Abstract: A method of assembly comprising a spindle bank for a pick-and-pace machine, a base including a plurality of mount locations, each of the plurality of mount locations configured to receive a mountable spindle module including at least one pick-and-place spindle and nozzle, a bearing system attachable to a movement axis of a pick-and-place machine such that the spindle bank is movable along the movement axis, and a power delivery system configured to deliver electrical power to each of the plurality of mount locations, wherein each of the plurality of mount locations is configured to deliver the electrical power to each of the mountable spindle modules when mounted.

Abstract: The pick-up tool is a tool used in a mounting device configured to mount a component on a board supported by backup pins disposed on a backup plate. The pick-up tool includes an attaching portion configured to be attached to a moving head moving the backup pin; a slit formed in an insertion direction in which an engaging portion formed on the distal end of the backup pin is inserted; and a groove, being formed orthogonally to the slit, into which the engaging portion enters.

Abstract: A mounting head includes a first air passage and a second air passage through which air is capable of flowing; a first valve configured to switch air flowing through the first air passage between positive pressure and negative pressure; a second valve configured to switch air flowing through the second air passage between positive pressure and negative pressure; a common air passage configured to communicate with the tool, through which air to be supplied to the tool is capable of flowing; and a third valve configured to selectively cause the first air passage or the second air passage to communicate with the common air passage.

Abstract: In a rotary head type component mounter, among a specified quantity of suction nozzles held by a rotary head, multiple suction nozzles are lowered simultaneously. When the rotary head is moved by a head moving mechanism to a nozzle exchange area and exchange of suction nozzles is performed, two station reference marks of the nozzle station are imaged by a mark imaging camera, image recognition is performed of the positions of the two station reference marks, and the position and angle of the nozzle station is calculated. Then, the position and angle of the rotary head is corrected to be aligned with the position and angle of the nozzle station, multiple of the suction nozzles held on the rotary head are lowered simultaneously by Z-axis driving mechanisms and simultaneously exchanged with multiple of the suction nozzles in the nozzle station.

Abstract: A rotary head, on which are arranged in a circumferential direction multiple nozzle holders each holding a suction nozzle, is provided with, separately to first negative pressure supply unit that supplies negative pressure to the suction openings of all the suction nozzles, second negative pressure supply unit that supplies negative pressure to the suction nozzle held by the nozzle holder that is lowerable when that nozzle holder is lowered. Accordingly, when performing pickup operation and mounting operation using the suction nozzle, the state of the suction nozzle is not affected by the state of the other suction nozzles.

Abstract: A wafer support system has a wafer support device and a dicing frame, wherein the wafer support device has a bottom plate and a top plate. The top plate has a support surface for supporting the wafer, and the bottom plate has a maximum diameter being larger than the maximum diameter of the top plate so that the bottom plate forms a repository for the dicing frame. The dicing frame has a plate-like shape defining a center hole, wherein the minimum diameter of the center hole is larger than the maximum diameter of the top plate so that the dicing frame sinks below the upper surface of the wafer and/or the support surface. Further, a wafer support device, a wafer support system and a mask aligner are provided.

Abstract: A transfer head for transferring micro elements includes a cavity with a plurality of vacuum paths; a suite having a plurality of suction nozzles and vacuum path components. The suction nozzles are connected to the vacuum path components respectively, and the vacuum path components are formed to connect to vacuum paths in the cavity respectively. The suction nozzles absorb or release the micro elements through vacuum pressure, which is transmitted by vacuum path components and vacuum paths of each path. When the suite is mounted in the cavity, the upper surface of the suite is arranged with optical switching components for controlling the switch of the vacuum path components and vacuum paths of each path so that the suction nozzles can absorb or release required micro element through vacuum pressure.

Abstract: A rotary head of a surface mounter includes a rotating body, an N-shaft servo motor configured to rotate and drive the rotating body and a plurality of suction nozzles attached to the rotating body in such a manner as to be movable in a direction of a rotation axis. The plurality of suction nozzles are arranged on a virtual circle with the rotation axis as the center, and the plurality of suction nozzles are configured to hold and release a component. The rotary head of a surface mounter further includes a Z-axis drive device including a Z-axis linear motor. The Z-axis drive device is configured to use the Z-axis linear motor to move, in the direction of the rotation axis, the suction nozzle that has moved to a predetermined drive position on the virtual circle.

Abstract: In a rotary head type component mounter, among a specified quantity of suction nozzles held by a rotary head, multiple suction nozzles are lowered simultaneously. When the rotary head is moved by a head moving mechanism to a nozzle exchange area and exchange of suction nozzles is performed, two station reference marks of the nozzle station are imaged by a mark imaging camera, image recognition is performed of the positions of the two station reference marks, and the position and angle of the nozzle station is calculated. Then, the position and angle of the rotary head is corrected to be aligned with the position and angle of the nozzle station, multiple of the suction nozzles held on the rotary head are lowered simultaneously by Z-axis driving mechanisms and simultaneously exchanged with multiple of the suction nozzles in the nozzle station.

Abstract: Provided is a component loading apparatus which includes: a work table comprising a working plane; a component recognizer configured to recognize components placed on the working plane of the work table; a head configured to suck the components; and a tray support for supporting a tray on which the components sucked by the head are loaded. The component loading apparatus further includes: an impurity remover configured to remove impurities attached onto the components in at least one of a first state of being placed on the working plane of the work table and a second state of being sucked by the head; and a tray analyzer configured to inspect loading positions of the components on the tray.

Abstract: A mounting device is provided with a first raising and lowering drive section configured to raise and lower an entire syringe member to which a suction nozzle that picks up a component is attached, and a second raising and lowering drive section that raises and lowers the suction nozzle only of the syringe member to which the suction nozzle is attached. The mounting device controls a raising and lowering operation of the first raising and lowering drive section based on height information that includes at least one of information of the thickness of the component and information of the height of a board. With the mounting device, it is possible to move the entire syringe member to which the suction nozzle is attached to a position closer to the board in accordance with the height of the board and the thickness of the component.

Abstract: An interference-prevention Q-axis rotation height position is set as a height position at an intermediate point of raising operation of suction nozzle, and a height position at which the component does not interfere with central protruding member on the lower surface of rotary head. Performed is control of large component interference prevention mode, in which, after picking up the component using suction nozzle at a component pickup height position that is the lower limit height position of lowering operation, the direction of the component is corrected by raising the suction nozzle to the interference-prevention Q-axis rotation height position that is a height position at an intermediate point of raising operation of suction nozzle and then rotating the component held by suction nozzle by Q-axis driving operation, and subsequently raising suction nozzle to a maximum height position of the raising operation, and then moving rotary head in the XY direction.

Abstract: In a component mounter, a gap between adjacent circular plate sections of nozzles is large enough such that a pressing roller is able to pass through in a vertical direction. Therefore, the size of a circular plate section can be made relatively small, and a rotary head can be made small. A horizontal protrusion overlaps with one or both of adjacent ring-shaped protrusions of the nozzle when viewed from above in a case in which the pressing roller is positioned between adjacent circular plate sections of nozzles. In a state with the pressing roller positioned above the gap between adjacent circular plate sections of nozzles, even if power to a Z-axis linear actuator is cut such that the raising and lowering member suddenly loses support and falls, the horizontal protrusion of the raising and lowering member engages with and stops the ring-shaped protrusion of the nozzle.

Abstract: A rotary head includes a rotating body on which a plurality of suction nozzles that suck a component at a tip end are disposed in a circumferential direction, and revolves the plurality of suction nozzles by rotation of the rotating body, in which a wall portion with a wall surface along an axial direction of a rotary axis of the rotating body, is provided on a lower surface of the rotating body, and the wall portion is provided in the vicinity of an inner circumferential side of the plurality of suction nozzles such that a reduction in pressure on the inner circumferential side of the plurality of suction nozzles caused by the revolving of the suction nozzles is suppressed.

Abstract: A mounting inspection device includes a missing component inspection device and a foreign object inspection device. The missing component inspection device is for performing missing component inspection of components mounted on a printed circuit board. The foreign object inspection device is for performing foreign object inspection in which foreign objects on a printed circuit board are inspected with regard to the printed circuit board on which a missing component is detected, based on results of the missing component inspection carried out by the missing component inspection device.

Abstract: A component mounter includes a side imaging camera that is provided to be integral with the placing head having a plurality of suction nozzles, that moves relatively with respect to the plurality of suction nozzles, and thereby that images, from a side, peripheral regions of front ends of the plurality of suction nozzles, respectively, in order. Incidentally, a component presence/absence determiner (determiner) determines the presence or absence of a component sucked on the front end of the suction nozzle, based on primary image data obtained by the side imaging camera and the calculator calculates a thickness of the component sucked on the front end of the suction nozzle, based on secondary image data obtained by the side imaging camera.

Abstract: A chuck device includes a plurality of types of chuck pawls clamping a component, a chuck pawl switching mechanism switching the chuck pawls in use among the plurality of types of chuck pawls in accordance with the type of the component to be clamped, and a driving mechanism allowing the chuck pawl switched by the chuck pawl switching mechanism to be put into a clamping operation. The chuck pawl switching mechanism is configured to use a cylindrical cam, the plurality of types of chuck pawls are placed at predetermined intervals around the cylindrical cam, a cam follower disposed in each of the chuck pawls is fitted into a cam groove in an outer peripheral surface of the cylindrical cam, and the respective chuck pawls are moved upward and downward independently of each other by the cylindrical cam being rotated.

Abstract: Acquisition or pick-up tools that themselves aid in improving the ease with which images of an acquired substrate may be captured, and methods of operating such pick-up tools, are provided. The pick-up tools may include a pick-up surface adapted to interface with a foreign substrate and a light source integrated with the pick-up tool such that light emitted from the light source passes through the pick-up surface to the foreign substrate when the foreign substrate is temporarily coupled with the pick-up surface to create a silhouette of the foreign substrate. A vision system may be adapted for capturing the silhouette of the foreign substrate when the foreign substrate is temporarily coupled with the pick-up surface. The substrate pick-up surface may be formed of one of a transparent, a semi-transparent, or a translucent material such that light may at least partially pass there through.

Abstract: The present invention concerns the field of graphic apparatuses and in particular its object is an apparatus and a relative method for the so-called “weeding” of plastic or paper films having or more self-adhesive, double sided adhesive or electrostatic layers coupled with a support liner treated with a non-stick agent. The apparatus comprises analysis and cutting means adapted to map and execute weeding assisting cuts.

Abstract: Provided is a component loading apparatus which includes: a work table comprising a working plane; a component recognizer configured to recognize components placed on the working plane of the work table; a head configured to suck the components; and a tray support for supporting a tray on which the components sucked by the head are loaded. The component loading apparatus further includes: an impurity remover configured to remove impurities attached onto the components in at least one of a first state of being placed on the working plane of the work table and a second state of being sucked by the head; and a tray analyzer configured to inspect loading positions of the components on the tray.

Abstract: A system and method for moving directional drill pipe with vacuum power. The system is used with a vacuum beam mounted on a boom. It has a vacuum pad that is pivotally attached at one end by a hinge to the vacuum beam. The other end of the vacuum pad is attached to the vacuum beam via a hydraulic cylinder. Operation of the hydraulic cylinder causes the vacuum pad to rotate about the hinge and change the angle of the vacuum pad relative to the vacuum beam. Lateral movement of the vacuum pad relative to the vacuum beam is provided by one or more pinned connections located adjacent to the hinge. Vacuum pressure from the vacuum pad is used to grasp and release drill pipe.

Abstract: A component supply device is arranged adjacent to a mounter which mounts components on a board and supplies components to the mounter. This component supply device includes a replenishment section provided with a magazine which houses a component carrying member on which multiple components are arranged on a base material, and a conveyance section which conveys a component carrying member housed in the magazine and which is equipped with side surface number one to which the replenishment section is attached and side surface number two which is arranged adjacent to the mounter. The replenishment section is slidably attached with respect to side surface number one of the conveyance section.

Abstract: A suction nozzle, including a suction assistance section provided within an intake passage and connecting a side downstream of a pin and a side upstream of the pin, is provided. A cross section (the area of a cross section cut in a direction perpendicular to the direction in which the intake passage extends) of the intake passage is narrowed by the pin. Air bypasses the pin by flowing through the suction assistance section.

Abstract: A component placement device for picking up a component and placing a component on a substrate device comprises a holder which is movable at least in a main direction, as well as a nozzle for picking up a component. The nozzle is movable at least in a direction opposite the main direction relative to the holder. The component placement device comprises a fluid flow channel which opens or closes upon movement of the nozzle in the direction opposite the main direction relative to the holder, detection means for detecting the opening or closing of the fluid flow channel as well as means for controlling the movement of the holder in at least the main direction on the basis of a signal delivered by the detection means concerning the opening or closing of the fluid flow channel.

Abstract: The present invention provides a sheet glass alignment system.

Abstract: The component supply device includes a table on which a wafer sheet is carried and a pickup head which picks up a component on the wafer sheet carried on the table. The pickup head includes multiple component supply side suction nozzles, and a switching mechanism which switches the multiple component supply side suction nozzles between a pickup position at which the tip of the multiple component supply side suction nozzles faces down and a transfer position at which the tip of the multiple component supply side suction nozzles faces up. The arrangement of the multiple component supply side suction nozzles corresponds to the arrangement of multiple mounter side suction nozzles equipped on the mounting head of the mounter.

Abstract: Acquisition or pick-up tools that themselves aid in improving the ease with which images of an acquired substrate may be captured, and methods of operating such pick-up tools, are provided. The pick-up tools may include a pick-up surface adapted to interface with a foreign substrate and a light source integrated with the pick-up tool such that light emitted from the light source passes through the pick-up surface to the foreign substrate when the foreign substrate is temporarily coupled with the pick-up surface to create a silhouette of the foreign substrate. A vision system may be adapted for capturing the silhouette of the foreign substrate when the foreign substrate is temporarily coupled with the pick-up surface. The substrate pick-up surface may be formed of one of a transparent, a semi-transparent, or a translucent material such that light may at least partially pass there through.

Abstract: Acquisition or pick-up tools that themselves aid in improving the ease with which images of an acquired substrate may be captured are provided. The pick-up tools may include a pick-up surface adapted to interface with a foreign substrate and a light source integrated with the pick-up tool such that light emitted from the light source passes through the pick-up surface to the foreign substrate when the foreign substrate is temporarily coupled with the pick-up surface to create a silhouette of the foreign substrate. A vision system may be adapted for capturing the silhouette of the foreign substrate when the foreign substrate is temporarily coupled with the pick-up surface. The substrate pick-up surface may be formed of one of a transparent, a semi-transparent, or a translucent material such that light may at least partially pass there through.

Abstract: A substrate inspection device and a component mounting device are provided. The solder inspection device and the component mounting device respectively have substrate support devices that support a rear face of a printed circuit board. The substrate support device includes backup pins that support the rear surface of the printed circuit board, a location determiner that determines locations of the backup pins, and a backup pin locator that places the backup pins at the locations of the backup pins determined by the location determiner. The location determiner determines positions for supporting areas of the rear face of the printed circuit board where an electrode is covered by a resist film and where neither electronic component nor solder is present, as the locations of the backup pins.

Abstract: A component mounter which exchangeably holds rotary head in head holding unit is provided with Z-axis driving mechanism that engages lever engaging piece of the nozzle holder, which performs component pickup and mounting operations, among multiple nozzle holders held on rotary head, from above and below with pushing down roller and Z-axis lever in order to lower and raise the nozzle holder. The interval between lever engaging piece of first holder that performs component pickup and mounting operation first and lever engaging piece of last holder that performs component pickup and mounting operation last is set at a wide interval at which engagement with Z-axis lever is released, and the wide interval between lever engaging piece of first holder and lever engaging piece of last holder is used as a passage through which Z-axis lever passes in an up/down direction when rotary head is attached/removed to/from head holding unit.

Abstract: There is provided a part holding head assembly of a part mounting device including: a rotary head; a spindle configured to rotate in a first direction T with respect to a central axis of the spindle and configured to move in a second direction Z substantially parallel with an extending direction of the central axis of the spindle; a nozzle provided at a first end of the spindle; a raising part configured to move the spindle to in the second direction Z; and a contact detecting sensor configured to sense the nozzle contacting a part or the part held by the nozzle contacting a substrate and configured to generate a contact sensing signal according to the sensing.

Abstract: A mounting turn that is going to be performed from now on and the identifiers of the feeders that are the supply sources of the components for the mounting turn are read out from a mounting program, and it is determined whether there is a non-supply feeder which does not supply a component to the component supply position 13p in the feeders corresponding to the identifiers that are read out, based on the output from the component detecting sensors provided in the feeders corresponding to the identifiers that are read out. As a result, when there is not a non-supply feeder, the mounting turn that is read out is performed, and when there is a non-supply feeder, the performing of the mounting turn that is read out is suspended and another mounting turn is read out.

Abstract: A donor film tray that supplies a donor film includes: a tray main body disposed in correspondence with an edge of the donor film, and including an opening that exposes a center area of the donor film; and a clamp disposed in an area of the tray main body for clamping the edge of the donor film, and for pulling the edge of the donor film in a direction away from the tray main body using the repulsive force of a magnet.

Abstract: A tool is disclosed for separating a semiconductor die from a tape to which the die is affixed during the wafer dicing process. The tool includes a pick-up arm for positioning a vacuum tip over a semiconductor die to be removed. The vacuum tip includes a non-uniform array of vacuum holes to grip the semiconductor wafer.

Abstract: A mounting head 16 includes shaft members 23 respectively provided with suction nozzles 22, rotation driving motors 24 for individually conducting rotary movements of the shaft members 23, and vertical movement driving motors 25 which are arranged in a staggered arrangement in an opposite direction to a staggered arrangement of the shaft members 23, and adapted to individually conduct vertical movements of the shaft members 23. The rotation driving motors 24 directly drive the shaft members 23, and the vertical movement driving motors 25 move the shaft members 23 up and down, together with the rotation driving motors 24.

Abstract: A PNP apparatus may include a robotic arm, and a PNP tool head carried by the robotic arm. The PNP tool head may include a body configured to apply bonding pressure to a first area of an electronic device, and a pick-up tip movable between an extended position and a retracted position relative to the body as the pick-up tip rests against a second area of the electronic device. The pick-up tip may define a vacuum passageway therethrough to couple a vacuum source to the second area of the electronic device.

Abstract: Embodiments provide a slide assembly device having a static tooling base which is statically and solidly affixed to a base such as a table and a moveable tooling arm that is rotatable about a hinge connected to the static tooling base, so that moveable tooling arm rotates about the hinge in a manner similar to a book cover opening and closing. The embodiments further provide an upper slide chuck that is removably attachable to the moveable tooling arm and a lower slide receiver that is removably attachable to the static tooling base. The upper slide chuck is configured to hold an experimental slide via a vacuum mechanism to engagedly hold the experimental slide to the upper slide chuck while the moveable tooling arm is rotated about the hinge from an open-book position to a closed-book position.

Abstract: A mounting apparatus includes a stage device on which an installation substrate and a component are placed, a suction head provided vertically above the stage device, the suction unit moving in a direction perpendicular to the stage device, a contact attached to the suction head that comes into contact with an electrode of the component, a camera provided vertically above the suction head, the camera moving in a direction perpendicular to the suction head, and a control unit that controls operation of the stage device, operation of the suction head, application of electricity to the contact, and operation of the camera.

Abstract: A light-emitting diode (LED) wafer picker that may increase a suction force and may perform stable adsorption without a concern for contact with a top surface of an LED wafer is provided. An LED wafer picker may include a main body to hold, in an adsorbed state, an LED wafer disposed below the main body, when air drawn in from a top of the LED wafer picker is discharged along a streamlined discharge surface to both sides of the LED wafer picker, a guide member to enable the air to flow along the discharge surface, the guide member being disposed below the discharge surface, a single central hole formed in a central portion of the guide member, excluding a portion facing the discharge surface, and a support portion to support the LED wafer, the support portion extending downward from the guide member. Accordingly, it is possible to easily perform adsorption of an LED wafer that is relatively far from the LED wafer picker.

Abstract: This invention relates to a method for securing a carrier by gas pressurization to inhibit warpage of the carrier. The method includes following steps: provide a carrier with an upper surface and a lower surface which are opposite to each other; providing an evacuable jig with an apertured surface on which a plurality of apertures are provided; placing and securing one of the upper and lower surfaces of the carrier on the apertured surface in a manner of facing the apertured surface, wherein the surface of the carrier faced to the apertured surface is defined as a first surface, and the other surface opposed to the first surface is defined as a second surface; and gas pressurizing a chamber and evacuating the jig positioned in the chamber, to form a pressure difference between the first surface and the second surface of the carrier, whereby the carrier is pressed on the jig, wherein the chamber is pressurized to a predetermined pressure greater than a standard atmospheric pressure.

Abstract: There is provided a component mounting apparatus, which includes: a nozzle which sucks a component; a nozzle supporting member, on which the nozzle is installed, which moves in a vertical direction with respect to an upper surface of a substrate on which the component sucked at the nozzle is mounted; an optical system which captures an image of a leading edge portion of the nozzle where the component is sucked in a component mounting operation, from a side direction, such that an optical axis of the optical system is inclined at a predetermined angle with respect to a sucking surface of the nozzle; and an analyzer which analyzes the image of the leading edge portion to determine whether a sucking state of the component sucked by the nozzle is normal or abnormal.

Abstract: A component supplying apparatus includes a motor, a rotating body, a transmitting mechanism, and a predicting section. The rotating body engages with a carrier tape in which a plurality of components to be mounted on a circuit board by a component mounting apparatus are accommodated at predetermined pitches and pays out the carrier tape at the predetermined pitches for supplying the plurality of components. The transmitting mechanism transmits a driving force of the motor to the rotating body. The predicting section predicts a deviation amount of a supplying position of each of the plurality of components based on a model formula expressing a periodical fluctuation of the supplying position of each of the plurality of components that is due to the transmitting mechanism and caused at a time the carrier tape is paid out by the rotating body.

Abstract: A device includes a vacuum nozzle, a driver, a light source, a measuring unit, and a controller. The vacuum in the nozzle picks up and holds a light receiver. The driver drives the nozzle to press the light receiver onto a substrate such that the light receiver is electrically connected to the substrate. A light source in the nozzle illuminates the light receiver causing the generation of a first electrical signal. The measuring unit measures a second electrical signal that is a part of the first electrical signal, and the driver is controlled drive the nozzle to press harder until the second electrical signal stops increasing, the degree of conductivity between the light receiver and the substrate being then at the maximum.

Abstract: The present invention relates to a high load and high precision polygonal guide, and to a picker actuator using same, wherein the polygonal guide includes: an integrated ball cage designed and formed in a polygon and having a plurality of ball receiving holes formed on each side of the polygonal ball cage for receiving balls; a housing having a polygonal through hole for rolling motion such that, after the balls are inserted into the ball receiving holes formed on each side of the polygonal ball cage, the balls cannot escape from the ball receiving holes; and a guide post inserted and fitted inside the polygonal ball cage into which the balls are inserted and fitted, whereby the guide post or the housing reciprocates in a straight line by the rolling motion of the balls.

Abstract: A ball grid array presentment apparatus and associated method are provided. The apparatus has a stationary guard defining a first passage. A core is mounted adjacent to the stationary guard, the core being operably moveable between an unload position and a second position. The core defines a second passage and supports a workpiece fixture operably retaining the ball grid array. The unload position of the core operably aligns the second passage to the first passage, the aligned passages being sized to permit access to unload the ball grid array from the workpiece fixture. The second position of the core operably misaligns the second passage from the first passage whereat the core and the stationary guard cooperatively form an enclosure around the workpiece fixture containing a supply of balls that are not retained in the ball grid array.

Abstract: A substrate fixing apparatus includes a back-up member which is located between a pair of conveying members arranged at a distance from each other in a plan view and is below a film-like substrate conveyed along the conveyance path and supported from below by the pair of conveying members. An elevation driver moves at least one of a back-up member and a substrate pressing member upward and downward. The elevation driver elevates the back-up member and/or lowers the substrate pressing member together with the pair of conveying members, thereby separating the substrate upward from the pair of conveying members while supporting the substrate from below by the back-up member and pressing the surface of the outer peripheral part of the substrate downward by the substrate pressing member to correct warpage of the outer peripheral part of the substrate.

Abstract: A device includes a vacuum nozzle, a driver, a light source, a measuring unit, and a controller. The vacuum in the nozzle picks up and holds a light receiver. The driver drives the nozzle to press the light receiver onto a substrate such that the light receiver is electrically connected to the substrate. A light source in the nozzle illuminates the light receiver causing the generation of a first electrical signal. The measuring unit measures a second electrical signal that is a part of the first electrical signal, and the driver is controlled drive the nozzle to press harder until the second electrical signal stops increasing, the degree of conductivity between the light receiver and the substrate being then at the maximum.

Abstract: A method of sharing a test resource at a plurality of test sites executes respective test flows at the plurality of test sites with an offset in time, the respective test flows accessing the test resource at a predetermined position in the test flow.

Abstract: An object of the invention is to provide a component mounting apparatus which includes a plurality of substrate conveying lanes and which efficiently controls the order of carrying in of substrates, thereby capable of improving productivity, and also is to provide a substrate conveyance method in the component mounting apparatus. In a configuration which includes: component supplying units (20A, 20B) positioned lateral to conveyor lines including conveyors (10A, 10B, 10C, 10D) arranged in parallel; and a substrate distributing unit (M3B) configured to distribute substrates (13) delivered from an upstream apparatus, in the case where a substrate request signal (R) is output for a plurality of conveyors, a new substrate (13) is carried in from the substrate distributing unit (M3B) into conveyors (10A, 10D) which are closest to the component supplying units (20A, 20B) among the conveyors (10A, 10B, 10C, 10D).

Abstract: A workpiece transfer apparatus includes a nozzle unit and an imaging unit. The nozzle unit includes a tubular body, a suction hole opening at one end of the tubular body and an end face member of a transparent body sealing the other end of the tubular body. The imaging unit captures images of first patterns for positioning that are located on an upper surface of a workpiece. The size and shape of the suction hole fits within an outline of the upper surface of the workpiece. The end face member of the transparent body maintains a negative pressure inside the cylindrical body and permits optical penetration for the imaging unit. The imaging unit captures the image of the first pattern for positioning of the workpiece while the imaging unit views a suctioned surface of the workpiece through the transparent body and the suction hole.