Abstract: A method of assembling a power distribution apparatus including a plurality of conductive circuit plates, each conductive plate including a plurality of contact pads that are interconnected by removable connecting links. The method includes selectively removing a portion of the connecting links on each conductive circuit plate to form discrete circuits on the conductive plates, stacking the conductive plates, mounting contact pins to selected contact pads, and heating the stacked plates and the mounted contact pins, thereby reflowing the conductive circuit plates and the pins to create solder joints therebetween.

Abstract: A pick and place system comprises a pick and place nozzle. The nozzle includes a groove comprising tapered sides that feed into a depression at the bottom of the groove, and a plurality of air holes configured to allow air suction to attract a component and hold it in the groove in such a manner as to ensure that the component can be accurately placed. The system also comprises a tray configured to hold a plurality of components to be picked up and placed using the pick and place nozzle. The tray can be configured to hold the components in a precise location within the tray.

Abstract: The object of the present invention is to provide a free and precise control of the plating amount while easily determining a selected portion to be plated. Small balls 24 are arranged at, and adhered or bonded to, via holes 22 of a TAB tape 21 and the small balls 24 are then melted so that a copper wiring 23 exposed at the via holes 22 of the TAB tape 21 can be selectively plated with a different metal to enable selected portions of a substrate for electronic devices to be partially plated easily and precisely.

Abstract: The present invention provides methods for connecting electrically conductive elastomer to electronics that reduce cost and time for manufacturing a tactile sensor that includes an electrically conductive elastomer such as a conductive foam. The methods provide a good connection between the electrically conductive elastomer and the electrodes connected to the electronics, which provide for repeatable measurements. The methods can be used for all cases of electrically conductive elastomers and elastomers made to be conductive with the addition of conductive particles (such as carbon, silver, nickel, gold, etc.) including thermoplastic and some thermosetting elastomers.

Abstract: A printed circuit board (PCB) and method of forming same is performed without incoming lines for plating. The plating is preferably performed on ball pad areas and/or bonding pad areas being the top layer of a multi-layer PCB. A metal layer that later forms circuit patterns serves to supply a power for plating ball pads for solder-ball bonding and bonding pads for wire-bonding with gold (Au). Thus, the gold (Au)-plating is performed prior to forming the circuit patterns. A positive-type first photoresist is coated on the metal layer to form the ball pads and the bonding pads. The coated first photoresist is also used to form circuit patterns. The gold (Au)-plated metal layer of ball pad areas and the bonding pad areas are protected by a second photoresist, which is reactive with a larger quantity of light than the first photoresist. Both first and second photoresists can be concurrently developed.

Abstract: Circuit board reworking techniques involve removing original solder from the metallic pad, removing an outer portion of the metallic pad to expose an inner portion of the metallic pad, and applying new solder to the metallic pad. Removal of the original solder and the outer portion of the metallic pad exposes the inner portion which has non-corroded and non-contaminated metal. The application of new solder to this inner portion of the pad enables wettability of the pad as well as provides a protective coating to prevent corrosion of the inner portion (e.g., oxidation, reaction with contaminants, etc.). Accordingly, circuit board abnormalities such as “Black Pad” defects can be cured.

Abstract: A method and apparatus to eliminate conductive contamination reliability problems for assembled substrates, such as electrical arcing in power semiconductor leads. One embodiment of the invention involves a method for assembling an electrical component having leads on a substrate having conductive contacts, wherein an elastomer part encapsulates the leads of the electrical component. A second embodiment of the invention involves assembling an electrical component having leads to a substrate having conductive contacts, wherein an elastomer shape cut by a punch die encapsulates the leads of the electrical component. A third embodiment of the invention involves an assembled substrate including an electrical component having leads, and an elastomer surrounding the leads to encapsulate the leads.

Abstract: Method for producing an electrical connection between a first and a second contact partner, provision being made, according to the invention, for the two contact partners to be led together as a plug-in connection and then non-detachably connected to each other in an integral or quasi-integral manner.

Abstract: A method is provided for manufacturing a saw filter in which a carrier plate 10 that can be separated into base plates 2 is respectively provided with interconnects in the base plate regions A and these are contacted to the active structures of SAW chips 1 in flip-chip technique. A metal foil 3 or plastic film 4 is placed onto the chip-equipped carrier plate 10 and, for example, is pressure and heat treated such that it envelopes each chip 1 (except for the chip surface facing toward the carrier plate 10) and lies hermetically tight on the carrier plate surface in regions between the chips.

Abstract: Electrical nets are prepared by bonding an electrically conductive element in a deleted plated via. The electrically conductive element has a headed portion that contacts the bottom of the laminate and the other end of the electrically conductive element electrically connects to a BGA pad or surface trace line.

Abstract: An electronic parts replacing apparatus comprises: a holder for holding a piece of electronic parts to be replaced; a head detachably provided to the holder; and a guide bar for guiding the head to move close to or away from a circuit board. After holding the piece of electronic parts to be replaced on the circuit board by the holder and then integrating the head to the holder, the piece of electronic parts to be replaced are removed by moving the holder to a direction away from the circuit board. After removing the piece of electronic parts to be replaced from the holder and then holding a new piece of replacing electronic parts, the piece of replacing electronic parts are mounted on the circuit board by moving the head close to the circuit board.

Abstract: The invention is to form plated films on a conductive foil a thigh precision, and simplify a procedure of forming the plated film. A resin film composed of a thermosetting resin is formed on the surface of the conductive foil. The resin film of parts which become bonding pads and die pads is eliminated by a laser etching. A clamper presses of the periphery of the block so as to form hermetically sealed spaces on the block. The interior of the clamper is filled with a plating liquid by means of an injection means and an evacuation means, and subsequently, and Ag plated film is formed by an electroplating method.

Abstract: A method of assembling a power distribution apparatus including a plurality of conductive circuit plates, each conductive plate including a plurality of contact pads that are interconnected by removable connecting links. The method includes selectively removing a portion of the connecting links on each conductive circuit plate to form discrete circuits on the conductive plates, stacking the conductive plates, mounting contact pins to selected contact pads, and heating the stacked plates and the mounted contact pins, thereby reflowing the conductive circuit plates and the pins to create solder joints therebetween.

Abstract: A flash circuit board in a lens-fitted photo film unit includes a board part, and a battery contact part connected to the board part by solder. A part exchanging apparatus for the circuit board includes an eliminating unit, which melts the solder, and removes the battery contact part from the board part while the solder is melted. An assembling unit mounts an unused battery contact part on the board part. The unused battery contact part has an unused form of the first battery contact part. A soldering unit connects the unused battery contact part to the board part by use of solder.

Abstract: A process of forming a multi-layer electronic composite structure. The process includes providing at least one core including at least one plane of at least one electrically conducting material with a plane of at least one electrically insulating material on both sides of the at least one plane of at least one electrically conducting material. The at least one core includes a plurality of placed through holes formed therethrough. At least one pad is provided over at least one of the plated through holes. The pad provides a flat surface for attaching an electronic device and also prevents solder from entering the at least one plated through hole.

Abstract: A method of producing a multilayer electronic part having the shape of a substantially rectangular parallelopiped is constituted which has a multilayer body formed by superposing coil conductors and green sheets of a magnetic or nonmagnetic material. Terminal electrodes are formed respectively on both ends of the multilayer body along the direction of the magnetic flux generated when current is caused to flow through the coil conductors in the multilayer body. The terminal electrodes each has a conductive substrate formed within the area of the end of the multilayer body and including a lamination body as a component of the multilayer body.

Abstract: Disclosed is a method of producing a flexible circuit board having gold selectively plated on only desired elements of the conductive circuits. These desired elements typically are attachment sites, such as wire bond pads or ball grid array pads, for semiconductor chips. This method eliminates the requirement to buss all circuits to a common plating contact by using a background seed metal for plating continuity. This method also provides a means to alleviate the requirement for precise registration or alignment when multiple photoresist layers are employed in order to selectively plate only a portion of the metallic elements present on the flexible circuit board. The defect of resist lifting followed by nickel/gold underplating is eliminated by conditioning the intermediate photoresist to survive the nickel/gold plating bath.

Abstract: A ceramic electronic part includes at least one chip ceramic electronic part body having terminal electrodes and terminals provided on both sides. Each terminal is composed of a metal plate bent into a u shape. The outer face of a first leg of each bent terminal faces and is attached to a terminal electrode, and a second leg is attached to a substrate. The inner face of the bent terminal is provided with a solder-phobic surface not having affinity for solder, and the outer face of the bent terminal is provided with a solder-philic surface having high affinity for solder.

Abstract: Low profile interconnect structure includes an electronic circuit module with a plurality of mounting areas and a plurality of electrical contact areas defined by the mounting surface. The plurality of mounting areas are spaced a first distance from a mounting and interconnect surface parallel to and spaced from the mounting surface and the plurality of electrical contact areas are spaced a second distance, less than the first distance, from the mounting and interconnect surface. Large solder balls are used between the mounting areas and the mounting and interconnect surface to form a solid mount and smaller solder members are used for electrical interconnections.

Abstract: Process and device for the contacting of a wire conductor (113) in the course of the manufacture of a transponder unit arranged on a substrate (111) and comprising a wire coil (112) and a chip unit (115), wherein in a first phase the wire conductor (113) is guided away via the terminal area (118, 119) or a region accepting the terminal area and is fixed on the substrate (111) relative to the terminal area (118, 119) or the region assigned to the terminal area, and in a second phase the connection of the wire conductor (113) to the terminal area (118,119) is effected by means of a connecting instrument (125).

Abstract: A system for mounting circuit components on a circuit substrate, including a circuit-substrate supporting device which supports the circuit substrate, a circuit-component mounting device which mounts, at a circuit-component mounting position, the circuit components on the circuit substrate supported by the circuit-substrate supporting device, and a circuit-substrate carry-out device which receives, from the circuit-substrate supporting device, the circuit substrate with the circuit components being mounted thereon, and carries out the received circuit substrate, the circuit substrate being transferred from the circuit-substrate supporting device to the circuit-substrate carry-out device in a direction substantially perpendicular to a plane of the circuit substrate.

Abstract: The present invention relates to a workpiece implementation device that fabricates individual workpieces, positions them at their point of use on a component, and connects the workpieces to the components. The device further comprises an accessory assembly capable of shaping the workpieces, coating the workpieces with an adhesive or solderable material, burnishing the point of use on the component, and testing the connection between the workpieces and the component. The positioning, attaching, and accessory assemblies of the workpiece implementation device are adapted to selectively perform their individual functions without the necessity of first repositioning the component or the implementation device. Accordingly, the present invention increases overall production efficiency by integrating several separate implementation tools and workstations into a single, adaptable device.

Abstract: A connector utilized to electrically connect together conductive pads disposed on different substrates includes a flexible substrate having a plurality of conductive through-holes therein. A conductive line formed in the flexible substrate extends between at least two of the conductive through-holes. A plurality of contacts is mounted in the conductive through-holes of the flexible substrate. Each contact includes a post connected to a base of a crown-shaped head having a plurality of projections around the periphery of the base that extend away from the base in the direction opposite the post. The post of each contact is soldered into one of the plurality of conductive through-holes. A compression mat positioned on a side of the flexible substrate opposite the crownshaped heads includes a plurality of resilient cylinders that extend away from a resilient base. Each resilient cylinder has a distal end alignable in registration with a distal end of the post of one of the plurality of contacts.

Abstract: A wire-wound component to be mounted on a printed circuit board. The wire-wound component is formed by winding a wire on the body of the wire-wound component and by winding both end portions of the wire on terminals. The terminals and the body of the wire-wound component are formed as one unit by molding a heat-resistant resin material. The molded terminals, on which both end portions of the wire are wound, are inserted into the printed circuit board, and then connected to a circuit pattern on the printed circuit board by soldering.

Abstract: Electrical pin (10) for solderless insertion into metallized apertures of circuit boards, comprising an elastically deformable press-fit portion (14) with four contact areas (26), which are located on a first larger diameter (28) as compared with the diameter of the apertures of the circuit boards. A positioning portion (18) is provided ahead of the press-fit portion (14) and a transition portion (16) lies therebetween. The positioning portion (18) also has four contact areas (36), which are located on a second diameter (30) slightly smaller than the diameter of the apertures. Contrary to the press-fit portion (14) the positioning portion (18) is not deformed during the insertion of the electrical pin (10). Due to the positioning portion (18) the electrical pins can be connected to the circuit board in two operation steps, the first one being the positioning step and the second one being the press-in step.

Abstract: A transmitter in a process control system transmits a pressure over a process control loop. The transmitter includes I/O circuitry, compensation circuitry and an absolute pressure sensor. The I/O circuitry transmits information over the process control loop. Compensation circuitry receives a pressure related signal and responsively controls the I/O circuitry to transmit pressure information on the loop. The absolute pressure sensor includes a cavity which deforms as the sensor deflects in response to an applied pressure. A sensor in the cavity provides the pressure related signal to the compensation circuitry in response to the deformation.

Abstract: Shielded stripline multi-lead flex cable is successfully attached to solder pads on a circuit board by applying a hot bar to the backside of the cable placed in abuttment with the associated solder pads. The hot bar generates sufficient heat to reflow pretinned cable elements and the corresponding solder pads of the circuit board. An attachment is attained in which the outer ground plane metal layer of the cable covers the signal lines and the other ground plane metal layer is attached adjacent those signal lines, producing effective RF shielding of the signal leads and minimizing introduction of inductance into the ground current circuit. A novel cable end configuration and cable termination is disclosed to implement the attaching procedure.

Abstract: A process for manufacturing an electronic module comprising a board populated with electronic components and provided with terminal pins and a housing shell; this process features the following process steps:the terminal pins and the housing shell form a one-piece unit,the housing shell is mounted on the board by simultaneously bringing the terminal pins into their intended fitting positions on the board and electrically connecting them with the board, and finallythe terminal pins and the housing shell are separated from each other during final assembly by use of a cutting tool.

Abstract: A unitary assembly of electronic cards has a base printed card carrying electronic microcomponents having outputs distributed at a first pitch and at least one core printed card having a size smaller than that of the base printed card, carrying microcomponents. Some at least of the microcomponents have outputs distributed at a pitch smaller than the first pitch. Several electrically conductive solder beads, distributed according to a two-dimensional array, mechanically and electrically connect the core printed card and the base printed card.

Abstract: A method of mounting an electronic power component to a cooling element includes finishing at least a bonding area of the cooling element with a finish for use during soldering, forming an indentation in the bonding area of the cooling element, placing adhesive in the indentation, attaching the power component to the cooling element using the adhesive, and thereafter soldering the power component to the cooling element. The finishing melts during soldering and the adhesive prevents shifting of the power component on the cooling element during soldering. Alternatively, the power component is attached to a printed circuit board by adhesive bonding prior to soldering.

Abstract: A method of manufacturing an electric member having a number of leads such as in a remote-controlled light receiving module, loosening prevention kinks created on at least one of the leads are shaped such that, the shorter the distance from the loosening prevention kink to the tip of the lead the thinner the loosening prevention kink. When the electric member is mounted on a printed circuit board, the leads are inserted into wiring through-holes on the printed circuit board by pressing the electric member against the board, allowing the position and orientation of the electric member to be firmly fixed automatically by virtue of the loosening prevention kinks.

Abstract: In order to make contact from heavy-current connecting elements of a component, in particular a relay, to connecting conductors of an insulating mount (1), the blade terminals of the component, in the form of connecting tongues (10) are welded to bent connecting tabs (12) of the connecting conductors (13), which are embedded in a mount, for example a printed circuit board. In order to protect the plastic located in the vicinity against damage from the welding energy, the end sections of the connecting tabs (12) and of the connecting tongues (10) are provided with a tooth contour, such that the individual teeth (16, 17) are welded successively. Having a reduced area with which to conduct the current, the teeth reach a high thermal load. In consequence, the teeth rapidly reach the melted phase, without the adjacent plastic being caused to melt via the heat conduction in the short welding time.

Abstract: A bracket assembly and method for attaching pin-in-hole components and daughter boards to a surface mount printed circuit board which alleviates the problem of the limited peel strength of the interconnect patterns on the surface of surface mount boards and also prevents these components from being subjected to the heat of soldering techniques such as reflow soldering.

Abstract: Plug-in connectors primarily intended for connecting lighting fixtures into system circuitry, the connectors include selector mechanisms which allow selection of a hot conductor or conductors necessary for energization of the fixtures. The connectors of the invention allow selection of a specific circuit at the job site rather than pre-wiring of a fixture to a specific circuit during factory assembly, a given fixture then being rapidly installed by plugging of the connector into a tapping port in electrical cable extending between fixtures in an installation. The selection mechanism of the invention acts primarily to change the wiring configuration of the associated fixture with the hot leg or legs of the fixture being movable to adapt to a desired specific circuit. The invention further encompasses use of the apparatus of the invention in a method for rapidly wiring fixtures into system circuitry, thereby resulting in labor and job cost savings.

Abstract: An optic module contains a flexible circuit board forming a cable which connects between an optical sub-assembly and a rigid interconnect structure within the optic module. The cable includes lands proximate to through holes for soldered connection to leads which extend from the optical sub-assemblies and are substantially smaller than the hole. A soldering bridge comprising several separate tabs equally spaced about the land and which project from the land into the hole and are very flexible in relation to the lead so that the lead can be placed in any radial position within the hole, but regardless of the position of the lead within the hole the projections of the soldering bridge project close enough to the lead so that during wave soldering a joint of desired configuration is produced. The soldering bridge can be integral with the land so that the bridge helps connect the solder to the land allowing the land to be smaller and thus providing for closer spacing between connection holes.

Abstract: This disclosure describes a procedure for soldering an insulated wire where the wire end features a U- or V-shaped hook with one bending point and is introduced such into the soldering hole of a printed circuit board that the bending point protrudes from the other side of the soldering hole.

Abstract: A method and apparatus providing an automated means for detecting unsoldered thru-hole connector leads is herein disclosed. This means consists of a thru-hole connection pad and a test pad positioned in close proximity to each lead of an electrical component. A thru-hole connection pad is formed about the periphery of each thru-hole. It serves to form a solder pad for securing the lead to the printed circuit board and establishes an electrical connection between the component and reverse sides of the printed circuit board. A test etch easily accessible by an automated testing device is positioned within close proximity of each thru-hole connection pad. As each lead is individually soldered to the printed circuit board, a solder bridge must also be formed across the thru-hole connection pad and the test etch thereby establishing an electrical connection between the lead and the test etch. This electrical connection is used by an automated testing device to detect any unsoldered leads.

Abstract: A method for installing an axial multiple connection component, for connecting to a circuit board, comprising a shell, the shell substantially cylindrical, having two opposite ends. Conducting leads extend from the opposite ends along the axis, for providing two isolated connections to other components on the circuit board. At least one contact ring encircles the shell with the axis at the center of the contact ring, and provides another connection to the other components on the circuit board. The conducting leads are inserted into lead holes on the circuit board, and the contact ring rests against a metallically plated through ring hole. The component is either manually solder utilizing a solder melting tool or alternatively wave soldered onto the circuit board, with the solder wicking up the plated through ring hole to the contact ring to make a good electrical contact therebetween.

Abstract: A method of preparing a large-current printed circuit board comprises inserting a fastener with a bottom flange in a through-hole formed in a printed circuit board so that the bottom flange is engaged with a surface of the printed circuit board, putting a washer having substantially the same outer diameter so the flange around the fastener at the other surface of the board, forming a radial extension at the outer side of the washer by caulking the fastener, whereby the fastener is fixed to the printed circuit board by means of the radial extension and the bottom flange wherein the washer is interposed between the radial extension and the printed circuit board.

Abstract: A conductor attachment wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.

Abstract: A telephone line overvoltage protection device and a method of forming an overvoltage protection device are provided. A first terminal guard housing defines a plurality of terminal receiving channels. A second housing contains a printed wiring board and the first terminal guard housing is arranged for mating engagement with the second housing. A plurality of terminals are inserted in the terminal receiving channels. Each of the terminals includes an outwardly extending terminal portion extending outside the first terminal guard housing. The outwardly extending terminal portion of each of the terminals is formed to define a line of terminal portions corresponding to a plurality of terminal receiving apertures in the printed wiring board. Then the terminal portions are inserted in the terminal receiving apertures and soldered to the printed wiring board. The terminals are bent to position the printed wiring board and a mating portion of the first terminal guard housing for insertion into the second housing.

Abstract: A multichip integrated circuit package comprises a substrate having a flat upper surface to which is affixed one or more integrated circuit chips having interconnection pads. A polymer encapsulant completely surrounds the integrated circuit chips. The encapsulant is provided with a plurality of via openings therein to accommodate a layer of interconnection metallization. The metallization serves to connect various chips and chip pads with the interconnection pads disposed on the chips. In specific embodiments, the module is constructed to be repairable, have high I/O capability with optimal heat removal, have optimized speed, be capable of incorporating an assortment of components of various thicknesses and function, and be hermetically sealed with a high I/O count. Specific processing methods for each of the various module features are described herein, along with additional structural enhancements.

Abstract: An electrical device comprises a three-dimensional body formed from an organic polymer and a plurality of electrical elements attached to the body. The body has a regular pattern of sockets in its surface, and the electrical elements have barbed appendages, or, alternatively, the body has appendages and the electrical elements have sockets. The elements are affixed to the body by insertion of the appendages into the sockets. Electrical connections between the electrical elements are formed by selective deposition of tungsten onto the surface of the body with a scanning laser beam. A miniature ("gnat") robot can be constructed using those constructional techniques.

Abstract: A method for the construction and application of a plate interface for the electrical interconnection in control and monitoring devices with terminal outlets of the plate type, using the steps of:making a rigid printed circuit having apertures disposed according to the layout of the output terminals of the control device;applying by screen-printing a soldering paste onto the locations of the printed circuit corresponding to the terminals to be brought into electrical contact;preheating only the terminals of the control device;assembling the electrical interconnection plate on the control device with the interposition of a further plate for the thermal protection of the control device itself; andmelting of the soldering paste according to a thermal cycle comprising an associated programming and monitoring device having output terminals for connectors of the plate-type, electrically interconnected and functionally arranged by means of an interface having a rigid plate electrically connected to the terminals by

Abstract: Disclosed is a method of forming a multilayer microelectronic circuit package. According to the disclosed method, the first layer of the package has features that are brought into proximity to an optical system which is adapted for imaging a surface of the layer. The optical system images features on the surface of the first layer, and generates targets around selected ones of the features. The, the next layer of the circuit package is brought into proximity to the optical system. This next layer is moved, i.e., translated and rotated, until selected features of the layer coincide with the targets generated through the optical system. This next layer is then placed atop the previous layer. Finally, the layers are laminated to form the multilayer microelectronic circuit package.

Abstract: By a pick-up device having pick-up elements, components are picked up one by one from differently spaced positions in tray packings, are moved together above component receiving supports and are then placed one by one on different ones of the supports. The supports are transported along a supply and discharge track. The tray packings are displaced through a supply and discharge mechanism to a presentation position and remain fixed in the presentation position during removal of the components. The components have varying shapes and are of comparatively large dimensions.

Abstract: Electrical component equipped with contacts for its electrical connection with its electrical environment. It is provided with two sets of contacts interconnected electrically by groups of two contacts belonging respectively to these two sets. One of these sets of contacts is constituted by contacts adapted to ensure electrical connections by simple pressure contact on respectively oppositely situated conducting spots, mechanical fastening means being also provided to fix the electrical component mechanically to a support associated with said conducting spots. The other of these sets of contacts is constituted by contacts adapted to be connected mechanically, particularly by welding, to respective conducting members or conducting spots.

Abstract: A method of making a current sensor device is disclosed wherein a sensor, having a magnetoresistive element configured into a bridge, an insulating substrate and a conductive member are sub-assembled and then the sub-assembly is heated to bond the components together. The bridge is attached to a first substrate having a first layer of insulation with first vias therein in which are deposited first elements of solder projecting beyond the first layer of insulation. Second elements of (e.g.) solder are deposited in second vias in a second layer of insulation on the second substrate. When the components are sub-assembled, the first elements rest on the second elements to provide a clearance between the first and second layers of insulation.

Abstract: An electrical connector having an insulating housing has a rear face with a plurality of electrical terminals extending therethrough. A sealant material in the form of a hotmelt material is placed over the ends of the terminals and the connector, including the sealing material, is thereafter heated to melt the material. The sealing material flows around the terminals and partially into the apertures of the housing to provide for a sealed atmosphere on the interior of the connector housing.

Abstract: An electrical component (21) for mechanical mounting and electrical connection with respect to plated through holes (34) of a printed circuit board (20) compatibly with a surface mount attaching process includes an electrically non-conducting body (30), plural generally elongate contacts (31) extending from the body for insertion into such plated through holes (34), and the component (21) having a strip of solder type material (33) for melting, for flow into respective plated through holes, and for re-solidifying mechanically and electrically to couple the component to such printed circuit board. The strip preferably encircles the contacts and has reduced cross section portions between adjacent contacts. Preferably the component is a connector, such as a header, and the contact pins or leads thereof provide an interface connection between the printed circuit board and a separate or portable connector.