Abstract: An electronic module comprises (a) an electrical assembly of electrical components and a cap. The cap surrounds a portion of the electrical assembly of electrical components to form a pocket between a portion of the electrical assembly of electrical components and the cap. The cap has at least one sidewall, each of the at least one sidewalls having an end, one of at least one sidewalls proximately positioned to at least one electrical lead and having at least one notch positioned in the end, the pocket filled with an encapsulant. A process comprises providing a cap and filling the cap with encapsulant, placing an electrical assembly of electrical components in the cap filled with the preselected amount of encapsulant, and allowing the electrical assembly to seat to a proper depth.

Abstract: A method of protecting a conductive connecting part of a flat cable and a protecting structure of the cable are provided. The method includes a step of connecting conductors of the flat cable to conductors of relay wires at the conductive connecting part, a step of arranging a protective member at the exterior of an insulating cover part of the flat cable, a step of interposing the protective member between opposing molding dies and accommodating the conductive connecting part of the flat cable in a cavity defined by the molding dies in a leak-tight manner, and a step of supplying insulating material in the cavity for an insert molding. The protecting structure includes the conductive connecting part, the protective member and the insulating member for enclosing the conductive connecting part together with a leading end of the protective member. The insulating member is formed by insert molding.

Abstract: A method of making a semiconductor device having a lead-on-chip structure includes bending a die pad extending from an outer frame outwardly from the outer frame. Thereafter, with the die pad in a convenient position, a semiconductor chip is die-bonded to the die pad. Thereafter, the die pad is bent back toward the outer frame so that it is generally parallel to but spaced from the outer frame with leads extending from the outer frame being generally parallel to the semiconductor chip. Electrodes of the semiconductor chip are connected by wire-bonding to the leads extending from the outer frame. After resin molding, the outer frame lying outside the resin package is severed and removed, completing the lead-on-chip semiconductor device.

Abstract: A method of making an encapsulated transducer (10), which includes an injection molded encapsulation (20) having a front end (22) and a back end (24). The encapsulation (20) is a monolith of cured moldable material ensconcing a sensing element (90) proximate the front end (22) and a portion of an information transmitting medium (120) emanating from the back end (24). A component alignment preform (40) operatively couples the sensing element (90) with the information transmitting medium or cable (120). The component alignment preform (40) includes a front ferrule (70) and a rear ferrule (80) bonded thereto and linearly spaced apart along a long axis "A". The component alignment preform (40) further includes an annular recess (44) in which the sensing element or coil (90) is placed so that it is linearly spaced and aligned along the common long axis "A" in which the front and rear ferrules (70), (80) are aligned.

Abstract: In order to arrange an electric heating element in a housing of a thermostatic working element and to guide connecting lines to the outside in a sealing manner, a base made of plastic is injection molded into an opening of the bottom through which the connecting lines are guided to the outside.

Abstract: A low cost LED array is formed from a plurality of modular units that are snapped together. Each modular unit consists of one or more U-shaped lead frame substrates which are overmolded with a thermoplastic insulator material. The lead frame substrates act as heat dissipators. The LEDs are then bonded onto the upper surfaces of the lead frame substrates. A reflector unit is separately molded and has one cone-shaped reflector for each light emitting diode. The reflector unit is aligned and affixed to the top of the lead frame unit such that the LED is disposed in the center of each cone. Each of the reflector units has several dovetail-shaped connectors which enable the completed module to be connected to adjacent modules to form the array. The modules are then electrically connected together in series or in parallel according to the particular application. The arrays may be used for plant growth or in photodynamic therapy.

Abstract: The invention relates to a method for forming a plastic package for an integrated electronic semiconductor device to be encapsulated within a plastic body, being of the type which comprises the step of molding said plastic body so as to fully enclose a semiconductor element, on which an integrated electronic circuit has been formed and which is placed onto a metal leadframe connected electrically to said integrated electronic circuit and carrying a plurality of terminal leads for external electric connection. To compensate the outward bends uncontrollably undergone by the plastic body due to thermal stresses during the molding step, a mold is used which has a cavity delimited by perimeter walls which define a concave-shaped volume. Preferably, at least one of the large walls, a bottom wall and a top wall, has a curvature inwardly of said mold cavity. The curvature values are predetermined to compensate any outward curvature undergone by corresponding surfaces of said plastic body during the molding step.

Abstract: A method and apparatus for hermetically sealing implantable devices, such as a microstimulator, moicrotransducer, microtelemeter, or the like, prevents entrapment of water vapors and other volatile gases, and allows hermeticity testing at all manufacturing levels. The venting of water vapors and other volatile gases is accomplished with a tubular feedthrough that allows such gases trapped within the sealed device to vent during the manufacturing process. The tubular feedthrough also establishes a conduit through which leakage tests or other hermeticity tests can be conducted prior to and after sealing the feedthrough. The tubular feedthrough, when made from conductive materials, also provides for electrical connections between electronic circuits sealed within the device and electrodes and other electrical terminals on the outside of the capsule.

Abstract: The present invention relates to a solid printed substrate to be used for mounting electronic parts and a method of manufacturing the same. A metal base substrate having a plurality of copper foil layers stacked thereon is employed placing a thermoplastic polyimide sheet between each copper foil. The metal base substrate with a circuit pattern prepared on each copper foil layer is processed by bending or deep drawing into a box-shaped work which has an opening surface. The opening surface is processed so as to have a substantially equal area with that of the bottom of the substrate and have a collar portion on the periphery thereof. On the collar portion, leads to be used for connection with other wiring substrate are formed by patterning on copper foil layers.

Abstract: Disclosed are a method of manufacturing a synthetic resin part integrally formed with metal members, including the steps of: integrally forming a plurality of metal member sets through coupling portions, each of the metal member sets including a plurality of coupled together metal members; inserting the metal member sets into the molding dies of a forming machine; injecting synthetic resin for molding into the molding die, and forming a synthetic resin part integrally formed with metal members in sequence to form a synthetic resin part continuum where a plurality of synthetic resin parts are connected; and cutting off the coupling portions to manufacture the plurality of synthetic resin parts, and a synthetic resin part manufactured according to the above-mentioned manufacturing method.

Abstract: The present invention includes a high density integrated circuit module which includes a plurality of stacked, individual integrated circuit devices wherein serpentine electrical interconnect rails connect electrical leads extending from the individual integrated circuit devices within the module.

Abstract: A method is described for manufacturing a plurality of proximity sensors which are attached to a printed circuit board during the manufacturing steps and subsequently severed from the printed circuit board by shearing. Each of the proximity sensors comprises a core and coil assembly, a plurality of electronic components and an electrical connector. These components of each of the proximity sensors is encapsulated during an overmolding process and the encapsulations are removed from the printed circuit board by a shearing step. Each of the encapsulations can be inserted into a cylindrical housing.

Abstract: In order to define cavities for vibrating spaces in a chip-type piezoelectric-resonator, which is protected with resin so as to be capable of surface mounting, a mother substrate including a piezoelectric substrate and a plurality of piezoelectric resonance elements formed thereon is prepared, and upraised adhesive layers in the form of walls are provided on respective major surfaces of the mother substrate so as to enclose the vibrating region of the mother substrate. Mother sheets, which are provided with plural cover sheets, are arranged so as to cover both the major surfaces of the mother substrate, thereby defining cavities for vibrating spaces therebetween. Then, protective resin members are applied to cover both the major surfaces of the mother substrate, which in turn is divided to obtain a plurality of chip-type piezoelectric-resonators.

Abstract: A molded electrical connector having a grounding and compression ground washer exposed and interposed in the outer surface of the molded body of the connector and having an internal integral tab welded to a ground wire both being surrounded by the molded body of the connector.

Abstract: Two phase bridge rectifiers are fabricated starting with three lead flames and bonding a first pair of semiconductor chips on mounting pads of a first of the frames and a second pair of semiconductor chips on mounting pads of a second of the frames. The frames are then disposed one on top of the other with upper surfaces of the first pair of chips contacting under surfaces of the mounting pads of the second frame and with upper surfaces of the second pair of chips contacting under surfaces of a pair of mounting pads on the third frame. A mounting pad on the third (upper) frame includes an extension thereof extending downwardly and bonded to a terminal formed in the second (middle) frame, and a mounting pad on the first (lower) frame includes an extension thereof extending upwardly and bonded to another terminal of the second frame.

Abstract: Based on the fact that those portions of a lead frame which are liable to undergo deformation are the to-be-nonplated portions, the to-be-nonplated portions defined around the to-be-plated portions are covered with an adhesive tape or a resin film before the lead frame is subjected to a plating treatment, whereby to prevent deformation of the lead frame from the stage preceding to the surface treating step.

Abstract: A method and apparatus for providing a multiple-element ultra high density level-two integrated circuit modular package utilizing a temporary manufacturing fixture to achieve a stack of individual thin ultra high density integrated circuit packages.

Abstract: A semiconductor device having a substrate support (22) and a method of forming the semiconductor device. A substrate (11) has conductive traces (12) and a bonding pad (13) on a bottom surface and conductive traces (14) and a semiconductor chip attach pad (17) on a top surface. The substrate support (22) has an aperture (23) and is coupled to the substrate (11). A semiconductor chip (31) is coupled to the semiconductor chip attach pad (17). The semiconductor chip (31) is covered by an encapsulating material (38) or a cap (41, 51) which provide protection for the semiconductor chip (31).

Abstract: A three dimensional integrated circuit interconnect for connecting a plurality of chips in a module with a standard footprint for pin grid array or quad flat pack mounting. Each IC is mounted on a custom interconnect slice and tested. The slices are stacked together with electrical connections from one slice layer to the next. The module may use multi-layer ceramic slices or printed circuit board materials.

Abstract: Disclosed is a high temperature, high pressure process of encapsulating electronic devices. The high pressure process is particularly suitable for encapsulating flip-chip devices wherein the collapse of flip-chip solder bumps is prevented. A special mold may be used to prevent the ceramic substrate of the flip-chip device from breaking under the high injection pressure conditions. The encapsulant is a rigid liquid crystal polymer.

Abstract: In order to improve reliability in electrical connection between internal terminal electrodes and external electrodes in a chip-type piezoelectric-resonator which, protected with resin so as to be capable of surface mounting, a mother substrate is prepared comprising a piezoelectric substrate and a plurality of piezoelectric resonance elements formed thereon. Thick-film electrodes are formed so as to cover the terminal electrodes of the respective piezoelectric resonance elements. Thermosetting protective resin members are applied to cover both major surfaces of the mother substrate, which in turn is divided into individual piezoelectric resonance elements so that the thick-film electrodes are exposed on divided surfaces formed by dividing step. External electrodes are formed on the divided surfaces.

Abstract: A piezoelectric component-mounting foil and foil making method are disclosed, whereby a first portion of the foil in a first plane substantially parallel to a second portion of the foil in a second plane are connected by a central portion not in the first or second plane, the central portion having at least one width dimension of the central portion less than at least one length dimension of the central portion. A conductive foil material, appropriate thickness, overall geometry, and, if desired, appropriate notch configuration are selected for a desired implementation of the foil for conductively attaching and at least partially supporting at least one piezoelectric component such as a quartz crystal.

Abstract: A magnetic device (10), suitable for attachment to a substrate, includes at least one sheet winding (24) having a pair of spaced-apart terminations (26), each receiving an upwardly rising portion (28) of a lead (12). The sheet winding terminations and upwardly-rising lead portions, together with at least a portion of the sheet windings, are then encapsulated with masses of insulative material (18, 19 and 34). A ferromagnetic core (20,22) surrounds at least a portion of the sheet windings to impart a desired magnetic property to the device.

Abstract: An ultra-thin level-one integrated circuit package with improved moisture penetration characteristics manufactured using a transfer molded casing with metallic lamination layers is provided. Additionally, a method and apparatus for providing a multiple-element modular package including a plurality of such level-one packages in horizontal or vertical stack configuration is provided.

Abstract: A coaxial cable side tap assembly of a coaxial cable with pins separately attached to the cable center conductor and braided sheath for connecting to a branch cable or an integrated circuit or transducer microchip and processes for manufacture thereof.

Abstract: Disclosed is an improved two part floating electric connector which prevents damage to a solder joint and deformation to terminals which are caused in coupling and decoupling conventional floating type connector parts when misalignment is present. The two part floating electric connector includes a housing body molded integrally with a collar and attached together by frangible bridging portions. A pair of fitting nails are fixed to the opposite ends of the outer stationary collar so that these nails may prevent the inner floating housing from rising above the outer stationary housing while allowing horizontal floating.

Abstract: A surface mounted electrical connector assembly includes a dielectric housing having a mounting peg projecting outwardly from one surface of the housing for insertion into a hole in a printed circuit board. The mounting peg is split to define a slot extending through a distal end of the peg. A bifurcated metal retainer member having barbs thereon is disposed in the slot and projects transversely outwardly therefrom for biasingly engaging the board. Inwardly projecting ribs are provided on the peg, within the slot, with the ribs being engageable with the metal retainer member when the peg is inserted into the hole in the printed circuit board. The ribs are spaced axially from a distal end of the retainer member whereby the retainer member is maintained spaced from the peg within the slot in a zone between the rib means and the distal end of the peg.

Abstract: A ribbon conductor set and related method of production and installation are provided for electrically interconnecting components in an implantable medical device, such as a heart pacemaker unit or the like. The ribbon conductor set is formed by die cutting and/or stamping a thin plate of conductive material to define a plurality of conductor ribbons supported from a frame. The ribbon set and supporting frame are shaped for seated placement into a fixture to orient the conductor ribbons in predetermined array to extend between electrical components on the fixture, such as between connector blocks and feedthrough terminals of a heart pacemaker unit. The fixture thus supports the conductor ribbons for facilitated connection to the electrical components, such as by welding, after which the resultant subassembly may be further processed as by encapsulation within a cast epoxy head or the like.

Abstract: A process is indicated for producing an electrical connection between a ribbon line and a connecting line, which have at least two electrical conductors each. To relieve the strain on the conducting areas, the exposed ends of the conductors of both lines are placed in a support which is made of insulated material and is equipped with corresponding recesses. Subsequently, the conductors of the lines to be connected are soldered to each other. Finally, an insulation material cover, which adheres firmly to the support, is molded over the connections of the conductors and the ends of both lines.

Abstract: The invention relates to a device for the transmission of current between two end points between which there is arranged a ribbon cable (10) having at least two electric conductors. The cable is contained in a housing, serves for electrical connection, and extends in coils. The length of the conductors is substantially greater than the distance between the two end points. At least one of the two end points is moveable relative to the other. For a simple connecting of a further extending line, metal conductors (14), which are insulated from each other, are connected in electrically conductive manner at their two ends to the conductors of the ribbon cable (10). The metal conductors have a course wherein their free ends, developed as contact pins, are accessibly in the completely mounted device from the outside of the housing through a passage opening (16) in a wall (1a) thereof.

Abstract: After a semiconductor die is placed onto a leadframe and electrically connected to the die, the die and the ends of the leads adjacent to the die are encased in a packaged body. The exposed ends of the leads are trimmed so that the leads are of desired lengths for leadforming, or for connection to substrates or sockets. The ends of the leads are enclosed in a protective body, so that when the package is tested and handled, the protective body reduces undesirable bending of the leads. By trimming the leads before forming the protective body, the leadframe used need, not be larger than those normally used.

Abstract: A semiconductor device is fabricated by placing a semiconductor chip in a lead frame which has no die pad. Electrodes of the chip are connected by bonding wires to respective lead fingers. Additionally, the lead frame has movement restricting fingers which limit horizontal movement of the chip within the lead frame during injection of resin into a mold surrounding the chip. Furthermore, the mold has horizontal movement restricting projections to limit vertical movement of the chip within the mold cavity. The restriction on horizontal and vertical movement of the chip reduces the risk of the bonding wires being broken or short circuited during the resin injection process.

Abstract: A method for manufacturing a lead frame for assemble with a semiconductor device comprises the steps of covering, with a cover film, a die to which an electronic device is attached and a conducting section of a lead section to be electrically connected to the die, covering the whole of the die and lead section and the cover film with an inorganic protective film, and removing the cover film and the protective film formed over the cover film to partly expose the die and the conducting section for electric connection.

Abstract: A method and apparatus for fixing a connector having pins onto a printed circuit board wherein the apparatus is movable between a position rear the pins and a position retracted from the pins. The apparatus includes heating means and pressure heads which act in a complimentary manner. After the pins are heated and are cooling, the pressure heads upset the pins thereby strengthening the connection.

Abstract: Flush mounting of a sensor on a surface is provided by first forming a recessed area on the surface. Next an adhesive bonding mixture is introduced into the recessed area. The adhesive bonding mixture is chosen to provide thermal expansion matching with the surface surrounding the recessed area. A strip of high performance polymeric tape is provided, with the sensor attached to the underside thereof, and the tape is positioned over the recessed area so that it acts as a carrier of the sensor. A shim having a flexibility so that it will conform to the surface surrounding the recessed area is placed over the tape, and a vacuum pad is placed over the shim. The area above the surface is then evacuated while holding the sensor flush with the surface during curing of the adhesive bonding mixture. After such curing, the pad, shim, and tape are removed from the sensor, electrical connections for the sensor are provided, after which the remaining space in the recessed area is filled with a polymeric foam.

Abstract: A high tension cable device with a series gap wherein an extraordinary discharge such as a creeping discharge which may occur along an outer face of a glass tube of a discharge tube is prevented effectively and a process of producing the same are disclosed. The high tension cable device comprises an electrically insulating tubular casing and a connecting terminal for the connection to a terminal of an ignition plug of an engine. The connecting terminal is fixedly fitted in the inside of an end portion of the casing, and a high tension cable is fitted in the other end portion of the casing. An additional function part such as a discharge tube for the formation of a series gap is mounted in the inside of the casing and coupled at an end thereof to the connecting terminal and at the other end thereof to the high tension cable, and an electrically insulating resin material is filled in a spacing in the inside of the casing.

Abstract: A miniature bulb assembly adapted to be mounted on a base board includes a socketless miniature bulb, a base portion molded of synthetic resin and a pair of terminal members. The miniature bulb is received in a bulb receiving hole at the central part of the base portion while a pair of lead wires extending from the miniature bulb are inserted through lead wire holes on the bottom wall of the base portion. Each terminal member comprises an elongated plate-shaped terminal and a base fitting portion, both of which are integrated with the base portion during a molding operation. The lead wires are connected to tongue-shaped pieces projecting from lead wire connection tabs in a clamped state. The base portion may be formed with T-shaped terminal insert holes on the opposite sides thereof such that terminal members each having a disengagement preventive tapered portion are tightly inserted thereinto from the above.

Abstract: A solid state measurand sensor is described in which the pressure sensor element is protected from the measurand by a combination of a pressure transfer medium and a thin covering membrane. A method is described for forming the diaphragm in situ. The diaphragm material is selected from a group of materials which includes fluorosilicone, so as to substantially avoid entrapment of air or formation of voids in the pressure transfer medium such as would degrade the performance of the sensor. The pressure transfer medium is gel-like material such as dimethyl silicone and equivalents. Alternatively, the gel may be fluorosilicone and the diaphragm may be dimethyl silicone. The membrane material is chosen to be substantially impermeable to the ambients or process media being measured and also flexible, is to be poured and cured in place on the assembly during fabrication.

Abstract: A high-voltage transformer is provided which includes a primary coil and a secondary coil disposed in a coil case, and a support member attached to the coil case and having a high-voltage terminal for electrically connecting a lead wire of the secondary coil with an external electrical device. The primary and secondary coil are first accommodated in the coil case, and the lead wire of the secondary coil is temporarily connected with the high-voltage terminal while the support member is separated from the coil case and freely moved to an appropriate location. Then, the lead wire of the secondary coil thus temporarily connected is soldered to the high-voltage terminal. Thereafter, the support member having the high-voltage terminal thus soldered to the secondary coil lead wire is attached to the coil case. Finally, a resin is filled into the coil case so as to firmly secure the primary and secondary coils and the support member to the coil case.

Abstract: A process for transforming a cylindrical electrical part into a component having at least one flat surface, suitable for use as a surface mounted device.

Abstract: At two large opposite end faces a component composed of a wafer-shaped or lamina-shaped body (1) has coatings (2, 3) and ribbon-shaped terminal elements (5, 6) and is pressure-coated with a lamina-shaped or cuboid insulating coat (7). The terminal elements (5, 6) of the component are conducted toward the outside through the insulating coat (7) at the level of the end faces of the body (1) without being bent off, the upper terminal element (5) is bent off in a downward direction and is then bent over onto the underside (19) of the insulating coat, and the lower terminal element (6) is first bent off in an upward direction, and is then arranged at the surface of the insulating coat (7) at the level of the exit location of the first terminal element (5), is then bent over by 180.degree. at this level and, lying against the terminal element (6), is bent down under the underside (19) of the insulating coat (7).

Abstract: A surface mountable electronic device and method of making same wherein a discrete electronic device is encapsulated in a body of electrical insulating material having opposite ends and a mounting surface extending between the ends, and an electrode is provided on each end. Each electrode includes a portion on the end of the body in electrical contact with the corresponding lead of the discrete electronic device and a contact portion extending along the mounting surface for making electrical connection to a circuit portion defined on a surface to which the device is mountable. The discrete electronic device is manufactured, prior to encapsulation, by known techniques. Preferably the body is a rectangular solid with each of the four sides having electrode contact portions thereon to serve as one of four possible mounting surfaces each with substantial mechanical stability.

Abstract: A motor is equipped with a magnetic structure, stator assemblies having a non-magnetic molding member for being incorporated in the magnetic structure and coils for being wound on the outer periphery of each stator assembly.The magnetic structure is provided with magnetic pole plate bodies, a recess provided in each magnetic pole plate body, bridge members incorporated in the magnetic pole plate body in such a manner as to surround the recess and a plurality of terminal elements whose base ends are coupled to the bridge members and whose free ends are extended toward the recess. The recess, together with the free ends of the terminal elements, is filled with the non-magnetic molding member. On the other hand, the bridge members are not embedded with the non-magnetic molding member but are subsequently cut and removed, so that the base ends of the terminal elements are arranged in such a manner as to project from the surface of the non-magnetic molding member.

Abstract: An electronic part comprises an electronic element, for example, a piezo-electric vibrator. This electronic element has a first connecting electrode on one of the main surfaces thereof and has a second connecting electrode on the other main surface thereof. A first external electrode is connected to this first connecting electrode. Furthermore a second external electrode is connected to the second connecting electrode. The first external electrode and the second external electrode are fixed by fixing member composed of an insulating material at the peripheral edge parts thereof. Thereby, the electronic element is covered with the first connecting electrode, the second connecting electrode and the fixing member.

Abstract: The present invention provides a surface mount Gull-Wing type resin-encapsulating package for encapsulating a semiconductor chip, wherein the cut face (outer tip end) of each outer lead is formed to have a smaller cross-sectional area than that of each outer lead, for improving the extension of solder to the cut face of that lead. Such relatively smaller cross-sectional area of the outer tip end of each outer lead reduces the exposed area of the lead material when disconnecting the leads from the frame in separating the device from the frame.

Abstract: A method of making a surface mountable electronic device comprising the steps of providing a discrete electronic device comprising a body and a pair of spaced apart leads each of substantially circular cross-section and extending axially outwardly from the body in generally opposite directions, shaping each of the leads to provide a plate-like section in each of the leads at a location axially outwardly from the body, encapsulating the device body in electrical insulating material in a manner shaping the material to provide a body having first and second spaced apart ends and a mounting surface extending between the ends, the plate-like sections of the leads extending from the ends, and shaping each of the plate-like sections of the leads to have a contact portion extending along the mounting surface for making electrical connection to a circuit having a portion defined on a surface to which the device is mountable.

Abstract: A method for producing a magnetic transducer including a plurality of heads comprising placing p magnetic cores (such as 17-4), each provided with a winding (scuh as E4) extending over the entire length of the core, on a support plate (20), embedding these cores in an insulating layer (25), eliminating the spirals located at the ends of each core, and connecting the spirals (29, 30) located at the ends of the remaining windings to contact zones (52C, P1, P2, . . . ).

Abstract: A method for correctly positioning a metallic plate supporting a semiconductor chip in a mold used for encapsulation, wherein according to a first solution, at least a pair of retractable locating pins are utilized together with a lead connected to the supporting plate. The ends of the locating pins are retracted in the final phase of encapsulation, from the surfaces of the plate, whereas in the initial phase they are in direct contact with the surfaces. According to a second solution, a pair of clamping pins are indirectly connected to the plate through the interposition of insulating thicknessings.

Abstract: A molded pin-grid-array package includes a heat sink available at the face opposite to the pins. The heat sink is secured to a printed wiring board that has plated through holes therein that form the desired pin-grip-array and wires are secured in the holes to form the package pins. The heat sink covers an aperture in the board and the semiconductor die is secured to the heat sink inside the cavity thereby formed. After the semiconductor die is attached and the bonding pads connected to the metal traces on the board, the assembly is placed in a transfer mold. Plastic encapsulant is then transfer molded to encapsulate the semiconductor die and to extend flush with the heat sink to form a skirt around the periphery of the board. This leaves the molded package with an available heat sink face for efficient cooling after the package is mounted for ultimate use.

Abstract: To encapsulate integrated circuits mounted on continuous dielectrical strips (surface-mounted circuits) it is proposed to transfer mold a thermosetting resin around circuits carried by the strip, the resin being injected outside the parting plane of the mold, contrary to the usual practice in this field. The protection of the circuits is improved while, at the same time, the ability to test the strip is preserved.