Abstract: The final-bonder is equipped with a warping correction unit that is equipped in parallel with a backup stage with a distance of about 20 mm from such backup stage, and that includes accordion pads for sucking a liquid crystal panel; the backup stage that supports, from the back, the liquid crystal panel when pressure is applied to its outer edge portion at the bonding of semiconductor components; and a pressure head that carries out final bonding of the semiconductor components onto the outer edge portion of the liquid crystal panel by applying pressure and heat to them.

Abstract: A probe is provided for testing the electrical characteristics of a device. The probe includes a housing, a plurality of cables, a circuit board located within the housing, and a field-replaceable probe tip. The probe tip includes an array of contacts. Each of the plurality of cables is connected to a corresponding contact. The probe includes a retractable shroud that retracts as the probe is connected to the device. The contacts have bifurcated tips. An alignment assembly for aligning a probe with respect to a device to be tested includes a first alignment block, a second alignment block, and an alignment piece connecting the first alignment block and the second alignment block. The first alignment block and the second alignment block are arranged to be attached to the device to be tested to align the probe with respect to the device to be tested.

Abstract: A vacuum bonding tool for pick-and-place and bonding semiconductor chips onto a substrate or onto a previously mounted die to form a die stack includes a shank and a suction part. The shank has a vacuum conduit extending from a first end to a second end of the shank. The shank is adapted for cooperative engagement with the suction part at the second end, and the shank has a plate at the second end to support the suction part. The suction part has a surface for contacting a semiconductor chip during pick-and place operation. According to the invention, the suction part is made of an elastically deformable conductive or non-conductive material. In various embodiments, the chip contacting surface of the elastically deformable suction part flat overall, or is concave, of has a flat central region and concave regions.

Abstract: A nozzle unit includes a rotating body and a driving source. The rotating body includes a plurality of nozzles for holding a component using a negative pressure and rotates the plurality of nozzles. The driving source drives the rotating body in a non-contact state.

Abstract: A die sucking module comprises a holder, a sucking head arranged below the holder and used to suck a die, and two pressing structures respectively arranged below the holder and at two sides of the sucking head. Each pressing structure further comprises a pressing head pressing against an adjacent die when the sucking head sucks a die; and an elastic element providing resilience to implement the function of the pressing head. The present invention can prevent from the double-die problem and promote the yield of the die-bond process.

Abstract: A method for manufacturing an electronic device includes: preparing an electronic component having an electrode; fixing the electronic component to a supporter, the supporter having a support surface and an inlet disposed in a position that is at a side of the support surface and lower than the support surface, by supporting the electronic component with the support surface so that the electronic component does not come into contact with the inlet and so that a part of a surface of the electronic component adjacent to the support surface is exposed out of the support surface and by attracting a region of the electronic component exposed out of the support surface toward the inlet; and electrically coupling the electrode and a conductive pattern with the electronic component fixed to the supporter.

Abstract: A conductive ball mounting method for mounting conductive balls on a mount using an arraying mask, in which the mount includes mounting positions formed in a predetermined pattern, and the arraying mask is provided above the mount and includes through holes provided in positions corresponding to the mounting positions. The method includes providing a ball suction unit for sucking solder balls, the ball suction unit including a ball holding member capable of holding the conductive balls, sucking up the conductive balls below the ball suction unit, holding the conductive balls on a lower surface of the ball holding member while sucking up the conductive balls, and after the holding the conductive balls, falling the conductive balls held by the ball holding member to the mount.

Abstract: Provided is a component mounter. The component mounter comprises: a bed; a component supply unit; a conveyor transferring at least one PCB to a specified mounting position; a plurality of head units having at least one nozzle for picking up the electronic component from the component supply unit and for mounting it to the PCB; first and second Y axis transfer mechanisms; an X axis transfer mechanism having a first end of mounted to the first Y axis transfer mechanism and the second end mounted to the second Y axis transfer mechanism; a first driving unit controlling the movement of the first end of the X axis transfer mechanism along Y axis; and a second driving unit controlling the movement of the second end of the X axis transfer mechanism along the Y axis, independently of the first driving unit.

Abstract: An apparatus is provided for supporting a PCB substrate during printing. The apparatus includes first and second fixing units that cooperate to edge-clamp the substrate. The first fixing unit includes a first movable plate, a first actuator, and a first stopper that limits outward movement of the first movable plate. The second fixing unit includes a second movable plate, a second actuator, and a second stopper that limits outward movement of the second movable plate. When printing the substrate from the first edge to the second edge, the first and second fixing units operate so that the second actuator moves the second movable plate outwardly to contact the second stopper, and the first actuator moves the first movable plate inwardly to press the substrate toward the second movable plate. When printing the substrate from the second edge to the first edge the first and second fixing units operate oppositely.

Abstract: A workpiece holding method and holding system able to shorten the workpiece attachment/detachment time, wherein pressurized air is circulated through a nozzle of an ejector unit of a chuck at all times to make the inside of a suction chamber a negative pressure before chucking a workpiece, completion of chucking is detected based on a pressure value detected by a pressure sensor after chucking the workpiece, and the workpiece is unchucked by having a valve close an exhaust port to raise the pressure inside an exhaust chamber and introducing pressurized air from the ejector unit to the suction chamber.

Abstract: An electronic-component holding apparatus and an electronic-component mounting system each of which assures that a nozzle head holding a plurality of suction nozzles is easily attached to, and detached from, a head holding member, are provided. A suction surface of a head holding member is held in close contact with a to-be-sucked surface of a revolver head so as to define a head-related negative-pressure chamber that holds the revolver head by utilizing suction. The revolver head is revolved, and moved upward and downward, with the head holding member.

Abstract: A technique is provided for installing circuit components, such as memory devices, in a support, such as a socket. The device to be installed is supported in a holder or shell. The holder is positioned over a support region in the receiving socket. A manual actuator is pressed into the holder to eject the device from the holder and to install the device in the support. The holder may be configured to hold a single device, or multiple devices aligned in slots defined by partitions. A multi-device tray may be provided for indexing devices toward an ejection slot, through which the devices are installed by manual actuation of an ejecting actuator. The technique provides protection for the device prior to and during installation, and facilitates manual installation of such devices without requiring direct hand contact with the device either prior to or during installation.

Abstract: The invention relates to a method for applying an electronic component (24), which is provided with terminal faces (34, 35), to a substrate (33), which is provided with terminal faces (31, 32), wherein the component is removed from a feeding device by means of an application device (27), the component is subsequently positioned on the substrate by means of the application device in such a manner that the component terminal faces extending from a contact side (37) of the component up to a component rear side (38) and the substrate terminal faces are in an overlapping position and the terminal faces are subsequently contacted by means of a direct application of laser energy to the component terminal faces.

Abstract: A subpad support for use in a web format or belt format polishing apparatus for polishing one or more layers of semiconductor device structures. The subpad support includes a subpad retention element for nonadhesively securing the subpad thereto. The subpad support may also include one or more lips protruding therefrom so as to at least substantially inhibit lateral movement of the subpad relative to the subpad support. Polishing apparatus including the subpad support are also disclosed. The polishing pads of such polishing apparatus may be at least partially moved away from the subpad or subpad support so as to facilitate assembly of a subpad with the subpad support or removal of the subpad from the subpad support without damaging the polishing pad. Methods of removably securing a subpad to the subpad support, removing the subpad from the subpad support, and replacing another subpad on the subpad support, as well as polishing methods, are also disclosed.

Abstract: A tape feeder including an electronic component accommodating part installed at one side of a tape feeder main body to accommodate electronic components which are not picked up by a suction nozzle of an electronic component conveyance robot installed at an electronic component mounting device, thereby preventing the electronic components from clogging a carrier tape moving path, and storing the electronic components in the electronic component accommodating part. Therefore, it is possible to increase efficiency of equipment without operational delay and stoppage of the equipment, readily extract and reuse the electronic components accommodated in the electronic component accommodating part, and keep an operational environment clean.

Abstract: The invention provides an electronic component mounting apparatus which can obtain a relative vertically moving stroke of a suction nozzle and is applicable to electronic components ranging from thin to thick ones. The electronic component mounting apparatus of the invention has a suction nozzle for picking an electronic component up from a plurality of component feeding units supplying the electronic component to a component pickup position and mounting the electronic component on a printed board, where a mounting head movable along a beam can move vertically by a head vertical movement device and the suction nozzle provided on the mounting head can move vertically by a nozzle vertical movement device 50.

Abstract: The present invention relates to a Jig and method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame 21, and a rubber film 22 arranged within the outer frame 21 and having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber film 22 increases, the wafer-fixing jig 20 deforms the rubber film and allows the tapes 2 and 6 arranged between the wafer 1 and the rubber film 22A to be pushed toward the wafer 1 gradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.

Abstract: There is provided an ACF attachment device that attaches ACFs to an electronic component for saving installation space, improving mounting tact time, and reducing costs in a liquid crystal driver mounting stage. A preliminary press bonding device (102) includes a component supply unit (401), an ACF attachment device (101), and a preliminary press bonding unit (305). The ACF attachment device (101) includes an ACF attachment unit (301) that simultaneously attaches the ACFs to two sides on a panel side and a PCB side of the electronic component, an ACF tape supply unit (302) that supplies an ACF tape, a nozzle (303) that suctions and holds the electronic component, and a separator collection unit (304) that collects separators bonded to the ACFs.

Abstract: Certain example embodiments relate to a method for bonding slider row bars for a photolithography process. A holding device having a sticky surface is formed. A plurality of slider row bars is provided, with each having a first surface for forming an air bearing surface and a second surface opposite the first surface. The slider row bars are secured to the holding device with their first surfaces facing the sticky surface so that the first surfaces of the slider row bars are aligned each other. The slider row bars are bonded together by an encapsulating glue. A carrier is provided, and the carrier is bonded to the second surfaces of the slider row bars. The holding device is removed. The example embodiments also can be used to manufacture sliders.

Abstract: This invention provides an electronic component mounting apparatus which can detects an electronic component held by a suction nozzle without fail after a mounting operation of electronic components on a printed board and perform various processes in a case where the electronic component is held by the suction nozzle.

Abstract: Apparatus and associated systems or methods include a linear machine with an elongate, axially-slidable core member (i.e., shaft). In one embodiment, the shaft includes at least one radial aperture to provide fluid (e.g., air) communication from an interior volume of a winding tube that contains one or more stationary windings, to either end of the shaft through a lumen that extends axially through the length of the shaft. The stationary windings are spaced apart to permit fluid to flow through a plurality of radial apertures in the winding tube. In particular, fluid circulation across the windings may provide sufficient cooling to increase the machine's maximum current rating. The fluid circulation may also provide pneumatic processing capabilities (e.g., vacuum hold, blow-off). In one exemplary embodiment, the apparatus may be used to insert tube-and-square paper separators into battery casings at high rates.

Abstract: A pick-up tool for gripping a die comprises a sleeve and a gripping member. The sleeve has a longitudinal bore extending in the longitudinal direction in which the gripping member is inserted. The gripping member is held in the sleeve displaceably in the longitudinal direction. A portion of the gripping member protrudes from the sleeve. The gripping member assumes a predetermined position relative to the sleeve at the absence of any external action of force on the portion of the gripping member protruding from the sleeve, in which the portion of the gripping member protruding from the sleeve is held in a play-free manner radially to the longitudinal direction. In the case of action of force in the longitudinal direction on the portion of the gripping member protruding from the sleeve, the gripping member can be inserted further into the sleeve and is then radially movably held in the longitudinal bore of the sleeve. The mass of the gripping member is not more than 1 gram.

Abstract: A method and apparatus for mounting a light emitting element, enabling positioning on an object with precision with reference to the optic axis of a light emitting element, and mounting the element.

Abstract: An electronics assembly apparatus with improved pick evaluation is provided. The apparatus includes a placement head having at least one nozzle for releasably picking up and holding a component. A robotic system is provided for generating relative movement between the placement head and a workpiece, such as a circuit board. An image acquisition system is disposed to obtain at least one before-pick image of a component pick up location and at least one after-pick image of the component pick up location. The before-pick image contains a plurality of image portions, having each image portion view the pick-up location from a different point of view, while the after-pick image contains a plurality of image portions, having each image portion view the pick-up location from a different point of view.

Abstract: An apparatus for packaging a tape substrate is provided. The apparatus includes a plurality of robotic arms, a plurality of clamping elements attached to the robotic arms, a memory having a program stored therein, and a control module coupled to the memory to execute the program to perform a packaging process. The packaging process includes clamping a plurality of segments of a tape substrate to the clamping elements, encapsulating a first chip to a first side of a tape substrate to form a first capsule in a first segment, and securing a second segment of the tape substrate adjacent the first segment to a second clamping element. The packing process also includes moving the robotic arms relative to one another to stack the second segment over the first capsule. The first clamping element and second clamping element move independently of each other.

Abstract: The invention is directed to increased stabilization of a pickup operation by reducing a reaction against disturbance by reducing a feedback value when a pickup rate is improved. A positional shifting amount of an electronic component on a suction nozzle before the electronic component is mounted on a printed board is stored in a RAM each time the component is picked up at a component feeding unit until a pickup count number reaches a predetermined pickup number, and a CPU calculates an average of the positional shifting amounts. When the pickup count number reaches the predetermined pickup number, the CPU obtains a temporary coefficient by adding an initial value to a value obtained by multiplying a negative coefficient by the pickup count number, and calculates a feedback value by multiplying the temporary coefficient by the average.

Abstract: During the manufacture an aircraft, a tool-carrying rail is removably attached to a rail-side surface of the aircraft with a vacuum cup. The tool-carrying rail includes a longitudinal axis to mount a tool. The vacuum cup is stiffened along a first axis transverse to the longitudinal axis of the tool-carrying rail and the vacuum cup is stiffened along a second axis parallel to the rail-side surface of the aircraft. To removably attach the tool-carrying rail, a perimeter of the vacuum cup is removably sealed to the rail-side surface of the aircraft against vacuum loss and a point on the rail is rigidly positioned with respect to a point on the rail-side surface of the aircraft. In addition, a vacuum source is coupled to a spatial volume occupying all of a space between the vacuum cup and the rail-side surface of the aircraft and the tool is slidably positioned along the longitudinal axis of the tool-carrying rail.

Abstract: The method of manufacturing a nozzle plate, comprises the steps of: providing a liquid-repelling film on a first surface of a nozzle plate having a nozzle for ejecting liquid; then performing semi-curing of the liquid-repelling film; then providing a mask having a mask hole corresponding to the nozzle, on the liquid-repelling film; then forming a film hole in the liquid-repelling film by blowing a removing element to the liquid-repelling film; then removing the mask; and then performing full-curing of the liquid-repelling film.

Abstract: A fixture with a shaped molding may hold a first micro-actuator part and a second micro-actuator part in place for coupling while maintaining the structure of the first micro-actuator part. The first micro-actuator part and the second micro-actuator part may be a frame or a strip of piezoelectric material. A vacuum nozzle system embedded in the fixture may hold the first micro-actuator part in place. A mobile vacuum nozzle system may hold the second micro-actuator in place and positions the second micro-actuator part relative to the first micro-actuator part. A camera system may monitor the process. A dispense may apply epoxy between the first and second micro-actuator part. An ultraviolet source may provide ultraviolet radiation for curing.

Abstract: In an electronic component mounting apparatus, nozzle mechanisms are formed slender by providing shaft-type linear motors vertically upward of nozzle units and providing linear encoders vertical upward of the shaft-type linear motors, respectively. Thus, it becomes implementable to reduce the occupational area of the individual nozzle mechanisms in XY directions (horizontal direction), allowing the pitch of neighboring nozzles to be narrowed. It also becomes achievable to keep up with increasingly narrowing mounting pitches of electronic components in boards of increasingly smaller-size and higher-integration.

Abstract: A head assembly for a chip mounter is provided. The head assembly includes: a housing having a plurality of spindle receiving holes; nozzle spindles that are fitted with nozzles picking up and mounting electronic components and vertically movably inserted into the spindle receiving holes; a selection member selecting at least one of the nozzle spindles and vertically moving the selected nozzle spindle; a horizontal driver horizontally moving the selection member and changing a nozzle spindle to be selected; and an elevating driver vertically moving the selection member.

Abstract: A component mounting condition determination method is used in a component mounter of mounting components onto a board using a mounting head having plural suction nozzles, and includes: a maximum suction component number determination step (Loop A, S11 to S16) of determining the maximum number of components to be suctioned by the mounting head so as to be greater than an upper limit of a suction power within which the suction nozzles do not drop components even when the mounting head moves at a predetermined speed; and a task determination step (S18 to S20) of determining a task which is a group of components to be mounted in one iteration of a series of operations that includes suctioning, transporting, and mounting components by the mounting head, based on the determined maximum number of components.

Abstract: A component mounting apparatus including an exchangeable suction nozzle is easily supplied with another suction nozzle to replace the former suction nozzle. A plurality of mounting modules 12 having respective identical constructions are arranged adjacent to each other such that the mounting modules are oriented in a same direction, so that the mounting modules 12 constitute a mounting-apparatus line. When the mounting-apparatus line is reset, a mounting head 40 is used to exchange automatically suction nozzles 158 between a nozzle stocker 330 and a nozzle carrier plate 400, so that a current arrangement of suction nozzles on the nozzle stocker 330 is changed to a new arrangement of suction nozzles for the next component mounting operation. The nozzle carrier plate 400 can hold a plurality of sorts of suction nozzles 158 that are needed for the next component mounting operation but are not held by the mounting modules 12.

Abstract: The invention is directed to manufacturing a divided board without wasting an electronic component by judging whether or not a shortage of electronic components of a given type to be mounted on divided board portions will occur during the mounting before mounting electronic components on the divided board. A printed board having three board portions is carried onto an XY table from a supply conveyer and positioned by positioning means. Then, for each of component feeding units, a CPU judges whether or not the number of remaining electronic components is smaller than the number of necessary electronic components for manufacturing all the divided board portions. When the number is judged smaller, for example, when the number of remaining electronic components of Fdr. No. “102” is judged to be two that is less than three, the CPU calculates that the number of manufacturable divided board portions is two.

Abstract: Provided are a tape feeder for use in chip mounters that can reduce a chip feeding duration and prevent chips from being turned over or assuming wrong postures to feed the chips stably, and a chip mounting method. The tape feeder includes a second link having one end linked to a link shaft through which a first link and a pivot lever are combined and the other end in which a slot curved at a predetermined inclination is formed. The velocity at which a carrier tape is fed changes according to the inclination of the curve of the slot with respect to the moving direction of the first link, the curve contacting the contact unit upon the movement of the first link in a direction helping to rotate a ratchet gear.

Abstract: A CPU pickup device for mounting a CPU (50) to a socket (61) includes a main body (10), a suction piece (20) and a positioning mechanism (30). The suction piece is attached to the main body. The suction piece includes a suction cup (21) for picking up the CPU by means of compelling air out from the suction cup via the main body. The positioning mechanism is attached to the main body for engaging the socket to align the CPU with the socket.

Abstract: In an electronic part mounting apparatus provided with first, second and third beam members 31, 32 and 33, all supported by a common Y-axis frame at both ends thereof, holding a chip 6 by suction from an electronic part feeding unit 2 by means of a mounting head attached to the first beam member 31, and mounting the chip onto a substrate held by first and second substrate-holding units 10A and 10B, a supporting mechanism for the substrate-holding unit (an SHU-supporting mechanism) 10 is provided which supports a slide table 50, on which the first and second substrate-holding unit 10A and 10B are arranged, in such a manner that the slide table is movable between an operating position P1 and a maintenance position P2. With such configuration, the slide table 50 can be moved to the maintenance position P2 easily accessible for maintenance, leading to the improvement of working efficiency.

Abstract: A component mounting method including recover processing appropriate for use in a modular-type component mounter. The component mounting method is for use in a component mounter which includes a multi-nozzle mounting head for picking up plural components, holding the components at one time, and attaching the picked-up components in sequence on a board, and the component mounting method includes: acquiring mounting operation information; judging, based on the acquired mounting operation information, whether or not a component has been mounted properly; and in the case where the component is judged as not having been mounted properly, performing recovery by re-mounting the component not mounted properly, before moving to the task that follows the task in which the component was not mounted properly (S211 to S213). The task is defined as one iteration of a process that includes the series of pickup, transport, and attachment of a component by a multi-nozzle mounting head.

Abstract: The final-bonder (103) is equipped with: a warping correction unit (201) that is equipped in parallel with a backup stage (203) with a distance of about 20 mm from such backup stage (203), and that includes accordion pads (202) for sucking a liquid crystal panel; the backup stage (203) that supports, from the back, the liquid crystal panel when pressure is applied to its outer edge portion at the boding of semiconductor components; and a pressure head (204) that carries out final bonding of the semiconductor components onto the outer edge portion of the liquid crystal panel by applying pressure and heat to them.

Abstract: A connection device for an electric component 4 is constituted by two units 2 and 3, height position change means that changes the height position of one end 4a of the electric component 4 relative to the other end 4b is provided for a second unit 3, and the size and weight of a first unit 2 that connects the electric component 4 to a wiring board can be reduced. Therefore, the electric component 4 can be connected, under a low load, to a limited connection region of a wiring board.

Abstract: The invention is directed to an electronic component mounting apparatus which is applicable to a case in which component feeding devices need not be provided on both sides of a carrying device respectively for reasons of types of electronic components or a setting space and increases an operating rate of a beam to enhance production efficiency. An electronic component mounting apparatus has a carrying device carrying a printed board, a component feeding device supplying electronic components, a pair of beams movable in one direction by drive sources, and mounting heads each having suction nozzles and movable along the beams by drive sources.

Abstract: The invention realizes setting of measurement positions suitable for a warping state of a printed board and an easy work of setting the measurement positions. A printed board as a measurement sample is positioned three-dimensionally in X, Y and vertical directions on a positioning portion, and then a backup base is lifted up to apply backup pins to the back surface of the board and support the board horizontally. Then, the warping state of the board is measured by a height level detection device, and based on the measurement result the CPU displays the board on a monitor three-dimensionally or by contour lines. Once an operator sets measurement positions on the screen, the CPU converts each of the set positions into coordinates on the board, writes the coordinates of the set positions in the top of mounting data, and stores the data in the RAM.

Abstract: A component mounting apparatus and method for mounting a plurality of components on a board. The aparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.

Abstract: An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching tool is mounted on the standard surface that is formed on the IC socket substantially regardless of the external shape of the semiconductor device. The semiconductor device is then aligned and attached to the IC socket by using the electronic component attaching tool, and the electronic component attaching tool is removed from the IC socket. Another electronic component attaching tool suitable for an external shape of another semiconductor device is prepared, and the same procedure as the above is performed to align and attach this semiconductor device to the same type IC socket.

Abstract: A placement unit for mounting electric components onto substrates has means for moving perpendicularly to the substrate, a housing, a built-in, rotatable holder for the components, and a rotary drive for the holder mounted within the housing. The holder is connected via an axially elastic coupling to the rotary drive in a manner which is at least temporarily torsionally rigid, wherein the coupling includes a separable coupling having coupling elements arranged to be uncoupled in an axial direction. The holder is pre-stressed axially toward the component against the rotary drive by an adjustable pressure device, wherein the coupling surfaces of the coupling elements form an axial stop for the holder, and wherein the coupling surfaces separate from one another by an axial application force that acts on the holder and prevails over the axial pre-stress.

Abstract: A ball attaching apparatus for respectively attaching solder balls onto a plurality of ball lands of a material which has mold caps formed between the ball lands. The apparatus includes an indexer on which the material is seated and fixed; a holder located above the indexer such that it can be raised and lowered; an attachment plate installed on a lower surface of the holder, having projections at positions corresponding to the mold caps of the material, and defined with grooves at positions corresponding to the ball lands of the material, in which the solder balls are placed; and eject pins arranged in the respective grooves of the attachment plate for conveying and dropping the solder balls through introduction and removal of vacuum.

Abstract: A tape feeder including an electronic component accommodating part installed at one side of a tape feeder main body to accommodate electronic components which are not picked up by a suction nozzle of an electronic component conveyance robot installed at an electronic component mounting device, thereby preventing the electronic components from clogging a carrier tape moving path, and storing the electronic components in the electronic component accommodating part. Therefore, it is possible to increase efficiency of equipment without operational delay and stoppage of the equipment, readily extract and reuse the electronic components accommodated in the electronic component accommodating part, and keep an operational environment clean.

Abstract: The invention prevents reduction of a pickup rate even when a storage tape in use and a new storage tape are connected to each other with a connection tape. A component recognition camera takes an image of an electronic component held by a suction nozzle, and a recognition processing device performs recognition processing. When a positional shifting amount calculated by CPU based on the recognition processing result is more than ?, a board recognition camera takes an image of a storage portion of a storage tape storing a next electronic component to be picked up. When a positional shifting amount of the storage portion calculated based on the recognition processing result is more than ?, the CPU enables seam passage processing. Based on the image taking of the storage portion by the board recognition camera and the recognition processing by the recognition processing device which are performed each time the storage tape is fed N times, the CPU controls correction of a pickup position.

Abstract: In a method for releasing a work having an adhesive tape from a holding member which sucks and holds the work having the adhesive tape, the work having the adhesive tape is released from the holding member while supplying a gas which reduces a holding force of the holding member between the holding member and the work having the adhesive tape.

Abstract: The invention is directed to reduction of torque by reduction of an outside diameter of a mounting head. A cylindrical cam rotation motor is provided under a nozzle rotation motor. A first rotation axis member as a rotor of the nozzle rotation motor is provided along an axis line of a nozzle holder and penetrates into the nozzle rotation motor and the cylindrical cam rotation motor. A second rotation axis member as a rotor of the cylindrical cam rotation motor is provided along an axis line of a cylindrical cam member and penetrates into the cylindrical cam rotation motor. A suction nozzle to be used protrudes from a lower end surface of the nozzle holder at a protrusion position.