Abstract: A heat exchanger for use in a vehicular air conditioning apparatus, including a plurality of first and second tubes; a first heat exchanger section, a boundary portion, and a second heat exchanger section; a plurality of first fins disposed on the first heat exchanger section and a plurality of second fins disposed on the second heat exchanger section; and a partition member formed at the boundary portion, wherein the partition member is made of a synthetic resin or synthetic rubber and in contact with the plurality of the first and second tubes and end surfaces of the plurality of the first and second fins at the boundary portion such that the partition member blocks the air from flowing between the first heat exchanger section and the second heat exchanger section.

Abstract: Cooling methods are provided for facilitating pumped immersion-cooling of electronic components. The cooling method includes: providing a housing forming a compartment about one or more components, and providing a supply manifold, a return manifold, and coupling a coolant loop coupling in fluid communication the supply and return manifolds and the housing. Coolant flowing through the coolant loop flows through the compartment of the housing and, at least partially, immersion-cools the component(s) by flow boiling. A pump facilitates circulation of coolant within the loop, and a coolant bypass line is coupled between the supply and return manifolds. The return manifold includes a mixed-phase manifold section, and the bypass line provides coolant from the supply manifold directly to the mixed-phase manifold section. Coolant flows from the coolant bypass line into the mixed-phase manifold section in a direction counter to the direction of any coolant vapor flow within that manifold section.

Abstract: A method of fabricating a cooling apparatus is provided to facilitate two-phase, immersion-cooling of one or more electronic components. The cooling apparatus includes a housing having a compartment within which dielectric fluid is disposed which facilitates immersion-cooling of the electronic component(s). A liquid-cooled heat sink is associated with the housing and cools a cooling surface exposed within the compartment. One or more pumps are disposed within the compartment and configured to pump dielectric fluid liquid within the compartment towards the cooling surface to facilitate cooling the liquid within the compartment below a saturation temperature of the dielectric fluid. The heat sink includes or is coupled to condensing and sub-cooling regions exposed within the compartment.

Abstract: A zone-control unit for use in a heating, ventilation, and air conditioning (HVAC) system, the zone-control unit includes a heat exchanger, an inlet piping assembly coupled with the heat exchanger for supplying fluid to the heat exchanger, an outlet piping assembly coupled with the heat exchanger for receiving fluid from the heat exchanger, a bracket that maintains the inlet piping assembly and the outlet piping assembly in positional relationship, and an ancillary component coupled with the heat exchanger.

Abstract: A thermal pad includes: a thermally conductive sheet-like substrate, where the sheet-like substrate has a compressible porous mesh structure in a thickness direction; and a thermally conductive coating, where the coating is formed of a flexible organic compound, and the organic compound fills inside the sheet-like substrate or is coated on a surface of the sheet-like substrate, or the organic compound both fills inside the sheet-like substrate and is coated on the surface of the sheet-like substrate. In the thermal pad, the method for fabricating a thermal pad, the heat dissipating apparatus, and the electronic device provided in the embodiments of the present application, a thermally conductive flexible organic compound fills inside or is coated on a thermally conductive sheet-like substrate having a compressible porous mesh structure in the thickness direction.

Abstract: The invention apparatus and method is practiced in large steam surface condensers and in one aspect comprises relatively narrow horizontal trays installed between the vertical tube bundles to drain the condensate from the upper bundle around the lower ones and thereby improve the heat transfer coefficient of the lower bundle(s). A second aspect of the invention apparatus comprises relatively narrow horizontal trays installed slightly below the lowest bundle to improve reheating of falling condensate up toward the saturation temperature of the condenser thereby reducing subcooling and the level of dissolved oxygen in that condensate. A third aspect of the invention apparatus comprises a partial hood retrofitted at the top of the central tube sheet air off-take entrance which is a unique element of the starburst/core pipe condenser design to thereby improve the air removal capability and consequently the performance of the condenser.

Abstract: A heat engine system is disclosed and includes first and second condensers fluidly and structurally coupled to first and second recuperators. An expansion device is coupled to the condensers at a drive end and suspended from the recuperators at a non-drive end. The recuperators can be printed circuit heat exchangers which provide superior heat transfer capabilities but are also robust enough to support the expansion device, and thereby form an integral part of a structural baseplate for mounting and aligning various components of the heat engine system. Exhaust conduits extending between the expansion device and the recuperators also provide added structural support for the expansion device.

Abstract: Heat exchanger comprising at least a heat exchanger space, a burner space and a water conducting channel, wherein the heat exchanger comprises a body having at least one slot and at least one cassette insertable into said at least one slot, said cassette comprising at least part of a water conducting channel.

Abstract: According to an embodiment, a satellite is disclosed comprising an anti-nadir panel having a first side and a second side. In one or more embodiments, the first side of the anti-nadir panel is mounted to an anti-nadir side of the main body of the satellite. The satellite further comprises at least one battery pack mounted to the second side of the anti-nadir panel, where at least one battery pack comprises at least one battery cell.

Abstract: A method for producing a heat exchanger for a motor vehicle, wherein the heat exchanger has reservoirs and a bundle of flow-through fluid conduits for guiding the flow between the reservoirs. The conduits are produced together as a bundle. A heat exchanger for a motor vehicle, especially a micro-channel cooler, can be produced by this method.

Abstract: A distributor incorporates a heat exchanger mounted in the interior space of the distributor while being made integral with the wall of the body of the distributor by at least one side flange. The distributor is characterized in that its two constituent parts (5 and 5?) are joined by welding opposing joining edges (6 and 6?), the edges (6, 6?) being connected physically to one another in an airtight manner along a contact area (7) in the form of a peripheral continuous band, surrounding the outer periphery of the flange (4), and mechanically connected, in a localized and discontinuous way, to the flange (4) by engagement at through openings (8) and/or at deformed or radius-chamfered areas of the latter. A process of manufacturing the distributor is also described.

Abstract: The present invention discloses a manufacturing method of heat-dissipating element, including the following steps: processing a heat-dissipating element body with a bottom plate and at least two stop plates, the stop plates being disposed at two sides of the bottom plate and bending towards surface; cutting from the bottom plate of the heat-dissipating element body to form heat-dissipating element, the dissipating element at least comprising two heat-dissipating elements of same shape or of symmetric shape. The present invention also discloses a heat-dissipating element and backlight module manufactured by the above method. The heat-dissipating element, manufacturing method and backlight module thereof can maintain optimal heat-dissipation effect and save material used to lower cost.

Abstract: A process for producing a turbulence device (1) which is to be mounted in at least one flow duct of a heat exchanger of a motor vehicle includes the steps of, in a first process step, at least one shaping operation is used to produce at least one substantially meandering turbulence device (30) with substantially smooth walls (2) from a substantially continuously planar sheared strip (9), wherein a longitudinal direction (RLR) of the walls runs substantially parallel to a forward feed direction (VSR) of the sheared strip (9), and in a second process step, wall sections are deformed at least by an angle (?) in relation to the forward feed direction (VSR), in such a way that undercuts (3) are produced in relation to the forward feed direction (VSR, RLR), wherein the substantially continuously planar sheared strip (9) is cut into turbulence devices (1) of predetermined lengths before carrying out the second process step.

Abstract: A luminaire comprising a base, a heat sink modularly connected to the base, and a heat-generating element in thermal communication with the modular heat sink. The heat sink may include a heat-generating element contacting portion, and a plurality of heat sink segments connected to and extending outwardly therefrom. Each of the heat sink assemblies segments may comprise at least one fin assembly. Each heat sink segment may pass through a respective plurality of passageways in the top portion of the base so that the heat sink segments may matingly engage the medial portion of the base. A method for forming a heat sink comprises fabricating a heat-generating element contacting portion, constructing a plurality of heat sink segments, and assembling the plurality of heat sink segments to connect to and extend outwardly from the bottom surface of the heat-generating element contacting portion.

Abstract: A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

Abstract: A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

Abstract: The invention apparatus and method is practiced in large steam surface condensers and in one aspect comprises relatively narrow horizontal trays installed between the vertical tube bundles to drain the condensate from the upper bundle around the lower ones and thereby improve the heat transfer coefficient of the lower bundle(s). A second aspect of the invention apparatus comprises relatively narrow horizontal trays installed slightly below the lowest bundle to improve reheating of falling condensate up toward the saturation temperature of the condenser thereby reducing subcooling and the level of dissolved oxygen in that condensate. A third aspect of the invention apparatus comprises a partial hood retrofitted at the top of the central tubesheet air off-take entrance which is a unique element of the starburst/core pipe condenser design to thereby improve the air removal capability and consequently the performance of the condenser.

Abstract: A heat exchanger element includes at least two honeycomb structures arranged serially and each including a cell structural portion having cells separated and formed by partition walls containing SiC and functioning as passages which extend from one end face to the other end face and which a first fluid passes through, and an outer peripheral wall disposed on the outer periphery of the cell structural portion. The first fluid passes through the cells of the honeycomb structures without leaking out of the cells or mixing. The cell structural portions of at least a pair of the honeycomb structures adjacent to each other among the honeycomb structures arranged serially are disposed with a gap, and the first fluid passing through the cells mixes together between end faces forming the gap.

Abstract: Disclosed herein is a heat radiating substrate including: a heat radiating plate including a plurality of holes having a predetermined depth and formed in a lower portion of one side thereof; a conductor pattern layer formed on the heat radiating plate and including a mounting pad on which a control device and a power device are mounted and a circuit pattern; and an insulating layer formed between the heat radiating plate and the conductor pattern layer.

Abstract: The heat exchanger HE comprising a case 2 housing a plurality of heat transfer tubes 1 and a header 3 having a hollow main body 30 with an open edge 33. A side wall 21 of the case 2 is provided with a bulging portion 22 having a cylindrical circumferential wall 22a bulging out of the case 2 and an end wall 22b which blocks a tip portion of the circumferential wall 22a. Each end of the heat transfer tubes 1 is inserted into a penetrating hole 22c provided for the end wall 22b of the bulging portion 22, and is jointed to the end wall 22b, and the open edge 33 of the header 3 is fitted onto the circumferential wall 22a of the bulging portion 22, thereby forming a chamber 36 communicating with the inside of each heat transfer tube 1. Therefore, it is possible that the number of the members of the heat exchanger HE is reduced, the configuration is simplified, and the heat exchanger HE is easily manufactured at low cost.

Abstract: According to the preferred embodiment, an improved method and apparatus for the manufacturing of an aluminum tube and aluminum fin heat exchanger that includes steps for pneumatic cleaning, thermal cleaning, and uncontrolled-atmosphere open-flame autobrazing of hairpins to return bend fittings. The method uses a tube lubrication system that is adjustable to control amount of lubrication applied to the tube prior to final expansion. The method uses a pneumatic coil cleaning station that is adjusted to reduce the residual oil particulate from the expansion process required to be thermally cleaned.

Abstract: Super heater systems include self-contained units which are easily transported to remote locations. Such super heater systems include heat exchanger assemblies adapted to heat liquid on-the-fly (i.e., directly from the supply source to a wellbore or pipeline system. A heat exchange assembly may include a first header with a plurality of first header layers in alternating fluid communication, and a second header with a plurality of second header layers in alternating fluid communication. A plurality of heat exchange coils can be coupled between the first header and the second header such that the heat exchange coils are exposed to heat generated by a burner manifold. Other aspects, embodiments, and features are also claimed and described.

Abstract: A method is provided for facilitating cooling of electronic components of an electronic system. The method includes: providing a housing at least partially surrounding and forming a compartment about the components, and providing an immersion-cooling fluid is disposed within the compartment, at least one component of the electronic system being at least partially non-immersed within the fluid in the compartment; providing a wicking film element physically coupled to a main surface of the at least one component and partially disposed within the fluid within the compartment; and securing, via a coupling element, the wicking film element in physical coupling to the main surface of the at least one component without the coupling element overlying the main surface of the component(s). As an enhancement, the wicking film element wraps over the component to physically couple to two opposite main sides of the component.

Abstract: The present invention relates to a temperature-control element. The present invention relates to a temperature-control element, having at least one surface region with an electrically insulating and thermally conductive coating, in particular a ceramic coating provided on said surface region, and attached to the coating is at least one electronic component which is thermally connected to the temperature-control element and is configured to be electrically insulating with respect to the temperature-control element. The present invention also relates to a method for attaching an electronic component to the temperature-control element.

Abstract: A radiating fin and a method of manufacturing the same are disclosed. The radiating fin includes a main body having a first side and an opposite second side, and being provided with at least one through hole to extend between the first and the second side for a heat pipe to extend therethrough; and at least one extension being formed on at least one of the first and the second side of the main body to locate around the at least one through hole and axially project from the main body. The extension is crimped to form a plurality of circumferentially alternate ridge portions and valley portions for tightly pressing against an outer surface of the heat pipe, so as to firmly bind the radiating fin to the heat pipe. A thermal module can be formed by sequentially binding a plurality of the radiating fins to the heat pipe.

Abstract: A method of manufacturing a heat dissipating base includes steps of providing a first base, wherein the first base is made of a first heat conducting material; putting the first base into a mold; pouring a second heat conducting material, which is melted, into the mold, wherein a thermal conductivity of the first heat conducting material is larger than that of the second heat conducting material; and processing the second heat conducting material by a die casting process, so as to form a second base, wherein the second base covers a periphery of the first base and an upper surface and a lower face of the first base are exposed.

Abstract: A vapor condenser is provided which includes a three-dimensional folded structure which defines, at least in part, a set of coolant-carrying channels and a set of vapor condensing channels, with the coolant-carrying channels being interleaved with and extending parallel to the vapor condensing channels. The folded structure includes a thermally conductive sheet with multiple folds in the sheet. One side of the sheet is a vapor condensing surface, and the opposite side of the sheet is a coolant-cooled surface, with at least a portion of the coolant-cooled surface defining the coolant-carrying channels, and being in contact with coolant within the coolant-carrying channels. The vapor condenser further includes, in one embodiment, a top plate, and first and second end manifolds which are coupled to opposite ends of the folded structure and in fluid communication with the coolant-carrying channels to facilitate flow of coolant through the coolant-carrying channels.

Abstract: The present invention relates to a heat-sink base provided with heat-sink fin portions, it manufacturing method and a motor provided with the heat-sink base. The base is produced by pouring cast metal into a mold cavity to replace a pattern having a predetermined sublimation temperature. The base includes a preformed heat-sink member comprising a plurality of heat-sink fin portions and at least one anchor portion embedded at least partially in the pattern, and a base body comprising an enclosed base portion and a holder portion for receiving and holding the at least one anchor portion. By virtue of the invented method, the heat-sink member having an extremely thin thickness can be mounted on the base body and the overall surface area of the heat-sink base is increased considerably.

Abstract: A cooler includes: a housing in a form of a frame including a first opening and a second opening opposite to each other; a first radiator including a first substrate joined to the housing—to close the first opening, and a first heat radiation unit provided on the first substrate; and a second radiator including a second substrate joined to the housing to close the second opening, and a second heat radiation unit provided on the second substrate, the first heat radiation unit—having a plurality of first fins, the second heat radiation unit having a plurality of second fins, the first fins each abutting against a tip of at least one second fin.

Abstract: A heat-dissipating fin capable of increasing heat-dissipating area includes a lower plate and an upper plate. The lower plate is provided with a through-hole. The upper plate extends from the lower plate and is bent to be overlapped on the lower plate, thereby forming a heat-dissipating path (b) therebetween. In this way, the heat-dissipating area in the same height can be increased, thereby improving the heat-dissipating efficiency of the fin.

Abstract: Apparatus and methods for use with a baffle support fixture for a machine assembly of the tubes and baffles in a bundle assembly of a shell and tube type heat exchanger. The bundle comprises tubes inserted through baffles. The bundle is assembled using a holding fixture that includes anti-rotational features to secure baffles in a desired orientation. Following assembly, the bundle assembly is temporarily fixtured using pressure applying means such as plates and rods, and is then permanently affixed using an adhesive composition. After adhesive is applied, bundles, with the pressure applying means still attached, are preserved on racks and heat treated to cure and permanently set the adhesive.

Abstract: A containment vessel for a thermal energy storage system comprising a bottom wall joined to a surrounding containment side wall, and a liner comprising a liner bottom disposed upon the bottom wall of the vessel, the liner bottom having an outer perimeter and comprising an array of plates, each of the plates joined at a portion of its perimeter to a portion of the perimeter of an adjacent plate by a flexible joint; and a liner side wall joined to the outer perimeter of the liner bottom and disposed within the containment side wall. A thermal energy storage system comprising the containment vessel and an array of heat exchangers is also disclosed. The heat exchangers are disposed in the vessel, and are each supported by a support frame joined to one of the plates of the array of plates of the liner.

Abstract: A distributor assembly for a space conditioning system comprising a sealed expansion device and a sealed distributor housing. The expansion device has a first opening, a second opening and an interior chamber there-between. The interior chamber contains an orifice housing, wherein the orifice housing has a through-hole orifice therein. The orifice housing is configured to move between the first opening and the second opening within the interior chamber. An outer surface of the orifice housing forms a fluid stop around the first opening such that a refrigeration fluid of the space conditioning system delivered through the second opening can substantially only pass through the through-hole orifice to the first opening. The distributor housing has a largest opening that is permanently sealed to the first opening of the sealed expansion device and a plurality of smaller openings configured to be fluidly connected to a heat-exchange coil of the space conditioning system.

Abstract: An exemplary heat sink includes a heat-conducting substrate and a heat-conducting film formed on an outer surface of the substrate. A heat resistance of the heat-conducting film is lower than that of the heat-conducting substrate. A heat conductivity coefficient of the heat-conducting film is higher than that of the heat-conducting film. The heat-conducting film is thinner than the heat-conducting substrate, and a thickness of the heat-conducting film is in a range from about 0.025 mm to about 0.05 mm.

Abstract: A room enclosure assembly on a base of a concrete ceiling or wall is disclosed. In an embodiment, it includes metal sheet material having contact surfaces toward the base and web faces leading away from the base and heat exchange surfaces. Folding regions are formed between the sub-faces of the sheet material. The contact surfaces are fastened to the base area via a heat conducting connection layer. The heat-exchange faces are provided with a coating layer. The heat flow between the base and the heat exchange surfaces is especially efficient because it takes place in the continuous metal sheet material. Through-openings in the heat exchange surfaces, together with the use of a suitable coating layer on the heat exchange surfaces, allow for the acoustic insulating effect and optical appearance to be optimized.

Abstract: An exhaust gas recirculation cooler for internal combustion engines and a method of forming same. One or more cooler tubes incorporate a flexible section, comprised of one or more integrally formed convolutions, with a tube and fin architecture. The exhaust gas recirculation cooler provides thermal compensation, on a per-tube basis, with the flexible sections of the one or more cooler tubes individually displacing upon the thermal expansion of any of the respective tubes.

Abstract: The present invention is directed to a forging method for forming a heat sink 9 including a base board 91 and a plurality of pin fins 92 integrally formed on an upper surface of the base board 91. A back pressure applying pin 75 of a forging die for forming pin fins 92 are slidably arranged in a fin-forming hole 52. At the time of plastically deforming a forging blank W, a back pressure is applied by the back pressure applying pin to a metal material of the forging blank W flowed into the fin-forming hole 52. A concave portion 76 is formed on the restraining tip end face of the back pressure applying pin 75 for restraining the metal material, and a joining convex portion 93 is integrally formed on a tip end of the pin fin 92 by the metal material filled in the concave portion 76.

Abstract: A liquefied natural gas production facility and a method of designing and constructing a liquefied natural gas production facility are described. The facility includes space-apart modules for installation at a production location to form a production train including a major axis and a minor axis, each module including a module base for mounting a plurality of plant equipment associated with a selected function assigned to the module, the module base including a major axis and a minor axis. Heat exchangers are arranged to run parallel to the major axis of the production train to form a heat exchanger bank including a major axis and a minor axis, where the major axis of the bank is parallel to the major axis of the train. A subset of the plurality of heat exchangers is arranged on a first level vertically offset from the base of at least one module.

Abstract: A heat exchanger for heating a liquid is provided, in particular, for high-pressure cleaners, including an inner and an outer heating coil which each have a plurality of turns, and including spacers which are arranged between the inner heating coil and the outer heating coil and are distributed over the circumference of the inner heating coil. To develop the heat exchanger in such a way that it can be manufactured more cost-effectively and is highly efficient, at least one turn of the outer heating coil includes between two spacers immediately adjacent to each other a first turn section in which the radial spacing from the inner heating coil is smaller or larger than in the region of the spacers. Two methods for manufacturing such a heat exchanger are also provided.

Abstract: An exemplary method for manufacturing a heat dissipation apparatus includes, firstly, providing a fin assembly including a stack of fins spaced from each other. Each fin defines a through hole therein, and includes a collar formed at an edge of the through hole. Then a heat pipe is provided, and inserted in the through holes of the fins. Next, two opposing punching tools are provided. Each punching tool defines a series of recesses. The subassembly of the heat pipe and fins is positioned between the two punching tools, with the collar of each fin located between two corresponding recesses of the two punching tools. The two punching tools punch the collars of the fins from two opposite sides of the collars. Thereby, the collars shrink inwardly and press the heat pipe to deform until the heat pipe is fittedly mounted in the collars of the fins.

Abstract: A ram outlet header includes a ram outlet header body. A ram air fan mounting neck and a ram air fan mounting flange are configured to couple the ram outlet header to a ram air fan housing. A heat exchanger mounting flange is configured to couple the ram outlet header to a heat exchanger assembly. A lower face includes a first stiffener. A mid-section includes a second stiffener, a third stiffener, and a fourth stiffener. The ram air fan mounting flange is positioned between the lower face and the mid-section. A ratio of thickness of the second stiffener to the third stiffener is between 1.04 and 1.16, and a ratio of thickness of the fourth stiffener to the third stiffener is between 1.04 and 1.16.

Abstract: Slotted heatsinks comprise a base containing a plurality of slots adapted to removably secure light emitting devices, wherein each of said slots comprises at least four cavities; and a plurality of fins adjacent to and/or on top of said slots for removing heat generated by the light emitting devices. The slots may have a t-shaped or +-shaped cross section. Opposing sidewalls may also be provided together with one or more active cooling devices and various covers for the components. Related systems and methods are also provided. When combined with a suitable light source, such devices are useful for a wide range of applications, including, for example, as aquarium or grow lights.

Abstract: A heat sink and method of fabrication are provided for removing heat from an electronic component(s). The heat sink includes a heat sink base and frame. The base has a first coefficient of thermal expansion (CTE), and includes a base surface configured to couple to the electronic component to facilitate removal of heat. The frame has a second CTE, and is configured to constrain the base surface in opposing relation to the electronic component, wherein the first CTE is greater than the second CTE. At least one of the heat sink base or frame is configured so that heating of the heat sink base results in a compressive force at the base surface of the heat sink base towards the electronic component that facilitates heat transfer from the electronic component. A thermal interface material is disposed between the base surface and the electronic component.

Abstract: A cooling element for use with a carafe that may be used for serving a consumable liquid such as wine. The cooling element can be inserted into the open, upper end of the carafe and the cooling element has as hollow tube that is filled with a cooling agent such as ice, and which extends downwardly into direct contact with the liquid contained within the carafe. There is a passageway that is formed between the cooling element and the carafe that allows the liquid to be poured out of the carafe without removing the cooling element from the carafe. The hollow tube is constructed of a material that has a high thermal conductivity, such as stainless steel, such that the heat exchange is efficient and the heat passes through a single thickness of the heat conductive material.

Abstract: An air-cooling apparatus is provided which includes a securing mechanism for holding two or more separate electronics racks in fixed relation adjacent to each other, and a multi-rack door sized and configured to span the air inlet or air outlet sides of the racks. The securing mechanism holds the electronics racks in fixed relation with their air inlet sides facing a first direction, and air outlet sides facing a second direction. The door includes a door frame with an airflow opening. The airflow opening facilitates the ingress or egress of airflow through the electronics racks, and the door further includes an air-to-liquid heat exchanger supported by the door frame, and disposed so that air flowing through the airflow opening passes across the heat exchanger. In operation, the heat exchanger extracts heat from the air passing through the separate electronics racks.

Abstract: An air-cooling apparatus is provided which includes a securing mechanism for holding two or more separate electronics racks in fixed relation adjacent to each other, and a multi-rack door sized and configured to span the air inlet or air outlet sides of the racks. The securing mechanism holds the electronics racks in fixed relation with their air inlet sides facing a first direction, and air outlet sides facing a second direction. The door includes a door frame with an airflow opening. The airflow opening facilitates the ingress or egress of airflow through the electronics racks, and the door further includes an air-to-liquid heat exchanger supported by the door frame, and disposed so that air flowing through the airflow opening passes across the heat exchanger. In operation, the heat exchanger extracts heat from the air passing through the separate electronics racks.

Abstract: A cooling system and method for cooling electronic components, including IC dies. The cooling system employs a cooling device that includes a composite structure having first and second plates arranged substantially in parallel and bonded together to define a sealed cavity therebetween. The first plate has a surface that defines an outer surface of the composite structure and is adapted for thermal contact with at least one electronic component. A mesh of interwoven strands is disposed within the cavity and lies in a plane substantially parallel to the first and second plates, with the strands bonded to the first and second plates. A fluid is contained and sealed within the cavity of the composite structure, and flows through interstices defined by and between the strands of the mesh.

Abstract: An integrated circuit device is provided. The integrated circuit device includes a die having a first surface and a second surface opposite the first surface. The die has at least one circuit element positioned on its first surface. At least one micro-channel is defined in the second surface of the die. The integrated circuit device includes a cooling substrate attached to the second surface of the die. At least one fluid routing channel is defined in the cooling substrate. The at least one fluid routing channel is connected to the at least one micro-channel defined in the die. Additionally, the cooling substrate has at least one valve positioned within the at least one fluid routing channel. The at least one valve is configured to autonomously regulate a flow rate of a cooling fluid flowing through the at least one fluid routing channel.

Abstract: A tube assembly for use in a heat exchanger is made by arranging a first corrugated fin structure between one broad, flat side of a tube and a side sheet, and arranging a second corrugated fin between another broad and flat side of a tube and another side sheet. Compressive forces are applied to the opposite faces of the side sheets to place crests and troughs of the corrugated fin structures into contact with the side sheets and the broad, flat sides, and the assembly is brazed.

Abstract: An air-cooling apparatus is provided which includes a securing mechanism for holding two or more separate electronics racks in fixed relation adjacent to each other, and a multi-rack door sized and configured to span the air inlet or air outlet sides of the racks. The securing mechanism holds the electronics racks in fixed relation with their air inlet sides facing a first direction, and air outlet sides facing a second direction. The door includes a door frame with an airflow opening. The airflow opening facilitates the ingress or egress of airflow through the electronics racks, and the door further includes an air-to-liquid heat exchanger supported by the door frame, and disposed so that air flowing through the airflow opening passes across the heat exchanger. In operation, the heat exchanger extracts heat from the air passing through the separate electronics racks.