Abstract: A piezoelectric device includes: a piezoelectric vibrating reed; and a package, wherein the piezoelectric vibrating reed has a vibrating part and first and second supporting arms extending from a base end part, the package has a base, a lid, a cavity defined by the base and the lid, a convex part projecting from the base or the lid into the cavity, a length of the first supporting arm is shorter than a length of the second supporting arm, and the convex part is provided in a range ahead of a leading end of the first vibrating arm in an extension direction of the first supporting arm and at least partially overlapping with the second supporting arm in a length direction of the piezoelectric vibrating reed so as not to overlap with the piezoelectric vibrating reed in a plan view.

Abstract: A piezoelectric oscillator includes: a package including a floor surface and a step portion thereinside; a conductive adhesive applied on the step portion; and a piezoelectric vibrator including one end placed on the step portion via the conductive adhesive. The floor surface is provided with a recess filled with a resin material having a thermal deformation property. The package includes a sidewall having transparency.

Abstract: An exemplary piezoelectric device has a piezoelectric vibrating board including a portion that exhibits thickness-shear vibration, and a frame portion extending around and supporting the vibrating portion. A first cover board, bonded to the first main surface of the frame portion, has a first excitation electrode. A second cover board, bonded to the second main surface of the frame portion, has a second excitation electrode. Thus, the vibrating portion is sealed in a package formed by the frame portion and cover boards. A first convexity, defined either on the bonded main surface of the first cover board or on the first main surface of the frame portion, surrounds the excitation electrode and establishes a predetermined gap between the vibrating portion and excitation electrode. The first cover board and frame portion are bonded by adhesive applied, adjacent the first convexity but not on the first convexity, continuously around the vibrating portion.

Abstract: A piezoelectric assembly is described. In accordance with one embodiment, there is provided a piezoelectric assembly comprising: an electrode assembly; a signal electrical connector electrically connected to the electrode assembly; a reference electrical connector electrically connected to the electrode assembly; and a spacer positioned about a perimeter of the electrode assembly and disposed between the signal electrical connector and the reference electrical connector such that no electrical communication is provided between the signal electrical connector and the reference electrical connector through the spacer; wherein a humidity barrier space is defined between the signal electrical connector, the reference electrical connector and the spacer, and wherein the electrode assembly is disposed in the humidity barrier space.

Abstract: To provide a piezoelectric device prevented from overflowing of sealing materials. The piezoelectric device (100) stores a piezoelectric vibrating piece (30) having a pair of excitation electrodes. The piezoelectric device comprises: a package lid (10), including a first bonding surface (M1) formed in periphery of the package lid in a circumferential pattern and a lid recess (10); a package base (30), including a second bonding surface (M2), a base recess surrounded by a second bonding surface that is higher than the second bonding surface, and a pair of seats that is protruding from the base recess, situated for mounting the piezoelectric piece; a piezoelectric piece mounted onto the pair of seats; and a non electric conductive sealing material (48) disposed peripherally in relative to the first bonding surface and the second bonding surface in a circumferential pattern, thus the adhesive bonding the first bonding surface and the second bonding surface.

Abstract: Providing a glass assembly cutting method capable of improving yield by cutting a glass assembly into a predetermined size, providing a package manufacturing method, a package and a piezoelectric vibrator manufactured by the manufacturing method, and an oscillator, an electronic device, and a radio-controlled timepiece. Providing a wafer assembly cutting method of cutting a wafer assembly 60 along a scribe line M?, the method including: a scribing step of irradiating a laser beam having an absorption wavelength of the wafer assembly 60 along the contour line to form the scribe line M? on a lid board wafer 50; and a breaking step of applying a breaking stress along the scribe line M? using a cutting blade to cut the wafer assembly along the scribe line M?, wherein the scribing step involves forming the scribe line M? so that the ratio of a depth dimension D of the scribe line M? to a width dimension W thereof is 0.8 or larger and 6.0 or smaller.

Abstract: In a piezoelectric resonator plate, a substrate having a main face formed in a rectangular shape is provided with a vibration portion and a joining portion that are integrated with each other, the vibration portion including a vibration region configured by forming a pair of excitation electrodes, and the joining portion having formed therein a pair of terminal electrodes that is joined to an external portion. The terminal electrodes in the pair each have a conductive bump formed therein and are electrically connected respectively to the excitation electrodes in the pair. Also, the substrate includes a post portion formed convexly at a position where the pair of terminal electrodes is formed.

Abstract: A piezoelectric device employs solder on a roughened surface to improve bonding of electrical contacts with the device package. The device package includes a base, a crystal frame and a lid. The base includes connecting electrodes on a side of the base adjacent the crystal frame. The base has a through hole and a through hole electrode formed in the through hole in electrical contact with the connecting electrodes. The through hole is sealed with a sealing material and a first external electrode layer, which is electrically connected to the through hole electrode, is formed on an outside surface of the base opposite the piezoelectric plate. A second external electrode layer is formed to cover the first external electrode layer and the sealing material.

Abstract: A microelectromechanical resonator includes a resonator body, which is encapsulated within a sealed cavity extending between first and second substrates that are bonded together. The resonator body is anchored to the first substrate by at least a pair of tethers that suspend the resonator body opposite an underlying recess in the first substrate. A resistive heating element is provided, which is configured to indirectly heat the resonator body through convective heating of the cavity. This resistive heating element may be disposed on an inner surface of the second substrate that is exposed to the cavity. The resonator may also include first and second electrical interconnects, which extend through the second substrate and contact respective first and second portions of the resistive heating element.

Abstract: A piezoelectric vibrating piece includes a vibrator, a framing portion, and a connecting portion. The vibrator vibrates at a predetermined vibration frequency. The vibrator includes excitation electrodes on both principal surfaces. The vibrator is formed at a predetermined thickness. The framing portion surrounds a peripheral area of the vibrator. The connecting portion connects the vibrator and the framing portion. The vibrator has a side surface. At least a part of the side surface is formed into a taper shape such that a thickness of the vibrator becomes thin as close to an outer periphery of the vibrator. The piezoelectric vibrating piece further includes an extraction electrode extracted from each of the excitation electrodes to the framing portion via the connecting portions. One of the extraction electrodes is extracted from one principal surface to another principal surface via a taper-shaped side surface of the vibrator.

Abstract: A method of manufacturing a piezoelectric vibrator according to the invention is a method of manufacturing a piezoelectric vibrator in which a piezoelectric vibrating reed is sealed in a cavity formed between a base substrate and a lid substrate bonded to each other, the method including the steps of: inserting a core portion of a conductive rivet member, which includes a planar head portion and the core portion extending in a direction vertically to the surface of the head portion, into a penetration hole of the base substrate and bringing the head portion of the rivet member into contact with a first surface of the base substrate; attaching a laminate material having elastic properties to the first surface of the base substrate so as to cover the head portion; applying a paste-like glass frit on a second surface of the base substrate and filling the glass frit in the penetration hole; and baking and curing the glass frit.

Abstract: To provide a piezoelectric resonator that suppresses spread of a conductive adhesive and is low in cost and a method of manufacturing a piezoelectric resonator. At positions, of a base 3, corresponding to electrode terminals on a crystal resonating piece 10, projection portions 41, 42 are formed by etching the base 3, and a metal film is formed on front surfaces of the above projection portions 41, 42, and the above metal films and the electrode terminals on the above-described crystal resonating piece 10 are electrically connected with a conductive adhesive 34. The conductive adhesives 34 rise on side surfaces of the above-described projection portions 41, 42 due to surface tension to bring the conductive adhesives 34 into a state where they do not easily flow outward, so that it is possible to suppress spread of the conductive adhesives 34.

Abstract: A piezoelectric vibrating piece includes a rectangular vibrator, a framing portion, a connecting portion, and a protrusion. The rectangular vibrator vibrates at a predetermined vibration frequency. The framing portion surrounds a peripheral area of the vibrator. The framing portion includes an inner side surface facing the vibrator. The connecting portion connects the vibrator and the framing portion. The protrusion protrudes to the vibrator side. The protrusion is formed on at least one of the inner side surface facing a side of the vibrator where the connecting portion is connected and the inner side surface adjacent to the connecting portion.

Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Abstract: A piezoelectric device includes: a base having a top surface, and first and second marginal ends; first and second supporting stands protruding from the top surface of the base; an adhesive applied to and filled between the first and second supporting stands; and a piezoelectric resonator including a mounting part having outer and inner sections respectively bonded to the first and second supporting stands, and a middle section bonded to the adhesive, and a resonant arm extending from the inner section toward the second marginal end in a cantilever fashion.

Abstract: There are provided a piezoelectric resonator and an electrode structure thereof. The piezoelectric resonator includes: a piezoelectric body oscillated according to an electrical signal; and first and second electrodes each including first and second electrode layers stacked on respective both surfaces of the piezoelectric body, wherein the first electrode layer includes one or more selected from the group consisting of chromium (Cr), nickel (Ni), titanium (Ti), and an alloy including any one thereof, the ratio of the thickness of the first electrode layer to the thickness of the first or second electrode is 3% to 30%; and the second electrode layer includes copper (Cu) or an alloy including copper (Cu), and the ratio of the thickness of the second electrode layer to the thickness of the first or second electrode is 70% to 97%.

Abstract: An object of the invention is to provide a surface mount oscillator that can suppress a change with the lapse of time in frequency characteristics. A surface mount type crystal unit 1 includes: a framed crystal plate 2 in which an oscillating part 6 having a first excitation electrode 5a and a second excitation electrode 5b on opposite principal surfaces thereof is surrounded by a frame 7, and the oscillating part 6 and the frame 7 are connected by connecting parts 8a and 8b; a base 3; and a cover 4. The surface mount type crystal unit 1 has such a configuration that a first metal film 17 is formed in one area of two areas formed by dividing the principal surface of the frame 7 facing the base 3 at two positions around a circumferential direction of the frame 7, and a second metal film 18 is formed in the other area. The first metal film 17 is electrically connected to the first excitation electrode 5a, and the second metal film 18 is electrically connected to the second excitation electrode 5b.

Abstract: A surface mount piezoelectric device includes a piezoelectric vibrating piece, a base plate, and a lid plate. The piezoelectric vibrating piece includes a vibrating portion. The base plate has one principal surface that includes a pair of mounting terminals and another principal surface where the piezoelectric vibrating piece is placed. The mounting terminals include a metal film formed by sputtering or vacuum evaporation and electroless plating film formed on a surface of the metal film. The lid plate has one principal surface that includes a metal film and an electroless plating film formed on a surface of the metal film by electroless plating and another principal surface seals the vibrating portion. The electroless plating film formed on the one principal surface of the base plate and the electroless plating film formed on the one principal surface of the lid plate have mutually a same shape and a same area.

Abstract: An acoustic wave element includes a piezoelectric substrate, an IDT electrode, a sidewall, a lid, and an adhesive layer. The IDT electrode is provided on the piezoelectric substrate. The sidewall is provided around the IDT electrode above the piezoelectric substrate. The lid is provided above the sidewall so as to cover a space above the IDT electrode. The adhesive layer is made of an adhesive provided between the lid and the sidewall. The top surface of the sidewall has a groove. The groove is filled with an adhesive, which reduces the protrusion amount of the adhesive.

Abstract: The present invention is a metal paste for sealing comprising a metal powder and an organic solvent characterized in that the metal powder is one or more kinds of metal powders selected from a gold powder, a silver powder, a platinum powder and a palladium powder which has a purity of 99.9% by weight or more and an average particle size of 0.1 ?m to 1.0 ?m and that the metal powder is contained in a ratio of 85 to 93% by weight and the organic solvent is contained in a ratio of 5 to 15% by weight. As a sealing method using this metal paste, there is a method of applying and drying a metal paste, sintering it at 80 to 300° C. to form a metal powder sintered body and after that pressurizing the base member and the cap member while heating the metal powder sintered body.

Abstract: Provided is a surface mount crystal oscillator and a substrate sheet to prevent a decrease in a frequency variable amount by reducing electrostatic capacitance of the crystal oscillator. The surface mount crystal oscillator and the substrate sheet are each configured such that one end of a crystal holding terminal is connected to a corner terminal, and another end of the crystal holding terminal is formed from a center of a short side to be shorter than the one end so as to form an area in which no pattern is formed, and a pattern of a GND terminal is formed on that portion of a rear surface of a substrate which is opposed to the area in which no pattern is formed, so that the pattern (a crystal-mounted pattern) of the crystal holding terminal and the pattern of the GND terminal are not opposed to each other across the substrate.

Abstract: An acoustic wave device according to one embodiment of the present invention has a base with a vibrating body, a sealing member which is joined to the base in a frame-shaped region surrounding the vibrating body and faces the vibrating body with a space therebetween, and an intermediate layer between the frame-shaped region of the sealing member and the base. The frame-shaped region has a recess and at least a portion of the intermediate layer is located inside the recess.

Abstract: To provide a vibration actuator, a lens barrel, a camera, a manufacturing method for a vibration body and a manufacturing method for a vibration actuator, which have a high driving efficiency and can lead to easy manufacture. A vibration actuator of the present invention is provided with an elastic body and an electromechanical transducer element sintered onto the elastic body in the state that the element is divided into a plurality of areas by a groove-shaped border portion.

Abstract: A piezoelectric vibrator includes a tuning fork type piezoelectric vibrating reed including a pair of vibration arm portions; a package that accommodates the piezoelectric vibrating reed; and a getter material that is formed along the longitudinal direction of the vibration arm portion in an inner portion of the package, wherein a cross-sectional area of a middle portion of the getter material adjacent to a center portion of the longitudinal direction of the vibration arm portion is greater than that of an end portion of the getter material.

Abstract: Methods are provided for manufacturing piezoelectric vibrating devices that do not contain any unwanted gas or water vapor inside the devices. In an exemplary method, a base wafer is prepared including multiple package bases each having a first main surface and a second main surface. The base wafer also includes a pair of through-holes disposed between adjacent package bases of the base wafer. A piezoelectric vibrating piece is placed on each package base. A lid wafer is prepared that includes multiple package lids. A sealing material is applied to the base wafer or lid wafer in peripheral bands used for bonding the bases and lids together and defines respective interior cavities. The band of sealing material includes a communicating groove that communicates from the inner cavity to the first through-hole. The base wafer and lid wafer are subject to heat and compression to effect bonding.

Abstract: A nano/micro electro-mechanical relay, comprising an at least one normally open (NO) nano/micro relay switch and an at least one normally closed (NC) nano/micro relay switch. Both the NC nano/micro relay switch and the NO nano/micro relay switch can be switched between their respective normal relay switch positions and their respective actuated relay switch positions. An at least one nano/micro actuator including an at least one piezoelectric stack layer being attached to an at least one elastic layer, wherein the at least one piezoelectric stack layer contracts to deflect the at least one elastic layer, and thereby actuate the at least one nano/micro contact bar to simultaneously switch the NC nano/micro relay switch and the NO nano/micro relay switch between their respective normal relay switch position and their respective actuated relay switch positions.

Abstract: There are provided a piezoelectric vibrator capable of suppressing vibration leakage while securing mounting strength of a piezoelectric vibrating reed and an oscillator, an electronic apparatus, and a radio-controlled timepiece each using the piezoelectric vibrator. The piezoelectric vibrator includes: a package that accommodates a piezoelectric vibrating reed; and a bump that mounts the base portion of the piezoelectric vibrating reed on a package. The bump includes a plurality of main bumps which is arranged in a line in the width direction of the base portion so as to be bonded to the base portion; and an auxiliary bump which is bonded to the base portion in an area between the main bumps disposed at both ends in the width direction of the base portion and an area between the main bumps and base ends of the vibrating arms in the longitudinal direction of the base portion.

Abstract: Quartz-crystal devices are disclosed, of which the CI value is reduced by adjusting the shortest distance between an edge of electrically conductive adhesive and an edge of the excitation electrode. The device has a quartz-crystal plate having long-edges and short-edges. Excitation electrodes are on first and second surfaces of the plate. Conductive pads are electrically connected to respective excitation electrodes and extend to the short-edge of the quartz-crystal plate. A package having a pair of external mounting terminals and respective connecting electrodes are situated on opposing sides of the mounting terminals for making electrical connections to the mounting terminals. An electrically conductive adhesive bonds the connecting terminals and respective conductive pads together, and the quartz-crystal plate onto the package. The shortest distance between an edge of the adhesive and an edge of the excitation electrode is 10%-15% the length of the quartz-crystal plate in the long-edge direction.

Abstract: A piezoelectric device includes a piezoelectric vibrating piece, a base plate, and a lid plate. The base plate includes one principal surface where the piezoelectric vibrating piece is placed and includes a connecting electrode electrically connected to the extraction electrode, and another principal surface including a mounting terminal. The lid plate seals the vibrator. The lid plate seals the vibrator. At least a part of the mounting terminal includes a first metal film, a second metal film, and an electroless plating film. The second metal film is formed to cover the first metal film or is formed at a part of a surface of the first metal film. The second metal film has a different area from the first metal film. The electroless plating film is formed at least on a surface of the second metal film by electroless plating.

Abstract: Piezoelectric devices are disclosed that are mountable on the surface of a printed circuit board or the like. An exemplary device comprises a piezoelectric vibrating piece enclosed and sealed within a package including at least a cover and a base-substrate formed of glass or piezoelectric material. The package includes frame-shaped metallic films formed in peripheral regions of inner main surfaces of the cover and/or the base substrate. The frame-shaped metallic films are used for sealing the package using a eutectic material (e.g., solder). At least one mounting terminal is provided on the outer (bottom) main surface of the base-substrate. At least one of the frame-shaped metallic films and mounting terminals includes a chromium foundation layer formed on the surface of the glass or piezoelectric material, a middle layer of NiW alloy formed on the surface of the chromium layer, and a gold layer formed on the surface of the middle layer.

Abstract: A protective assembly that is adapted to provide temperature isolation for an electronic device is disclosed. The assembly includes a housing having a cavity with a top surface and at least one side surface. The housing is configured to accept an electronic device having a top and a bottom in the cavity with the top of the electronic device proximate to the top surface of the cavity. The housing is further configured to maintain a vacuum within the cavity. The assembly includes at least one support disposed within the cavity. The at least one support is configured to contact the housing only at a first point proximate to the top surface of the cavity and contact the electronic device only at a second point that is proximate to the bottom of the electronic device.

Abstract: A crystal device and an inspection method for inspecting the crystal device are provided. The crystal device includes: a crystal plate; excitation electrodes formed on the crystal plate; extraction electrodes extending from the excitation electrodes; electrode pads electrically connected with the extraction electrodes; a package including mounting terminals formed on a mounting surface and connection terminals formed on a bottom surface, which is on the other side of the mounting surface, and electrically connected with the mounting terminals; and an electrically-conductive adhesive agent bonding and fixing the connection terminals to the electrode pads. An bonding status inspection region, on which no metal film is formed, is formed in the crystal plate, and the bonding status inspection region is surrounded by or adjacent to the electrode pads. In addition, the bonding status inspection region occupies not more than 25% of the area of the electrode pads.

Abstract: A surface mount type piezoelectric device includes a piezoelectric vibrating piece, a base plate in a rectangular shape, and a lid plate. The piezoelectric vibrating piece includes a vibrator vibrating at a predetermined vibration frequency. The base plate has one principal surface where the piezoelectric vibrating piece being to be placed. The lid plate seals the vibrator. The other principal surface of the base plate includes a pair of mounting terminals to mount the piezoelectric device. The pair of mounting terminals includes a metal film and an electroless plating film. The electroless plating film is formed on a surface of the metal film. The mounting terminal includes a trace from which a part of the electroless plating film is removed by laser or dicing.

Abstract: An electronic component package is provided with a base on which an electronic component element is mounted and a lid that includes a conductive member and that is bonded to the base with a sealing member so as to hermetically seal the electronic component element. The base includes a bottom portion and a wall portion that extends from the bottom portion. A cavity in which the electronic component element is mounted is formed on a first main surface of the base by the bottom portion and the wall portion. The base also includes electrode pads electrically connected to electrodes of the electronic component element, external terminals electrically connected to outside and line patterns electrically connected to the electrode pads and the external terminals. The external terminals include a GND terminal for grounding.

Abstract: A package structure realizing a size and/or thickness reduction and suitable for packaging a surface acoustic wave element is provided. The package structure for solving the above challenge includes a base having a thick floor on which to place a surface acoustic wave element and a thin floor on which to place an electronic component, the surface acoustic wave element and the electronic component being mounted close to each other on the plane coordinate system. In addition, in the package structure described above, the difference in height between the thin floor and the thick floor is the same as, or larger than, the thickness of the electronic component mounted on the thin floor.

Abstract: A manufacturing method of common mode filters and a structure of the same are revealed. A common mode choke layer is disposed over a composite substrate and a second magnetic material layer is coated on an upper surface of the common mode choke layer. The common mode choke layer is produced by a wafer-level electrode leading out method and having leading-out terminals on sides thereof. External electrodes are formed on sides of the common mode choke layer by partial cutting, sputtering, lithography and electroplating at wafer level and corresponding to the leading-out terminals. Thereby common mode filters produced are supported more stably. Moreover, the volume is minimized due to inductive coils and external electrodes connected by wafer level packaging. Thus the common mode filters are mass-produced, the cost is down and the defect rate is reduced.

Abstract: A vibration device according to an embodiment of the present invention includes a base, a lid body bonded to the base to form a cavity and a vibrating reed housed in the cavity. The vibrating reed includes a main body and an extended portion extending in a short side direction of the main body, and in the vibrating reed, the extended portion is supported by a first connection portion arranged on the base and the main body is supported by a second connection portion in a cantilever manner. Accordingly, when ambient temperature changes and a stress is applied between the first and second connection portions, the stress is alleviated by the extended portion.

Abstract: A crystal resonator element include a pair of resonating arms extending from a base, the resonating arms includes a groove, a slope portion is formed in a connection portion of the resonating arms to the base so that a distance between the groove and the outer edge of each of the resonating arms increases as it approaches the base from the resonating arms, and a non-electrode region which extends over a range of areas from a connection portion connected to a first side surface formed along the longitudinal direction of the groove and a connection portion connected to a second side surface facing the first side surface with a bottom portion disposed there between and in which excitation electrodes are not formed is provided in the groove in at least a part of the bottom portion positioned in the slope portion.

Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Abstract: In a linear driving device 7, in which a driving shaft 21 vibrates in an axial direction by a vibration member 17, as a result of which a movable body 3 that is frictionally contact with the driving shaft 21 slides along the axial direction of the driving shaft 21, the vibration member 17 includes a piezoelectric element 23 and a vibrator 19 made of a metal plate having elasticity; the vibrator 19 is fixed to the piezoelectric element 23 by superimposing plate faces thereof; the driving shaft 21 has a trunk 25 along which the movable body 3 slides, and an end portion 26 to be fixed to the vibrator 19; a base surface 24 of the end portion 26 abuts with and is fixed to the vibrator 19; and an area of the base surface 24 is smaller than a cross sectional area of the trunk 25.

Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Abstract: A dual mode vibrator is disclosed. There are available two vibrating units to enable obtainment of a variety of vibrations. Each lateral portion of the first and second vibrating units respectively supported by the first and second elastic members is supported by the first and second support bars secured at the housing for rotatable installation. Therefore, although the first and second vibrating units may rotate about the first and second support bars, the first and second vibrating units are not allowed to deviated or disengaged from the first and second support bars, whereby the plastic deformation of the first and second elastic members is prevented, and the first and second vibrating units can be positioned at predetermined positions at all times to enhance reliability of product.

Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Abstract: Surface-mounted piezoelectric devices are disclosed, of which an exemplary device includes a tuning-fork type piezoelectric vibrating piece having a base portion and a pair of vibrating arms extending from the base portion. The device includes a package defined by a wall. The package includes a cavity accommodating the tuning-fork type piezoelectric vibrating piece and at least one columnar body situated between the vibrating arms in the cavity.

Abstract: A method of manufacturing packages includes a welding step for welding a base substrate wafer to a rivet member by heating the base substrate wafer while pressing the same by a forming die from both sides in the thickness direction is provided, wherein a rivet member receiving portion which can receive a distal end of a core member is formed in a receiving die of the forming die, and an inner surface of the rivet member receiving portion is formed into a tapered shape widening from the bottom side toward the opening side.

Abstract: An oven controlled crystal oscillator includes a thermostatic bath, an inner circuit board, an outer circuit board, a heating element, and a temperature sensor. The inner circuit board comprising a crystal oscillation circuit is positioned inside the thermostatic bath and electrically connected with the outer circuit board via a pin. The outer circuit board has a temperature control circuit and a power supply circuit. The heating element and the temperature sensor electrically connect with the outer circuit board. A through slot is formed through the outer circuit board, and the thermostatic bath is inserted into the through slot. By inserting the thermostatic bath into the through slot of the outer circuit board, the height and the weight of the oven controlled crystal oscillator are reduced, the electric connection performance is enhanced, and thus the stability of the output frequency of the oven controlled crystal oscillator is improved.

Abstract: Provide a highly efficient manufacturing method of a piezoelectric vibrator and to provide a piezoelectric vibrator manufactured by this manufacturing method.

Abstract: Provided is a highly reliable acoustic wave device wherein deterioration of electrical characteristics due to deformation of a protective cover is suppressed. A method for manufacturing such acoustic wave device is also provided. The acoustic wave device has a piezoelectric substrate 1 propagating an acoustic wave; an excitation electrode arranged on a first main surface of the piezoelectric substrate 1; a columnar outside connection-use electrode 10 electrically connected to the excitation electrode; a protective cover 17 having a hollow accommodating space 8 in which the excitation electrode is accommodated on the first main surface; and a conductive layer 18 connected to the electrode 10 on the protective cover 17.

Abstract: A method for fabricating electrostatic transducers and arrays electrically separates the substrate segments of the transducer elements from each other using a technique involving two cutting steps, in which the first step forms a patterned opening in the substrate to make a partial separation of substrate segments, and the second step completes the separation after the substrate segments have been secured to prevent instability of the substrate segments upon completion of the second step. The securing of the substrate segments may be accomplished by filling a nonconductive material in the partial separation or securing the transducer array on a support substrate. When the substrate is conductive, the separated substrate segments serve as separate bottom electrodes that can be individually addressed. The method is especially useful for fabricating ID transducer arrays.

Abstract: In an exemplary method a piezoelectric wafer is prepared on which multiple piezoelectric frames are formed. Each frame has a piezoelectric vibrating piece including excitation electrodes, and a frame portion surrounds the vibrating piece. A lid wafer is prepared on which multiple respective lids are formed, each sized substantially similarly to the respective frames. A base wafer is prepared on which multiple of bases are formed, each sized substantially similarly to the respective frames. Each base has through-holes. Stripes of a first bonding film are formed on both major surfaces of the piezoelectric wafer around the periphery of each frame. Stripes of a second bonding film are formed on the inner major surface of the lid wafer, corresponding to respective stripes of the first bonding film. Stripes of a third bonding film are formed on the inner major surface of the base wafer, corresponding to respective stripes of the first bonding film.