Means To Align And Advance Work Part Patents (Class 29/759)
  • Publication number: 20080196244
    Abstract: An article of manufacture for removing outlet safety covers from electrical outlets. The invention consists of an elongated body having a first end, a second opposite end, a first side and a second opposite side, the first end of the body terminating in a curved chisel shape curving toward the first side of the body, the body defining at least two tabs extending therefrom positioned near the second end of the body in a direction from the second side of the body, the first end of the body being dimensioned for enabling the first end of the body to wedge between a pair of prongs of an outlet safety cover to remove the cover, the tabs being dimensioned to grasp an electrical cord.
    Type: Application
    Filed: February 13, 2008
    Publication date: August 21, 2008
    Inventor: David R. Miglin
  • Patent number: 7406763
    Abstract: A method of producing a multiconductor cable is provided herein. A plurality of wires are arranged in a flat array with a specific pitch at both ends of them having an intermediate portion that are bundled together and a transforming portion. The plurality of wires have lengths different from one another, where the lengths vary successively from the minimum length, Ls, to the maximum length, Lm. At both end portions, the transforming portion of the wires are arranged using an arranging tool and attached so that the wires are held in grooves. The wires are moved from the arranging tool and a terminal structure is formed for electrical connection at both ends of the multiconductor cable.
    Type: Grant
    Filed: August 3, 2006
    Date of Patent: August 5, 2008
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Hisashi Hirata, Shizuyoshi Satou, Hiroyuki Senba
  • Patent number: 7396244
    Abstract: An apparatus for extracting and inserting a circuit card into a socket, the apparatus includes a tool device releasably mountable to opposing sides defining the circuit card. The tool device includes a pair of frame members having a friction fit feature for attachment to the opposing side edges defining the circuit card; and a sliding plane translatable between the pair of frame members. Upward translation of the sliding plane relative to the fixed pair of frame members acts to release latches on the connector to extract the circuit card from the connector upon upward translation of the pair of frame members, and downward translation of the sliding plane relative to the fixed pair of frame members acts to transfer a force to the circuit card, thereby inserting the circuit card with the connector.
    Type: Grant
    Filed: August 22, 2007
    Date of Patent: July 8, 2008
    Assignee: International Business Machines Corporation
    Inventors: Kyle S. Barna, William L. Brodsky, Amanda E. E. Mikhail, John G. Torok
  • Patent number: 7392582
    Abstract: The invention refers to a process for loading a socket and/or adapter device with a corresponding semi-conductor component, a socket and/or adapter device, a precision alignment device, as well as a mechanism for loading a socket and/or adapter device with a corresponding semi-conductor component, whereby the mechanism comprises a device, especially a mechanical device for aligning the mechanism in relation to the socket and/or adapter device.
    Type: Grant
    Filed: December 10, 2004
    Date of Patent: July 1, 2008
    Assignee: Infineon Technologies AG
    Inventor: Holger Hoppe
  • Patent number: 7370407
    Abstract: A disc centering device includes a base plate, a chuck which is installed on the base plate, a hub unit which is detachably engaged to the chuck and receives discs to be stacked, disc pushers which are slidably provided outside the hub unit and include corresponding pressure members which center the discs by pushing circumferences of the discs, and a driving unit which slides the disc pushers simultaneously. Accordingly, as the accuracy of centering the discs is improved, discs with data recorded thereon having a uniform quality can be obtained. Additionally, vibration of a rotation body can be minimized due to the simple configuration the disc centering device. Therefore, in view of the simplified maintenance and repair of the disc centering device, the productivity and manufacturability of HDDs can be improved.
    Type: Grant
    Filed: October 2, 2003
    Date of Patent: May 13, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ki-keon Yeom, Sang-jin Choi, Sang-chul Ko, Soo-hyung Kim, Tae-hoe Ha
  • Patent number: 7367115
    Abstract: A component mounting apparatus having a work conveyor-positioner unit is arranged on a supporting base to convey and position a substrate in an X direction. Supporting frames extend vertically from ends of the supporting base and face each other in a Y direction. The component mounting apparatus further includes a plurality of Y-axis tables extending between upper ends of the supporting frames, X-axis tables attached to movable portions of the Y-axis tables, and operating heads attached to movable portions of the X-axis tables to perform operations with respect to the substrate on the work conveyor-positioner unit. Each of the plurality of the Y-axis tables includes a movable portion at a lower part. Each of the X-axis tables includes a movable portion at a lower part and the operating heads are attached to a lower part of the movable portion of the X-axis tables.
    Type: Grant
    Filed: December 4, 2003
    Date of Patent: May 6, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Nobuhiro Nakai, Hiroshi Ota, Kensuke Kawasumi, Hirotsugu Uemori, Kimio Iizuka
  • Patent number: 7357288
    Abstract: When a component, that has a connection portion to be connected to an electrode of a board and a weak heat-resistant portion of a lower heat-resisting property than a fusing point of a connection material for connecting the electrode of the board with the connection portion, is connected to the board with interposition of connection material between the electrode of the board and the connection portion, a cooling member is brought into contact with the weak heat-resistant portion or its neighborhood while heating the connection material by heating the board brought in contact with a placement member, and a quantity of heat conducted to the weak heat-resistant portion via the board is reduced by being conducted to the cooling member, thereby performing fusing of the connection material while preventing occurrence of thermal damage to the weak heat-resistant portion.
    Type: Grant
    Filed: July 15, 2004
    Date of Patent: April 15, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Naoto Hosotani, Kazuki Fukada, Keiichi Iwata, Daido Komyoji
  • Patent number: 7353589
    Abstract: A component mounting apparatus includes one head unit which has a component holding member capable of holding a component and which is selected from among a plurality of types of head units according to a type of the fed component, a head moving unit which has a head fitting portion onto which the selected one head unit is removably loaded and which moves the head unit loaded on the head fitting portion in a direction extending generally along a surface of the board, and a head control unit which is provided for each of the head units and which performs control for component mounting operation by a head unit corresponding to the loaded head unit.
    Type: Grant
    Filed: October 6, 2004
    Date of Patent: April 8, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kensuke Kawasumi, Kunio Tanaka, Hiroto Miyazaki, Nobuhiro Nakai
  • Patent number: 7334321
    Abstract: An automated wire harness machine is capable of manufacturing a wire harness in an automated process. The wire harness is generally a plurality of bundled, preferably un-stripped, insulated wires. Each un-stripped end portion of each wire is preferably terminated by an electrical terminal in one of a series of electrical connectors of the wire harness. Each connector has at least one wafer which houses a plurality of terminals. The wire harness machine utilizes a pallet that holds all of the wafers of one wire harness. A conveyor transports the pallet and wafers through a series of stations which perform automated manufacturing steps. The first station is a terminal inserter which inserts and locks the terminals within pre-assigned cavities of the wafers. The next station is an automated wire loader which measures, cuts and crimps the two ends of each wire into the respective terminals of the loaded wafer assembly.
    Type: Grant
    Filed: May 24, 2005
    Date of Patent: February 26, 2008
    Assignee: Delphi Technologies, Inc.
    Inventors: James A. Gourash, John Thomas Kightlinger, Nick M. Loprire, Robert Alan McFall, John C. McLane, Andrew F. Rodondi
  • Patent number: 7325297
    Abstract: An automatic assembly machine includes a basis (10), a sliding device (30) horizontally movably attached on the basis for supporting a fan (40) thereon, a tube (27) fixed to the basis for receiving a plurality of bearings (28) therein, a diversion station for provisionally holding one bearing thereon, a mounting device (70) vertically movably attached to the basis, a horizontal driving device (60), a vertical driving device (80), and a control device (90) for controlling periodical movement of the horizontal and vertical driving devices. In one period, the vertical driving device drives the mounting device to catch the bearing from the diversion station and then the horizontal driving device drives the sliding device and the diversion station to move to allow the diversion station to receive another bearing from the tube and the mounting device to mount said bearing to the fan upon driven of the vertical driving device.
    Type: Grant
    Filed: July 27, 2004
    Date of Patent: February 5, 2008
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventor: Jian-Ming Xia
  • Patent number: 7308757
    Abstract: An intermediate product manufacturing apparatus for carrying intermediate products and processing the intermediate products with a plurality of processing apparatuses is provided, the apparatus comprising: a plurality of carrying means for carrying the intermediate products to the processing apparatuses; a common processing apparatus provided between the plurality of carrying means, for carrying out a common process on the intermediate products carried by the carrying means; and intermediate product transfer sections provided between the plurality of carrying means, for transferring the intermediate products between the common processing apparatus and the carrying means.
    Type: Grant
    Filed: March 5, 2004
    Date of Patent: December 18, 2007
    Assignee: Seiko Epson Corporation
    Inventors: Keiji Fukuhara, Yasutsugu Aoki, Yoshitake Kobayashi, Hisashi Fujimura
  • Patent number: 7302753
    Abstract: A method and apparatus for the safe and easy installation of wall-mounted electrical outlets and switches utilizing a multi-functional tool. Two different but similar tools are provided, each in the form of an insulated handle that may be detachably engaged with either a wall socket or a wall switch. The wall socket device includes one or more prongs for temporary engagement with slots in the socket fixture, and may include testing circuitry. The wall switch device is temporarily attached to a switch fixture using one or more magnets. Both tools may also include built-in electrical wire measuring, stripping and bending structures.
    Type: Grant
    Filed: October 7, 2004
    Date of Patent: December 4, 2007
    Inventors: Bryan Cahill, Deborah Unser
  • Patent number: 7281323
    Abstract: A method for mounting electronic components is provided. The method comprises: rotating at least one rotation housing, and thereby correcting positions of a plurality of nozzle spindles depending on specified absorption positions of the electronic components; absorbing the electronic components by descending at least one nozzle spindle; rotating at least one rotation housing and rotating nozzle spindles to which the electronic components are absorbed, thereby correcting positions of the electronic components absorbed to the nozzle spindles depending on an inclination angle of specified positions for mounting the electronic components to a printed circuit board; moving the absorbed electronic components over the printed circuit board; and mounting the absorbed electronic components to the specified mounting positions of the printed circuit board.
    Type: Grant
    Filed: June 15, 2005
    Date of Patent: October 16, 2007
    Assignee: Samsung Techwin Co., Ltd.
    Inventor: Young-soo Hwang
  • Patent number: 7278204
    Abstract: An electric-component holding apparatus including a component holder which holds an electric component and includes an engaging portion, a holder-holding member to which the component holder is detachably attached, a lock member which consists of a substantially rigid body, and which is supported by the holder-holding member such that the lock member is movable relative to the holder-holding member, and is engaged with the engaging portion of the component holder to lock the component holder to the holder-holding member, and a locked-state maintaining device which includes an operable member and an elastic member and which maintains, owing to an elastic force of the elastic member, a locked state in which the lock member is engaged with the engaging portion of the component holder.
    Type: Grant
    Filed: July 14, 2005
    Date of Patent: October 9, 2007
    Assignee: Fuji Machine Mfg, Co., Ltd.
    Inventors: Takeyoshi Isogai, Hiroshi Katsumi, Hisashi Kojima, Masato Ando, Tetsuo Hayashi
  • Patent number: 7275312
    Abstract: The specification discloses an apparatus comprising an alignment plate having a plurality of depressions therein, each depression being sized to receive a packaging cap therein and to prevent its movement, and a force applicator to apply a force to press the packaging caps and a substrate firmly together. Also disclosed is a process comprising inserting a plurality of packaging caps in a plurality of depressions on an alignment plate, each depression being sized to receive a packaging cap and prevent its movement, aligning the plurality of packaging caps with individual devices on a substrate, placing the substrate in contact with the packaging caps, and applying a force to press the caps against the substrate. Other embodiments are disclosed and claimed.
    Type: Grant
    Filed: June 30, 2003
    Date of Patent: October 2, 2007
    Assignee: Intel Corporation
    Inventors: Gregory S. Clemons, Mitesh C. Patel
  • Patent number: 7269891
    Abstract: A system provides a zero interconnection height in a board-to-board interconnect while maintaining efficient space allocation for multiple axis connections by providing a floating connection in one plane thereby enabling a connection in another plane. A first circuit board having a first plurality of through-holes is aligned with a second circuit board having a second plurality of through-holes so that the first plurality of through-holes is matched with the second plurality of through-holes. An interconnection height of zero is provided between the first circuit board and the second circuit board. At least one pass-through socket, which includes pass-through socket through-holes, is aligned with the combination of the first circuit board and second circuit board. One or more pins disposed on a pin header are inserted through the pass-through socket, the first circuit board, and the second circuit board.
    Type: Grant
    Filed: December 3, 2003
    Date of Patent: September 18, 2007
    Assignee: Cisco Technology, Inc.
    Inventors: Matthew L. Heston, James T. Theodoras, II
  • Patent number: 7257890
    Abstract: A method for registering a plurality of substrates that are retained on a workpiece carrier onto an exposure mask for carrying out a photolithography process has the steps of registering and immobilizing the exposure mask onto an alignment panel having precisely fitting passthrough orifices for reception of one substrate for each passthrough orifice and inserting into the passthrough orifices of the alignment panel the substrates that are retained on the workpiece carrier.
    Type: Grant
    Filed: August 28, 2002
    Date of Patent: August 21, 2007
    Assignee: Robert Bosch GmbH
    Inventors: Volker Wingsch, Joachim Gluck
  • Patent number: 7251879
    Abstract: An installation, insulation displacement, and terminating power tool, for inserting electrical wires into, and for electrically connecting the electrical wires to electrical contact members disposed within, an electrical connector, comprises a piston-cylinder driving assembly for inserting the electrical wires into the electrical connector. More particularly, the piston-cylinder driving assembly comprises a three-chamber pneumatic piston-cylinder driving assembly for developing an enhanced level of driving force necessary for inserting the electrical wires into the electrical connector.
    Type: Grant
    Filed: March 15, 2005
    Date of Patent: August 7, 2007
    Assignee: Illinois Tool Works Inc
    Inventors: Anatoly Gosis, James A. Turek
  • Patent number: 7243417
    Abstract: An apparatus for facilitating the insertion and extraction of a PC board into and from a card cage, comprising a mounting body, an engager, and an actuator. In a preferred embodiment, the apparatus has a ring-shaped mounting body having a clearance hole therethrough. The apparatus is sliadably and rotatably mounted on a cylindrical rod through the clearance hole such that the apparatus is slidably rotatable along the length of the cylindrical rod. In operation, the engager is positioned in physical contact with the PC board in a notch in the board such that when a force is applied to the actuator, the engager is effected to urge the board to move in the direction of the force.
    Type: Grant
    Filed: July 21, 2004
    Date of Patent: July 17, 2007
    Assignee: Tellabs Petaluma, Inc.
    Inventor: George Dalisay
  • Patent number: 7243415
    Abstract: An equipping installation introduces fitted-out cable ends into plug housings and is arranged downstream from a fitting-out installation. A contact for the first plug housing is arranged at the leading cable end and a contact for the second plug housing is arranged at the trailing cable end. A feeder unit takes over the cable loop fitted-out to a finished state from a second transfer unit and transfers the leading cable end to a positioning unit and the trailing cable end either to a rotatable store or, after the positioning unit is again free of cable, to the positioning unit in accordance with a cable plan. An equipping unit takes over the cable ends in succession at the positioning unit and introduces the cable ends into the corresponding plug housings.
    Type: Grant
    Filed: October 27, 2004
    Date of Patent: July 17, 2007
    Assignee: Komax Holding AG
    Inventors: Jean Revel, Claudio Meisser
  • Patent number: 7240421
    Abstract: An electric-wire guide unit is provided with a fixed roller and a movable roller that is supported movably toward and away from the fixed roller, and holds an electric wire from both of the sides of the electric wire in cooperation with the fixed roller. An electric-wire nozzle unit is provided with a fixed nozzle guide and a movable nozzle guide that is slidably placed, and forms a nozzle opening through which the electric wire is inserted, in cooperation with the fixed nozzle guide. A link mechanism, which couples the movable roller and the movable nozzle guide so as to be interlocked, is prepared. An tension spring, which presses the movable roller in an approaching direction toward the fixed roller, is attached. In accordance with the size of the diameter of the electric wire to be held between the movable roller and the fixed roller, the movable nozzle guide is slide-operated through the link mechanism so that the nozzle opening is size-adjusted.
    Type: Grant
    Filed: September 20, 2004
    Date of Patent: July 10, 2007
    Assignee: ShinMaywa Industries, Ltd.
    Inventors: Akira Miyoshi, Tetsuya Yano
  • Patent number: 7225529
    Abstract: A bonding device. A plurality of bonding units each has a base and a fastening member. Each base has a first connecting portion, a second connecting portion, and a stopper. An electronic device has a circuit unit and a predetermined element. The circuit unit has several first positioning portions and the predetermined element has several second positioning portions. The first positioning portions and the second positioning portions are through holes. When the predetermined element is attached to the upper surface of the circuit unit by aligning the second positioning portions with the corresponding first positioning portions, the second connecting portion of the base is first fit into the first positioning portions of the circuit unit, then the fastening member passes through the second positioning portion of the predetermined element to couple with the fastening member by several turns. Thus, the predetermined element is fixed on the circuit unit.
    Type: Grant
    Filed: August 11, 2003
    Date of Patent: June 5, 2007
    Assignee: Inventec Appliances Corporation
    Inventor: Shun-Ping Wang
  • Patent number: 7225531
    Abstract: An index head assembly for a semiconductor device test handler is provided which allows for precise positioning of a device in a test socket, as well as accurate testing of the device once properly positioned in the test socket. The head portion of the index head assembly includes a holding part which absorbs and holds the device using a vacuum force, a heating part which generates heat to maintain the device at the appropriate temperature, and a compliance part which accurately aligns and positions the index head relative to the test socket so that the device may be properly connected to the test socket. The downward force used to connect the semiconductor device to the test socket is controlled by a force transducer, and the temperature of the semiconductor device is accurately controlled through direct heat transfer from an electric heater provided within the head portion of the index head assembly.
    Type: Grant
    Filed: March 16, 2005
    Date of Patent: June 5, 2007
    Assignee: Mirae Corporation
    Inventor: Hyun Joo Hwang
  • Patent number: 7210222
    Abstract: The present invention provides a power supply control method which is executed by the electronic component mounting apparatus. A drive power source and a control power source are separately connected and shut-off in accordance with a command from a control device to each of component feed drive parts for driving component feed devices, a component transfer drive device for driving a component transfer device, and a circuit board positioning drive device for driving a circuit board positioning device. The control device detects an individual occurrence of a halt condition of each of constituent parts of an electronic component mounting apparatus and shuts off a drive power source to the drive device in the halt condition. Thus, wasteful power consumption is eliminated and production is continued with a necessary minimum power.
    Type: Grant
    Filed: January 16, 2004
    Date of Patent: May 1, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Keizo Izumida, Takeshi Takeda, Kazuyuki Nakano
  • Patent number: 7191512
    Abstract: The present invention provides a tray for holding components having first and second sides, wherein the first side has at least one first component receptacle for engaging said component; and the second side has at least one component engaging member, and further wherein the first component receptacle and the component engaging member are aligned such that when multiples of the tray are stacked upon each other the first component receptacle and the component engaging member will cooperate to restrain the motion of the component relative to the tray. In such an embodiment the component will have first and second engagement surfaces and the first component receptacle will engage the first component engagement surface and the component engaging member will engage the second component engagement surface.
    Type: Grant
    Filed: February 11, 2002
    Date of Patent: March 20, 2007
    Assignee: Applied Kinetics, Inc.
    Inventors: Mark T. Girard, Ryan A. Jurgenson, Susan June Livermore, legal representative, David R. Swift, Joseph P. Tracy, Roger R. Livermore, deceased
  • Patent number: 7191513
    Abstract: A device for installation of a gradient coil unit into a magnetic resonance apparatus has at least one support unit and at least one carrier unit. The carrier unit is fashioned to carry the gradient coil unit, and the at least one support unit is supported thereon such that it can tilt on a connector.
    Type: Grant
    Filed: November 30, 2005
    Date of Patent: March 20, 2007
    Assignee: Siemens Aktiengesellschaft
    Inventors: Johann Schuster, Stefan Stocker
  • Patent number: 7188402
    Abstract: A disc centering device includes a base plate, a chuck which is installed on the base plate, a hub unit which is detachably engaged to the chuck and in which a plurality of discs are stacked, disc pushers which are slidably provided outside the hub unit, and include corresponding plate springs which center the discs by pushing circumferences of the discs, supporting units which support the corresponding plate springs with respect to the disc pushers so as to reinforce a restoring force of the plate springs after a disc centering of the discs, and a driving unit which slides the disc pushers simultaneously. Accordingly, even though the disc centering is continuously performed, a centering value can be maintained within a desired range (deviation), and deformation of discs can be prevented.
    Type: Grant
    Filed: October 2, 2003
    Date of Patent: March 13, 2007
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Tae-hoe Ha
  • Patent number: 7181833
    Abstract: The invention provides a mounting method capable of coping with high density mounting, narrower pitch mounting, cavity mounting and the like. In this method, displacement amounts of a chip that is picked up from a wafer by a pick-up nozzle to be held by the pick-up nozzle, with respect to a reference attitude, are obtained, and when the chip is delivered to a mounting nozzle for actually mounting the chip onto a substrate, the displacement amounts are corrected while taking the displacement amounts into consideration, so that the mounting nozzle always holds the chip in a fixed attitude.
    Type: Grant
    Filed: November 2, 2004
    Date of Patent: February 27, 2007
    Assignee: TDK Corporation
    Inventors: Toru Mizuno, Tomomi Asakura, Masatoshi Ito, Masaaki Kaneko, Toshinobu Miyagoshi
  • Patent number: 7178226
    Abstract: An electrician's tool generally comprises a plate having a hole formed therein, the hole defined by an inner edge. The edge includes means for safely sliding wire through the hole and past the edge. In one embodiment the means for safely sliding the wire includes at least one roller rotatably positioned adjacent the inner edge for safely sliding the wire past the edge. In another embodiment of the invention, the means for safely sliding comprises a round bar or curled inner edge providing a curved surface for safely sliding the wire across the edge.
    Type: Grant
    Filed: November 28, 2001
    Date of Patent: February 20, 2007
    Inventor: James C. Manning
  • Patent number: 7165318
    Abstract: A substantial apparatus width along a board carrying direction of an electronic component placing apparatus for placing electronic components on a board having a length L along the board carrying direction is a total dimension 4L+SL. Specifically, 4L denotes a length of the sum of the lengths of a first board retreat position, a first component placement position, a second board retreat position and a second component placement position. Further, SL denotes a length of the sum of the lengths of the spaces for positioning a board stop mechanism provided at each of the first board retreat position, the first component placement position, the second board retreat position and the second component placement position. Finally, the substantial apparatus width is between 450 mm and 1000 mm inclusively.
    Type: Grant
    Filed: March 8, 2005
    Date of Patent: January 23, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Youichi Nakamura, Kunio Sakurai, Kazumasa Okumura, Ken Takano, Minoru Yamamoto, Hirokazu Honkawa, Kentaro Nishiwaki, Yoshihiko Misawa
  • Patent number: 7152310
    Abstract: A crimping installation with first and second crimping stations includes at each station a device platform with device stations and a crimp press. A cable is advanced by a tape drive whereby the leading cable end is taken over by a first grip arm arranged on a first swivel arm, which supplies the stripped cable end to the first crimping station. After the leading cable end is provided with a crimping contact, a first swivel arm moves backwards into an axis of the tape drive. Then the tape drive continues to advance the cable until the desired length of a cable section is reached. A separation and a stripping station separates the cable section from the cable and removes the insulation at the cable ends. The lagging cable end of the cable section is taken over by a second grip arm arranged on a second swivel arm which supplies the lagging cable end to the second crimping station for assembly with a crimping contact.
    Type: Grant
    Filed: March 17, 2005
    Date of Patent: December 26, 2006
    Assignee: Komax Holding AG
    Inventor: Alois Conte
  • Patent number: 7145976
    Abstract: In a nuclear reactor, cooled by pressurized water, an apparatus is employed for replacing a section of a primary circuit primary pipe that interconnects first and second components of a primary circuit. The apparatus cuts out and removes a section of the primary pipe. Supports are provided for the end parts of a new replacement section in a position held by the removed pipe. The apparatus bevel welds the end parts of the new replacement section of the primary pipe to confronting corresponding ends of the remaining primary pipe. Means are provided to work within the pipe along the entire length of the interior surface of the primary pipe and is introduced through one of first and second components of the primary circuit to a location within the welded replacement pipe section.
    Type: Grant
    Filed: February 26, 2004
    Date of Patent: December 5, 2006
    Assignee: Framatome ANP
    Inventors: Pascal Latreille, Jean-Michel Channussot
  • Patent number: 7140083
    Abstract: A nozzle sheet has arrays of nozzles, and additionally has two first positioning holes on opposite sides of the arrays of nozzles, respectively, that are opposite to each other in a lengthwise direction of the nozzle sheet, and two second positioning holes in respective vicinities of the two first positioning holes. When the nozzle sheet is adhered to a lower surface of a channel unit consisting of a plurality of sheet members and having a plurality of ink channels, first, two first positioning pins of a first jig are fitted in the two first positioning holes of the nozzle sheet so as to position the nozzle sheet relative to the first jig and, subsequently, the channel unit is adhered to the nozzle sheet so as to provide a cavity unit.
    Type: Grant
    Filed: November 25, 2003
    Date of Patent: November 28, 2006
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventor: Atsushi Ito
  • Patent number: 7131182
    Abstract: An assembly method and fixture for assembling a supporting disk of a motor rotor according to the invention is based on an “adjusting, and fixing” concept. A functional axis fixture and an adjusting axis fixture, which can match with each other for holding the supporting disk and the rotor, are first prepared. The functional axis of the supporting disk is aligned with the geometric axis of the functional axis fixture, and the geometric axis of the rotor is aligned with the geometric axis of the adjusting axis fixture. By engaging the functional axis fixture and the adjusting axis fixture, the functional axis of the supporting disk is aligned with the geometric axis of the rotor. Therefore, the bias and concentricity can be precisely controlled and improved.
    Type: Grant
    Filed: May 2, 2003
    Date of Patent: November 7, 2006
    Assignee: Delta Electronics, Inc.
    Inventors: Dung-Chang Yeh, Yung-Ping Lin
  • Patent number: 7131190
    Abstract: A method for fabricating membrane electrode assembly includes providing an anode side diffusion layer structure and a cathode side diffusion layer structure with a layer of membrane electrolyte therebetween. The diffusion layer structures include diffusion segments, which are coupled to each other by a first engaging member having one or more portions configured for engagement with a feed or aligning mechanism. Also, one or more of the segments of the diffusion layer structures may be connected to other segments or the first engaging member by one or more bridges. Bridges of each diffusion layer structure may be offset to avoid electrical contact with each other in response to diffusion layer structures being assembled with each other and with the layer of membrane electrolyte.
    Type: Grant
    Filed: December 17, 2004
    Date of Patent: November 7, 2006
    Assignee: MTI Micro Fuel Cells, Inc.
    Inventors: Eric J. Brown, Megan A. Fannon, Robert S. Hirsch
  • Patent number: 7124499
    Abstract: The apparatus is used for installing a wire in a crimp, in particular a wire being provided on a wire spool mounted on a spool holder. The wire outputs the apparatus at a wire output guide. The apparatus comprises a crimp punch tool located in front of the wire output guide. A first actuator allows operating the crimp punch tool. The wire is cut using a wire cutter adjacent to the crimp punch tool. The cutter tool is operated by a second actuator. In use, the wire is installed by feeding the wire from the wire spool through the wire output guide and then into the crimp. The crimp is closed by punching it using the crimp punch tool. The wire is cut after the last crimp using the wire cutter tool. The apparatus and method can be used for installing very fragile and small wires.
    Type: Grant
    Filed: July 29, 2003
    Date of Patent: October 24, 2006
    Assignee: Simpler Networks Inc.
    Inventors: Jean-Claude Villeneuve, Michel Décarie, Normand Lassonde, Pierre Kakos, Paul-André Messier
  • Patent number: 7120996
    Abstract: There is provided a plurality of component mounting apparatuses for sucking a plurality of components by a mounting head section and successively mounting the components onto a board located at a board positioning section. The component mounting apparatuses are arranged in parallel to one another, and a board transfer path is provided so that it penetrates the component mounting apparatuses. Even when the number of components to be mounted onto the board increases, the components are mounted on the component supply tables of the component mounting apparatuses as distributed thereto, and therefore, the whole apparatus is not dimensionally increased. The component supply tables are fixedly installed so as to become free of vibration, and the mounting head section executes the suction and the mounting of the plurality of components. Therefore, the component mounting operation speed can be remarkably increased.
    Type: Grant
    Filed: July 23, 2004
    Date of Patent: October 17, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kanji Hata, Noriaki Yoshida
  • Patent number: 7114244
    Abstract: A disc centering device includes a base plate, a chuck which is installed on the base plate, a hub unit which is detachably engaged to the chuck and receives discs and spacers to be stacked, disc pushers which are slidably provided outside the hub unit and include corresponding pressure members which center the discs by pushing circumferences of the discs, a driving unit which slides the disc pushers, and biasing units which are slidably provided outside the hub unit and push circumferences of the spacers. Accordingly, by performing a spacer biasing along with a disc centering, the accuracy of a centering is increased, thereby providing the discs having data recorded thereon with a uniform quality. Additionally, vibration of a rotation body can be minimized due to the simple configuration of the disc centering device. Furthermore, the productivity and manufacturability of HDDs are improved in view of the simplified maintenance and repair of the same.
    Type: Grant
    Filed: October 2, 2003
    Date of Patent: October 3, 2006
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ki-keon Yeom, Sang-jin Choi, Young-kun Kwon, Hyun-jin Lee, Dong-ok Kwak
  • Patent number: 7103967
    Abstract: According to the present invention, in the field of packaging the chip component, increase in speed and stability in packaging the chip component is achieved without significantly increasing the cost of the device. The size of the suction face of the suction nozzle is set so as to be larger than the relevant chip component. Near the inserting position P of the chip component, a push cover is provided in close proximity to the upper surface of the carrier tape. A hole is provided in the push cover at the inserting position P, and the size of the hole is slightly larger than the size of the tip face of the suction nozzle. After the chip component held to the suction nozzle enters the component-accommodating recess of the carrier tape, the suction of the suction nozzle is released and the carrier tape starts to move in the direction shown with an arrow, orthogonal to the suction nozzle. The suction nozzle is raised after the opening of the component-accommodating recess is completely under the push cover.
    Type: Grant
    Filed: December 31, 2002
    Date of Patent: September 12, 2006
    Assignees: Ricoh Company, Ltd., FAT Corporation, PALMEC Inc.
    Inventors: Junichi Nakagawa, Yuuji Inoue
  • Patent number: 7100273
    Abstract: Interconnect validation instruments and methods are provided. In one embodiment, an interconnect validation instrument has a shell with an opening at first end thereof and a second end opposite the first end. The second end has a plurality of holes. Each of the plurality of holes is adapted to receive a respective one of a plurality of pins therein. Each of the plurality of holes is further adapted to align the respective one of the plurality of pins when received therein when the respective one of the plurality of pins is not aligned.
    Type: Grant
    Filed: March 3, 2003
    Date of Patent: September 5, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: William Dale Youngman, Kin Shing Tam
  • Patent number: 7096594
    Abstract: An alignment device eases installation of computer assemblies, such as drives, into a corresponding chassis. The alignment device includes one or more planar areas located and oriented so as to be substantially alignable with one or more computer assemblies to be mounted to the chassis. The computer assembly has a user-visible surface which is moved until it is co-planar with a corresponding planar area of the alignment device. When positioned in this co-planar configuration, the computer assembly is correctly positioned relative to the chassis to be mounted thereto. The alignment device can be located on the computer chassis between mounting locations for two computer assemblies, such as a 5¼-inch drive and a 3½-inch drive and, in such application, can be provided with two planar areas at two different heights, one corresponding to the alignment position for one of the computer assemblies, the other corresponding to the alignment position for the other of the computer assemblies.
    Type: Grant
    Filed: June 30, 2003
    Date of Patent: August 29, 2006
    Assignee: Gateway Inc.
    Inventors: Vernon D. Erickson, David R. Davis, Kevin Alan Patin
  • Patent number: 7096914
    Abstract: In an embodiment of the invention an apparatus is configured to stack a plurality of semiconductor chips having the same or similar size. The apparatus includes a tape providing unit for providing an insulating adhesive tape, a tape attaching device for attaching the insulating adhesive tape to an area between electrode pads of a first chip, and a chip attaching device for attaching a second chip to the insulating adhesive tape.
    Type: Grant
    Filed: July 29, 2003
    Date of Patent: August 29, 2006
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dong-Kuk Kim, Min-Il Kim, Sang-Yeop Lee, Chang-Cheol Lee
  • Patent number: 7096572
    Abstract: The inventive device comprises a positioning device (4) for a fitting head (14). The positioning device is anchored on a support (3), which is detachably fastened to a supporting body (2) of the inventive device. A control device (17) for the positioning device (4) is additionally fastened to the support. These functional parts form a completely operative functional unit, which can be separately tested, calibrated and supplied by the supporting body (2). Different supports (3, 23) for different positioning devices (4, 20) can be fastened to the supporting body (2), whereby the inventive device can be optimally adapted to perform different fitting tasks.
    Type: Grant
    Filed: May 23, 2001
    Date of Patent: August 29, 2006
    Assignee: Siemens Aktiengesellschaft
    Inventors: Sebastian Aigner, Mohammad Mehdianpour
  • Patent number: 7089655
    Abstract: A system for performing an operation to a printed wiring board (PWB) having an apparatus for automatically resetting a PWB supporting device including a supporting table, supporting members which are set on a surface of the supporting table to support the PWB, a supporting-member storing device for storing the supporting members, a holding head for holding each of the supporting members, a moving device which moves the holding head relative to each of the supporting table and the storing device, in a direction parallel to the supporting table surface, so that the holding head takes a prescribed one of the supporting members from the storing device and sets the supporting member at a prescribed setting position on the surface of the supporting table, and takes the supporting member from the setting position and stores the supporting member in the storing device, and a control device which controls the moving device.
    Type: Grant
    Filed: September 29, 2003
    Date of Patent: August 15, 2006
    Assignee: Fuji Machine Mfg. Co., Ltd.
    Inventors: Takeyoshi Isogai, Noriaki Iwaki
  • Patent number: 7089971
    Abstract: A guide tool for organizing and identifying telecommunications cables during network cabling installation. Said guide tool is comprised of a solid, flexible material with multiple openings arranged in a curvilinear pattern around an arch. Cables are placed through the openings and pulled a desired distance. The guide tool is then slid by hand along the cables and the cables are secured in a bundle as they emerge from the back of the guide tool. Upon reaching the desired distance, cables are removed and a subsequent set is placed through the openings. The arch is positioned so that the secured bundle of the initial set passes through the arch. This placement maintains the guide tool on substantially the same path as the initial set, enabling the user to secure the subsequent set along substantially the same path as the initial set. This process is repeated for remaining set.
    Type: Grant
    Filed: July 24, 2003
    Date of Patent: August 15, 2006
    Inventor: Thomas Francis Spain
  • Patent number: 7089656
    Abstract: An electronic parts mounting apparatus which holds an electronic part with a mounting head, photographs the electronic part by a line camera 11, processes an image of the electronic part photographed by the line camera to recognize a position of the electronic part by using a recognition unit 16, positions the electronic part to a substrate in accordance with the position recognition result, and mounts the electronic part on the substrate. Offset values which are pre-stored for each recognition system associated with its own light source, a light source for transmission illumination 15a or a light source for reflection illumination 15b, are used for offset values used when a position correction is made, at the time of positioning, based on the position recognition result.
    Type: Grant
    Filed: December 1, 2003
    Date of Patent: August 15, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kazuhide Nagao, Shigeyuki Yoshitomi
  • Patent number: 7086145
    Abstract: The invention relates to an assembly device for microcomponents that are disposed in a magazine. The inventive assembly device does not require any optical systems and allows for an exact positioning of the microcomponents. The assembly will also be unaffected by any position changes of the microcomponents caused by wastage. The assembly device is provided with mechanical alignment devices that engage with or act upon adjustment structures of the magazine. The assembly device further comprises clamping devices for fixing the magazine and at least one plunger for ejecting at least one microcomponent from the magazine. An assembly platform is provided in the upper tool or in the lower tool of the assembly device and receives the microcomponents in a defined position. The invention further relates to a method for assembling microcomponents and to a corresponding magazine.
    Type: Grant
    Filed: February 27, 2001
    Date of Patent: August 8, 2006
    Assignee: Institut fur Mikrotechnik Mainz GmbH
    Inventors: Wolfgang Ehrfeld, Matthias Nienhaus, Udo Berg, Felix Schmitz, Marc Begemann, Yannick Ansel
  • Patent number: 7084533
    Abstract: A dual-function, three-axis positioning system having a high precision z-theta state with a horizontal translation axis (z-axis) and a rotary axis (theta-axis) parallel with the translation axis and a second horizontal translation axis (x-axis) comprises parallel spaced apart linear translation states, a first carriage supported between the parallel translation stages, and a rotation stage carried by the carriage between the parallel translation stages. A removable or permanently fixed second carriage is mounted on or being part of the first carriage.
    Type: Grant
    Filed: December 21, 2004
    Date of Patent: August 1, 2006
    Assignee: Aerotech, inc.
    Inventors: Stephen J. Botos, Brian P. O'Connor
  • Patent number: 7080444
    Abstract: An apparatus for dispensing blocks in a fluid over a substrate. The apparatus includes a first tube having a first end and a second end. A compression device is coupled to the first tube. A second tube is connected to the first tube to deliver a slurry having blocks to the first tube. The compression device pulsates at least one block in the slurry which is flowing through a portion of the first tube.
    Type: Grant
    Filed: February 28, 2002
    Date of Patent: July 25, 2006
    Assignee: Alien Technology Corporation
    Inventors: Gordon S. W. Craig, Ming X. Chan, Cornelius V. Sutu, Omar R. Alvarado, Hoang Pham, Mark Alfred Hadley
  • Patent number: 7076862
    Abstract: A tool for installing and removing flexible flat cable with respect to a protective sleeve has a groove for receiving the cable. The cable slides into and is formed into an arc by the groove and is supported evenly on both sides of the cable. With the full width of the cable in the groove, the tool slides down the length of the cable into the sleeve for the cable to be removed. As the tool slides into the sleeve, there is a smooth transition of the cable from flat to curved, and the cable and sleeve separate. The tool is slid through the sleeve as far as necessary for the needed action. After alternations to the sleeve or cable are complete, the tool is used to replace the cable back into the sleeve by reversing these steps.
    Type: Grant
    Filed: August 6, 2003
    Date of Patent: July 18, 2006
    Assignee: International Business Machines Corporation
    Inventors: Shawn Michael Nave, George G. Zamora