Electrical Systems Patents (Class 310/314)
Temperature compensation circuits (Class 310/315)
Input circuit for simultaneous electrical and mechanical output from piezoelectric element (Class 310/316.01)
Input circuit for mechanical output from piezoelectric element (Class 310/317)
Input circuit for electrical output from piezoelectric element (Class 310/318)
Electrical output circuit (Class 310/319)
  • Ultrasonic bonding apparatus
    Patent number: 4040885
    Abstract: Apparatus for non-destructively monitoring the bonding quality of an ultrasonic bonding system by detecting the amplitude deviation of a vibrating bonding tool between the vibration amplitude thereof in the freely vibrating (no-load) condition and the vibration amplitude during an ultrasonic bonding operation.
    Type: Grant
    Filed: July 9, 1975
    Date of Patent: August 9, 1977
    Assignee: U.S. Philips Corporation
    Inventors: Michael John Hight, Roy Victor Winkle, John Robert Dale