Abstract: The modification of existing and assembled electrical printed circuit boards is accomplished by placing additional conductors between the lead wires (4) of the electrical components (2). These conductors are in the form of a printed conductor foil (3) which is placed on the support plate (1) of the printed circuit module. The ends of the conductors on the conductor foil (3) terminate in soldering eyelets which are soldered to the protruding lead wires (4). By this means all additional electrical connections can be made at one time and without the danger of routing errors.

Abstract: An integrable, high frequency superlinear amplifier and its fabrication method is disclosed which is related to the basic amplifier fabrication field having negative feedback and signal conversion. The three stage amplifier design involves a first and second stage which have a narrow bandwidth response and a third amplifier stage with a larger or wider bandwidth response. The bandwidth of the wide bandwidth stage is such that when the gain curve for the two narrow bandwidth stages passes through the -6dB point at a first frequency then the peak point of the wide bandwidth stage is located at a second frequency higher than the first frequency. The wide bandwidth stage utilizes a single capacitor so that the resulting curve of the three stages has an approximately flat portion below the zero gain point. The impedance of the network is adjusted to a desired value through a feedback configuration.

Abstract: An automatic apparatus for mounting electronic parts on a printed circuit board includes a turntable, a plurality of mounting heads mounted in positions spaced at equal distances around the turntable, a plurality of mounting chucks movably mounted on each of the mounting heads and each having a shape for picking up a different shape electronic part, cams disposed around the periphery of the turntable and engageable with the mounting heads for positioning one mounting chuck on each of the mounting heads in a position for picking up a desired part, carrying the part around the periphery of the turntable and mounting it on the printed circuit board, and a device to drive the mounting chucks to pick up an electronic part and to mount electronic part picked up on the printed circuit board.

Abstract: When mounting pinless electronic components on the conductor path side of a printed circuit card, the components are oriented in a predetermined manner, depending on the desired orientation at the mounting site, in component trays from which the components are transferred to the printed circuit card by means of a manually operated suction device. On the conductor path side of the printed circuit card, an adhesive material has previously been applied to the intended mounting sites of the components, the suction force of the suction device being set at a lower value than the adhesive force of the adhesive material.

Abstract: An installation for manually assemblying electrical and electronic components on a printed circuit board using a display device for optically identifying the respective assembly positions of the component on the board, at least one magazine with a removable position for supplying the required component and an arithmetic unit for controlling the display device and selection of the particular magazine characterized by the magazine being designed to carry all components for a large number of different printed circuit boards and an identification device which is connected to the arithmetic unit to identify the particular circuit board which is being supplied, sending a signal to the arithmetic unit to identify the board so that the arithmetic unit provides the necessary assembly program.

Abstract: A hybrid integrated circuit is manufactured byplacing chip-type circuit elements on predetermined portions of a template;preparing a printed circuit board having predetermined conductive patterns thereon and adhesive material at predetermined portions thereof;placing the printed circuit board on the template so as to bring the circuit elements into contact with the adhesive material;turning the template with the circuit board upside down and then transferring the circuit elements to the circuit board by removing the template from the circuit board;hardening the adhesive material to temporarily hold the circuit elements on the circuit board; andsoldering the circuit elements to conductive patterns formed on the circuit board, so as to electrically connect the circuit elements with the conductive patterns.

Abstract: An apparatus is provided for individually selecting a number of dual in-line (DIP) components and sequentially inserting them into a printed circuit board. The apparatus has a basic mode of operation, under a program control, and comprises a shuttle assembly and a component insertion assembly. In operation, the shuttle assembly transfers a component from a selected one of a plurality of magazines to an unload station. At the unload station, the shuttle assembly loads the insertion assembly which rotates to a vertical position for insertion of the component in a printed circuit board. The printed circuit board is mounted on an X-Y positioning system controlled by a tape reader or a computer which also determines the automatic sequencing of the shuttle assembly.

Abstract: An improved assembly table for assembling conductor boards wherein integrated circuits to be inserted on the boards are conveyed by trays automatically and in a synchronized manner from a rotatable magazine to the conductor boards. The integrated circuits are contained in predetermined arrangement in the magazine and are picked up one at a time by a transfer means and each integrated circuit is deposited in an associated tray with a recess shaped to accept the integrated circuit. This arrangement permits safe direct picking up of the integrated circuits with assembly tongs within short reach of the conductor boards.

Abstract: A single automatic part insertion machine which can insert the leads of various electronic components such as resistors, IC chips, IF transformers, variable resistors, connectors and so on, into specified insertion or mounting holes of printed circuit boards. The boards are supported on a common set of conveyor rails in one row, and are displaced in X and Y coordinate directions while they are transferred from a feeding position to an unloading position. Specified lead insertion holes of specified printed circuit boards are thus aligned one at a time with selected units of a number of parts feeding means in a predetermined sequence, so that the leads of corresponding electronic components may be inserted into specified insertion holes of the printed circuit boards and clinched if required. An automatic unfinished printed circuit board loading device is provided, as well as an automatic finished printed circuit board stacking device.