Abstract: In the thermoelectric module composed of p- and n-conductive thermoelectric material legs which are connected to one another alternately via electrically conductive contacts, at least some of the electrically conductive contacts on the cold and/or the warm side of the thermoelectric module are formed between, or embedded into, the thermoelectric material legs composed of porous metallic materials.

Abstract: A method for fixing tin balls in one of a connector or an IC device to the welding portion of the terminals of an electric connector, IC or other electronic element so that the terminal can be welded to the tin balls of the ball grid array seat; the method comprising the steps of: selecting a ball grid array seat; covering a bottom of the ball has a mold by a mold plate having a plurality of recesses; filling the tin glue into the recesses of the mold plate so that the tin glue exactly encloses the welding portions of the terminals; taking out the mold plate; and melting the tin glue so as to condense as a balls or ball-like tin balls, so that condensed tin balls are combined to the welding portions. Moreover, the mold plate can be removed in manufacturing the tin balls.

Abstract: An electrocatalyst based on a highly electroconducting polymer and a transition metal, in which transition metal atoms are covalently bonded to heteroatoms of the backbone monomers of the polymer. The covalently bonded transition metal atoms are nucleation sites for catalytically active transition metal particles. The complex is prepared by complexing a highly electroconducting polymer with transition metal coordination ions and then reducing the transition metal ions to neutral atoms. An electrode for a fuel cell is made by impregnating an electrically conducting sheet with the catalytic complex and drying the impregnated sheet. The scope of the present invention includes such electrodes and the fuel cells that incorporate these electrodes.

Abstract: Disclosed is a method for manufacturing a composite member comprising a porous substrate, a via, and a wiring. The method comprises exposing a first region and a second region in the porous substrate to a exposure beam through a mask, the second region exposed by the exposure beam not more than 50% of the exposure of the first region, the exposure beam having the wavelength that an average size of voids of the porous substrate is, as expressed by a radius of gyration, {fraction (1/20)} to 10 times, and forming the via and the wiring by infiltrating a conductive material into the first region and the second region respectively.

Abstract: A method of making an article, such as an electrical connector includes an injection-molded plastic substrate and a pattern of injection-molded metal conductors supported on and mechanically interlocked with the substrate, wherein one of the substrate and the conductors is over-molded onto the other of the substrate and the conductors.

Abstract: An inexpensive and high throughput process for manufacturing a printed circuit board (PCB) substrate includes first weaving a plurality of electrically non-conductive strands (e.g., fiberglass yarns) and at least one electrically conductive strand (e.g., a copper wire) to form a woven fabric with an upper surface and a lower surface. Next, the woven fabric is impregnated with a resin material to form an impregnated fabric, which is then cured to form a cured fabric. The upper and lower surfaces of the cured fabric are subsequently planed. The planing step segments the electrically conductive strand(s) and forms a PCB substrate that includes a planarized cured fabric with upper and lower planed surfaces and a plurality of electrically conductive strand segments extending from the upper planed surface to the lower planed surface.

Abstract: A coaxial connector ensures positive, stable contact and permits sufficiently reduced size and thickness. The coaxial receptacle (1) is equipped with: a synthetic resin insulating case (2) which has a hexahedron shape; an internal terminal (30) composed of a metallic fixed terminal (4) and a movable terminal (5) made of a flexible metal material, which are provided in a cavity or internal space (3) of the insulating case (2); a rubber elastic member (51) disposed under the movable terminal (5) in the cavity (3) of the insulating case (2); and an external terminal or outer conductor (40) provided to cover an essential section of the insulating case (2). The cavity (3) of the insulating case (2) is a vertical columnar space; and the upper side thereof has an annular opening to form an inlet (7) through which the central contact of a mating coaxial connector is introduced downward.

Abstract: A wiring body, used for manufacturing a substrate, includes a columnar body, having an axis, made of fired porous inorganic insulator impregnated with an organic insulator; and a large number of metallic fine wires embedded in the columnar body in parallel with the axis while the metallic fine wires are arranged at intervals, wherein a ratio of the inorganic insulator in the columnar body is 50 to 80 volume %, preferably 50 to 60 volume %. A method for manufacturing a wiring body includes the steps of charging a dispersed solution, in which inorganic insulating powder is dispersed, into a container in which a number of metallic fine wires are arranged in parallel with the axis, drying the dispersed solution, and firing inorganic insulating powder so that the porosity of the fired body can be in a range from 20 to 50 volume % so as to form a columnar body; and the steps of impregnating the obtained porous columnar body with uncured organic insulating material, and curing the organic insulating material.

Abstract: A portion of a highly conductive metal member is infiltrated in voids of a porous high melting point metal member, and both the metal members are integrally joined to each other. An arc electrode portion 13 is formed of a high melting point area 11 in which the highly conductive metal is infiltrated in voids of the high melting point metal member. A coil electrode portion 14 is formed by hollowing out the interior of a highly conductive metal area 12 composed only of highly conductive metal and by forming slits 15 to 17 thereon. A rod 18 is hard-brazed on the rear surface of the coil electrode portion 14. With this electrode, it is possible to reduce the number of parts, and to omit the brazing portion between the arc electrode portion 13 and the coil electrode portion 14 for lowering the electric resistance and thereby the calorific value.

Abstract: An electrical connecting device including a first circuit board providing thereon with input/output terminals, each of the terminals having a tip surface coated with gallium and a second circuit board providing thereon with contact terminals, each of the terminals having a tip surface coated with indium or tin. A low-melting point alloy layer is formed by a mutual action between gallium and indium or tin, when the input/output terminals of the first circuit board are in contact with the respective terminals of the second circuit board and electrically connected to each other. The second metal layer includes a plurality of wire-like metal supports extending substantially perpendicular to the surface of the terminal and a low-melting point metal retained by the wire-like metal supports.

Abstract: An electronic module and a method for coupling a power lead (32) to a bond pad (28) on a semiconductor die (17) within the electronic module. A clip support (13) having a slot (27) is coupled to a baseplate (11) via an isolation structure (14). The semiconductor die (17) is coupled to the baseplate (11) via an isolation structure (19). The power lead (32) is coupled to the isolation structure (14). The clip support (13) is coupled to the semiconductor die (17) via a clip (29), wherein a first end of the clip (29) is inserted in the slot (27) and a second end of the clip (29) is compressively mated with the semiconductor die (17). Compressively mating the clip (29) with the semiconductor die (17) eliminates the need for bond feet, thereby increasing the reliability of the module.

Abstract: A reinforced wrap around ground and method includes a substrate, including opposite first and second substrate surfaces separated by a substrate edge. A first metalization layer is coupled to the first substrate surface and a second metalization layer comprising an electrical ground, is coupled to the second substrate surface. An electrical ground reinforcement is coupled between the first metalization layer and the second metalization layer around the substrate edge. Conductive paste coats the electrical ground reinforcement, and the conductive paste is fired to bind the wrap around ground to the substrate and to electrically ground the first metalization layer to the second metalization layer through the electrical ground reinforcement and the conductive coating.

Abstract: A precision molded electrical discharge machining electrode is made by shaping a preform from granules of carbon and granules of a refractory material selected from the group consisting of tungsten, molybdenum, carbides thereof, and stoichiometric and hyperstoichiometric carbides of the other elements of the groups IVB, VB, and VIB of the Periodic Table of the Elements, the carbon and refractory granules being interconnected in the form of a skeleton at their contiguous points of contact, and infiltrating the preform with copper, silver, or alloys containing those metals.