Abstract: Methods of making packaged surface acoustic wave devices are provided. The method may include forming a photosensitive resin coat over a cavity-defining structure encapsulating a surface acoustic wave device. The photosensitive resin coat may be formed using a spin-coating process, and then patterned to form a desired shape. Portions of the photosensitive resin may be removed from areas near the edge of the die, to facilitate separation of a wafer into individual dies. The method may also include forming a conductive structure using a plating process, where the conductive structure is located between the resin coat and the cavity defining structure. The photosensitive resin can include a phenol resin. The packaged surface acoustic wave devices made using a photosensitive resin coat may be relatively thin, and may have a height of less than 220 micrometers.

Abstract: A MEMS device that includes a substrate including an element and a connection wiring electrically connected to the element, and a connection portion electrically connected to the connection wiring. The connection portion is formed of a eutectic alloy of a first metal and a second metal. A line width of the connection wiring is smaller than a width of the connection portion when a main surface of the substrate is viewed in a plan view.

Abstract: A vibrator device includes: a base; a vibrator disposed in the base; and a lid including a substrate having a light transmitting property and a silicon substrate joined to the substrate and a part of the base surrounding the vibrator.

Abstract: A resonator device includes: a base having a first surface and a second surface that are in front-back relation; a resonator element that is located at a first surface with respect to the base and that includes a resonation substrate and an electrode disposed at a surface of the resonation substrate on a base side; a conductive layer that is disposed at the first surface and that includes a joint portion joined to the electrode; and a stress relaxation layer that is interposed between the base and the conductive layer and that at least partially overlaps with the joint portion in a plan view of the base. The stress relaxation layer includes an exposed portion exposed from the conductive layer.

Abstract: A tuning fork-type vibration piece is provided, in which a cushioning portion is formed on the base of a package and allowed to contact parts for contact of arm portions which are any parts but their edges, and the parts for contact of the arm portions that contact the cushioning portion are electrodeless regions, which prevents the risk of frequency fluctuations caused by any electrode being chipped off by contact with the cushioning portion.

Abstract: An acoustic wave device includes an element substrate having piezoelectricity, an interdigital transducer electrode provided on the element substrate, and a mold resin covering the element substrate. When viewed in a cross section, the element substrate includes an interdigital transducer formation region in which the interdigital transducer electrode is provided and a pair of interdigital transducer non-formation regions in which the interdigital transducer electrode is not provided and located on both sides of the interdigital transducer formation region, and a thickness dimension of a center portion, in a width direction, of the interdigital transducer formation region is less than at least one of thickness dimensions of center portions, in the width direction, of the interdigital transducer non-formation regions.

Abstract: A physical quantity sensor includes a physical quantity sensor element including a lid joined to a substrate to define a housing space in the inside and a physical quantity sensor element piece housed in the housing space and a circuit element bonded to the outer surface of the lid via an adhesive material. In the lid, an electrode is provided to extend from an inner wall of a through-hole, which pierces through the lid from the housing space to a surface on the opposite side of the side of the physical quantity sensor element piece and is sealed by a sealing member, to a peripheral edge of the through-hole at the surface on the opposite side. In a sectional view, thickness of a region at the peripheral edge of the electrode is smaller at the opposite side of the side of an opening of the through-hole than the opening side.

Abstract: An acoustic wave device includes an acoustic wave substrate including a first main surface and a second main surface, IDT electrodes provided on the first main surface, and sealing resin covering at least the second main surface of the acoustic wave substrate. A hollow is provided in a region where the IDT electrodes on the first main surface of the acoustic wave substrate is located. The sealing resin has through-holes each extending from a top surface 13B of the sealing resin to the second main surface of the acoustic wave substrate. The acoustic wave substrate is made of silicon or includes a layer made of silicon.

Abstract: An oscillator wafer-level-package structure is provided, comprising a bottom layer, an oscillator crystal and a capping layer. The bottom layer includes an upper plane, the capping layer includes a lower plane, and the oscillator crystal is disposed between the bottom layer and the capping layer and includes at least one cavity. An upper seal ring and a lower seal ring are respectively surrounding the oscillator crystal such that the oscillator crystal is sealed in between the capping layer and the bottom layer by employing the upper and lower seal rings. In addition, a diffusion barrier is further disposed in the upper seal ring and in the lower seal ring for avoiding interface diffusion. Moreover, the present invention adopts the same material for fabricating the capping layer, the oscillator crystal and the bottom layer to achieve an optimal thermal stress result when realizing the packaging structure.

Abstract: A vibrator includes a vibration element having an excitation section which is provided with excitation electrodes, and which excites a thickness shear vibration, and a fixation section electrically coupled to at least one of the excitation electrodes, a vibration attenuator disposed on at least one of principal surfaces of the vibration element, and a support substrate having a coupling electrode which is electrically coupled to the fixation section, and which supports the vibration element, wherein the vibration attenuator is disposed at the fixation section side of the excitation electrodes, and at an outer circumferential edge side of the vibration element from the fixation section in a direction perpendicular to a direction in which the excitation electrodes and the fixation section are arranged side by side.

Abstract: In a crystal resonator plate (2), a support part (24) extends from only one corner part positioned in the +X direction and in the ?Z? direction of a vibrating part (22) to an external frame part (23) in the ?Z? direction. The vibrating part (22) and at least part of the support part (24) form an etching region (Eg) having a thickness thinner than a thickness of the external frame part (23). A stepped part is formed at a boundary of the etching region (Eg), and a first lead-out wiring (223) is formed over the support part (24) to the external frame part (23) so as to overlap with the stepped part. At least part of the stepped part that is superimposed on the first lead-out wiring (223) is formed so as not to be parallel to the X axis in plan view.

Abstract: An electronic component includes a metal cap including a first main-surface having a flat plate-like shape with a first main surface and an annular portion that has an annular shape and that surrounds the first main surface when viewed in a direction perpendicular to the first main surface. The first main-surface and the annular portion forming a recess. A substrate is provided having a flat plate-like shape with a second main surface that hermetically seals the recess, a joining member that joins the cap and the substrate to each other, with an element accommodated in the recess. An outer peripheral surface of the annular portion has a band-shaped region between the first and second main surfaces in the direction perpendicular to the first main surface. A groove is formed in the band-shaped region that extends in a circumferential direction of the annular portion.

Abstract: A resonator that includes a vibrating portion that has a piezoelectric film, and a lower and upper electrodes that face each other with the piezoelectric film interposed therebetween. Moreover, a holding portion is provided at least around a maximum displacement region of the vibrating portion and has an insulating film. A holding arm connects the vibrating portion and the holding portion, and include a conductive portion that is in contact with the insulating film of the holding portion in at least a region that faces the maximum displacement region of the vibrating portion. In addition, the conductive portion is electrically connected to the lower electrode or the upper electrode or is grounded.

Abstract: A display substrate, a method for fabricating the same, and a display device are provided. The display substrate includes: a substrate 100 that includes a first via filled with a first conductive section 4011; a drive thin film transistor that is placed on a first side of the substrate and includes a first terminal 2051; and a light emitting diode chip 300 that is placed on a second side of the substrate distal to the drive thin film transistor; wherein the light emitting diode chip 300 includes a first lead 301 and a second lead 302; the first lead 301 is in electrical contact with the first terminal 2051 through the first conductive section 4011; and the second lead 302 is in electrical contact with a second electrode 402 that is placed on the second side of the substrate.

Abstract: A method is provided for producing a hermetically sealed housing having a semiconductor component. The method comprises introducing a housing having a housing body and a housing cover into a process chamber. The housing cover closes off a cavity of the housing body and is attached in a gas-tight manner to the housing body. At least one opening is formed in the housing. At least one semiconductor component is arranged in the cavity. The method furthermore comprises generating a vacuum in the cavity by evacuating the process chamber, and also generating a predetermined gas atmosphere in the cavity and the process chamber. The method moreover comprises applying sealing material to the at least one opening while the predetermined gas atmosphere prevails in the process chamber.

Abstract: A piezoelectric resonator unit includes a piezoelectric substrate, first and second excitation electrodes, first and second connecting electrodes, and first and second exterior members. The first excitation electrode and first connecting electrode are disposed on a first main surface of the piezoelectric substrate and are electrically connected to each other. Similarly, the second excitation electrode and the second connecting electrode are disposed on a second main surface of the piezoelectric substrate and are electrically connected to each other. First and second exterior members bonded to the substrate with sealing members interposed. The first exterior member includes a first terminal portion formed in a shape that externally exposes at least part of the first connecting electrode. A first outer electrode covers the first terminal portion and the exposed portion of the first connecting electrode protruding from the first exterior member.

Abstract: A quartz crystal resonator unit includes a quartz crystal substrate, first and second excitation electrodes, first and second conductive sealing members, and first and second exterior members. The first excitation electrode is disposed on a first main surface of the substrate with the first conductive sealing member surrounding the first excitation electrode. Similarly, the second excitation electrode is disposed on a second main surface of the substrate with the second conductive sealing surrounding the second excitation electrode. The first and second exterior members are bonded to the quartz crystal substrate with the first and second conductive sealing member respectively interposed therebetween and to cover the first and excitation electrodes, respectively. In a plan view of the first main surface of the substrate, at least part of the first conductive sealing member is located outward of the second conductive sealing member.

Abstract: A tuning fork-type vibration piece is provided, in which a cushioning portion is formed on the base of a package to make contact with abutting portions of arm portions which are any parts but their edges, and the abutting portions of the arm portions allowed to contact the cushioning portion are electrodeless regions including no electrode, which prevents the risk of frequency fluctuations that may occur in case an electrode is chipped off by possible contact with the cushioning portion.

Abstract: A quartz crystal unit that includes a quartz crystal resonator with a quartz crystal blank on which a pair of excitation electrodes are formed, a frame body that surrounds an outer periphery of the blank, and a coupling member that couples the frame body to the blank. Moreover, a package member is joined to an entire periphery of the frame body on at least one side of the excitation electrodes; and an extension electrode is provided that is electrically connected to one of the excitation electrodes. A recess is formed in a junction region of at least one of the frame body and the package member. In the junction region, the extension electrode is disposed in the recess in such a way that the extension electrode has a thickness that does not exceed a depth of the recess.

Abstract: A crystal vibration element that includes a crystal piece that has a prescribed crystal orientation, and a first direction and a second direction in a plan view thereof; and excitation electrodes that are respectively provided on front and rear surfaces of the crystal piece in order to excite a thickness shear vibration in the crystal piece upon application of an alternating electric field. A vibration distribution of the crystal piece has a vibration region that extends in a band-like shape in the second direction of the crystal piece and non-vibration regions that are adjacent to opposed sides of the vibration region in the first direction of the crystal piece.

Abstract: Provided is a semiconductor encapsulation structure, including: a device base (1) and a cover plate (2). The device base is provided with a cavity (11) for accommodating a chip (3). The device base is further provided with a cover-plate sintered layer (12). The cover-plate sintered layer is metallized. The cover plate matches the device base. The cover plate is provided with a base sintered layer (22). The base sintered layer is also metallized. The cover plate is connected to the base by sintering. The cover plate is connected to the base by sintering, so that low-temperature connection is achieved, thereby avoiding damage to the chip and electronic components in the base caused by high connection temperature. Furthermore, encapsulating costs are greatly reduced while ensuring connection reliability.

Abstract: An electronic component includes a piezoelectric substrate, a functional electrode on the piezoelectric substrate, a support layer on the piezoelectric substrate, a cover layer on the support layer, the cover layer, the support layer, and the piezoelectric substrate defining a hollow space that the functional electrode faces, and connection terminals that are electrically connected to the functional electrode, that are each made from a metal particle aggregate, and that each have a porous structure. The connection terminals are each located at a position in which the connection terminals overlap at least a portion of the hollow space in plan view.

Abstract: A vibration device includes a first substrate that includes a first surface and a second surface; a second substrate that includes a third surface and a fourth surface; an intermediate substrate that is disposed between the first substrate and the second substrate and that includes a vibration element, a frame surrounding the vibration element, and a coupler linking the vibration element and the frame; a conductive first joining member that is located between the frame and the first substrate and that joins the frame and the second surface; a conductive second joining member that is located between the frame and the second substrate and that joins the frame and the third surface; an internal electrode disposed on the first substrate; and a first conductive member that is disposed between the first substrate and the intermediate substrate and that electrically couples the vibration element and the internal electrode.

Abstract: A quartz crystal resonator unit including a quartz crystal resonator having a quartz crystal blank, a frame surrounding an outer periphery of the quartz crystal blank, and coupling members connecting the frame to the quartz crystal blank. Moreover, a lid member and a base member are attached to the frame and seal the resonator. One or more outer electrodes is formed over end surfaces of the frame, the lid member, and the base member on a side where the coupling members are coupled. The one or more outer electrodes has a machinery quality factor smaller than that of the frame.

Abstract: A surface acoustic wave device includes a piezoelectric substrate with an IDT electrode that excites a surface acoustic wave provided on a principal surface, a cover layer opposing the principal surface and that covers the IDT electrode, a support provided in a standing manner around the IDT electrode on the one principal surface, and that, with the cover layer separated from the IDT electrode, supports a piezoelectric-substrate-side surface of the cover layer, and a connector that is provided on the piezoelectric-substrate-side surface of the cover layer and that joins the cover layer and the support to each other. At least a portion of a cover-layer-side end portion of the support exists in the connector. A dimension of the connector in a normal direction to the one principal surface is less than a dimension of the support in the normal direction.

Abstract: An apparatus include a device substrate having an upper surface, and a frame layer having an upper surface. The frame layer is disposed over the upper surface of the device substrate, and a first opening exists in the frame layer. The apparatus also includes a seed layer disposed over the device substrate and substantially bounded by the first opening; and a lid layer having an upper surface. The lid layer is disposed over the upper surface of the frame layer. A second opening exists in the lid layer, and the second opening is aligned with the first opening. The apparatus also includes an electrically and thermally conductive pillar disposed in the first opening and the second opening.

Abstract: In a resonator is provided that suppresses a shift of a resonant frequency. The resonator includes a vibration portion that has a base with front and rear ends and multiple vibration arms with fixed ends connected to the front end of the base and that extend away from the front end. Moreover, the resonator includes a frame that at least partially surrounds the vibration portion and one or more holding arms provided between the vibration portion and the frame with first ends connected to the base and the second ends connected to a region of the frame at the front end side relative to the rear end of the base portion.

Abstract: A piezoelectric vibration component that includes a substrate having a principal surface and a side face, a piezoelectric vibrator, a lid, and an adhesive layer that hermetically seals the piezoelectric vibrator in a space between the lid and the principal surface. The adhesive layer extends from the principal surface to at least a portion of the side face of the substrate.

Abstract: A piezoelectric device includes a base, a piezoelectric vibrating piece, and a cover. The base has a depressed portion and a bank portion. The piezoelectric vibrating piece is housed within the depressed portion. The cover is bonded on a top surface of the bank portion of the base with a sealing metal. The top surface of the base has an inclined surface that inclines down toward an inside of the base in a direction along a width direction of the bank portion or an inclined surface that inclines down toward an outside of the base in the direction along the width direction of the bank portion.

Abstract: A resonator may include a first dielectric member, a second dielectric member, and a composite member. The first dielectric member may have a first cavity. The composite member may include a piezoelectric layer and may overlap at least one of the first dielectric member and the second dielectric member. At least one of the second dielectric member and the composite member may have a second cavity. The piezoelectric layer may be positioned between the first cavity and the second cavity. A projection of the first cavity in a direction perpendicular to a flat side of the first dielectric member and a projection of the second cavity in the direction may intersect each other to form a polygon. No two edges of the polygon may be parallel to each other.

Abstract: A resonator device includes first and second resonators and an integrated circuit. The integrated circuit includes first and second oscillation circuits that oscillate first and second resonators, first and second terminals connected to the first oscillation circuit, and third and fourth terminals connected to the second oscillation circuit. The first terminal of the integrated circuit and one electrode of the first resonator are connected to each other via a bump. The third terminal and one electrode of the second resonator are connected to each other via a bump. In a plan view, at least a portion of the first resonator overlaps the first oscillation circuit and at least a portion of the second resonator overlaps the second oscillation circuit.

Abstract: A filter includes a multilayer structure comprising films and forming bulk acoustic wave resonators, a cap accommodating the bulk acoustic wave resonators and bonded to the multilayer structure, a bonding agent disposed in a bonded area between the multilayer structure and the cap and comprising a bonding layer, and a shielding layer disposed on an inner surface of the cap and comprising a same material as at least a portion of the bonding layer.

Abstract: A tunable optical device comprising an optical ring cavity and one or more pairs of electrodes for capacitive actuation of the optical tuning. Applying a potential difference to the electrodes applies a capacitive force to the optical ring cavity which changes the optical resonance frequency. The device can be used as a binary optical switch.

Abstract: The present invention relates to a piezoelectric sensor (1,100) comprising a piezoelectric material (10) interposed between a first (11) and a second (12) electric contact element. The first electric contact element (11) comprises at least two sensing areas (110, 111) spatially separated along a sensing direction. It also describes a sensor node that includes the piezoelectric sensor, a system and a method for monitoring the integrity of a structure using said piezoelectric sensor.

Abstract: A system for protecting a power electronic device is provided. The system includes a power electronic device and a controller. The power electronic device includes a piezoelectric substrate, a metal substrate coupled to the piezoelectric substrate, a semiconductor device, and a bonding layer positioned between the metal substrate and the semiconductor device such that the metal substrate is bonded to the semiconductor device. The controller includes a power supply, one or more processors, and one or more memory modules storing computer readable and executable instructions. The computer readable and executable instructions, when executed by the one or more processors, cause the controller to: receive a temperature of the power electronic device, and provide a voltage determined based on the temperature of the power electronic device across the piezoelectric substrate.

Abstract: An ultrasound sensor includes a substrate in which a space is formed, a diaphragm provided on the substrate so as to block the space, a piezoelectric element which is provided on the diaphragm and includes a first electrode, a piezoelectric layer, and a second electrode, and an acoustic matching layer provided on a periphery of the piezoelectric element or in the space, in which the diaphragm has a bend in which a region corresponding to the space becomes convex (upwardly convex) to the opposite side to the space in a state where a voltage is not applied to the piezoelectric element, and a relaxation time of the polarization of the piezoelectric layer in the piezoelectric element is a repeating transmission period of the ultrasound sensor or less.

Abstract: A high-frequency module includes a branching circuit element, a multilayer substrate, and a shield conductor. The branching circuit element includes transmission and receiving terminals and is disposed on a surface of the multilayer substrate. The shield conductor is disposed on the side of the surface of the multilayer substrate and covers the branching circuit element. The transmission and receiving terminals are disposed with respect to the shield conductor such that a signal in at least a portion of the frequency band of a first signal, which is transmitted from the transmission terminal, is cancelled by a second signal at the receiving terminal.

Abstract: An electronic component housing package includes an insulating substrate having a first principal face and a second principal face opposing the first principal face; external connection conductors provided on the second principal face; and connection conductors provided so as to extend from outer peripheral ends of the external connection conductors to outer peripheral ends of the insulating substrate, respectively. The connection conductors are provided so as to be curved convexly toward a first principal face side over a range from the outer peripheral ends of the external connection conductors to the outer peripheral ends of the insulating substrate in a vertical cross-sectional view of the electronic component housing package and so that a distance from each of the connection conductors to the second principal face is gradually increased in a thickness direction of the insulating substrate. Insulating bodies are provided so as to cover the connection conductors, respectively.

Abstract: In object to provide a unit of piezoelectric element having a preferable bending strength and preferably used as a part of a driving unit, a unit of piezoelectric element comprising: a multilayer piezoelectric element, having internal electrodes laminated having a piezoelectric body layer in-between and a pair of external electrodes formed on side surfaces extending along laminating direction and electrically connected to the internal electrodes, a wiring part connected to the external electrodes via a solder part, wherein a solder is solidified, a resin part, joining one end surface in the laminating direction of the multilayer piezoelectric element and a mounting surface of a connection member placed to face the one end surface, wherein the resin part is continuous from the one end surface and the mounting surface to the solder part; and the resin part covers the solder part, is provided.

Abstract: A crystal resonator includes: a crystal resonator plate; a first sealing member that covers a first excitation electrode of the crystal resonator plate; and a second sealing member that covers a second excitation electrode of the crystal resonator plate and includes a first external electrode terminal and a second external electrode terminal to be bonded to a circuit board using a flowable conductive bonding material. The second sealing member includes a second through hole and a third through hole that pass through between a first main surface and a second main surface on which the first external electrode terminal and the second external electrode terminal are formed. The second through hole and the third through hole include: respective through electrodes for conduction between electrodes formed on the first main surface and the second main surface; and respective through parts.

Abstract: A monolithic haptic-type touch screen capable of performing both touch recognition and haptic feedback are provided. The monolithic haptic-type touch screen includes an insulating film formed by doping ferroelectric material in an electroactive polymer (EAP), an upper electrode formed on an upper surface of the insulating film, and a lower electrode formed on a lower surface of the insulating film and corresponding to the upper electrode.

Abstract: A vibration element includes a crystal blank, a pair of excitation electrodes, and pair of extraction electrodes. The crystal blank is an AT cut crystal blank including a mesa part and an outer circumferential part which is thinner than the mesa part and surrounds the mesa part. The pair of excitation electrodes is provided on the two major surfaces of the mesa part. The pair of extraction electrodes include pad parts which are provided at the end parts of the crystal blank in the longitudinal direction on one major surface of the outer circumferential part and are connected to the pair of excitation electrodes. The length in the longitudinal direction of the crystal blank is less than 1000 ?m. When the resonance frequency is F (MHz) and t=1670/F, the distance “y” (?m) between each of the pad parts and the mesa part satisfies 0.048F+1.18<y/t<0.097F+0.36.

Abstract: An optical ring resonator structure with a backside recess is provided at a device. The device includes: a substrate having a device-side and a backside opposite the device-side; an optical ring resonator located on the device-side of the substrate; a heater having a shape complementary to the optical ring resonator, the heater positioned to heat the optical ring resonator; and one or more metal traces that connect at least to the heater, the metal traces configured to provide power to the heater and extending outward from the heater. The device further includes a recess on the backside of the substrate, the recess centered on the optical ring resonator, and having a diameter larger than both respective outer diameters of the optical ring resonator and the heater, the recess further extending laterally into a region of the one or more metal traces.

Abstract: A moveable micromachined member of a microelectromechanical system (MEMS) device includes an insulating layer disposed between first and second electrically conductive layers. First and second mechanical structures secure the moveable micromachined member to a substrate of the MEMS device and include respective first and second electrical interconnect layers coupled in series, with the first electrically conductive layer of the moveable micromachined member and each other, between first and second electrical terminals to enable conduction of a first joule-heating current from the first electrical terminal to the second electrical terminal through the first electrically conductive layer of the moveable micromachined member.

Abstract: A printed circuit board (PCB) includes a substrate base including at least two chip attach regions spaced apart from one another, a plurality of upper pads disposed in the at least two chip attach regions of the substrate base, an accommodation cavity overlapping a part of each of the at least two chip attach regions and recessed in an upper surface of the substrate base, and at least one spacing groove recessed in the upper surface of the substrate base. The at least one spacing groove is connected to the accommodation cavity, and extends in a region between the at least two chip attach regions.

Abstract: A high quality-factor electromechanical resonator that includes a tapered quartz crystal member having a first tapered portion, a second tapered portion, and an active portion between the first and second tapered portions, the active portion having a first edge portion and a second edge portion extending from the first tapered portion to the second tapered portion, each of the first and second portions being tapered along a longitudinal axis away from the active portion, a first electrode coupled to the first edge portion of the active portion and configured to apply a first voltage to the active portion, and a second electrode coupled to the second edge portion of the active portion and configured to apply a second voltage to the active portion, wherein the first and second electrodes are spaced apart along a lateral axis.

Abstract: An acoustic wave device includes a substrate comprising one surface on which an acoustic wave generator and at least one ground pad are included; a support component formed of an insulating material and disposed on the substrate along a circumference of the acoustic wave generator; and a shielding member electrically connected to the ground pad and blocking reception or emission of electromagnetic waves at the acoustic wave generator.

Abstract: A resonator device includes a substrate, a resonator element including a base member having first and second surface, and a pair of excitation electrodes, and first and second bonding member. Defining center of the first and second bonding member as a first and second bonding center, a center of a resonating region as a resonating region center, and defining a distance between the first bonding center and the second bonding center as L1, a length of a perpendicular drawn from the resonating region center to an imaginary line connecting the first bonding center and the second bonding center to each other as L2, a linear expansion coefficient of the first metal layer, the second metal layer, and the base member as ?1, ?2, ?3 respectively, and a length of the resonator element as L3, 0<L1/L2?0.97, |(?2??1)/?1|?0.35, |(?3??1)/?1|?0.35, and L3?1.5 mm are satisfied.

Abstract: A method and apparatus for distributing power in an integrated circuit (IC) is disclosed. The IC includes at least one electrically conductive bump coupled to a true voltage node. Power may be distributed to the IC from an external power source coupled to the bump. The integrated circuit further includes a virtual voltage node. A power switch may be implemented, with the power switch being located directly beneath the bump. A first vertical connector may couple one portion of the power switch to the bump, while a second vertical conductor may couple another portion of the switch to the virtual voltage node.

Abstract: A vibration device which is possible to secure the fixing of a vibrating element and to reduce deterioration in characteristics of the vibrating element includes a substrate, a plurality of elastic members each of which includes a connection portion connected to a first surface of the substrate, and a support portion extending from the connection portion to a position separated from the connection portion, and a vibrating element that is supported at the support portion, in which the vibrating element is supported by the plurality of elastic members via three or more support portions.