoustic component. The circuit arrangement includes a first conductor loop and a further element. The first conductor loop includes a main loop and a negative feedback loop. The negative feedback loop has a sense of curvature that is opposite to a sense of curvature of the main loop. The negative feedback loop compensates for a coupling between the main loop and the further element.

Abstract: A semiconductor device having a polymer layer and a method of fabricating the same is provided. A two-step plasma treatment for a surface of the polymer layer includes a first plasma process to roughen the surface of the polymer layer and loosen contaminants, and a second plasma process to make the polymer layer smoother or make the polymer layer less rough. An etch process may be used between the first plasma process and the second plasma process to remove the contaminants loosened by the first plasma process. In an embodiment, the polymer layer exhibits a surface roughness between about 1% and about 8% as measured by Atomic Force Microscopy (AFM) with the index of surface area difference percentage (SADP) and/or has surface contaminants of less than about 1% of Ti, less than about 1% of F, less than about 1.5% Sn, and less than about 0.4% of Pb.

Abstract: A phase change material (PCM) switch is disclosed that includes a resistive heater element, and a PCM element proximate the resistive heater element. A thermally conductive electrical insulating barrier layer positioned between the PCM heating element and the resistive heating element, and conductive lines extend from ends of the PCM element and control lines extend from ends of the resistive heater element.

Abstract: Disclosed herein is a method for manufacturing a high frequency inductor, the method including; forming a primary coil for manufacturing the high frequency inductor on a wafer; coating a primary PSV on the wafer on which the primary coil is formed; forming a secondary coil for manufacturing the high frequency inductor, after the coating of the primary PSV; coating a secondary PSV, after the forming of the secondary coil; forming a barrier layer on an electrode portion to be exposed of the high frequency inductor, after the coating of the secondary PSV; filling and curing an insulating resin on the wafer, after the forming of the barrier layer; and polishing the cured resin up to the barrier layer to expose the electrode.

Abstract: A write head includes a first pole P1, a P1 pedestal, a first back gap layer plated on top of the first pole P1 leaving a region between the P1 pedestal and the first back gap layer for plating a coil. Further, a first insulation layer is applied on top of the P1 pedestal and the first back gap layer and the region between the P1 pedestal and the first back gap layer. The write head further includes a coil, patterned at least partially on top of the P1 pedestal and the first back gap layer and the region between the P1 pedestal and the first back gap layer, copper plated in the coil patterns, and a second insulation layer is applied to fill the spaces in between the coil turns. The resulting structure is planarized via chemical mechanical polishing.

Abstract: A manufacturing method for a thin-film magnetic head including first and second magnetic layers, a gap layer, a thin-film coil, and a coil insulating layer for insulating neighboring ones of turns of the thin-film coil. The manufacturing method includes the steps of: forming the first magnetic layer; forming the gap layer on the first magnetic layer; forming the second magnetic layer on the gap layer; forming the thin-film coil; and forming the coil insulating layer. The coil insulating layer is formed by stacking a plurality of insulating films formed by chemical vapor deposition.

Abstract: In one embodiment and method of the present invention, a coil of a write head is created by forming a P1 pedestal layer and a back gap layer and further forming a coil pattern consistent with the coil to be formed and insulator spacers dispersed in the coil pattern, using a non-damascene process, thereafter the coil is formed by plating using a damascene process.

Abstract: A method of constructing a differential inductor having a high self-resonance frequency is provided. In general, a ground point is identified. A first coil having a first and second loop is created such that the first loop is electrically further away from the ground point than the second loop. A second coil having a third and fourth loop are created such that the third loop is electrically further away from the ground point than the second loop. The first coil and the second coil are positioned such that the first loop is positioned as a near neighbor to said fourth loop and said second loop is positioned as a near neighbor to said third loop.

Abstract: An inductor embedded in a substrate, including a substrate, a coil electrode formed by filling a metal in a spiral hole formed on the substrate, an insulation layer formed on the substrate, and an external connection pad formed on the insulation layer to be connected to the coil electrode. The inductor-embedded substrate can be used as a cap for a micro device package by forming a cavity on its bottom surface.

Abstract: A method of applying an outer insulation to a bare stator bar to form an insulated stator bar. The method entails extruding at least one extruded member that will form the outer insulation. The extruded member has an opposing pair of edges that are parallel to the longitudinal length of the extruded member. In addition, the extrusion process creates an inner cavity that extends the longitudinal length of the extruded member. A bare stator bar is then inserted into the inner cavity of the outer insulation so that the outer insulation surrounds the perimeter of the bar and extends along a longitudinal length thereof. The opposing pair of edges of the extruded member are then attached together so that the perimeter of the bar is entirely enclosed by the extruded member.

Abstract: A manufacturing process is provided where aggressive (i.e. tight tolerance) stitching offers several advantages for magnetic write heads but at the cost of some losses during pole trimming. This problem has been overcome by replacing the alumina filler layer, that is used to protect the stitched pole during trimming, with a layer of electroplated material. Because of the superior step coverage associated with the plating method of deposition, pole trimming can then proceed without the introduction of stresses to the stitched pole while it is being trimmed.

Abstract: A method for fabricating a magnetic write head with a coil with a high aspect ratio using a Chemical Vapor Deposition process such as Atomic Layer Deposition (ALD), High Speed ALD, Plasma Enhanced ALD (PEALD), Plasma Enhanced Chemical Vapor Deposition (PECVD) or Low Pressure Chemical Vapor Deposition (LPCVD) to form encapsulating films over the coils without voids is disclosed. Materials which can be used for encapsulation include Al2O3, SiO2, AlN, Ta2O5, HfO2, ZrO2, and YtO3. The use of an ultra-conformal deposition process allows the pitch of the coils to be smaller than it is possible in the prior art. The method also allows materials with a smaller coefficient of thermal expansion than hardbake photoresist to be used with resulting improvements in thermal protrusion characteristics.

Abstract: An actuator/coil assembly (136) is disclosed where two different bonding operations are used. First, a bobbin (164) is overmolded to a coil (172), and a first overmolded part (176) is overmolded to both the coil (172) and a fan tail (152) of the actuator (140). The overmolding operation defines one or more adhesive receptacles (168) in the bobbin (164) on a perimeter that interfaces with the coil (172), and further defines one or more adhesive receptacles (180) in the first overmolded part (176) on a perimeter that interfaces with the coil (172) and that interfaces with the fan tail (152) of the actuator (140). Adhesive (184) is disposed within these receptacles (168, 180) to increase the stiffness of the actuator/coil assembly (136).

Abstract: The invention is directed to a method for manufacturing a thin film magnetic head comprising forming a first coil, a first pole piece and a first back gap piece on a first insulating film formed on a surface of a first magnetic film, so that the first coil, the first pole piece and the first back gap piece have a taper angle making a sectional shape wider in a lower part and narrower in an upper part; forming a second insulating film on surfaces of the first coil, the first pole piece and the first back gap piece; forming a first seed film on the second insulating film; growing a first plating film for a second coil on the first seed film in an area where the second coil is to be formed, so that the first plating film fills up spaces between the first pole piece and an outermost coil turn of the first coil, between coil turns of the first coil, and between an innermost coil turn of the first coil and the first back gap piece; and flattening the first plating film by polishing, so that to obtain a pattern of t

Abstract: A method and apparatus for forming a high conductance, high aspect ratio structure in a single low temperature copper chemical vapor deposition step. A trench for a winding of a coil is formed by forming a first length of the trench in the insulation layer. The first length of the trench forms a first portion of the winding of the coil in a confined area proximate a yoke region. A second length of trench is formed in the insulation layer extending away from the first length of the trench and the yoke region. The second length of trench includes parallel trenches for forming a second portion of the winding in a nonconfined area. A metal is deposited into the first length of the trench and the second length of the trench to form the first and second portions of the winding of the coil.

Abstract: A method of fabricating an inductor includes selecting a substrate, depositing a layer of magnetic material on the substrate, depositing an insulating layer on the magnetic material layer, forming a inductor pattern from gold on the insulating layer, depositing a second insulating layer on the inductor pattern, and depositing a second magnetic material layer on the second insulating layer.

Abstract: A method of applying an outer insulation to a stator bar to form an insulated stator bar. The method entails extruding at least one extruded member that will form the outer insulation. The extruded member has an opposing pair of edges that are parallel to the longitudinal length of the extruded member. The extrusion process creates an inner cavity that extends the longitudinal length of the extruded member. A bare stator bar is then inserted into the inner cavity of the outer insulation so that the outer insulation surrounds the perimeter of the bar and extends along a longitudinal length thereof. The edges of the extruded member are then attached together so that the perimeter of the bar is entirely enclosed by the extruded member.

Abstract: A system and method are provided for manufacturing a coil structure for a magnetic head. Initially, an insulating layer is deposited with a photoresist layer deposited on the insulating layer. Moreover, a silicon dielectric layer is deposited on the photoresist layer as a hard mask. The silicon dielectric layer is then masked. A plurality of channels is subsequently formed in the silicon dielectric layer using reactive ion etching (i.e. CF4/CHF3). The silicon dielectric layer is then used as a hard mask to transfer the channel pattern in the photoresist layer using reactive ion etching with, for example, H2/N2/CH3F/C2H4 reducing chemistry. To obtain an optimal channel profile with the desired high aspect ratio, channel formation includes a first segment defining a first angle and a second segment defining a second angle. Thereafter, a conductive seed layer is deposited in the channels and the channels are filled with a conductive material to define a coil structure.

Abstract: A thin film magnetic head is described, the magnetic head having an insulating layer and a protrusion which has an upper portion and a base portion, and the upper portion has an extended portion. The insulating layer is present under the extending part. A method of manufacturing the magnetic head includes forming a first insulating layer around the lower core layer; simultaneously forming a coil layer by plating the lower core layer with a coil insulating underlayer interposed between the lower coil layer and a coil lead layer connected to the coil layer on the first insulating layer; forming a coil insulating layer of an inorganic material on the coil layer and the coil lead layer; and, simultaneously forming a first plating underlayer for forming an upper core layer by plating, a second plating underlayer on the first coil lead layer exposed through the plating-forming opening, and a current-carrying lead layer.

Abstract: A method of sealing a generator stator bar and a stator bar end fitting receiving the end including the steps of: brazing the fitting to the end of the stator bar with a braze material; applying a metallic barrier coating material to the end of the stator bar in the fitting; heating the fitting at a temperature at least as hot as a liquidus temperature of the metallic coating material and cooler than a solids temperature of the braze material; coating the end of the stator bar in the fitting with liquid metallic barrier coating material, and solidifying the liquefied metallic coating material to form a metallic barrier coating on the end of the stator bar in the fitting.

Abstract: A Damascene process is provided for manufacturing a coil structure for a magnetic head. During the manufacturing process, an insulating layer is initially deposited after which a photoresist layer is deposited. A silicon dielectric layer is then deposited on the photoresist layer. After masking the silicon dielectric layer, at least one channel is etched in the photoresist layer and the silicon dielectric layer. Then, a conductive seed layer is deposited in the at least one channel. The at least one channel is then ready to be filled with a conductive material and chemically/mechanically polished to define a coil structure.

Abstract: A Chemical Mechanical Polish (CMP) process and slurry therefore slurry that is capable of removing NiFe, SiO2, Photoresist, Ta, alumina and Cu at substantially the same rate. The slurry is useful for obtaining a substantially planar surface of several materials while avoiding corrosion of Cu coil and NiFe structure.

Abstract: A a method for fabricating a structure, such as a magnetic head, having two coplanar metallic features of different compositions, both deposited on their own seed layers. The features may be made tall relative to their widths (ie. have a high aspect ratio), and are also very closely spaced. Only a single high-definition, critically aligned photolithographic procedure is used to create the critical structures, avoiding any problem with aligning features produced by multiple procedures. The method is applied to the production of the write structure of a magnetic read/write head, where a portion of the pole structure and the inductive coils are fabricated in the same plane with a close spacing and both having a vertical aspect ratio of more than about 2:1.

Abstract: A method for protecting a write head coil during write pole notching using ion mill resistant mask formed by reactive ion etching is disclosed. Ion mill shaping of the write pole is performed after depositing an ion mill-resistant material to protect the coil.

Abstract: A method for fabricating a coil and pedestal for a write head using a common seed layer is described. A nonmetallic gap layer is deposited on a planarized pole piece surface. Openings for the pole piece pedestal and the back gap pole piece are etched through the nonmetallic gap layer. A seed layer comprising a magnetic material is deposited on the etched gap layer. Preferably the coil is fabricated first on the planar surface of the seed layer. The coil structure, the pedestal pole piece, back-gap pole piece, side and center tap connections are fabricated on the same seed layer. The remaining seed layer is removed, the coil is encapsulated, the wafer is refilled with alumina and the wafer is planarized. The prior art process can be resumed at this point. Optionally a second seed layer such as copper (Cu) can be used.

Abstract: Methods suitable for use in making a write coil of a magnetic head includes the steps of forming a seed layer made of ruthenium (Ru) over a substrate; forming, over the seed layer, a patterned resist having a plurality of write coil trenches patterned therein; electroplating electrically conductive materials within the plurality of write coil trenches to thereby form a plurality of write coil layers; removing the patterned resist; and performing a reactive ion etch (RIE) in ozone gas (O3) for removing exposed seed layer materials in between the plurality of write coil layers. Advantageously, the write coil layers remain undamaged from the RIE in the ozone gas. Other structures may be fabricated in a similar manner.

Abstract: A method and apparatus using a pre-patterned seed layer for providing an aligned coil for an inductive head structure. The method uses an aligned process where the base plate imprint is fabricated on an electrically insulating layer and the reversed image is fabricated and etched into the coil insulation material, e.g., hard bake photoresist to alleviate the problems associated with complete ion removal of the seed layer between high aspect ratio coils. The method would also not be prone to plating non-uniformities (voids), and would not be subject to seed layer undercutting in a wet etch step process.

Abstract: A method of manufacturing a thin film magnetic head comprising an insulating layer provided between a core and a coil is provided. Also provided is a method for forming an inorganic insulation underlying layer and an organic insulation underlying layer on a lower core layer behind a recording region. The withstand voltage between the lower core layer and the coil layer can be improved because a coil is formed on the organic insulation underlying layer with an inorganic insulation layer disposed on the organic insulation layer.

Abstract: An ultra-miniature magnetic device generally comprises a conductive winding and a magnetic core. The conductive winding includes an upper conductor and a lower conductor. The magnetic core is of an elongate rectangular or oval shape having two elongate sections and two short sections. The lower conductor is preferably positioned below the elongate sections of the magnetic core while the upper conductor is preferably positioned above the elongate sections of the magnetic core. The lower and upper conductors are electrically connected by conducting via structures that are formed in sequential steps using semiconductor processing technology. The result is a coil winding around the elongate sections, with the short sections being preferably free of windings. The process provides an advantage of avoiding shorting between the via structures and the magnetic core caused by overetching when etching the via holes.

Abstract: A method for forming at least two layers of electrical coils and their supportive resistive layers for a magnetic write head having an ultra-short yoke so that the second and any additional coil layers are formed on flat resistive surfaces to eliminate problems associated with inter- and intra-layer shorting and with shorting between coil and yoke. The resistive layers are formed with flat surfaces and desired apex angles by using a novel two-step photoresist scheme in which a layer of photoresist is first photoexposed and developed, then photoexposed a second time to cure a surface region that will remain flat during a final low temperature curing process.

Abstract: A method for forming a medium having a substrate is formed have a patterned surface with a channel pattern and a transponder having a memory is provided in the channel pattern. A conductive material is deposited in the channel pattern with the conductive material operatively associated with the transponder.

Abstract: A bottom track pole is formed on a surface of a bottom pole, a thin film coil is formed on the bottom pole to form a flat coplanar surface with the bottom track pole, a write gap film is formed on the flat coplanar surface, first and second magnetic material films constituting a top pole are formed on a flat surface of the thin film coil, and the second magnetic material film, first magnetic material film, write gap film and bottom track pole are partially removed by RIE to form a top track pole and trim structure in a self-aligned manner. The thin film coil is formed by a first thin film coil half and a second thin film coil half having coil windings which are formed in a self-aligned manner between successive coil windings of the first thin film coil half and have a two-layer structure of a first conductive film at least a part of which is formed by CVD and a second conductive film formed by electrolytic plating.

Abstract: The present invention presents a method for fabricating coil elements for magnetic write heads. A coil pattern is formed on a substrate using photolithographic techniques. The substrate is etched using reactive ion etching, creating a coil-shaped trench in the substrate. Thin film seed layers are deposited using ion beam deposition. The substrate is electroplated with metal filling the trenches with metal. The substrate is chemical mechanical polished to remove excess metal and planarize the air bearing surface of the write head.

Abstract: To fabricate a magnetic field sensor, a copper barrier film is formed. A magnetic metal film is formed on the barrier film. A plurality of trenches is formed with a desired thickness in the magnetic metal film. A copper film is formed in the plurality of trenches, so that multiple layers of magnetic metal film and copper film are formed. The RF semiconductor device equipped with the magnetic field sensor includes a magnetic field sensor made by the above method. The magnetic field sensor is attached on a semiconductor substrate. Metal wirings are formed at near the both sides of the magnetic field sensor. An insulating film is formed on top. An inductor is formed on the insulating film at predetermined locations.

Abstract: A Damascene process is provided for manufacturing a coil structure for a magnetic head. During the manufacturing process, an insulating layer is initially deposited after which a photoresist layer is deposited. A silicon dielectric layer is then deposited on the photoresist layer. After masking the silicon dielectric layer, at least one channel is etched in the photoresist layer and the silicon dielectric layer. Then, a conductive seed layer is deposited in the at least one channel. The at least one channel is then ready to be filled with a conductive material and chemically/mechanically polished to define a coil structure.

Abstract: A method of manufacturing a thin film magnetic head having superior overwrite characteristics as well as an extremely small pole width is disclosed. The thin film magnetic head has a thin film coil provided in a recess region of a bottom pole. This makes it possible to appropriately ensure a thickness of the thin film coil, as well as to reduce a thickness of a second pole tip portion, and therefore it is possible to ensure superior overwrite characteristics, as well as to form the second pole tip portion having an extremely small uniform width. The method of manufacturing a thin film magnetic head forms a recess region in a second magnetic layer close to a first magnetic layer, and forms a first thin film coil for constituting a part of the thin film coil in the recess region.

Abstract: The present invention provides a magnetic write element for use in a magnetic data recording system such as a disk drive. The invention provides a method of manufacturing a well defined coil, which avoids the problem of shallow wall angle problems exhibited by prior art methods due to coil mask shrinkage during high temperature bake. A series of trenches are provided in the coil mask, the trenches being shallower than the coil pattern, and not extending completely through the coil pattern. During the high temperature baking process shrinkage of the coil mask will be absorbed by the trenches and not transferred to the coil pattern, preventing deformation of the coil wall portion of the mask.

Abstract: A method for producing a magnetic transducer with a inductive write head having a multilayer coil with a high aspect ratio and a short yoke is provided. A damascene process is used for two coil layers and a conventional process for the third coil layer. The process of the invention allows a seed layer for the coil to be deposited on the side walls of the trenches for the first and second coil layers. In one embodiment the seed layer for the coil is preceded by an adhesion layer.

Abstract: A Damascene process is provided for manufacturing a coil structure for a magnetic head. During the manufacturing process, an insulating layer is initially deposited after which a photoresist layer is deposited. A silicon dielectric layer is then deposited on the photoresist layer. After masking the silicon dielectric layer, at least one channel is etched in the photoresist layer and the silicon dielectric layer. Then, a conductive seed layer is deposited in the at least one channel. The at least one channel is then ready to be filled with a conductive material and chemically/mechanically polished to define a coil structure.

Abstract: A method of making a magnetic read/write head using a single lithographic step to define both a write coil and a pole tip structure. The use of a thin image resist layer over a hard reactive-ion etch mask and image transfer techniques allows very high resolution optical lithography which can accommodate formation of a very compact coil and pole structure. The use of a single high resolution lithography step on a planarized structure to define both a write pole tip and a write coil coplanar with the write pole tip avoids the problems of reflective notching associated with lithography to define the pole tip in the vicinity of non-planar features of the coil structure and also eliminates alignment inaccuracies inherent in separate lithography processes for the coil and pole.

Abstract: A thin film magnetic head wherein a partial insulating layer is formed on a bottom pole layer with a gap layer provided therebetween, the gap depth Gd being regulated by the distance from a surface facing a recording medium to the partial insulating layer. A magnetic flux partially leaks from a tip region of an upper core layer to the bottom pole layer through the partial insulating layer to effectively suppress magnetic saturation of the tip region, thereby improving the NLTS characteristic and PW50 characteristic, and suppressing the occurrence of side fringing.

Abstract: A method of manufacturing the same in an accurate and stable manner, in which a magnetic path length of a thin film coil is shortened by decrease a distance between adjacent coil windings of at least one layer thin film coil. On a first magnetic layer 37, is formed an insulating layer 38, and then a first thin film coil half 40 is formed on the surface of the insulating layer such that a distance between successive coil windings is large. Then, a second thin film coil half 44 is formed such that its coil windings situate between successive coil windings of the first thin film coil half. First and second coil halves 47 and 48 of a second layer thin film coil are formed on the first layer thin film coil in a similar manner. After forming an insulating layer 52, a second magnetic layer 53 and overcoat layer 54 are formed.

Abstract: All the electrode films corresponding to respective metal materials are laminated on a substrate beforehand, a first electrode film located farthest from the substrate is formed with a first metal pattern suitable for the first electrode film, and then the first electrode film is etched away so as to expose a second electrode film located lower than the first electrode film. Therefore, the second electrode film suitable for a metal material of a second metal pattern can selectively be plated, whereby the second metal pattern can be formed while optimizing the combination of its metal material and electrode film. Also, the second electrode film for the later step does not attach to the previously formed first metal pattern.

Abstract: A method for protecting magnetic read/write head assembly against electrostatic discharge during disk drive manufacturing are disclosed. The magnetic head assembly is supported on a substrate having a magnetoresistive sensor element disposed in spaced relationship between several magnetic shield elements. Before a focused ion beam fabrication operation, at least a portion of an air bearing surface of the magnetic head assembly is coated with a thin and transparent layer of conductive material. This layer of conductive material is subsequent removed after the focused ion beam fabrication operation.

Abstract: A method for fabricating precision non-symmetrical L-shape waveguide end-launching probe for launching microwave signals in both vertical and horizontal polarizations is disclosed. The L-shape waveguide probe is in a form of thin plate, has a first arm and a second arm, and is precisely fabricated and attached to one end of the central metal pin of a feedthrough. The feedthrough is installed to an aperture formed in a major wall of the universal conductive housing to achieve hermetic sealing. The L-shape waveguide probe is aligned by means of a specially designed alignment tool so that long axis of the second arm is always perpendicular to the broad walls of the output waveguide, which is mounted to the universal housing with the broad walls of the output waveguide either horizontally or vertically. Hence, in this invention, an end-launching arrangement using the L-shape probes that could yield a flexible waveguide interface either in horizontal polarization or vertical polarization is provided.

Abstract: A read/write head is provided with an embedded planar dual coil write structure. The head includes generally parallel shield, shield/pole, and pole layers. The shield/pole layer abuts a generally coplanar planarization layer in one embodiment. A circuitous recess is defined in the shield/pole and planarization layer, spanning the junction twice and encircling a central hub of adjoining shield/pole and planarization layer material. A write structure is located in the recess, with the shield/pole layer, planarization layer, and embedded write structure forming a substantially flat surface for building the pole layer. The write structure includes first and second substantially co-planar multi-turn flat coils, where turns of the first write coil are interspersed with turns of the second write coil. The first and second write coils reside in the circuitous recess, winding around the central hub. An insulating material separates the first and second coils.

Abstract: A thin film magnetic head and a method of manufacturing the same allowing high performance head characteristics to be achieved without complicating manufacturing steps are provided. At the same time an insulating film pattern defining a throat height TH is formed, an insulating film pattern is formed. When a thin film coil is formed, a coil connection portion integral with the thin film coil is simultaneously formed on the insulating film pattern, so that an upper surface of the coil connection portion is positioned higher than that of the thin film coil. After covering the entire surface with an insulating film, a surface of the insulating film is polished until both of an upper connection portion and the coil connection portion are exposed, so that only the coil connection portion can be exposed while the thin film coil remains unexposed.

Abstract: A thin film magnetic head in which the track width at the write pole can be set at a very small value with a high degree of accuracy without having to undergo a dry etching process. A first pole tip is laminated projecting out over a first yoke. a second pole tip is laminated onto a gap film, and has a track width which is equal to the track width of the first pole tip. The areas around the first pole tip, the second pole tip and the gap film are filled with a non-magnetic insulating film. The flattened surface of the non-magnetic insulating film forms a flat surface that is the same as the surface of the second pole tip, a second yoke, whose front end portion has a track width which is larger than the track width of the second pole tip, is laminated onto the second pole tip, with its two ends in the direction of the track width laminated onto the surface of the non-magnetic insulating film.

Abstract: In a method of efficiently and promptly mass-producing a combination type thin film magnetic head having accurately defined short throat height, apex angle, and MR height or the like and capable of reducing the saturation and leakage of magnetic flux even if a magnetic pole portion is miniaturized, a recessed portion is formed in a surface of a substrate, while a first magnetic layer constituting a lower shield for the GMR element is used as a mask. A second magnetic layer is formed along an inner wall of the recessed portion. A thin film coil is formed thereon in an isolated state, and a surface is flattened to constitute a common unit for manufacturing combination type thin film magnetic heads. A number of common units are manufactured and stocked without any relationship to users' specifications.

Abstract: A method of fabricating a coil structure for use in a writer portion of a recording head is disclosed. The method comprises fabricating a bottom pole. A bottom insulating layer is fabricated on the bottom pole, while a seed layer is fabricated on the bottom insulator layer. Alternating third and fourth coil conductors are spacially positioned on the seed layer. A first plurality of insulating barriers are fabricated on the seed layer between the alternating third and fourth coil conductors. A middle insulating layer is fabricated on the third coil conductor, the second coil conductor, and the first plurality of insulating barriers. The A alternating third and fourth coil conductors are spacially positioned on the middle insulating layer. A second plurality of insulating barriers are fabricated on the middle insulating layer between the alternating third and fourth conductors.