Abstract: A device for soldering an electrical conductor with a connection device includes a base plate having a passageway and an anvil mounted on the base plate and at least partially housed in the passageway. The anvil is electrically insulated from the base plate and positioned to allow an electrical current to pass through the electrical conductor and/or the connection device.

Abstract: A jig structure for assembling a high frequency connector includes a base on which a rotatable seat is provided, and the surface area of the rotatable seat is smaller than the base. A fixed table is provided on the rotatable seat. The fixed table further includes a first table, and an adjusting rod and a plurality of guide rods are provided on the first table. A plurality of assembly tables are provided on the adjusting rod and the guide rods. The assembly tables are correspondingly disposed, and their movement is controlled by the adjusting rod. A first assembly table and a second assembly table are provided on both sides of the fixed table. The first assembly table has movements along X-axis and Y-axis, and the second assembly stage has movements along Y-axis, thereby corresponding to the relative position of the assembly table and the fixed table so as to quickly place the circuit boards and connectors to be assemble.

Abstract: A method and an apparatus for feeding electronic components are capable of increasing a rate of filling accommodation holes with electronic components. An accommodation plate including accommodation holes, respective openings of which are distributed over a main surface of the accommodation plate, is prepared, and electronic components are loaded onto the main surface of the accommodation plate. A horizontal vibration in an X-axis direction and/or a Y-axis direction and a vertical vibration in a Z-axis direction are applied to the accommodation plate with the main surface of the accommodation plate level. The horizontal and vertical vibrations have an equal number of vibrations and a prescribed phase difference therebetween. The accommodation plate is vibrated so that each of the electronic components is fed into one of the accommodation holes while moving over the main surface of the accommodation plate.

Abstract: A method and an apparatus for feeding electronic components are capable of increasing a rate of filling accommodation holes with electronic components. An accommodation plate including accommodation holes, respective openings of which are distributed over a main surface of the accommodation plate, is prepared, and electronic components are loaded onto the main surface of the accommodation plate. A horizontal vibration in an X-axis direction and/or a Y-axis direction and a vertical vibration in a Z-axis direction are applied to the accommodation plate with the main surface of the accommodation plate level. The horizontal and vertical vibrations have an equal number of vibrations and a prescribed phase difference therebetween. The accommodation plate is vibrated so that each of the electronic components is fed into one of the accommodation holes while moving over the main surface of the accommodation plate.

Abstract: A leaded component held by suction nozzle is imaged under three types of imaging conditions, imaging in a state illuminated by laser illumination, imaging in a state illuminated by incident illumination, and imaging in a state illuminated by side illumination and incident illumination 114. In a case in which it is not possible to appropriately recognize a position of a lead by recognition processing using image data of the first set of imaging conditions, recognition processing is performed again using image data of a second set of imaging conditions different to the first set of imaging conditions. In a case in which it is not possible to appropriately recognize a position of a lead by recognition processing using image data of the second set of imaging conditions, recognition processing is performed again using image, data of a third set of imagine conditions different to the second set of imaging conditions.

Abstract: The invention relates to a device for orienting elements, in particular filter elements (F), for fitting injection-molded parts, in particular pipette tips (P), comprising an accommodating container (1a) for accommodating the filter elements (F) as bulk material, a sieve plate (1), which forms the bottom of the accommodating container and which has bores (11) for accommodating individual filter elements (F), a buffer plate (2), which is arranged under the sieve plate (1) and which has bores (2.1) corresponding to the bores of the buffer plate (2) and which is arranged below the buffer plate in such way that the transfer plate can moved in relation to the buffer plate (2).

Abstract: An assembly device for a writing head unit includes a head holder; a writing head; an imaging unit to image the writing head temporarily mounted on the head holder; an adjuster to adjust relative positions of the head holder and the writing head using the image of the writing head imaged by the imaging unit; and an optical unit to focus images of reference marks indicating a reference position of the writing head disposed in a direction different from the writing head, and the writing head on the same viewing field. The adjuster adjusts the writing head using the images of the writing head and the reference marks imaged simultaneously by the imaging unit.

Abstract: An apparatus for testing a semiconductor package including a shuttle, a socket and a pressing unit may be provided. The shuttle may include a pocket, which is configured to receive the semiconductor package and a printed circuit board (PCB). The PCB may be configured to make electrical contact with the semiconductor package. The socket may be arranged under the shuttle and include socket pins configured to make electrical contact with the PCB. The pressing unit may be arranged on the shuttle and may be movable in a vertical direction. The pressing unit may press on the shuttle toward the socket such that the semiconductor package may be electrically connected to the socket pins. Because the semiconductor package received in the shuttle may make contact with the socket at the testing region to test the semiconductor package, the semiconductor package may not fall off or may not be slanted.

Abstract: In a device for producing and/or processing a workpiece, in particular circuit boards (1), in a work station (2), in particular for printing a corresponding blank or for checking finished circuit boards (1), at least one mark (15) is provided on the workpiece. In this arrangement, at least one reference (14), which can be brought into alignment with the mark (15), is provided in the work station (2).

Abstract: The present disclosure provides an ancillary fixture for assembling a touch display and the method for using the same. The ancillary fixture comprises a first carrying member, a second carrying member, a support structure, a first positioning mechanism, and a second positioning mechanism. The first carrying member and the second carrying member are pivoted at the support structure. The first carrying member has a first carrying surface. The second carrying member has a second carrying surface opposing to the first carrying surface. The first carrying surface and the second carrying surface are used for carrying at least one component of the touch display, respectively. The first positioning mechanism and the second positioning mechanism are used for adjusting the inclination angle of the first carrying member and the second carrying member with respect to the support structure, respectively, to finish assembling the touch display.

Abstract: A retention-extraction device is provided for a removable card in a chassis. The device includes an actuation rod having a cam slot, the actuation rod configured to provide linear movement along the length of the actuation rod, and an extraction lever operatively connected to a proximal end of the actuation rod and pivotally secured to the chassis. The device also includes a bell crank with a cam follower that is configured to ride in the cam slot and a latch hook that pivots between an open and closed position based on the motion of the bell crank. The linear movement of the actuation rod causes the extraction lever to apply a force to a portion of the card and causes the latch hook to pivot to an open position to allow removal of the card.

Abstract: A pulling head work station for attaching the lugs of pulling heads to cables, so that the cables may be pulled simultaneously through a conduit. The pulling head work station includes staggered cable receiving jigs, each jig having two clamps to hold a corresponding cable in place during attachment of a pulling lug. A chop saw to cut the cables and a crimper to secure a pulling lug to each stripped end portion of a cable may be slidably mounted to a work surface of the work station. A wire stripper may be removably attached to the work station.

Abstract: A device for changing the electrode of an electrode-holder tool of a welding device, with a first part configured to house an electrode-holder tool and including means to prevent the electrode-holder tool from moving, and a second part installed around the first part and covering the part of the electrode protruding outside the first part, where the second part can be separated from the first part by sliding along the electrode, and is able to rotate relative to the fixed part when it surrounds it, and where the second part is configured to tighten or untighten the mandrel and to attach the electrode and the second part, enabling it to be removed from the mandrel when the first part and the second part are separated.

Abstract: A component aligning apparatus includes a component aligning jig, in which electronic components to be aligned have a rectangular parallelepiped shape whose length dimension is L, width dimension is W, and thickness dimension is T, the component aligning jig includes electronic component accommodating recesses opening on a surface, the depth Z of the accommodating recesses is shorter than the length L of the electronic components so that a single electronic component is held in each of the electronic component accommodating recesses while partially projecting upwards from each of the recesses with the WT surface on one side facing up, and letting s be the shortest separation that is larger than the thickness T and is the narrowest distance between opposing inside surfaces of each of the accommodating recesses when each of the accommodating recesses is seen in plan view, W>S>T.

Abstract: An apparatus for positioning a component relative to an associated component. The apparatus includes a component receiver and onto which the component is disposed. The apparatus also includes an associated component receiver and onto which the associated component is disposed. The component receiver orients the component into a position for retaining the component to the associated component. The apparatus further includes a retention device driver for inserting a retention device, the retention device retaining the component to the associated component in the position. The apparatus also includes an optical position verifier for verifying the position of the component and the associated component.

Abstract: A method of assembling a circuit board assembly is provided. The circuit board assembly includes a circuit board assembly fixture and a plurality of fixed circuits. The method includes coupling the plurality of fixed circuits to the circuit board assembly fixture. The plurality of fixed circuits includes at least one of a fully flexible circuit, a flexible circuit having stiffeners, and a rigid circuit. The fixture includes a plurality of supporting surfaces each including a first side, configured to receive at least one of the fixed circuits, and an opposite second side. The fixture includes at least one hinge, at least one fastening mechanism extending from the first side, and at least one retainer coupled to at least one of the plurality of supporting surfaces. The method includes folding the circuit board assembly fixture into a desired alignment.

Abstract: Wire positioning devices (1) for positioning an electrical wire (2) in a processing device, include a wire guide (4) for receiving the electrical wire (2) and a lowering device (5), movable vertically in relation to a first longitudinal axis (45) of the wire (2) received in the wire guide (4). The lowering device (5) has a press piece (6), spring-loaded via at least one spring element (15), and is provided so as to be contacted against the wire guide (4), the spring element (15) being arranged in a tube (16). Also disclosed are methods for lowering thin wires (2) and for positioning them in an oscillation-damped manner, wherein a wire positioning device (1) or a processing device are employed.

Abstract: An apparatus, method, and system, the apparatus including a receiving member dimensioned to receive an array of microelectronic devices; and a linkage member coupled to the receiving member, the linkage member configured to move the receiving member in at least two dimensions so as to modify a spacing between the electronic devices within the array of microelectronic devices received by the receiving member. The method including coupling an array of microelectronic devices to an expansion assembly; and expanding the expansion assembly so as to expand the array of microelectronic devices in at least two directions within a single plane. The system including a support member; an expansion assembly coupled to the support member, the expansion assembly having a plurality of receiving members configured to move in at least two dimensions within a single plane; and a plurality of microelectronic devices coupled to each of the plurality of receiving members.

Abstract: The invention aims at reducing unevenness at the intersections of mutually crossing electrodes with a method of and an apparatus for forming electrodes on a substrate. After forming a number of finger electrodes on a substrate, wide bus electrodes intersecting them are formed by application of an application liquid. Upon applying the application liquid which contains an electrode material and a photo-curing resin to the substrate, the application liquid is irradiated with UV light after a predetermined time and the application liquid is thus made to harden. A time difference since applying until light irradiation is set based on the result of measurement on changes of the height of the application liquid experimentally applied.

Abstract: Provided is a fitting tool for a liquid absorber which is included in a liquid ejecting apparatus having a liquid ejecting head for ejecting liquid from nozzle openings formed in a nozzle forming surface and fits the liquid absorber for absorbing the liquid in a cap which is capable of being abutted to the liquid ejecting head so as to cover the nozzle openings, the fitting tool including: a holding portion which holds the liquid absorber; and a locking portion which has elasticity and is locked to a portion of the cap when the holding portion is inserted into the cap.

Abstract: A method for servicing a stator frame of a power generator includes removing a first stator core from a main housing of the frame. A support assembly including a plurality of rails and a trolley is used to insert second laminations of a second stator core into the main housing. The rails extend axially within a bottom portion of the main housing and provide support for the trolley and for the second laminations as they are being inserted into the main housing. The trolley is provided for axial movement on the rails for inserting the second laminations into the main housing.

Abstract: A magnet loading apparatus for loading magnet pole pieces onto a field of an electric machine is described. The apparatus includes positioning means realized to hold a magnet pole piece of a plurality P of magnet pole pieces in place relative to its designated position on the field; and a transfer means realized to simultaneously transfer a plurality P of magnet pole pieces from the positioning means onto the field of the electric machine. Also described is a method of loading magnet pole pieces onto a field of an electric machine.

Abstract: A method and fixture using magnetic field assisted self-alignment for chip packaging. Typical embodiments include a magnetic device having one or more pole groups, each pole group including two or three poles. Some embodiments provide multiple pole groups arranged in a one or two dimensional pole group array. The poles can build up a self-alignment magnetic field. The structure of fixture is simple and easy to implement. Typical embodiments can greatly reduce chip packaging cost and make packaging more efficient. In accordance with typical embodiments, a chip and a substrate can be self-aligned magnetically regardless of their shapes.

Abstract: An apparatus for manufacturing electronic parts is provided. The apparatus includes a head unit installed on a main body and configured to move up and down, a nozzle unit installed on the head unit and configured to move up and down, and a positioning unit sequentially displacing the head unit and the nozzle unit to a position where the electronic parts are on standby to suction the electronic parts using the nozzle unit. Thus, when the head unit is used to suction the electronic parts on standby at a standby position of the electronic parts, the head unit and the nozzle unit installed on the head unit are sequentially lowered, so that it is possible to relieve an impact occurring when the electronic parts are suctioned to the ends of nozzles.

Abstract: An apparatus for assembling chip devices on a wire, each chip device comprising two substantially parallel lateral walls, and a groove in one of the lateral walls for receiving said wire. The apparatus includes a pinching device having two opposing surfaces, the distance between the opposing surfaces being substantially constant and substantially equal to the distance between the two lateral walls of a chip device. A wire feeder is adapted to continuously feed the wire in contact with one of the opposing surfaces of the pinching device. A chip device feeder is adapted to drive chip devices, one at a time, between the opposing surfaces, with their grooves turned towards the wire. The pinching device may comprise two cylindrical rollers having rotation axes substantially perpendicular to the wire, the opposing surfaces being formed by respective surfaces of the rollers.

Abstract: A substrate accommodating tray pallet has a substrate in a horizontal state, includes openings for inserting substrate removal tools for raising the substrate, and is used for transferring substrate accommodating trays which can be vertically stacked, wherein: the substrate accommodating trays are to be mounted on an upper surface; and substrate removal tool insertion openings for inserting the substrate removal tools are positioned so as to oppose openings of the mounted substrate accommodating trays.

Abstract: A method for stringing a first elongate element through a second elongate element is provided by placing the first elongate element in a channel and injecting compressed gas into the channel to propel the first elongate element therethrough. The channel has a first open end, and the second elongate element is sealed around the first open end. Compressed gas is injected into the channel towards the second elongate element, propelling the first elongate element through the second elongate element. Also disclosed is a system for performing such a method, including a source of compressed gas and a housing having a channel with a first end and a second open end. The first end is in fluid communication with the source of compressed gas. The channel has a tapered portion adjacent the open end of the channel, and the channel defines a straight longitudinal axis between the first end and the second open end.

Abstract: A bonding apparatus for bonding electronic devices including substrates comprises first and second rails arranged adjacent to each other which are configured to align the substrates in vertical orientations during transportation along the rails. A bonding system is locatable over a first bonding site which is located along the first rail and a second bonding site which is located along the second rail. A first indexer is located adjacent to the first rail and a second indexer is located adjacent to the second rail wherein each indexer is independently operative to transport a substrate along one rail while a substrate held on the other rail is being bonded. A container located at one end of the rails for holding multiple unbonded substrates is operative to feed unbonded substrates directly to the rails.

Abstract: The invention provides for a placement head for a die placing assembly of an assembler for assembling dice on a carrier. The assembler has an enclosure with a support assembly for operatively supporting a wafer with dies thereon, a die picking assembly for picking dice from said wafer, a die placement assembly for placing the dies onto the carrier, a die conveyance mechanism operatively conveying the dies from the die picking and placement assemblies, and a control system controlling the assembler. The placement head includes a first translation stage mounted on the die placement assembly, said first stage operatively displaceable along a first axis relative to the die placement assembly. The placement head also includes a second translation stage mounted on the first stage, the second stage displaceable perpendicular to the first stage.

Abstract: An align fixture for aligning an electronic component having a receptacle adapted to receive the electronic component and having a first abutting section and a second abutting section, the align fixture further having a first elastic unit and a second elastic unit, the first abutting section is flexibly mounted via the first elastic unit, and the second abutting section is flexibly mounted via the second elastic unit, and the first abutting section and the second abutting section are together adapted to floatingly engage the electronic component.

Abstract: A method and an apparatus for producing solar cell strings by connecting at least two solar cells by a least one conductor ribbon of a first length, wherein the solar cells are respectively spaced from one another at a string cell spacing(s), until a desired number of solar cells for producing a first solar cell string is connected together, connecting a further solar cell with a last solar cell of the first solar string by at least another conductor ribbon which is longer than the at least one conductor ribbon, wherein the second solar cell is spaced from the last solar cell at a greater spacing than the string cell spacing(s) and wherein the second solar cell forms the first solar cell for a second solar string, and separating the at least another conductor ribbon for decoupling the first solar cell string.

Abstract: Provided is a metal shell cutting and assembling machine for cutting a material tape with metal shells and assembling the metal shell with a plastic body of a connector. The metal shell cutting and assembling machine includes a frame, a material-feeding mechanism, a pre-press mechanism, a metal shell-cutting mechanism, a plastic body-inserting mechanism, a metal shell-inserting mechanism and a controller. The material-feeding mechanism is used for transferring the material tape. The pre-press mechanism can pre-press the metal shell of the material tape for being cut by the metal shell-cutting mechanism. The metal shell-inserting mechanism can push the metal shell held between the pre-press mechanism and the metal shell-cutting mechanism onto the plastic body-inserting mechanism, and the plastic body-inserting mechanism pushes the plastic body for assembling with the metal shell. Whereby the metal shell cutting and assembling machine can enhance the manufacture efficiency and reduce the labor cost.

Abstract: A plurality of indicated back-up pin devices are detachably placed on a back-up plate provided on a component mounting apparatus, to a plurality of indicated positions of the back-up plate to support a board from an under surface thereof, to which already mounted components have been mounted, when another components are to be mounted on an upper surface of the board. The back-up pin device comprises a base portion detachably placed on the back-up plate, at least one support pin erected upright on the base portion to support the board by contacting an upper end thereof with an under surface of the board and at least one of an identification mark for identifying the type of the back-up pin device and a position mark as a reference to determine a position of the base portion on the back-up plate, which is provided on the base portion.

Abstract: A lens assembly tool includes a lens receiving frame having a first surface, a positioning plate positioned on the lens receiving frame, and a pressing plate positioned on the positioning plate and having a second surface. The first surface defines a plurality of receiving holes. The positioning plate defines a plurality of through holes aligned with the plurality of receiving holes. The second surface forms a plurality of pressing punches aligned with the plurality of receiving holes.

Abstract: A component mounting apparatus includes: a conveyor device for sucking and holding a substrate in a substantially vertical posture and conveying the substrate in a direction extending along its flat plate surface; a plurality of working devices for performing a working process for mounting areas in edge portions of the substantially vertical-postured substrate received from the conveyor device. In the component mounting apparatus, each of the working devices includes: a substrate holder for sucking and holding the substrate in a substantially vertical posture; a holder up/down device for moving the sucked and held substrate to a downward working position; a receiving member for supporting an edge portion of the substrate positioned in the working position from its back face side; and a working unit for performing the working process on the mounting areas of the edge portions of the substrate positioned in the working position from its front face side.

Abstract: A component supplying apparatus which is appended to the electronic component working apparatus, for supplying electronic components to the electronic component working apparatus is provided. The component supplying apparatus includes a component storing section which stores the electronic components, and movement range regulator. The movement range regulator allows the component storing section to move between a supply position P1 which is set for supplying the electronic components and a retracted position P2 to which the component storing section is retracted for the purpose of maintenance of the electronic component working apparatus. In addition, the movement range regulator regulates the range of relative movement of the component storing section with respect to the electronic component working apparatus to a movement amount L4 that is previously established.

Abstract: Provided are an imaging device production system, an imaging device inspection system, and an imaging device inspection method. The imaging device production system includes a assembling process for assembling each components constituting an imaging device, an inspection process in which the imaging device assembled in he assembling process is continuously transferred without being stopped except for emergency when two inspection tasks adjacent to and different from each other are performed, and a packaging for packaging the imaging device which passes through the inspection tasks to confirm quality of the imaging device.

Abstract: A challenge to be met by the present invention is to provide a component mounting device, a component mounting system, and a component mounting method that make it possible to correctly position a substrate at a working location and mount components on the substrate even when components mounted on the substrate project outside from an end of the substrate in a direction parallel to a substrate conveyance path. When a front end portion (PbT) of a substrate (Pb) conveyed by a substrate conveyance path (13) is detected to have reached inspection light (L), operation of the substrate conveyance path (13) is immediately halted.

Abstract: Machine and insolation method for panels for turning a panel and successively insolating its first and second faces. According to the invention, this machine comprises at least one first insolation station (10), and a panel turner (30), having a first face and a second face, the latter comprising a prehension device (53, 54), configured to grip a panel (90), a displacement device, configured to displace the prehension device at least between the first and second insolation stations (10, 20), and a pivoting device, configured to pivot the prehension device (53, 54) and in this way have the panel (90) pivot about a pivoting axis (A) parallel to said panel (90), the turner (30) being configured so that it can grip the panel (90) by any one of its faces and release the panel (90) also by any one of its faces.

Abstract: A positioning apparatus has a pilot holder having a hold face, a positioning pin having a tapered tip and supported by the pilot holder so that the tapered tip protrudes from the hold face of the pilot holder, a pad having a pad face that opposes the hold face of the pilot holder, and a movable member having a stop face that opposes the positioning pin and a relief hole for avoiding the tapered tip of the positioning pin from hitting the stop face, the movable member resiliently supported on the pad. The pilot holder and the pad in which the thin plate material is set between the hold face and the pad face relatively move to insert the tapered tip of the positioning pin into the positioning hole of the thin plate material. The stop face is flush with or protruding from the pad face of the pad.

Abstract: A lens assembly alignment apparatus for a camera lens module is provided. The lens assembly alignment apparatus includes a position alignment apparatus that moves a lens assembly in a direction of an optical axis of the lens assembly and on a plane perpendicular to the optical axis. The apparatus also includes a slant alignment apparatus having first and second rotary axes which extend perpendicular to each other and perpendicular to the optical axis of the lens assembly, respectively. The lens assembly is received in a housing, and the slant alignment apparatus aligns an optical axis of an image sensor, which is mounted in the housing, parallel to the optical axis of the lens assembly by rotating the housing about each of the first and second rotary axes.

Abstract: An apparatus for manufacturing a semiconductor package includes an index rail transferring a lead frame in forward and backward directions, the lead frame having a first surface and a second surface that is opposite to the first surface, a loader portion connected to an end portion of the index rail and supplying the lead frame to the index rail, a frame driving portion connected to the opposite end portion of the end portion of the index rail and rotating the lead frame around a normal to the first surface, and a die attach portion attaching a semiconductor chip on the lead frame supplied to the index rail.

Abstract: Embodiments of the invention may provide a system for the production of photovoltaic modules that comprises at least a first work line having a plurality of positioning stations in which a series of first processing operations are performed and a second work line consisting of at least a positioning station in which at least a second processing operation is performed. The process sequence may include, for example, printing a layer material used to form one or more electric contacts on a base layer, and then positioning photovoltaic cells and various layers of insulating material in a desired orientation over the base layer to form a photovoltaic module.

Abstract: A method of placing an element onto a data carrier, where there is a placement actuator arranged to be able to secure the element. A transport layer is advanced until the element is located between the placement actuator and the data carrier in a desired position. The actuator is moved towards the data carrier so that it secures the element. The transport layer is then retracted to detach the element from it and then the placement element is moved towards the data carrier to bring the element into contact with the data carrier at the desired position.

Abstract: It is an object to provide an electronic component mounting system capable of concurrently, efficiently subjecting a plurality of substrates to component mounting operation and accomplishing both high productivity and a capability of addressing production of multiple products. An electronic component mounting system is configured by arranging, on an upstream side of a component loading unit having a plurality of substrate conveyance mechanisms, a screen printer M2 having a plurality of individual printing mechanisms and a coating and inspection machine M4 that applies a coat of a resin for use in boding an electronic component and that inspects a coated state. The coating and inspection machine M4 is equipped with a coating head 15 that performs operation for coating substrates conveyed by substrate conveyance mechanisms 12A and 12B from the screen printer M2 with the resin and an inspection head 16 that performs pre-coating inspection and post-coating inspection.

Abstract: A method of assembling a matrix of photovoltaic cells includes positioning photovoltaic cells in a desired orientation, aligning the row of photovoltaic cells relative to each other, and enabling a homogeneous downward pressure on the row of photovoltaic cells to facilitate electrical and mechanical connectivity between the photovoltaic cells.

Abstract: There is provided a work processing apparatus including a plurality of work conveyance lines on which works are to be moved, a stopping unit to stop a work in a predetermined processing position on each of the work conveyance lines, a processing unit to make a desired process on the work stopped by the stopping unit, and a moving unit to move the processing unit between the work conveyance lines. Works are sequentially processed on the plurality of work conveyance lines. While a work is being processed in the processing position on one of the work conveyance lines, another work can be carried in to the other work conveyance line. Therefore, immediately after a work is completely processed on the one work conveyance line, processing of another work can be started. As a result, the production rate is higher and the apparatus can be designed smaller in size.

Abstract: A head assembly for a chip mounter is provided. The head assembly includes a nozzle module disposed above a printed circuit board (PCB) and configured to pick up and move an electronic component to mount the electronic component on the PCB, and a component recognition module electrically connected to the nozzle module and configured to recognize presence of the electronic component, a distance between the PCB and the nozzle module, and alignment of the electronic component at least one given moving position of the electronic component.

Abstract: An electrical cable wiring head apparatus is provided to rapidly wire an electrical cable while more effectively restraining the electrical cable from floating. An electrical cable wiring head device of the electrical cable wiring head apparatus moves along a wiring surface of a wiring plate to wire an electrical cable on the wiring surface. The electrical cable wiring head device comprises: a head section supported rotatably about a rotary axis and provided with a guide recess for leading the electrical cable to the wiring surface, the guide recess being offset from the rotary axis; a head rotating mechanism for rotating the head section; a guide pushing member including a shaft portion and a roller portion provided rotatably on a distal end of the shaft portion, the guide pushing member being supported movably along the rotary axis; and a guide pushing member drive mechanism for reciprocating the guide pushing member.

Abstract: A tool is for attaching a coaxial cable connector to a coaxial cable by longitudinal compression of the coaxial cable connector. The tool includes a tool body defining therein a connector compression chamber and a plunger receiving chamber longitudinally adjacent thereto. A plunger having a plunger head is within the plunger receiving chamber and a plunger shaft extends outwardly therefrom, the plunger having a bore to receive an end of an inner conductor of the coaxial cable. A handle carried by the tool body is movable from a retracted position to a compressed position for driving the plunger head to longitudinally compress the coaxial cable connector within the connector compression chamber to attach the coaxial cable connector to the coaxial cable. A seating indicator is carried by the bore for contacting the inner conductor of the coaxial cable to indicate seating of the coaxial cable into the coaxial cable connector.