Abstract: The present invention relates to a light emitting device package and a method of manufacturing the same. There is provided a light emitting device package including a metal core; an insulating layer formed on the metal core; a metal layer formed on the insulating layer; a first cavity formed by removing parts of the metal layer and the insulating layer to expose a top surface of the metal core; and a light emitting device directly mounted on the top surface of the metal core in the first cavity and further there is provided a method of manufacturing the light emitting device package.
Type:
Grant
Filed:
June 17, 2008
Date of Patent:
October 30, 2012
Assignee:
Samsung Electronics Co., Ltd.
Inventors:
Young Ki Lee, Seog Moon Choi, Hyung Jin Jeon, Sang Hyun Shin
Abstract: A high-power switch tube is shown constructed from a plurality of electron guns each gun having a cathode and an anode. Between the cathode and anode is mounted a shadow grid closest to the cathode beyond which is mounted a control grid, a screen grid, and, in some applications, by a suppressor grid. Each anode is formed with an anode cavity having an opening that is smaller in dimension than the largest dimension of the cavity thus forming a Faraday cage collector which prevents secondary emission problems.