Means To Disassemble Electrical Device Patents (Class 29/762)
  • Patent number: 7296341
    Abstract: A disassembling tool pushes first and second coupling members out of a process cartridge that also has an electrophotographic photosensitive member, and first and second coupling members for rotatably coupling first and second frames of the cartridge together. The disassembling tool includes first and second base bodies, first and second engagement portions provided on the first and second base bodies respectively, and engageable with the cartridge to position the cartridge when the tool is mounted on the cartridge, and first and second pushing-out portions provided for movement relative to the first and second base bodies, respectively, for pushing out the first and second coupling members, respectively. The first and second engagement portions are provided at a location opposed to the first and second pushing-out portions, respectively, in a movement direction in which the first and second pushing-out portions are moved, respectively.
    Type: Grant
    Filed: August 30, 2005
    Date of Patent: November 20, 2007
    Assignee: Canon Kabushiki Kaisha
    Inventors: Ken Kikuchi, Toshiyuki Karakama, Toru Oguma, Akiyoshi Yokoi
  • Patent number: 7296340
    Abstract: The present invention provides a recycler that recycles a printed circuit board for separating and retrieving a metallic material, which includes a printed metallic material, and an insulating material, both composing the printed circuit board. The insulating body base of the printed circuit board as the waste printed circuit board can be a thermoplastic resin or a mixture of thermoplastic resin and inorganic loading material. The recycler includes a pressuring device that pressurizes the waste printed circuit board, a heater that heats the waste printed circuit board to a predetermined temperature at which the waste printed circuit board is at least softened, and a filter that filters the resin material from the waste printed circuit board. The heater can be maintain the filter at the predetermined temperature provided by the heater.
    Type: Grant
    Filed: July 21, 2005
    Date of Patent: November 20, 2007
    Assignee: DENSO CORPORATION
    Inventors: Atsusi Sakaida, Toshihisa Taniguchi
  • Patent number: 7296335
    Abstract: A method is provided for reworking a head gimbal assembly (HGA). An ultrasonic probe is used to stress the connection between the slider component of an HGA to remove the slider from its mounting position.
    Type: Grant
    Filed: May 31, 2005
    Date of Patent: November 20, 2007
    Assignee: Magnecomp Corporation
    Inventors: Visit Thaveeprungsriporn, Szu-Han Hu
  • Patent number: 7243418
    Abstract: An apparatus and method is provided which permits effective removal of a circuit board from sealed housing while minimizing stress, bending and flexing of circuit board sufficiently to prevent damage to circuit board and its electronic components. The apparatus includes a base to support the housing and a force transmitter to transmit a separation force to the exposed surfaces of one or more connectors of the circuit board. This apparatus effectively distributes the separation force across exposed surfaces of the connectors to create substantially uniform pressure on the connectors and thus the circuit board. The invention also includes steps for separating the circuit board from the housing including, in one embodiment, a separator apparatus for applying a pulling force to the connectors of the circuit board.
    Type: Grant
    Filed: June 22, 2004
    Date of Patent: July 17, 2007
    Assignee: Cummins, Inc.
    Inventors: Tomas Murillo, Jr., Francisco Chairez, Jose Monreal
  • Patent number: 7243419
    Abstract: The present invention involves a spark plug boot removal tool having a handle portion, an extension portion, and a grasping portion. The handle portion includes a spring-loaded trigger. The grasping portion includes a fixed grasping member and a rotatable grasping member. The extension portion includes an elongated flexible shaft enclosing a control rod that is attached to a triangular block. When the grasping portion is positioned over a spark plug boot, the trigger is compressed, causing the control rod to pull the block, causing the rotatable grasping member to join with the fixed grasping member to clamp around the spark plug boot. Both grasping members have an angular bend that allows the user to position the elongated flexible shaft outside of the engine compartment when exerting a force on the handle portion to remove the spark plug boot, thus minimizing the risk of injury.
    Type: Grant
    Filed: March 23, 2006
    Date of Patent: July 17, 2007
    Inventor: Dara Cheng
  • Patent number: 7240422
    Abstract: An apparatus and method is provided for detaching a semiconductor chip from an adhesive tape on which it is mounted. The apparatus comprises a platform adapted to contact the adhesive tape at a position of the chip and a retaining force generator coupled to the platform for drawing the adhesive tape in a direction away from the chip. An elevation device is projectable from the platform that is movable both laterally across a surface of the platform and vertically with respect to the platform for elevating the chip. By moving the elevation device across a width of the chip while lifting the chip, controlled lifting of the chip and propagation of delamination between the chip and the adhesive tape may be achieved.
    Type: Grant
    Filed: May 11, 2004
    Date of Patent: July 10, 2007
    Assignee: ASM Assembly Automation Ltd.
    Inventors: Yiu Ming Cheung, Chou Kee Liu, Ching Hong Yiu, Chi Ming Chong
  • Patent number: 7197811
    Abstract: A technique for separating the stator leads of an electric motor during the manufacturing process. The technique comprises a system having a lead gathering assembly, a lead separator, and a drive mechanism. The lead gathering assembly is adapted to gather together a plurality of stator windings extending from a stator. The lead separator having a plurality of teeth adapted to separate a stator winding from the plurality of stator windings gathered together by the lead gathering assembly. The drive mechanism is adapted to drive the lead separator into the plurality of stator windings. The lead separator has teeth to separate each of the stator windings gathered together by the lead gathering assembly.
    Type: Grant
    Filed: February 18, 2004
    Date of Patent: April 3, 2007
    Assignee: Reliance Electric Technologies, LLC
    Inventor: Hobart DeHart
  • Patent number: 7188405
    Abstract: A pin removal structure used in printed circuit board drilling machine comprised of a main body, a first driving member, a first driving rod, a collet member, a lower mounting cover, a socket, a second driving member, a plurality of second driving rods, and an air pressure control valve member. The collet member is sleeved vertically onto the locating pin, and through articulation of the air pressure control valve member, the first driving member and the first driving rod having the collet member positioned at its anterior extremity are impelled by air pressure into upward and forward movement, the collet member then guided by the socket fastened to a lower mounting cover to firmly clamp onto the locating pin.
    Type: Grant
    Filed: June 9, 2004
    Date of Patent: March 13, 2007
    Inventor: Shiun Hwang-Jyh
  • Patent number: 7182234
    Abstract: An automatic cutting device is described for cutting an assembly. The assembly includes a material having a weakened zone therein that defines a useful layer and being attached to a source substrate. The cutting device includes a cutting mechanism and a holding and positioning mechanism operatively associated with the cutting mechanism. The holding and positioning mechanism positions the material so that the cutting mechanism detaches the layer from the source substrate along the weakened zone. The cutting device also includes a control mechanism for adjusting at least two different portions of the assembly during detachment of the layer to facilitate a more precise detachment.
    Type: Grant
    Filed: July 1, 2004
    Date of Patent: February 27, 2007
    Assignee: S.O.I.Tec Silicon on Insulator Technologies S.A.
    Inventors: Olivier Rayssac, Fabrice Letertre
  • Patent number: 7150804
    Abstract: A method for disassembling an image display apparatus in which an image display unit including an internal space and a support member for supporting the image display unit are adhered by an adhesive member includes the step of separating the image display unit and the support member. The separating step includes a step of inserting a substance between the image display unit and the support member.
    Type: Grant
    Filed: December 19, 2002
    Date of Patent: December 19, 2006
    Assignee: Canon Kabushiki Kaisha
    Inventor: Hisao Tajima
  • Patent number: 7096649
    Abstract: While the manufacturing of integrated circuits (IC) has become a mostly automated process, the loading of the ICs into storage and shipping tubes 105 still requires a large amount of human interaction. A major stumbling block to the automation is the removal and insertion of retention pins 115 in the tubes. The present invention uses pressurized air 406 to hold a partially extracted retention pin 115 in position while the tube 105 is loaded. Once loaded, the retention pin 115 is reinserted. By not fully extracting the retention pin 115, alignment is maintained, simplifying the reinsertion step.
    Type: Grant
    Filed: August 4, 2004
    Date of Patent: August 29, 2006
    Assignee: Texas Instruments Incorporated
    Inventors: Jose Luis Estrada, Omar Carlin
  • Patent number: 7096574
    Abstract: A method for separating an encoder shaft of an angle encoder from a drive shaft, which are axially aligned with each other along an axial direction and are self-lockingly braced on each other by a press fit along the axial direction and a central fastening screw, which connects the encoder shaft and the drive shaft in the axial direction. A head of the fastening screw rests against an end of a bore of the encoder shaft, which receives a shank of the fastening screw, and a thread of the fastening screw is screwed into an internal screw thread of the drive shaft for bracing the encoder shaft and the drive shaft. The method includes partially turning the fastening screw out of the internal screw thread of the drive shaft and canceling the press fit by generating an axially oriented force acting between the head of the fastening screw and an end of the encoder shaft opposite the press fit.
    Type: Grant
    Filed: April 24, 2003
    Date of Patent: August 29, 2006
    Assignee: Dr. Johannes Heidenhain GmbH
    Inventor: Josef Thaler
  • Patent number: 7089658
    Abstract: A clamp remover is disclosed. In one example of the present embodiments, a wire clamp remover includes a first engaging member configured to engage a clamp and a second engaging member configured to engage the clamp. In addition, the wire clamp remover also comprises a first interface member coupled to the first engaging member and a second interface member coupled to the second engaging member.
    Type: Grant
    Filed: November 12, 2003
    Date of Patent: August 15, 2006
    Assignee: BellSouth Intellectual Property Corporation
    Inventor: John LoGuidice
  • Patent number: 7073251
    Abstract: The disassembling tool for a process cartridge has a base body, an engagement portion provided on the base body and adapted to be engaged with the process cartridge to thereby position the process cartridge, a pushing-out portion provided for movement relative to the base body for pushing out a coupling member, and a grip portion adapted to be gripped when the pushing-out portion is to be moved, and connected to the pushing-out portion, and the engagement portion is provided at a location opposed to the pushing-out portion in a movement direction in which the pushing-out portion is moved. Thereby, a process cartridge having a frame can be simply disassembled.
    Type: Grant
    Filed: September 3, 2003
    Date of Patent: July 11, 2006
    Assignee: Canon Kabushiki Kaisha
    Inventors: Ken Kikuchi, Toshiyuki Karakama, Toru Oguma, Akiyoshi Yokoi
  • Patent number: 7043829
    Abstract: A motherboard is assembled into an information handling system by coupling simulated electronic connectors of an assembly platform to electronic connectors of the motherboard to support movement of the motherboard to an installation position in the information handling system chassis. Openings in the assembly platform allow insertion of attachment devices to attach the motherboard to the chassis of the information handling system. Once the motherboard is secured to the chassis, the assembly platform is removed by pulling away from the motherboard to de-couple the simulated electronic connectors of the assembly board from the electronic connectors of the motherboard.
    Type: Grant
    Filed: December 9, 2002
    Date of Patent: May 16, 2006
    Assignee: Dell Products L.P.
    Inventors: Roy A. Rachui, Mark S. Manley
  • Patent number: 7040009
    Abstract: A heat sink hand placement tool for manually installing a heat sink to an integrated circuit (IC). The heat sink tool includes a heat sink interface block having a lower surface adapted to provide a force on a heat sink disposed over an IC. A force transducer interfaces with an upper surface of the heat sink interface block to produce an electrical signal, which is routed to a measurement circuit to measure the electrical signal. A chassis is disposed over the force transducer and the measurement circuit, wherein the chassis is adapted to receive a force from a user, such that the force is transmitted to the lower surface of the heat sink interface block. The measurement circuit then provides an indication of the force being applied within a predetermined range.
    Type: Grant
    Filed: June 30, 2003
    Date of Patent: May 9, 2006
    Assignee: Tektronix, Inc.
    Inventor: Michael S. Baxter
  • Patent number: 7028394
    Abstract: An automatic thermal debonding system removes slider rows from a stainless steel processing fixture. The system uses a bimodal pitch adjustment and a mechanical row detainment mechanism to remove the rows from the fixture. The system allows full control of all critical process parameters such as accurate and repeatable row placement; controlled temperature and heat flow; controlled mechanical removal pressure; temporal control and variability; clean and contaminant-free working area; and full electrostatic discharge grounding and compatible materials. The bimodal pitch adjustment feature allows for continual, high-speed removal of the ceramic rows from the fixture after an automated heating cycle is complete. As the rows are removed, they are accurately placed into the detainment mechanism for the next process step.
    Type: Grant
    Filed: September 30, 2003
    Date of Patent: April 18, 2006
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: John M. Borg, Sean M. Clemenza, Garrett T. Oakes, Katherine T. M. Tran
  • Patent number: 6973707
    Abstract: A method of removing stators from tubular stator housings involving subjecting a tubular stator housing having an interior surface to which a worn stator is adhered by adhesive to cryogenic refrigeration until the stator shrinks and pulls away from the interior surface of the tubular stator housing.
    Type: Grant
    Filed: February 5, 2003
    Date of Patent: December 13, 2005
    Inventor: John Russell McKay
  • Patent number: 6957484
    Abstract: A method for reworking a connector attached to an electronic board and including a plurality of stacked modules thereon. The method comprises providing a tool with a holding structure for holding the board and having first and second jaws for grasping and removing a selected one of the modules from the board, at least one of the jaws having a wedge and a slit for receiving the selected module, the tool having a first drive structure for moving the jaws between an open and a closed position along a direction parallel to the selected module, a second drive structure for moving the jaws along a direction perpendicular to the board and a third drive structure for moving the jaws along a direction parallel to the longitudinal axis of the connector, wherein the wedge separates an adjacent module from the selected module to be removed from the connector.
    Type: Grant
    Filed: June 28, 2004
    Date of Patent: October 25, 2005
    Assignee: International Business Machines Corporation
    Inventors: Silvio Pupin, Franco Scotti
  • Patent number: 6941625
    Abstract: A method of producing a piezoelectric/electrostrictive device in which a piezoelectric/electrostrictive element including a substantially trapezoidal laminate having narrower and wider surfaces lying substantially in parallel to each other and first and second surfaces opposed to each other between the narrower and wider surfaces. The first and second surfaces are inclined at given angles to one of the narrower and wider surfaces. The laminate includes piezoelectric/electrostrictive layers and interposed internal electrodes, the internal electrodes being broken up into a first and a second group, each of the first group internal electrodes lying over one of the second group internal electrodes through one of the piezoelectric/electrostrictive layers. A first external electrode is formed on the first surface of the laminate and is coupled to the first group internal electrodes. A second external electrode is formed on the second surface of the laminate and is coupled to the second group internal electrodes.
    Type: Grant
    Filed: September 27, 2004
    Date of Patent: September 13, 2005
    Assignee: NGK Insulators, Ltd.
    Inventors: Masahiko Namerikawa, Kazuyoshi Shibata, Masaki Iwamoto
  • Patent number: 6922888
    Abstract: An attachment for a tool used to attach and remove load break elbows and protective caps from bushings disposed on a transformer is provided. The tool attachment includes an elbow engaging member that is positionable around a load break elbow or cap fixed to a bushing. The engagement member is fixedly secured to a horizontal bar that includes a number of aligned openings extending through the bar. These openings are selectively alignable with a pair of openings disposed on a vertical bar to pivotally attach the vertical and horizontal bars to one another. The vertical bar also includes an opening through which a pulling eye on the elbow or cap can extend when the tool attachment is positioned on the elbow or cap.
    Type: Grant
    Filed: May 23, 2002
    Date of Patent: August 2, 2005
    Assignee: Speed Systems Inc.
    Inventors: William E. Barry, Todd K. Knapp
  • Patent number: 6915563
    Abstract: An apparatus for removing attached die having a pivoting means, having a pivot point and first and second sides, the pivot point having a corresponding first y coordinate, the first and second sides positioned opposite to one another, said pivoting means capable of attaching to a die carrier. The apparatus also having a shaft attached to the first side of the pivoting means. The apparatus further having a counterweight attached to the second side of the pivoting means. The apparatus lastly having a clamping means capable of attaching to at least one die, the die having a corresponding second y coordinate, wherein the first y coordinate is greater than the second y coordinate.
    Type: Grant
    Filed: June 27, 2003
    Date of Patent: July 12, 2005
    Assignee: International Business Machines Corporation
    Inventors: Lannie R. Bolde, Christopher Wayne Whittaker
  • Patent number: 6886234
    Abstract: The present invention is an apparatus and a method for removing a top cover from a disc drive. In accordance with one embodiment of the invention, an apparatus comprises a wedge configured to fit between the top cover and the base of the disc drive. The embodiment further comprises an actuator configured to drive the wedge with a sufficient driving force to separate the top cover from the base of the disc drive. The embodiment further comprises a crowder configured to support the disc drive, wherein the crowder is disposed to oppose the driving force imparted to the disc drive by the actuator. Finally, the embodiment comprises a top cover holder configured to remove the top cover. The present invention includes a method for implementing the steps performed by the embodiment of the apparatus.
    Type: Grant
    Filed: June 28, 2002
    Date of Patent: May 3, 2005
    Assignee: Seagate Technology LLC
    Inventors: Sham S. Nayar, James J. Stirn
  • Patent number: 6864431
    Abstract: A method of supporting a fragile board by a plurality of supporting members formed of respective elastic materials. The method includes steps of: (a) preparing a plurality of first and second supporting members as the supporting members such that the second supporting members have higher compression modulus than the first supporting members; (b) arranging the first and second supporting members on a plane such that each of the first supporting members is adjacent to a corresponding one of the second supporting members and such that each of the first supporting members has a larger height from the plane than each of the second supporting members; and (c) positioning the first and second supporting members under the board, whereby the board is supported at a lower surface thereof by the supporting members.
    Type: Grant
    Filed: March 25, 2002
    Date of Patent: March 8, 2005
    Assignee: Fuji Machine Mfg. Co., Ltd.
    Inventor: Shinsuke Suhara
  • Publication number: 20040261261
    Abstract: An apparatus for removing attached die having a pivoting means, having a pivot point and first and second sides, the pivot point having a corresponding first y coordinate, the first and second sides positioned opposite to one another, said pivoting means capable of attaching to a die carrier. The apparatus also having a shaft attached to the first side of the pivoting means. The apparatus further having a counterweight attached to the second side of the pivoting means. The apparatus lastly having a clamping means capable of attaching to at least one die, the die having a corresponding second y coordinate, wherein the first y coordinate is greater than the second y coordinate.
    Type: Application
    Filed: June 27, 2003
    Publication date: December 30, 2004
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Lannie R. Bolde, Christopher Wayne Whittaker
  • Publication number: 20040226169
    Abstract: A pull tab (1) is adapted to extract an electrical connector (2) from a mating electrical device. The electrical connector includes a mating portion (20) and a retaining portion (21). The pull tab includes an engaging portion (11) and a handling portion (12). The engaging portion has a bottom section (110) and a top section (111). The bottom section has an engaging hole (114) adapted for engaging with the mating portion of the electrical connector. The handling portion extends from the top section for receiving an extracting force for extracting the electrical connector from the mating electrical device.
    Type: Application
    Filed: July 17, 2003
    Publication date: November 18, 2004
    Inventors: Chia-Ming Kuo, Lung-Sheng Tai, Zhen-Da Hung, Hsien-Chu Lin
  • Patent number: 6817089
    Abstract: A tool for disengaging electrical connectors includes a central body section with disconnecting prongs projecting from the opposite ends thereof. The prongs are offset relative to the plane of the body section but extend in the same direction so that one set of the prongs forms an arcuate surface which facilitates the use of the prongs to disengage connector sections.
    Type: Grant
    Filed: April 16, 2002
    Date of Patent: November 16, 2004
    Assignee: Lisle Corporation
    Inventor: Michael L. Whitehead
  • Patent number: 6813815
    Abstract: A piezoelectric/electrostrictive element including a substantially trapezoidal laminate having narrower and wider surfaces lying substantially in parallel to each other and first and second surfaces opposed to each other between the narrower and wider surfaces. The first and second surfaces are inclined at given angles to one of the narrower and wider surfaces. The laminate includes piezoelectric/electrostrictive layers and interposed internal electrodes, the internal electrodes being broken up into a first and a second group, each of the first group internal electrodes lying over one of the second group internal electrodes through one of the piezoelectric/electrostrictive layers. A first external electrode is formed on the first surface of the laminate and is coupled to the first group internal electrodes. A second external electrode is formed on the second surface of the laminate and is coupled to the second group internal electrodes.
    Type: Grant
    Filed: July 31, 2003
    Date of Patent: November 9, 2004
    Assignee: NGK Insulators, Ltd.
    Inventors: Masahiko Namerikawa, Kazuyoshi Shibata, Masaki Iwamoto
  • Publication number: 20040205963
    Abstract: An improved tool for pulling off a rotor of a motor from a shaft or a fan from a shaft, which improved tool is provided with hooked arms that are releasably but securely held at one end in the housing, without the use of retaining clips, so that the arms do not fall off during use or become lost, and so that they do not interfere with the use of the tool when using the securing bolts for pulling off a rotor. The housing of the improved tool of the invention is circular in shape, and in a first version , is provided with a plurality of equally-spaced holes about its circumference, which holes received the hooked ends of the hooked arms, so that various configurations of hooked arms may be provided to best suit the configuration of vanes and type of fan being pulled off a shaft.
    Type: Application
    Filed: May 3, 2004
    Publication date: October 21, 2004
    Inventors: Michael Rubino, Michael Berg, Carol Rubino
  • Publication number: 20040200064
    Abstract: A process and tooling for removing a semiconductor chip (31) from a handling tape (321) without damage to either the chip or tape by one or more horizontal beam type ejector tools (333) driven by a variable speed motor (332) applying uniform pressure to the tape and chip backside. Each tool (333) emerges from a rigid support surface through an aperture which also serves to supply vacuum to hold the chip in alignment prior to ejection, and in turn allows planar removal of the chip by a pick-up arm (351).
    Type: Application
    Filed: April 14, 2003
    Publication date: October 14, 2004
    Inventor: Iszharudin Hassan
  • Patent number: 6796023
    Abstract: While the manufacturing of integrated circuits (IC) has become a mostly automated process, the loading of the ICs into storage and shipping tubes 105 still requires a large amount of human interaction. A major stumbling block to the automation is the removal and insertion of retention pins 115 in the tubes. The present invention uses pressurized air 406 to hold a partially extracted retention pin 115 in position while the tube 105 is loaded. Once loaded, the retention pin 115 is reinserted. By not fully extracting the retention pin 115, alignment is maintained, simplifying the reinsertion step.
    Type: Grant
    Filed: July 8, 2002
    Date of Patent: September 28, 2004
    Assignee: Texas Instruments Incorporated
    Inventors: Jose Luis Estrada, Omar Carlin
  • Patent number: 6796026
    Abstract: A tool for reworking a connector attached to an electronic board having a plurality of stacked wafer modules thereon. The tool includes first and second jaws for grasping and removing a selected one of the modules from the board, a holding structure for holding the board, and movement structure for moving the two jaws relative to the holding structure, at least one of the jaws adapted for separating each selected module from a module on each opposing side of the selected module such that removal of the selected module is attained without damage to the separated, adjacent modules.
    Type: Grant
    Filed: November 29, 2001
    Date of Patent: September 28, 2004
    Assignee: International Business Machines Corporation
    Inventors: Silvio Pupin, Franco Scotti
  • Patent number: 6779256
    Abstract: A tool is provided for separating a first circuit board and a second circuit board to prevent the damage thereof. The tool includes a piston assembly and a handle. A first blade and second blade are coupled between the handle and the piston assembly. The first blade and the second blade are normally biased outwardly. The handle has a first position and a second position relative to the piston assembly. In the first position the blades are biased outwardly and in the second position the piston assembly biases the blades inwardly to engage the first circuit board.
    Type: Grant
    Filed: June 14, 2002
    Date of Patent: August 24, 2004
    Assignee: General Electric Company
    Inventors: Mark A. Kappel, Robert J. Augustyn, Joseph J. Lacey
  • Patent number: 6757948
    Abstract: The present invention provides an ultrasonic probe and method for making the same is provided which has an advantageous construction and method of assembly. The ultrasonic probe has a segmented ultrasonic transducer having a plurality of individual independent transducers, a plurality of piezoelectric transducers connected to a first end of a respective individual independent transducer; and a plurality of electrical connections electrically communicating each the piezoelectric transducer with a power source.
    Type: Grant
    Filed: February 6, 2003
    Date of Patent: July 6, 2004
    Assignee: DaimlerChrysler Corporation
    Inventors: Andrei A Ptchelintsev, Roman Gr. Maev
  • Patent number: 6752896
    Abstract: A method of detaching a film of material (2) from the surface (5) of a substrate (1). An outlet (11) of a fluid delivery device (10) is engaged with an aperture (7, 8) in the substrate (1) from the opposite side of the substrate (1) from the surface (5) to which the film (2) is attached. Fluid is passed out of the outlet (11) and through the aperture (7, 8) to generate a detaching force between the film of material (2) and the surface (5) adjacent to the aperture (7, 8).
    Type: Grant
    Filed: July 10, 2001
    Date of Patent: June 22, 2004
    Assignee: ASM Technology Singapore PTE LTD
    Inventors: See Yap Ong, Keng Hock Chew, Shu Chuen Ho, Teng Hock Kuah
  • Publication number: 20040111854
    Abstract: The present invention provides a method and apparatus of recycling a printed circuit board for separating and retrieving a metallic material, which includes a printed metallic material, and an insulating material, both composing the printed circuit board. Both the metallic material and the insulating material, which are separated and retrieved, are possible for recycling. In the method for recycling the printed circuit board, hot filtration equipment 4a and resin-metal separation equipment 51 are used in hot filtration process P400. The waste printed circuit board 1 is heated and force-filtered so that only the insulating material 1a pass through the filter. Then, the insulating material 1a and the metallic material 1b are separated and retrieved. It is preferred that the insulating body base 23 of the printed circuit board 100 as the waste printed circuit board is made of thermoplastic resin or a mixture of thermoplastic resin and inorganic loading material.
    Type: Application
    Filed: March 26, 2003
    Publication date: June 17, 2004
    Inventors: Rikiya Kamimura, Katsumi Nakamura, Kouji Kondo, Atsusi Sakaida, Toshihisa Taniguchi
  • Publication number: 20040111876
    Abstract: A reworking device (10) for removing a socket connector (20) soldered to a PCB (40) comprises a body portion (12) and a pair of movable clips (16) assembled to the body portion. Each of the movable clips has a hook (16f) for hooking a portion of the socket connector. A spring (16e) is compressively mounted on each of the movable clips for providing an upward force to the hook to pull the socket connector upwardly from the PCB when a soldering connection between the PCB and the socket connector is heated to reflow. A pair of standing legs (14) is provided to stand on an upper surface of the PCB beside the socket connector. The body portion is mounted on the standing legs.
    Type: Application
    Filed: December 13, 2002
    Publication date: June 17, 2004
    Inventor: Andrew Cheng
  • Patent number: 6732427
    Abstract: A method for shortening a cable, which is mounted in a device housing of a measurement device, of a cable probe, comprising the step of: removing the measurement device electronics; interrupting the electrical connections between the measurement device electronics and the cable probe; releasing a built-in sleeve which surrounds the cable, as a result of which at least one seal which surrounds the cable and acts with respect to a medium to be measured, is relieved of load; drawing out of the device housing the built-in sleeve, together with the cable and the seal; shortening the cable by a desired length; once again drawing over the remaining cable of the cable probe, a seal, a built-in sleeve and clamping cone and mounting the cable in the built-in sleeve, by pulling it into said built-in sleeve; once again making the electrical connections between the cable probe and the measurement device electronics; and once again closing the device housing once the measurement device electronics have been fitted.
    Type: Grant
    Filed: May 7, 2002
    Date of Patent: May 11, 2004
    Assignee: Endress + Hauser GmbH + Co.
    Inventor: Robert Schmidt
  • Patent number: 6732426
    Abstract: An extraction tool (100) not only releases an optical fiber terminus (20) from a retainer clip (62) so the terminus can be moved rearwardly out of the connector, but also retracts the terminus without applying tension to the optical fiber (52) or force to the tip (32) of the optical fiber. The tool includes inner and outer tubes (104, 102), the inner tube having a front portion (110) forming a plurality of fingers (120) with front ends (124) that can grasp the terminus body. After the inner tube has been inserted into place, the outer tube is slid forwardly past the inner tube to expand the tines (64) of the retainer clip and prevent the fingers of the inner tube from expanding. Without sliding the tubes relative to each other, the inner and outer tubes are pulled rearwardly out of the connector passage to withdraw the terminus without pulling on the optical fiber.
    Type: Grant
    Filed: April 3, 2002
    Date of Patent: May 11, 2004
    Assignee: ITT Manufacturing Enterprises, Inc.
    Inventor: Terry Lee Adams
  • Patent number: 6725534
    Abstract: An extraction tip having first and second extraction segments. The first extraction segment is positioned at a distal end of the extraction tip and the second extraction segment is spaced therefrom. The first extraction segment includes an axial slot for transverse insertion of a stem portion of a pin and the second extraction segment is recessed from the first extraction segment to form a stepped surface between the first and second extraction segments. The second extraction segment is non-expandable to hold a head portion of the pin in abutment with the stepped surface so that the stepped surface pushes against the head portion to eject the pin.
    Type: Grant
    Filed: November 9, 2000
    Date of Patent: April 27, 2004
    Assignee: Seagate Technology LLC
    Inventor: George A. Schwartzbauer
  • Publication number: 20040074090
    Abstract: The invention relates to a continuous process and an apparatus for partially exposing conductor tracks in fully insulated laminated cables according to specifiable parameters selectable in accordance with the subsequent conditions for use. The object of the invention is to insert windows in exactly predetermined parts above/below individual/all flat conductors of a multiconductor flat cable, which windows are distinguished by clean and accurate contours and furthermore ensure good positional stability of the conductors. The flat cable (1) is first fed to an apparatus and fixed on it in such a way that an individually feedable and individually movable peeling tool (5) can be coordinated in a defined manner with each flat conductor, both from above and from below, which peeling tool effects first an incision in the insulation layer, then peeling off down to the flat conductor and finally separation of the chip (10).
    Type: Application
    Filed: October 18, 2002
    Publication date: April 22, 2004
    Inventors: Dietmar Zeibig, Leo Buhler
  • Patent number: 6719188
    Abstract: A method and apparatus are provided for reworking electronic component assemblies where the components are joined by solder interconnections. A cutting device employing a heated wire, blade or other cutting element is forced against and through the solder interconnections to sever the interconnections. A preferred cutting device employs moving the cutting element transverse to the solder interconnections to also provide a sawing action to the solder interconnections. Another cutting device employs a water jet to provide a high pressure stream of water that cuts and severs the solder interconnections.
    Type: Grant
    Filed: July 24, 2001
    Date of Patent: April 13, 2004
    Assignee: International Business Machines Corporation
    Inventors: Mukta G. Farooq, Raymond A. Jackson, David C. Linnell
  • Patent number: 6704987
    Abstract: The present invention is a terminator tool used in combination with a cable security terminator for installing or removing the cable security terminator. The terminator tool includes a handle, a shaft, a retaining pin and a spring member. The shaft is hollow and extends from the handle. The shaft includes a pin hole to receive the retaining pin, a handle end and a terminator end. The handle end is the end inserted and secured into the handle. The terminator end includes two ear slots and receives the spring member. The terminator end is sized to fit into a tool end of the cable security terminator. Ears of the spring member extend from the ear slots of the shaft.
    Type: Grant
    Filed: April 14, 2000
    Date of Patent: March 16, 2004
    Inventor: Glenn G. Miller
  • Patent number: 6678939
    Abstract: A system for manufacturing a thin-film magnetic head having a means for cutting a wafer into bars, each bar having a plurality of thin-film magnetic head sliders which are sequentially coupled with each other, a means for identifying the bar to be worked to generate an identification signal which indicates identity of said bar, a means for obtaining data of said bar in a unit of bar depending upon said identification signal, and a means for processing at least one working of said bar on the basis of said obtained data of said bar.
    Type: Grant
    Filed: February 6, 2001
    Date of Patent: January 20, 2004
    Assignee: TDK Corporation
    Inventors: Tomoyuki Yoshida, Noritsugu Kakegawa
  • Patent number: 6678945
    Abstract: A tool is described for the backside removal of single pins from a high pin density connector, either from the connector itself or a connector with pins such as compliant pins mounted in plated through vias on a host such as a printed circuit board. A pin is driven from a connector by advancing a sleeve portion to surround the pin and subsequently pushing the pin from the connector using a shaft with a spherical, concave end surface, whereby the pin is radially confined by the sleeve and aligned and driven by the shaft as it is advanced through the sleeve. Where the connector is mounted on a printed circuit board with the pin resident in a plated through via, the sleeve is aligned with and abutting the printed circuit board at the via opening and the shaft is thereafter advanced through and beyond the sleeve to engage, align and drive the pin with the via wall providing radial confinement.
    Type: Grant
    Filed: April 4, 2002
    Date of Patent: January 20, 2004
    Assignee: International Business Machnies Corporation
    Inventors: Michael Lee Eaton, Gregory Jay Geilow, Michael Lee Graham, Jeffrey C. Shonkwiler
  • Publication number: 20030229985
    Abstract: A tool is provided for removing a first connector portion from a second connector portion. The first connector portion has a retraction feature thereon. The tool has a piston assembly that has a channel therethrough. A cross-member slidably receives the piston assembly. The cross-member has a slot therein. The cross-member has a post head sized to be received within the retraction feature. The pin is positioned within the channel and is slidably received within the slot.
    Type: Application
    Filed: June 14, 2002
    Publication date: December 18, 2003
    Inventors: Mark A. Kappel, Joseph J. Lacey
  • Publication number: 20030229979
    Abstract: A tool is provided for separating a first circuit board and a second circuit board to prevent the damage thereof. In one aspect of the invention the tool includes a piston assembly and a handle. A first blade and second blade are coupled between the handle and the piston assembly. The first blade and the second blade are normally biased outwardly. The handle has a first position and a second position relative to the piston assembly. In the first position the blades are biased outwardly and in the second position the piston assembly biases the blades inwardly to engage the first circuit board.
    Type: Application
    Filed: June 14, 2002
    Publication date: December 18, 2003
    Inventors: Mark A. Kappel, Robert J. Augustyn, Joseph J. Lacey
  • Publication number: 20030221312
    Abstract: The invention is related to a kind of a PCB unloading mechanism, consisting of a floating plate and a moving mechanism attached between a fixing plate and a bed. On both sides of the floating plate insets a bushing, allowing the floating plate to move on a guiding shaft fixed between the fixing plate and the bed. The floating plate moves up and down through the control of the moving mechanism fixed on top of the fixing plate. Moreover, a plurality of ejecting pins are embedded on the surface of the floating plate. The ejecting pins can pass through the corresponding holes on the bed and the template for displacement, allowing the PCB to be released from the fixedness and complete the unloading operation smoothly so as to ensure the accuracy of the positioning for the next processed PCB.
    Type: Application
    Filed: May 31, 2002
    Publication date: December 4, 2003
    Applicant: Ta Liang Technology Co., Ltd.
    Inventor: Tzai-Wei Lee
  • Publication number: 20030213123
    Abstract: A method for separating an encoder shaft of an angle encoder from a drive shaft, which are axially aligned with each other along an axial direction and are self-lockingly braced on each other by a press fit along the axial direction and a central fastening screw, which connects the encoder shaft and the drive shaft in the axial direction. A head of the fastening screw rests against an end of a bore of the encoder shaft, which receives a shank of the fastening screw, and a thread of the fastening screw is screwed into an internal screw thread of the drive shaft for bracing the encoder shaft and the drive shaft. The method includes partially turning the fastening screw out of the internal screw thread of the drive shaft and canceling the press fit by generating an axially oriented force acting between the head of the fastening screw and an end of the encoder shaft opposite the press fit.
    Type: Application
    Filed: April 24, 2003
    Publication date: November 20, 2003
    Inventor: Josef Thaler
  • Patent number: 6640426
    Abstract: A pin grid array insertion and extraction tool is disclosed that is used to both insert and extract pin grid array connectors. The tool comprises a rigid window frame defined by bars connected to handles wherein the bars define straight slots and ramped slots on an elongated side that engage tabs and sliders of a header and socket of a pin grid array connector. The ramped slots are used to generate mechanical advantage and bring the insertion force seen by an operator's hand down to reasonable levels when engaging or disengaging connector pins to or from their mating receptacles. By using ramped slots the insertion and extraction tool can be made very compact in almost every dimension.
    Type: Grant
    Filed: February 15, 2001
    Date of Patent: November 4, 2003
    Assignee: Xerox Corporation
    Inventor: Brian E. Sonnichsen