Of Fused Material Patents (Class 29/878)
  • Patent number: 11545804
    Abstract: A connector assembling machine a revolver mechanism coupled to a frame. The revolver mechanism includes a shaft coupled to the frame, an actuator operably coupled to the shaft to rotate the shaft, and a rotor rotated by the shaft. The rotor includes a hub coupled to the shaft and mounting brackets extending from the hub. The revolver mechanism includes cartridges coupled to the mounting brackets each having cartridge walls forming a connector cavity configured to receive an electrical connector. The cartridge has a window exposing receptacles of the electrical connector. The rotor is rotated to move the cartridges between a connector loading station, a connector processing station, and a connector unloading station. The cartridges are loaded with the electrical connectors in the connector loading station and unloaded in the connector unloading station. The cartridges position the electrical connectors for loading support plates into the receptacles in the connector processing station.
    Type: Grant
    Filed: March 16, 2021
    Date of Patent: January 3, 2023
    Inventors: Swapnilsinh Solanki, Scott Thomas Schlegel, Jiankun Zhou, Roberto Francisco-Yi Lu, Edward T. Price, III, David Wiltraut
  • Patent number: 11217955
    Abstract: A method for manufacturing an electrical connector is provided. A metal plate is provided, and defines multiple terminals. Each terminal has a base portion and an elastic arm connected to the base portion. A portion of a lower surface of the base portion defines a conducting area. The base portion is cut on the metal plate, thereby forming a cutting slot on the metal plate located at a side edge of the base portion. An insulating body is formed on the metal plate by injection molding, such that the insulating body fills the cutting slot. The insulating body covers only the base portion and not the conducting area and the elastic arm, thereby forming a through hole on the insulating body to expose the elastic arm. Then, the elastic arm is cut on the metal plate, thereby forming a through slot on the metal plate surrounding the elastic arm.
    Type: Grant
    Filed: February 25, 2021
    Date of Patent: January 4, 2022
    Assignee: LOTES CO., LTD
    Inventors: Chien Chih Ho, Wen Chang Chang
  • Patent number: 9202478
    Abstract: A head and a method to manufacture a head are disclosed. A slider is provided and has a mounting face that is opposite but substantially parallel to its air bearing surface. According to an example embodiment, a first plurality of layers may be deposited on the mounting face, including a tin layer, a first underlayer that comprises platinum, and an interface layer disposed between the first underlayer and the tin layer. The interface layer may comprise Ti, V, Cr, Zr, Nb, Mo, Hf, Ta, or W. A submount with an attached laser diode may include a gold layer and be positioned adjacent to the first plurality of layers. The tin layer may then be melted so that the gold layer is dissolved therein, upon solidification attaching the submount to the mounting face by a solder layer that preferably comprises at least 45% gold by weight dissolved in tin.
    Type: Grant
    Filed: February 10, 2015
    Date of Patent: December 1, 2015
    Assignee: Western Digital (Fremont), LLC
    Inventor: Alexander V. Demtchouk
  • Patent number: 9136543
    Abstract: A battery system (100) having a heating element (124), a thermal switch (130), a battery module (140), and a pin structure (170) is disclosed. The battery system (100) comprises: a battery case (110) forming an internal space; a battery module (140) located in the battery case and including a battery; a heating element structure (120) located in the battery case (110) and increasing the temperature of the battery System by heat generated by an impact; and a pin structure (170) for concentrating and transferring an external impact to a pre determined region of the heating element structure.
    Type: Grant
    Filed: April 24, 2008
    Date of Patent: September 15, 2015
    Assignees: GS Energy Corporation, Agency for Defense Development
    Inventors: Sang-Cheol Nam, Ho-Young Park, Young-Chang Lim, Ki-Chang Lee, Kyu-Gil Choi, Ho-Sung Hwang, Gi-Back Park, Sung-Back Cho, Seung-Ho Kang, Hyun-Jin Ji
  • Publication number: 20150126068
    Abstract: An electrical connector has a conductive shell, a terminal module and a shielding plate. The conductive shell has a mating portion and an accommodate room. The mating portion has a first mating face. The terminal module is secured in the accommodate room and has a first insulator and a plurality of first terminals. The first insulator has a first face and a second face. Each of the first terminals has a first contacting portion protruding out of the first face of the first insulator. The shielding plate is disposed in the accommodate room and contacts with the conductive shell. The shielding plate presses on the second face of the first insulator so as to make first contacting portions be exposed to the first mating face. The disposition of the shielding plate has the function of pressing on the terminal module and preventing the interference of signal transmission between the terminals.
    Type: Application
    Filed: November 3, 2014
    Publication date: May 7, 2015
    Inventors: AI-HONG FANG, HUO-XING JIN, CHUN-SHENG LI
  • Publication number: 20150026970
    Abstract: There are provided a method of manufacturing a jelly roll-type electrode assembly and a method of manufacturing a secondary battery using the electrode assembly. The method of manufacturing the electrode assembly includes notching a cathode and an anode, elongated in one direction, in a constant size and shape to form a plurality of electrode units, laminating the cathode and the anode with a separator disposed therebetween to form a unit cell, and winding the unit cell by bending the connection units so that the electrode units of the cathode and the anode overlap each other. In the manufacturing of the jelly roll-type electrode assembly and the polymer secondary battery, whose production process can be easily simplified a jelly roll-type electrode assembly and a polymer secondary battery, both of which exhibit excellent design flexibility, can be manufactured.
    Type: Application
    Filed: September 25, 2014
    Publication date: January 29, 2015
    Applicant: LG CHEM, LTD.
    Inventors: Do-Hwa Jung, In-Gu An, Jae-Bin Chung, Soon-Ho Ahn, Dong-Myung Kim
  • Patent number: 8898897
    Abstract: A new method for making and manufacturing the User-Friendly USB Male connectors which is faster, lower cost, more energy efficient, waterproof and reliable, with no expensive tooling and molding required, having better quality and being easily adaptable for automated assembly.
    Type: Grant
    Filed: February 12, 2013
    Date of Patent: December 2, 2014
    Inventor: Joseph Lai
  • Patent number: 8850702
    Abstract: The embodiments herein relate to a conductor cable for use in a lead and more specifically to methods and devices related to laser consolidation of the cable. The various conductor cable embodiments and methods provide for at least one end of the cable having a weld mass created by a laser welding process.
    Type: Grant
    Filed: May 24, 2010
    Date of Patent: October 7, 2014
    Assignee: Cardiac Pacemakers, Inc.
    Inventors: Peter Hall, Haiping Shao
  • Publication number: 20140243942
    Abstract: A medical device lead connector includes two or more electrically conducting contact rings spaced apart by electrically insulating ceramic ring. An electrically insulating glass material fixes the two or more electrically conducting contact rings to the insulating ceramic ring in axial alignment.
    Type: Application
    Filed: May 5, 2014
    Publication date: August 28, 2014
    Applicant: MEDTRONIC, INC.
    Inventors: John E. Kast, Darren A. Janzig, Christopher J. Paidosh, Andrew J. Thom, Brad C. Tischendorf, Gerald G. Lindner
  • Patent number: 8813356
    Abstract: A common mode filter is manufactured to include a coil part including an insulation layer and a conductor pattern formed in the insulation layer; and a magnetic substrate coupled to one surface or both surfaces of the coil part. The magnetic substrate includes: an electrostatic absorbing layer made of an electrostatic absorbing material; a magnetic layer provided on one surface or both surfaces of the electrostatic absorbing layer and made of a magnetic material; and an electrode provided between the magnetic layer and the electrostatic absorbing layer and made of a conductive material. Therefore, common mode filter may maintain high efficiency characteristics while preventing an electrostatic discharge phenomenon.
    Type: Grant
    Filed: August 9, 2012
    Date of Patent: August 26, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sung Kwon Wi, Jeong Bok Kwak, Sang Moon Lee, Young Seuck Yoo, Yong Suk Kim
  • Patent number: 8808892
    Abstract: Battery packs having electrically insulating material between conductive surfaces of electrical components are described herein. In some embodiments, a battery pack includes a battery cell with a first conductive surface, an electrically conductive member with a second conductive surface, and electrically insulating material positioned between the first and second conductive surfaces. The electrically insulating material has at least one passage that enables the first and second conductive surfaces to be electrically connected. For example, the passage in the electrically insulating material may be formed by, during, or as a result of a process in which the first and second conductive surfaces are attached, such as by a welding process that both ablates a portion of the electrically insulating material to form the through passage and that physically joins the first and second conductive surfaces, thereby creating an electrical connection therebetween.
    Type: Grant
    Filed: October 13, 2010
    Date of Patent: August 19, 2014
    Assignee: Greatbatch Ltd.
    Inventors: Thomas P. Maxwell, Eric Petterson
  • Patent number: 8800140
    Abstract: Some embodiments of the invention comprise a customizable multichannel microelectrode array with a modular planar microfabricated electrode array attached to a carrier and a high density of recording and/or stimulation electrode sites disposed thereon. Novel methods of making and using same are also disclosed.
    Type: Grant
    Filed: January 6, 2011
    Date of Patent: August 12, 2014
    Assignee: NeuroNexus Technologies, Inc.
    Inventors: Jamille F. Hetke, Daryl R. Kipke, David S. Pellinen, David J. Anderson
  • Publication number: 20140048514
    Abstract: A contact assembly for use in a vacuum switch includes an electrode stem and a contact coupled to an end portion of the electrode stem via a threaded fastener which threadingly engages a threaded portion of the electrode stem.
    Type: Application
    Filed: August 20, 2012
    Publication date: February 20, 2014
    Inventors: GANESH K. BALASUBRAMANIAN, Stephen D. Mayo
  • Publication number: 20130232787
    Abstract: A connector comprises a base insulator, a plurality of elongated plate shaped contacts arranged on the base insulator, and a cover insulator arranged to hold the contacts in cooperation with the base insulator and welded to the base insulator, the base insulator is provided with a pair of openings arranged to face each other across each of holders and to intersect with the direction in which the holders are arranged.
    Type: Application
    Filed: April 22, 2013
    Publication date: September 12, 2013
    Applicant: Japan Aviation Electronics Industry, Limited
    Inventors: Takushi YOSHIDA, Yuko MOTOJIMA, Hiroshi AKIMOTO, Takahiro YAMAJI, Fumio ISHIBASHI
  • Patent number: 8479390
    Abstract: A method for producing a connector has first to fifth processes. In the first process, a contact unit having a plurality of contacts and a tying part, is formed with the contacts tied at each axial direction middle part of the contacts by the tying part and with the contacts arranged parallel to each other. In the second process, a plating layer is formed on a part of the contact unit by soaking the contact unit in a plating bath from an axial direction one end side of the contact unit to an axial direction middle part of the tying part. In the third process, the contacts are isolated by cutting the tying part. In the fourth process, a part where the plating layer is formed, of the contact is inserted into a hole of a circuit board. In the fifth process, the contacts are soldered to the circuit board.
    Type: Grant
    Filed: December 2, 2010
    Date of Patent: July 9, 2013
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Teruyuki Ohnishi, Shinichi Isobe, Kohtaro Shiino
  • Patent number: 8322031
    Abstract: Circuit boards, microelectronic devices, and other apparatuses having slanted vias are disclosed herein. In one embodiment, an apparatus for interconnecting electronic components includes a dielectric portion having a first surface and a second surface. A first terminal is disposed on the first surface of the dielectric portion for connection to a first electronic component. A second terminal is disposed on the second surface of the dielectric portion for connection to a second electronic component. The apparatus further includes a passage extending through the dielectric portion along a longitudinal axis oriented at an oblique angle relative to the first surface. The passage is at least partially filled with conductive material electrically connecting the first terminal to the second terminal.
    Type: Grant
    Filed: September 16, 2008
    Date of Patent: December 4, 2012
    Assignee: Micron Technology, Inc.
    Inventors: Chin Hui Chong, Choon Kuan Lee
  • Patent number: 8309857
    Abstract: Disclosed is a method of manufacturing a pattern electrode which excels in electroconductivity, transparency and etching property and a pattern electrode, the method comprising a step of applying a metal particle containing solution onto a substrate to form a conductive layer, a step of pattern printing a metal particle removing solution on a portion of the conductive layer, which is to be removed, and a step of washing the resulting printed material, whereby the portion of the conductive layer on which the metal particle removing solution has been printed is removed to form a non-conductive portion.
    Type: Grant
    Filed: September 3, 2010
    Date of Patent: November 13, 2012
    Assignee: Konica Minolta Holdings, Inc.
    Inventors: Masaki Goto, Akihiko Takeda, Kazuaki Nakamura
  • Patent number: 8250749
    Abstract: A connector for an implantable medical lead that is electrically and mechanically connectable to an implantable medical device, has a connector pin made of a first conducting material. A tubular insulator made of an insulating material concentrically surrounds at least a portion of the pin. A connector ring made of a second conducting material is concentrically positioned around at least a portion of the insulator. The insulator is connected to the connector ring by spark plasma sintering in the case of an active fixation lead, and is connected to the ring and the pin by spark plasma sintering in the case of a passive fixation lead.
    Type: Grant
    Filed: November 14, 2007
    Date of Patent: August 28, 2012
    Assignee: St. Jude Medical AB
    Inventors: Rolf Hill, Andreas Örnberg, Eva Micski, Henrik Djurling, Mats Nygren
  • Patent number: 8196300
    Abstract: A manufacturing method of an electric contact and manufacturing equipment of the electric contact. A contact and a metal base are superimposed and support by a jig, and a rotational tool, which rotates at a predetermined speed and advances/retracts to/from the jig, is pressed into a surface, which is not contacted with the contact, of the metal base while being rotated, so that the contact and the metal base are joined by solid state diffusion welding by using frictional heat generated by friction between the rotational tool and the metal base, and then the rotational tool is retracted from the metal base.
    Type: Grant
    Filed: January 16, 2009
    Date of Patent: June 12, 2012
    Assignee: Fuji Electric Fa Components & Systems, Ltd.
    Inventors: Seiji Imamura, Shinji Tada, Mamoru Akimoto, Yuuichi Yamamoto, Toshiya Shibayanagi
  • Publication number: 20120107669
    Abstract: A battery comprises a battery case forming a substantially sealed enclosure and an electrode stack within the enclosure. The electrode stack includes a first set of electrode elements and a second set of electrode elements. The electrode elements in the second set alternate with the electrode elements in the first set within the electrode stack. A conductive tab extends from each of the electrode elements in the first and second sets, wherein each of the conductive tabs in the first set forms an aperture, wherein the apertures are coincident with each other. The battery further comprises a feedthrough including a feedthrough pin extending through the battery case and through each of the coincident apertures, wherein the feedthrough pin serves as a positive terminal for the battery.
    Type: Application
    Filed: October 27, 2010
    Publication date: May 3, 2012
    Applicant: MEDTRONIC, INC.
    Inventor: Joseph Viavattine
  • Publication number: 20120030944
    Abstract: A dual interface separable insulated connector comprising a faraday cage molded over a bus bar for use in an electric power system and a method of manufacturing the same are provided. The faraday cage can be disposed within a semi-conductive shell. The configuration of the separable insulated connector can provide for easier bonding between the faraday cage and insulating material. Additionally, the configuration can eliminate or reduce the need to coat the bus bar with an adhesive agent and to smooth the metal bus bar to remove burrs, other irregularities, and sharp corners from the bar. Manufacturing the dual interface separable insulated connector can include molding a semi-conductive rubber faraday cage over a conductive bus bar, inserting the faraday cage into a shell, and injecting insulating material between the faraday cage and shell.
    Type: Application
    Filed: October 17, 2011
    Publication date: February 9, 2012
    Applicant: COOPER TECHNOLOGIES COMPANY
    Inventors: David Charles Hughes, Mark Clifford Kadow, Michael John Gebhard, SR.
  • Publication number: 20120021649
    Abstract: A connector comprises a base insulator, a plurality of elongated plate shaped contacts arranged on the base insulator, and a cover insulator arranged to hold the contacts in cooperation with the base insulator and welded to the base insulator, the base insulator is provided with a pair of openings arranged to face each other across each of holders and to intersect with the direction in which the holders are arranged.
    Type: Application
    Filed: June 28, 2011
    Publication date: January 26, 2012
    Applicant: Japan Aviation Electronics Industry, Limited
    Inventors: Takushi Yoshida, Yuko Motojima, Hiroshi Akimoto, Takahiro Yamaji, Fumio Ishibashi
  • Patent number: 8082663
    Abstract: A method of providing a hermetic, electrical connection between two electrical components by mating at least one metal pin in a glass-ceramic to metal seal connector to two electrical components, wherein the glass-ceramic to metal seal connector incorporates at least one metal pin encased (sealed) in a glass-ceramic material inside of a metal housing, with the glass-ceramic material made from 65-80% SiO2, 8-16% Li2O, 2-8% Al2O3, 1-5% P2O5, 1-8% K2O, 0.5-7% B2O3, and 0-5% ZnO. The connector retains hermeticity at temperatures as high as 700° C. and pressures as high as 500 psi.
    Type: Grant
    Filed: November 11, 2008
    Date of Patent: December 27, 2011
    Assignee: Sandia Corporation
    Inventors: Saundra L. Monroe, S. Jill Glass, Ronnie G. Stone, Jamey T. Bond, Donald F. Susan
  • Patent number: 8079136
    Abstract: A monolithic, multi-layer heating element forms the high temperature tip of a glow plug assembly. The heating element includes a conductive core which is surrounded by an insulator layer, which in turn supports a resistive layer. An optional conductive jacket can surround the resistive layer. These layered components are pre-formed in prior operations and then assembled one into the other to form a precursor structure. The precursor structure is transferred to a die, where it is compressed to form a so-called green part having dimensional attributes proportional to the finished heating element. The individual layers remain substantially intact, with some boundary layer mixing possible to enhance material-to-material bonding. The green part is sintered to bond to various materials together into an essentially solid mass. Various finishing operations may be required, following which the heating element is assembled to form a glow plug.
    Type: Grant
    Filed: September 21, 2009
    Date of Patent: December 20, 2011
    Assignee: Federal-Mogul World Wide, Inc.
    Inventors: William J. Walker, Jr., John W. Hoffman, James L. May
  • Patent number: 8011089
    Abstract: A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted to a substrate. The contactor units are formed, tested, and assembled to a backing substrate. The contactor units may include leads extending laterally for connection to an external instrument such as a burn-in board. The contactor units include conductive areas such as pads that are placed into contact with conductive terminals on devices under test.
    Type: Grant
    Filed: August 25, 2009
    Date of Patent: September 6, 2011
    Assignee: FormFactor, Inc.
    Inventors: Mohammad Eslamy, David V. Pedersen, Harry D. Cobb
  • Publication number: 20110192020
    Abstract: A core pack manufacturing apparatus for preventing or substantially preventing an iron from contacting a cell or a protective circuit part in a process of soldering a connection tab of the cell to a connection terminal of the protective circuit part. A core pack manufacturing apparatus for soldering a connection tab connected to a cell to a connection terminal of a protective circuit part includes a cap including a first cover configured to cover the cell, and a second cover extending from a side of the first cover and configured to cover the protective circuit part, the second cover having an opening part configured to expose the connection tab and the connection terminal through the second cover for soldering.
    Type: Application
    Filed: November 29, 2010
    Publication date: August 11, 2011
    Inventors: Jintae Hong, Jaeuk Ryu
  • Patent number: 7987587
    Abstract: A method is described by which an electrical path is created between layers on a printed circuit board (PCB) without the use of plated through holes (PTH). Through the use of a liquid solder or conductive epoxy injection fixture, a conductive path is created in pre-drilled holes forming an electrical connection between internal PCB metal layers and surface mounted components without the creation of parasitic stubs on the signal nets.
    Type: Grant
    Filed: March 7, 2008
    Date of Patent: August 2, 2011
    Assignee: International Business Machines Corporation
    Inventors: Wiren Dale Becker, Michael Ford McAllister, Alan Daniel Stigliani, John G. Torok
  • Publication number: 20110184480
    Abstract: A medical device lead connector includes two or more electrically conducting contact rings spaced apart by electrically insulating ceramic ring. An electrically insulating glass material fixes the two or more electrically conducting contact rings to the insulating ceramic ring in axial alignment.
    Type: Application
    Filed: January 25, 2011
    Publication date: July 28, 2011
    Applicant: MEDTRONIC, INC.
    Inventors: John E. Kast, Darren A. Janzig, Chris J. Paidosh, Andrew J. Thom, Brad C. Tischendorf, Gerald G. Lindner
  • Publication number: 20110177717
    Abstract: An electrical connector includes a dielectric housing, a plurality of conductive terminals, a fixing strip, a plurality of wires, and an upper shell, the dielectric housing having an upper face and a lower face opposite to the upper face, the upper face being provided with a plurality of terminal slots and recesses, the conductive terminals having a contact portion, a base portion, an engaged portion and received in the corresponding terminal slots, the engaged portion being engaged against the corresponding recesses, the fixing strip being transversally disposed on the upper face of the dielectric housing and across the conductive terminals and the terminal slots for securing the conductive terminals in the terminal slots, the wires respectively connecting with the base portions of the conductive terminals, and an upper shell is assembled on the dielectric housing above the fixing strip.
    Type: Application
    Filed: August 26, 2010
    Publication date: July 21, 2011
    Inventors: HSIEN-CHANG LIN, Shao-Kai Chen, Chih-Fan Wu
  • Publication number: 20110159323
    Abstract: A secondary battery includes a bare cell, and a protection circuit module electrically connected to the bare cell, the protection circuit module including a circuit board including a welding hole therethrough and a welding pad adjacent to the welding hole, and an electrode terminal tab positioned between the circuit board and the bare cell, the electrode terminal tab having a terminal connection portion and a board connection portion electrically connected to the bare cell and the circuit board, respectively, wherein the welding hole exposes the terminal connection portion of the electrode terminal tab, and the welding pad is electrically connected to the board connection portion of the electrode terminal tab.
    Type: Application
    Filed: December 7, 2010
    Publication date: June 30, 2011
    Inventor: Bong-Young Kim
  • Publication number: 20110151285
    Abstract: A battery pack and a method for fabricating the same are provided. The battery pack includes a plurality of battery cells connected in series or in parallel to each other, a protective circuit module (PCM) controlling charging and discharging of the plurality of battery cells, and a coverlay electrically connecting the plurality of battery cells to the PCM, wherein the coverlay includes a plurality of wires, each of the plurality of wires includes battery connecting pads provided at its one end, the battery connecting pads connected to the battery cells, and module connecting pads provided at it's the other end, the module connecting pads connected to the PCM, and a solder layer is formed on the battery connecting pads.
    Type: Application
    Filed: December 8, 2010
    Publication date: June 23, 2011
    Inventors: Jintae Hong, Jaeuk Ryu
  • Publication number: 20110086258
    Abstract: A method includes: preparing an electrode group 4 in which a positive electrode 1 and a negative electrode 2 are arranged with a porous insulating layer interposed therebetween, with an end 1a, 2a of at least one of the positive and negative electrodes protruding from the porous insulating layer; preparing a current collector 10 on a first principal surface of which a plurality of protrusions having vertexes are formed; bringing the end 1a, 2a of the at least one of the positive and negative electrodes into contact with a second principal surface of the current collector 10; and generating an electric arc toward the vertexes of the protrusions 11 to melt the protrusions 11, thereby welding the end 1a, 2a of the at least one of the positive and negative electrodes to the current collector 10 by a molten material 12 of the protrusions 11.
    Type: Application
    Filed: August 24, 2009
    Publication date: April 14, 2011
    Inventors: Hironori Yaginuma, Takashi Nonoshita, Kiyomi Kozuki, Seiichi Kato
  • Publication number: 20110086255
    Abstract: Battery packs having electrically insulating material between conductive surfaces of electrical components are described herein. In some embodiments, a battery pack includes a battery cell with a first conductive surface, an electrically conductive member with a second conductive surface, and electrically insulating material positioned between the first and second conductive surfaces. The electrically insulating material has at least one passage that enables the first and second conductive surfaces to be electrically connected. For example, the passage in the electrically insulating material may be formed by, during, or as a result of a process in which the first and second conductive surfaces are attached, such as by a welding process that both ablates a portion of the electrically insulating material to form the through passage and that physically joins the first and second conductive surfaces, thereby creating an electrical connection therebetween.
    Type: Application
    Filed: October 13, 2010
    Publication date: April 14, 2011
    Applicant: Micro Power Electronics, Inc.
    Inventors: Thomas P. Maxwell, Eric Petterson
  • Publication number: 20110003515
    Abstract: A lamp cap (100) comprising a base part (101) defining a cavity (102) for receiving a socket (203) of a lamp, the base part (101) having a lateral wall arrangement (103) limiting the cavity (102) and a ring shaped bottom side (104) surrounding an aperture (105); an electrical insulating interface (106) fixed to the bottom side of the base part (104) in such a manner that it covers the aperture (105), a space (102) being defined between the electrical insulating interface (106) and the lateral wall arrangement (103); and an electrical connector assembly (120) extending through the electrical insulating interface (106) to provide an electrical connection between the lamp socket (203) and an electrical power supply. A method of and apparatus for manufacturing a lamp cap is also described.
    Type: Application
    Filed: February 24, 2009
    Publication date: January 6, 2011
    Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.
    Inventors: Juergen Mertens, Vincent Deurwaarder, Piet Verburg, Henk Te Loos
  • Patent number: 7837522
    Abstract: An electrical contact including a head, a tail including an opposing pair of major surfaces and a hole, a body connected at one end thereof to the head and at another end thereof to the tail, a peg arranged adjacent to the hole and to extend perpendicular or substantially perpendicular to one of the opposing pair of major surfaces and including at least one beveled side, and a solder member attached to the tail such that the peg creates and fits in a protrusion in a surface of the solder member when the solder member is attached to the tail, such that a portion of the solder member extends into the hole, and such that the solder member engages the at least one beveled side of the peg.
    Type: Grant
    Filed: November 12, 2009
    Date of Patent: November 23, 2010
    Assignee: Samtec, Inc.
    Inventors: David Hoover, John Mongold, Donald Knowlden
  • Patent number: 7788803
    Abstract: A twist-on wire connector containing a mass of a cohering gel in a gel state therein for forming a protective covering over a wire connection in the twist-on wire connector with the gel thereon removal from the twist-on wire connector and peelable from the wire connection to enable one to quickly form a further wire connection without having to wipe off the wire connection.
    Type: Grant
    Filed: September 25, 2007
    Date of Patent: September 7, 2010
    Inventors: Lloyd Herbert King, Jr., Michael Belgeri, James Keeven, William Hiner
  • Patent number: 7774935
    Abstract: The electrically-conductive element, in particular for a rotary collector, for transferring electrical current between two parts (2, 24) that are movable relative to each other is covered in one or more layers of electrically-insulating enamel (42), with the exception of an electrical continuity zone (43). The layer(s) of enamel (42) is/are removed, e.g. by chemical, thermal, or mechanical attack. The enamel (42) is selected from the group comprising: polyvinyls, polyurethanes, polyesters, polyester imides, polyamide imides, and polyimides. The layers may be the same or different in chemical nature.
    Type: Grant
    Filed: June 30, 2004
    Date of Patent: August 17, 2010
    Assignee: Thales
    Inventors: Vincent Barbet, Paul Billon
  • Patent number: 7772047
    Abstract: A semiconductor device having a redistribution layer, and methods of forming same, are disclosed. After fabrication of semiconductor die on a wafer, a tape assembly is applied onto a surface of the wafer, in contact with the surfaces of each semiconductor die on the wafer. The tape assembly includes a backgrind tape as a base layer, and a film assembly adhered to the backgrind tape. The film assembly in turn includes an adhesive film on which is deposited a thin layer of conductive material. The redistribution layer pattern is traced into the tape assembly, using for example a laser. Thereafter, the unheated portions of the tape assembly may be removed, leaving the heated redistribution layer pattern on each semiconductor die.
    Type: Grant
    Filed: June 28, 2007
    Date of Patent: August 10, 2010
    Assignee: SanDisk Corporation
    Inventors: Chien-Ko Liao, Chin-Tien Chiu, Jack Chang Chien, Cheemen Yu, Hem Takiar
  • Patent number: 7748116
    Abstract: A method of creating an electrical contact involves locating a barrier material at a location for an electrical connection, providing an electrically conductive bonding metal on the barrier material, the electrically conductive bonding metal having a diffusive mobile component, the volume of barrier material and volume of diffusive mobile component being selected such that the barrier material volume is at least 20% of the volume of the combination of the barrier material volume and diffusive mobile component volume. An electrical connection has an electrically conductive bonding metal between two contacts, a barrier material to at least one side of the electrically conductive bonding metal, and an alloy, located at an interface between the barrier material and the electrically conductive bonding metal. The alloy includes at least some of the barrier material, at least some of the bonding metal, and a mobile material.
    Type: Grant
    Filed: April 5, 2007
    Date of Patent: July 6, 2010
    Inventor: John Trezza
  • Patent number: 7716810
    Abstract: A method of manufacturing a commutator main body which has a cylindrical insulating body, and a plurality of segments arranged in an outer circumference of the insulating body. A short-circuit member is arranged in an end in an axial direction of the insulating body. The short-circuit member has a plurality of first short-circuit pieces and a plurality of second short-circuit pieces. A tabular insulating portion covers first coupling portions of the first short-circuit pieces, and second coupling portions of the second short-circuit pieces. The insulating portion has a restriction recess, and the end in the axial direction has a restriction projection. The restriction projection is engaged with the restriction recess, whereby the movement of the short-circuit member in the circumferential direction with respect to the commutator main body is restricted. Accordingly, the assembly of the short-circuit member in the commutator main body is facilitated.
    Type: Grant
    Filed: June 26, 2007
    Date of Patent: May 18, 2010
    Assignee: ASMO Co., Ltd.
    Inventors: Tomohiro Aoyama, Yasuhide Ito, Toshio Yamamoto
  • Publication number: 20100025104
    Abstract: Electrical bushing, in particular for pressure applications, with a housing with at least one housing passage and with at least one electrical conductor, which is passed through the housing passage, protrudes at both ends on two housing sides, which are spaced apart from one another, out of in each case one opening of the housing passage out of the housing and is fixed in the housing by means of a tightly sealing material which fills at least the majority of the housing passage.
    Type: Application
    Filed: July 4, 2007
    Publication date: February 4, 2010
    Inventor: Helmut Hartl
  • Publication number: 20090158953
    Abstract: A glass-metal feed-through transmits an electrical signal from one face to another face that is opposite. The feed-through includes a glass plug, two metal pins passing through the plug, and a metal part surrounding the plug. The feed-through includes an electrically-conductive link between a first of the pins and the part. The link includes a brazing preform secured to the first pin and to the part.
    Type: Application
    Filed: November 9, 2006
    Publication date: June 25, 2009
    Applicant: AUTOLIV DEVELOPMENT AB
    Inventors: Alain Magne, Andelino Carrol, Gregory Minuzzo
  • Patent number: 7504925
    Abstract: An electric device generates a predetermined amount of heat in the event of a malfunction. The electric device is protected from overheating in that it is arranged, with a fuse in a circuit, such that the fuse and the electric device are thermally coupled to one another, so that the generation of the amount of heat by the electric device causes a fusible material in the fuse to melt. In this manner, the current terminal path of the electric device is interrupted.
    Type: Grant
    Filed: May 25, 2006
    Date of Patent: March 17, 2009
    Assignee: Infineon Technologies AG
    Inventors: Alfons Graf, Martin Maerz, Martin Saliternig
  • Patent number: 7486480
    Abstract: Embodiments of the invention relate to making reconnection when a soldered connection fails in a head/slider used in a magnetic disk drive. In one embodiment, a solder mass deposited on a slider pad of a head/slider is separated from a lead pad and a solder ball connection is yet to be made between the slider pad and the lead pad. A shaping tip is heated to a temperature near a melting point of a solder. The shaping tip is moved in parallel with a surface of the slider pad toward the side of the lead pad to soften the solder mass. The solder mass is thereafter irradiated with a laser beam so as to form a solder fillet, thereby making a soldered connection between the lead pad and the slider pad.
    Type: Grant
    Filed: February 15, 2006
    Date of Patent: February 3, 2009
    Assignee: Hitachi Global Storage Technolgies Netherlands B.V.
    Inventors: Takuya Satoh, Tatsushi Yoshida, Tatsumi Tsuchiya, Yoshio Uematsu
  • Publication number: 20080246145
    Abstract: A method of creating an electrical contact involves locating a barrier material at a location for an electrical connection, providing an electrically conductive bonding metal on the barrier material, the electrically conductive bonding metal having a diffusive mobile component, the volume of barrier material and volume of diffusive mobile component being selected such that the barrier material volume is at least 20% of the volume of the combination of the barrier material volume and diffusive mobile component volume. An electrical connection has an electrically conductive bonding metal between two contacts, a barrier material to at least one side of the electrically conductive bonding metal, and an alloy, located at an interface between the barrier material and the electrically conductive bonding metal. The alloy includes at least some of the barrier material, at least some of the bonding metal, and a mobile material.
    Type: Application
    Filed: April 5, 2007
    Publication date: October 9, 2008
    Inventor: John Trezza
  • Patent number: 7412767
    Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate.
    Type: Grant
    Filed: January 3, 2005
    Date of Patent: August 19, 2008
    Assignee: Microfabrica, Inc.
    Inventors: Kieun Kim, Adam L. Cohen, Willa M. Larsen, Richard T. Chen, Ananda H. Kumar, Ezekiel J. J. Kruglick, Vacit Arat, Gang Zhang, Michael S. Lockard
  • Patent number: 7353597
    Abstract: A method of forming a conductive gasket material by layering at least one conductive web layer having a blended mixture of conductive fibers and low melting point nonconductive fibers onto a foam core, and needlepunching the conductive web layer and the foam core forming a conductive composite gasket material having a plurality of conductive fibers interspersed through the foam core.
    Type: Grant
    Filed: January 6, 2006
    Date of Patent: April 8, 2008
    Inventor: Joseph J. Kaplo
  • Patent number: 7325303
    Abstract: A generally planar interposer having a plurality of interposer contact pads to contact a plurality of first contacts of a first electronic device on one side of the interposer, and a plurality of electrical connections between the interposer contact pads and a plurality of pressure contacts on the other side of the interposer. Each of the pressure contacts having a directionally deformable contact surface to removably contact a plurality of second contacts of a second electronic device on the other side of the interposer. Also methods of forming the interposer.
    Type: Grant
    Filed: December 8, 2006
    Date of Patent: February 5, 2008
    Assignee: Intel Corporation
    Inventors: David W. Boggs, John H. Dungan, Frank A. Sanders, Daryl A. Sato, Dan Willis
  • Patent number: 7240429
    Abstract: A conductor pattern is formed on a resin film which is made of a thermoplastic resin. Each single-sided conductor pattern film has via-holes filled with an electrically conductive paste. A printed conductor pattern and a printed resistor are formed on a ceramic substrate. The single-sided conductor pattern films are laminated on the ceramic substrate. Then, the multilayered assembly is heated and pressed from both sides thereof to obtain a printed circuit board. During the heat and press treatment, respective single-sided conductor pattern films and the ceramic substrate bond together while the interlayer connection is obtained between the conductor patterns as well as between the conductor pattern and the printed conductor pattern.
    Type: Grant
    Filed: August 3, 2004
    Date of Patent: July 10, 2007
    Assignee: DENSO Corporation
    Inventors: Yoshihiko Shiraishi, Koji Kondo
  • Patent number: 7238919
    Abstract: According to an aspect of the present invention, there is provided a bonding method, comprising disposing on a first body a second body with a bump interposed therebetween; and electrically and mechanically bonding the first body and the second body with the bump by passing a heating element between the first body and the second body to melt the bump by the heating element, the heating element being heated to a melting point or more of a material configuring the bump.
    Type: Grant
    Filed: February 7, 2006
    Date of Patent: July 3, 2007
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hisashi Kaneko, Mie Matsuo, Hirokazu Ezawa