Abstract: A piezoelectric vibrating piece having a first and a second surface at an opposing side of the first surface is comprised of an piezoelectric piece having designated coefficient of thermal expansion; a first electrode film having bigger coefficient of thermal expansion than the designated coefficient of thermal expansion and formed on the first surface; and a second electrode film having smaller coefficient of thermal expansion than the designated coefficient of thermal expansion and formed on the second surface.

Abstract: A piezoelectric planar composite apparatus to provide health monitoring of a structure and associated methods are provided. The piezoelectric planar composite apparatus includes a piezoelectric electric material layer, multiple electrodes positioned in electrical contact with the piezoelectric material layer, and multiple sets of electrode interconnect conductors each positioned in electrical contact with a different subset of the of the electrodes and positioned to form multiple complementary electrode patterns. Each of the complementary electrode patterns is positioned to form an electric field having an electric field axis oriented along a different physical axis from that of an electric field formed by at least one other of the complementary electrode patterns. The interconnect conductors can be distributed over several electrode interconnect conductor carrying layers to enhance formation of the different complementary electrode patterns.

Abstract: A piezoelectric actuator module having a piezoelectric actuator, fastened between an actuator head and an actuator foot, and having a sheath, surrounding the piezoelectric actuator, for electrical passivation, is proposed in which the sheath is an insulation guard layer that is joined by nonpositive and/or positive engagement, by means of a mechanical attachment, to attachment components in the region of the end faces of the piezoelectric actuator or of the actuator head and/or of the actuator foot.

Abstract: A surface mount type crystal oscillator includes: a container body composed of a laminated ceramic including a plate-shaped center layer, and first and second frame layers stacked on opposite surfaces of the center layer respectively; a crystal blank hermetically sealed in a first recess formed by the first frame layer and the center layer; an IC chip accommodated in a second recess formed by the second frame layer and the center layer; and a test terminal provided on the outer side surface of the container body and used to test the crystal blank. The center layer has at least a first layer and a second layers, and the test terminal is electrically connected to a crystal retaining terminal provided on the bottom surface of the first recess in order to retain the crystal blank through a conductive path provided on an interface between the first and second layers.

Abstract: The invention concerns an actuator that includes an active piston, an inner sliding cylinder and an outer cylinder in which the said sliding cylinder is pre-stressed, where one of the cylinders is in a material with a negative thermal expansion coefficient or one that is close to zero, with the other cylinder having a positive thermal expansion coefficient, in which the material of the cylinder with negative expansion coefficient or one close to zero is one of the following materials: ?-ZrMo2O8 in cubic structure, Zr2W P2O12, a silicious faujasite, Lu2 (WO4)3, ZrW2O8 in cubic phase, with nanograins whose size is approximately between 10 nm and 75 nm, or any possible combination of these materials.

Abstract: A piezoelectric thin-film resonator includes a supporting substrate. A piezoelectric thin-film is formed on the supporting substrate. A lower electrode and an upper electrode are formed with the piezoelectric thin-film therebetween. The stiffness of at least one of the lower and upper electrodes is higher than that of the piezoelectric thin-film.

Abstract: Various micro-transducers incorporating piezoelectric materials for converting energy in one form to useful energy in another form are disclosed. In one embodiment, a piezoelectric micro-transducer can be operated either as a micro-heat engine, converting thermal energy into electrical energy, or as a micro-heat pump, consuming electrical energy to transfer thermal energy from a low-temperature heat source to a high-temperature heat sink. In another embodiment, a piezoelectric micro-transducer is used to convert the kinetic energy of an oscillating or vibrating body on which the micro-transducer is placed into useful electrical energy. A piezoelectric micro-transducer also is used to extract work from a pressurized stream of fluid. Also disclosed are a micro-internal combustion engine and a micro-heat engine based on the Rankine cycle in which a single fluid serves as a working fluid and a fuel.

Abstract: In a manufacturing method for a SAW apparatus a first insulating layer is formed on the entire surface of a piezoelectric LiTaO3 substrate. By using a resist pattern used for forming an IDT electrode, the first insulating layer in which the IDT electrode is to be formed is removed. An electrode film made of a metal having a density higher than Al or an alloy primarily including such a metal is disposed in the area in which the first insulating layer is removed so as to form the IDT electrode. The resist pattern remaining on the first insulating layer is removed. A second insulating layer is formed to cover the first insulating layer and the IDT electrode.

Abstract: A hermetic package for electronic components which is made of metallic silicon is disclosed. The package includes a plurality of silicon elements which are bonded together. A metallic layer of platinum or gold is bonded to an internal surface of the hermetically sealed enclosure. While either metallic layer may serve as a heating element by subjecting the electronic circuit connected thereto with a large current, the platinum layer can also be used as a thermal sensor by passing a lower current there through. An internal heater is included to stabilize the performance of the electronic components.

Abstract: The specification discloses embodiments of an apparatus comprising a film bulk acoustic resonator (FBAR) filter comprising a piezoelectric membrane having a portion thereof sandwiched between a first electrode and a second electrode, the piezoelectric membrane being suspended from at least two edges thereof, and a heat transfer layer placed on the piezoelectric membrane surrounding, but not in contact with, the first electrode. Also disclosed are embodiments of a process comprising sandwiching a portion of the piezoelectric membrane between a first electrode and a second electrode, suspending a piezoelectric membrane from at least two edges thereof, and placing a heat transfer layer on the piezoelectric membrane surrounding, but not in contact with, the first electrode. Other embodiments are disclosed and claimed.

Abstract: A crystal unit comprises an AT-cut crystal blank, and an excitation electrode formed on each of opposing main surfaces of the crystal blank in an oscillation region of the crystal blank. The ratio b/a is 0.014 or less, and preferably 0.012 or less where a represents the thickness of the crystal blank in the oscillation region and b represents the thickness of the excitation electrode. The thickness a is typically 5 ?m or less.

Abstract: A piezoelectric blade protection structure for a plurality of juxtaposed piezoelectric blades mounting onto a circuit board to provide protection and anchoring effect for the piezoelectric blades. A protection member is mounted onto the vibration nodes of the piezoelectric blades to prevent the piezoelectric blades from broken by improper impact of external forces. The protection member, piezoelectric blades and circuit board are interposed respectively by a upper elastic element and a lower elastic element to provide a desired vibration space and anchoring for the piezoelectric blades.

Abstract: The present invention includes a method of compensating for differences in the rate of thermal expansion in one or more elements of an electro-mechanical actuator. The electro-mechanical actuator can include one or more elements such as a piezoelectric ceramic multilayer actuator (CMA) and a mechanism to amplify the motion of the CMA. A difference in the rate of thermal expansion or coefficient of thermal expansion, CTE, between the materials in the CMA and the amplifying mechanism can cause the two components to vary in size at differing rates as the ambient temperature varies. Since the amplifying mechanism provides substantial amplification of the motion of the CMA, the relative variation in size of the components due to temperature can be translated by the amplifying mechanism as motion of the CMA. This can result in substantial motion of the amplifying mechanism.

Abstract: A surface acoustic wave sensor is applied to an object by an adhesive. There are reflectors on the sensor body used to determine expansion and contraction. Additional reflectors on a smoothed edge zone of the body remain at the same distance apart and the sensor temperature is determined from the difference signal between these reflectors. The edge zone is without the adhesive.

Abstract: A composite structure of a backing material with enhanced conductivity for use in a transducer is presented. The composite structure includes a plurality of layers of backing material alternatingly arranged with a plurality of thermal conductive elements, wherein the plurality of thermal conductive elements are configured to transfer heat from a center of the transducer to a plurality of points on the composite structure of backing material.

Abstract: An adaptive manufacturing process for a Film Bulk Acoustic Resonator (FBAR) tests the FBAR circuit during manufacturing to determine a resonant frequency thereof. Reactive tuning elements may be adjusted as needed depending on the testing to change the resonant frequency to a desired resonant frequency. In an exemplary embodiment, predetermined masks may be applied to modify the tuning elements.

Abstract: A simple method for passivation of a component is presented which is particularly suitable for processing high-viscosity plastics. The component is arranged in a preproduced plastic body and is connected to the body. This method is proposed for the production of a piezoactuator arrangement, which is utilized for controlling injection valves in internal-combustion engines. The plastic consists of solid silicone and/or fluorinated silicone elastomer.

Abstract: The invention relates to a piezoactuator (1) comprising a piezoelectric body (4) and elements for pre-tensioning the piezoelectric body, consisting of a first (2) and a second (3) connecting element for transferring forces to the piezoelectric body (4). The actuator is provided with an element (6) for transferring tensile/pressure forces between the connecting elements (2, 3), said element being at least partially located in a gap (5) in the form of a bore in the piezoelectric body (4). According to the invention, the piezoactuator (1) is set to a defined working curve using the pre-tensioning elements (2, 3, 6). The piezoelectric body (4) is preferably produced by the lamination of piezoelectric layers, into which a gap is drilled after lamination and the component is subsequently sintered.

Abstract: A film bulk acoustic resonator (FBAR) includes an insulation layer on a substrate to prevent a signal from being transmitted to a substrate. The FBAR includes a portion of a membrane layer corresponding to an activation area to adjust a resonance frequency band and improve a transmission gain of the resonance frequency band, the portion of the membrane layer being partially etched to have a thickness less than the other portion of the membrane layer. A method of forming the FBAR includes forming an sacrificing layer made of polysilicon, forming an air gap using a dry etching process, and forming a via hole. The method prevents structural problems occurred in a conventional air gap forming process and provides locations and the number of the via holes to be controlled.

Abstract: A piezoelectric/electrostrictive device is provided, including a pair of mutually confronting thin plate portions, a fixing portion for supporting the pair of thin plate portions, movable portions provided at tip end portions of the pair of thin plate portions and having mutually confronting end surfaces, and piezoelectric/electrostrictive elements disposed on respective thin plate portions 12a and 12b. At least both side surfaces of the thin plate portions and the piezoelectric/electrostrictive elements are covered with coating films made of a material with a low thermal expansion coefficient.

Abstract: A resonator having temperature and electronic compensation. The resonator has several layers on a substrate having opposite thermal coefficients of the sound velocity for temperature compensation. Also, the frequency of the resonator is adjusted in accordance with an external time reference. The resonator has a high quality factor and a very small size.

Abstract: A piezoelectric actuator and a method of assembling and employing a piezoelectric actuator. This method comprises the steps of positioning an expandable piezoelectric material inside a case, and enclosing a vaporizable liquid in the case. The case is positioned in a high temperature environment; and the liquid vaporizes, in that high temperature environment, over a given period of time, to maintain the temperature of the piezoelectric material below a given value for said period of time. Preferably, the vaporizing liquid maintains the temperature of the piezoelectric material substantially constant over that period of time. Also, preferably the case is provided with a pressure responsive valve that opens and closes, in the high temperature environment, to expose the liquid to that environment and control the vaporization of the liquid to maintain the temperature of the piezoelectric material substantially constant over the period of time.

Abstract: A surface acoustic wave (SAW) filter includes a SAW chip mounted in a recession of a multi-layer substrate, a sealing plate covering the recession, an end surface electrode that is provided on the outer surface of the substrate and is in conduction with the SAW chip, a metal conductor for radiating heat that is provided on the surface at the opposite side from the sealing plate of the multi-layer substrate, and a through hole provided in the substrate, one end thereof being connected to the metal conductor. The other end of the through hole is connected with the SAW chip through the intermediary of a metal constituent, such as an electrically conductive adhesive layer.

Abstract: A first common electrode is fixed at a predetermined potential. A first piezoelectric layer is laminated on the first common electrode and has a first deformability with respect to a predetermined voltage. A drive electrode is laminated on the first piezoelectric layer, to which a drive signal is supplied externally. A second piezoelectric layer is laminated on the drive electrode and having a second deformability with respect to the predetermined voltage which is larger than the first deformability. A second common electrode is laminated on the second piezoelectric layer and to be fixed at the predetermined potential.

Abstract: A piezoelectric thin film resonator having a stabilized temperature characteristic of resonant frequency, a method for manufacturing the same, and a communication apparatus using the piezoelectric thin film resonator are provided. The piezoelectric thin film resonator is provided with a substrate having an opening, first and second insulation films which are provided on one surface of the substrate while covering the opening and which primarily include SiO2 and Al2O3, respectively, Al2O3 having oxygen defect and being in an amorphous state, and a piezoelectric thin film which is provided on the second insulation film and is sandwiched between electrodes and which primarily includes ZnO.

Abstract: A component having an acoustically active material, whose acoustic constants can be at least partially altered. The acoustically active material is located at least partially at a phase transition point and/or in the vicinity of a phase transition point.

Abstract: At least two electric elements (203) such as semiconductor chips or surface acoustic wave devices are mounted on wiring patterns (201), and the electric elements (203) are sealed with a thermosetting resin composition (204). An upper surface of the at least two electric elements (203) and an upper surface of the thermosetting resin composition (204) are abraded at the same time, thereby forming surfaces substantially flush with each other. Since they are abraded while being sealed with the thermosetting resin composition (204), it is possible to reduce the thickness without damaging the electric elements (203). Also, the electric elements (203) and the wiring patterns (201) can be prevented from being contaminated by an abrasive liquid. In this manner, it is possible to obtain an electric element built-in module whose thickness can be reduced while maintaining its mechanical strength.

Abstract: A method for fabricating a resonator, and in particular, a thin film bulk acoustic resonator (FBAR), and a resonator embodying the method are disclosed. The resonator is fabricated on a substrate by fabricating a bottom electrode layer and a piezoelectric (PZ) layer over the bottom electrode layer. A selected portion of the PZ layer is partially etched. Then, a top electrode is fabricated over the selected portion of the PZ layer.

Abstract: A piezoelectric actuator for actuating a mechanical component includes a piezoelectric element, for subjecting an actuating element to a tensile force or compressive force, and a compensating element, with the piezoelectric element and the compensating element having essentially the same coefficients of temperature expansion. The compensating element is mechanically coupled to the piezoelectric element in such a way that the temperature-caused expansions of the piezoelectric element and of the compensating element cancel one another out in the effective direction in such a way that the actuating element remains in its position.

Abstract: A piezoelectric actuator in which a piezoelectric element is present for subjecting an actuating element to a tensile or compressive stress. A sleeve is secured to a foot part, to which the piezoelectric element is secured and by way of which the piezoelectric element is kept centered in a housing under mechanical prestressing, and this sleeve surrounds the piezoelectric element in such a way as to stabilize it mechanically, at least in partial regions that are electrically insulated from the piezoelectric element. Between the sleeve and the piezoelectric element, a heat-conducting elastomer is placed, and the sleeve comprises a heat-conducting material that is deformable within predetermined limits.

Abstract: A valve for controlling fluids is proposed that for its actuation cooperates with a piezoelectric actuator (2). To compensate for changes in the length of the piezoelectric actuator (2) in the stroke direction that are caused by temperature changes, a compensation element (7) is provided, which comprises a material that has a coefficient of thermal expansion that is approximately equivalent to that of the piezoelectric actuator (2). The piezoelectric actuator (2) and compensation element (7), upon a certain temperature change, exhibit a comparable change in their length in the stroke direction. As a result, the change in length of the piezoelectric actuator with the temperature is compensated for. The valve is intended for use in fuel injection devices for internal combustion engines.

Abstract: A thin film resonator having enhanced performance and a manufacturing method thereof are disclosed. The thin film resonator includes a supporting means, a first electrode, a dielectric layer and a second electrode. The supporting means has several posts and a supporting layer formed on the posts. The first electrode, the dielectric layer and the second electrode are successively formed on the supporting layer. The thin film resonator is exceptionally small and can be highly integrated, and the thickness of the dielectric layer of the resonator can be adjusted to achieve the integration of multiple bands including radio, intermediate and low frequencies. Also, the thin film resonator can minimize interference and has ideal dimensions because of its compact substrate, making the thin film resonator exceptionally small, yet comprising a three-dimensional, floating construction.

Abstract: A piezoelectric component, including a ceramic actuator having a coating made of an elastomer. The elastomer is a heat conductive elastomer including a filler which is manufactured based upon aluminum dioxide, titanium dioxide, boron nitride, aluminum nitride, silicon carbide and/or preferably silicon dioxide.

Abstract: These and other objectives are attained with a piezoelectric actuator operable over a temperature range, and a method of operating a piezoelectric actuator. The piezoelectric actuator, generally, comprises a support structure, a piezoelectric material supported by the support structuer, and an insert disposed between the support structure and the piezoelectric material. The piezoelectric material and the insert are positioned in series, the piezoelectric material and the insert each have a respective length, and together the piezoelectric material and the insert have a combined length. The length of the piezoelectric material changes in response to a voltage applied to the piezoelectric material. Also, the respective lengths of the piezoelectric material and the insert change, in opposite directions, in response to the same change in temperature, and, in this way, the insert mitigates changes in the combined length of the insert and the piezoelectric material due to temperature changes.

Abstract: While suppressing that a vibration of a piezo-electric element propagates to a substrate by devising the composition of an electro-conductive support body, the piezoelectric resonant component which secures electroconductivity and can maintain a fall-proof shock property is provided. The piezoelectric resonant component has a substrate 20 on the top surface of which pattern electrodes 21 and 22 are formed, and on the lower surface of which it has electrodes 8 and 9. It has a piezoelectric element 1 using the length vibration on the substrate 20. Electro-conductive support bodies 10 and 11 are fixed to the length direction center section of the lower surface electrodes of the piezoelectric element 1. The connection fixation of these support bodies 10 and 11 to the pattern electrodes 21 and 22 of the substrate 20 is performed by electro-conductive adhesives 12 and 13.

Abstract: A surface acoustic wave device includes a quartz substrate, a piezoelectric thin film disposed on the quartz substrate and an interdigital electrode in contact with the piezoelectric thin film. The quartz substrate has an angle &phgr; at the Euler angle (0, &phgr;, &thgr;) which is selected such that the quartz substrate has a negative temperature coefficient of delay at a predetermined propagation direction &thgr;. The piezoelectric thin film has a positive temperature coefficient of delay, a thickness which is selected such that a fundamental mode of a leaky surface acoustic wave is excited on the quartz substrate, and the surface acoustic wave device operates using the fundamental mode of the leaky surface acoustic wave. It is preferable that the surface acoustic wave device has a quartz substrate with a Euler angle (0, 119°-138°, 85°-95°) and the normalized thickness of the piezoelectric thin film within the range of about 0.01 to about 0.15.

Abstract: In a crystal unit suitable for use in a thermostat oven, a first and a second excitation electrode are disposed on a first and a second surface of a crystal blank. A first and a second connection are disposed on the second surface as connections formed by applying a fillet of a mixture of a low-melting glass and a metal filler, and melting the fillet by heating. A third connection is disposed on a peripheral edge of the crystal blank to extend over both surfaces. A lead of the first excitation electrode is directly connected to the third connection, while a lead of the second excitation electrode is connected to the first connection through a vapor-deposited metal thin film. The second and third connections are connected to each other through a vapor-deposited metal thin film. The first and second connections are secured to a pair of holding members by brazing.

Abstract: An improved, temperature-compensated piezoelectric force motor features greater dynamic range and robustness as compared to previous motor designs. By implementing positive and negative expanding elements, the overall motor length is held constant over temperature. A central stretching member removes the PZT element from the load path of the motor when the motor is relaxed, thereby preventing damage to the element during assembly and deployment. When the piezoelectric element is powered, the central structural member also improves the failure strength of the assembly to further increase the robustness of the motor design. The invention finds applicability in various commercial products including, but not limited to, scientific etalons, nanopositioning systems, custom fiber optic assemblies, and custom CCD detectors.

Abstract: A temperature compensated crystal oscillator is manufactured by placing a ring-shaped board on a main board to surround compensating components on the main board, and placing a crystal package on the ring-shaped board. A component mounting area on the main board is reduced, thereby reducing a product size. At least one conductive pad may be attached to the ring-shaped board to connect the crystal package to a certain circuit on the main board. The conductive pad may be provided at each of four corners of a rectangular ring-shaped board.

Abstract: A fuel injector comprises a tube assembly, a stem assembly, and a plurality of sets of piezoelectric elements. The tube assembly includes a seat defining an opening through which fuel enters an internal combustion engine. The stem assembly includes a cap and a stem that are relatively movable with respect to one another. A gap is located between the stem and cap when the stem contiguously engages the seat such that fuel flow through the opening is prevented. A first set of piezoelectric elements moves the cap in response to a first electric field, and a second set of piezoelectric elements moves the first set of piezoelectric elements in response to a second electric field. A sensor measuring the gap compensates the second electric field for physical changes in at least one of the tube and stem assemblies.

Abstract: A temperature compensated crystal oscillator has first and second layered structures, an IC chip, a crystal vibrating chip, a resin mold portion and a metal cover. Each of the first and second layered structures has a cavity formed therein. The cavity formed in the second layered structure does not overlap with the cavity of the first layered structure. The IC chip is inserted into the cavity of the first layered structure. The crystal vibrating chip is inserted into the cavity of the second layered structure. The resin mold portion is formed by charging resin into the cavity of the first layered structure. The metal cover is arranged on the upper surface of the second layered structure for covering an opening of the cavity of the second layered structure.

Abstract: A film bulk acoustic resonator (FBAR) includes an insulation layer on a substrate to prevent a signal from being transmitted to a substrate. The FBAR includes a portion of a membrane layer corresponding to an activation area to adjust a resonance frequency band and improve a transmission gain of the resonance frequency band, the portion of the membrane layer being partially etched to have a thickness less than the other portion of the membrane layer. A method of forming the FBAR includes forming an sacrificing layer made of polysilicon, forming an air gap using a dry etching process, and forming a via hole. The method prevents structural problems occurred in a conventional air gap forming process and provides locations and the number of the via holes to be controlled.

Abstract: A piezoelectric actuator, e.g., for actuating a mechanical component, is proposed, in which a piezoelectric element (2) for acting on an actuating element (9) with a pulling or pushing force, and a compensating element (3; 20) are provided, wherein the piezoelectric element (2) and the compensating element (3; 20) basically have the same temperature expansion coefficients. The compensating element (3; 20) is mechanically coupled to the piezoelectric element (2) in such a fashion that the temperature-induced expansions of the piezoelectric element (2) and the compensating element (3; 20) cancel each other out in the effective direction in such a fashion that the actuating element (9) remains in its position. A heat transfer compound (12) is located between the piezoelectric element (2; 21) and the compensating element (3; 22).

Abstract: A piezoelectric bending transducer having a supporting element and a piezoelectrically active layer applied to at least one side of the supporting element. In order to reduce the inherent thermal distortion, an adaptation layer with a predefined volume is applied to the piezoelectrically active layer.

Abstract: A piezoelectric actuator in which at least on piezoelectric element is present for subjected an actuating element to a tensile force or compressive force. In addition, stabilizing elements are mounted parallel to the piezoelectric element with a flexible intermediate layer located between the elements. The piezoelectric element and the stabilizing elements have a great length in the effective direction (Z axis) in proportion to their width transversely to the effective direction (X, Y direction).

Abstract: A piezoelectric thin film resonator having a stabilized temperature characteristic of resonant frequency, a method for manufacturing the same, and a communication apparatus using the piezoelectric thin film resonator are provided. The piezoelectric thin film resonator is provided with a substrate having an opening, first and second insulation films which are provided on one surface of the substrate while covering the opening and which primarily include SiO2 and Al2O3, respectively, Al2O3 having oxygen defect and being in an amorphous state, and a piezoelectric thin film which is provided on the second insulation film and is sandwiched between electrodes and which primarily includes ZnO.

Abstract: A multilayer type piezoelectric filter is provided which includes at least two chambers for receiving therewithin resonators, respectively. The chambers are partly defined by a top printed circuit board and an intermediate printed circuit board. The top printed circuit board and the intermediate printed circuit board are formed with communication holes for communicating the chambers with the outside.

Abstract: A temperature compensated crystal oscillator, which is manufactured by placing a ring-shaped board on a main board to accommodate compensating components on the main board, and placing a crystal package on the ring-shaped board, is disclosed. A component mounting area on the main board is reduced, thereby reducing a product size. At least one conductive pad may be attached to the ring-shaped board to connect the crystal package to a certain circuit on the main board. The conductive pad may be provided at each of four corners of the ring-shaped board in the case of a rectangular ring-shaped board. The present invention also provides a method of manufacturing the temperature compensated crystal oscillator.

Abstract: A piezoelectric resonator using an nth-order mode of a thickness longitudinal vibration or a thickness-shear vibration includes a vibrating section having a piezoelectric layer, a pair of electrodes and a support member for holding the vibrating section. The pair of electrodes are provided on opposite sides of the piezoelectric layer, respectively, and the pair of electrodes partially overlap with each other via the piezoelectric layer to define an opposite electrode portion. The support member holds the vibrating section such that the vibrating section vibrates under an nth-order mode of a thickness longitudinal vibration or a thickness-shear vibration. The opposite electrode portion preferably has a substantially circular shape having a radius r or is a polygonal shape circumscribing the substantially circular shape. The radius r satisfies the inequality 20t/n≦r, where t is a thickness of the vibrating section.

Abstract: A device includes a die that contains a filter circuit. The filter is implemented using film bulk acoustic resonators. A package contains the die. The package includes a base portion. Signal paths are incorporated in the base portion. Solder joints attach the die to the base portion. The solder joints electrically connect pads on the die to the signal paths in the base portion. The solder joints do not include, and are used instead of, wire bonds.