Abstract: A cantilever probe card device and a focusing probe thereof are provided. The focusing probe includes a soldering segment, a testing segment, two outer elastic arms spaced apart from each other, and a focusing portion. The testing segment is spaced apart from the soldering segment along an arrangement direction, and has a needle tip, an outer edge, and an inner edge that is opposite to the outer edge. Each of the two outer elastic arms has two end portions respectively connected to the soldering segment and the inner edge of the testing segment. The focusing portion is connected to the inner edge and is located between the needle tip and the two outer elastic arms, and has a plurality of focusing points arranged on one side thereof away from the two outer elastic arms.

Abstract: A vertical probe head includes upper and lower die units having upper and lower through holes, and probes each including a body portion between the die units, tail and head portion installation parts in the upper and lower through holes respectively, and a head portion contact part for electrically contacting a device under test. The probes include a pair of signal probes including at least one distinctive probe, for which, the body portion is smaller in width than the head portion installation part, and a body portion center line is deviated from a head portion installation part center line toward the probe paired thereto. For the paired probes, a head portion contact part pitch is larger than a body portion pitch for matching a large-pitch high-speed differential pair of the device under test, great impedance matching effect, and consistent contact force and stable elasticity of the probes in operation.

Abstract: A display device includes a display panel, a main circuit board including a plurality of board pads arranged along a first direction, a connection circuit board electrically connected to the display panel and the main circuit board, and a driving chip disposed on the connection circuit board. The connection circuit board includes a plurality of board connection pads respectively connected to a plurality of board pads, a plurality of lines connecting the driving chip to the plurality of board connection pads to each other, and a test pattern disposed spaced part from the driving chip, where a first line and a second line among the lines are electrically connected to the test pattern, and a same voltage is applied to the first line and the second line.

Abstract: An electronic component handling apparatus handles a device under test (DUT). The electronic component handling apparatus includes: transfer units that each include a DUT transfer part that mounts the DUT on a first tray and removes the DUT from the first tray; contact units that each press the DUT mounted on the first tray against a socket disposed on a test head connected to a tester; and a tray transporter that transports the first tray between the contact units and the transfer units. Either or both of (i) at least one of the contact units and (ii) at least one of the transfer units are removably disposed on the electronic component handling apparatus.

Abstract: An inspection apparatus includes: first and second stage parts on which a housing container housing substrates is mounted; first and second inspection parts having an imaging unit imaging the substrate; a first transfer region provided with a first transfer mechanism performing a first operation of transferring the substrate between the first stage part and the first inspection part; and a second transfer region provided with a second transfer mechanism performing a second operation of transferring the substrate between the second stage part and the second inspection part. In plan view, the first and second stage part are at positions not overlapping with each other, the first and second inspection part are at positions not overlapping with each other, and the first and second transfer region are at positions different from each other so as to perform the first and second operation in parallel.

Abstract: A high-frequency testing probe having a probe substrate and at least two probe tips. The probe substrate is a printed circuit board and the probe tips are coupled to and extend outward from the printed circuit board. The first and second probe tips are each communicatively coupled to respective first and second probe connectors through respective first and second conducting traces disposed upon the printed circuit board. The probe connectors are configured to couple the testing probe to at least one of a high-frequency vector network analyzer and a high-frequency time domain reflectometer. The probe tips translate along their respective central longitudinal axes through respective adjustable couplings to modify respective distances the probe tips extend outward from the printed circuit board.

Abstract: An EMC test system (1) and an EMC test method performed in the EMC test system (1) for testing a DUT (6), wherein the EMC test system (1) comprises an EMC test chamber (2), wherein the DUT (6) is positioned in the EMC test chamber (2), at least one measurement equipment (4) positioned in the EMC test chamber (2) and communication means (3) using LiFi for transmitting and receiving measurement data and/or control data by the measurement equipment (4).

Abstract: Moisture that is possibly present in an integrated circuit is detected autonomously by the integrated circuit itself. An interconnect region of the integrated circuit includes a metal level with a first track and a second track which are separated by a dielectric material. A detection circuit applies a potential difference between the first and second tracks. A current circulating in one of the first and second tracks in response to the potential difference is measured and compared to a threshold. If the current exceeds the threshold, this is indicative of the presence of moisture which renders said dielectric material less insulating.

Abstract: As a semiconductor device is miniaturized, a scribe area on a wafer also tends to decrease. Accordingly, it is necessary to reduce the size of a TEG arranged in the scribe area, and efficiently arrange an electrode pad for probe contact. Therefore, it is necessary to associate probes and the efficient layout of the electrode pad. The purpose of the present invention is to provide a technique for associating probes and the layout of an electrode pad of a TEG to facilitate the evaluation of electrical characteristics. According to the present invention, the above described problem can be solved by arranging a plurality of probes in a fan shape or manufacturing the probes with micro electro mechanical systems (MEMS) technology.

Abstract: The technical solution relates to measurement technology and is intended for measuring the dielectric permittivity and moisture of highly conductive loose, paste-like and fluid materials such as saline slurry, anthracite, ore, crude oil and oil sludge. The present method is based on using a sensor configured as a segment of a long transmission line, and involves feeding a high-frequency probing signal from a generator that is swept through a range of frequencies to an input of the sensor, and measuring harmonic frequencies at which a length of a signal conductor of the sensor is equal to or a multiple of a half-wavelength of the probing signal in the material filling the sensor. The harmonic frequencies are determined based on a voltage minimum at an output of a detector configured as a phase discriminator, the output voltage of which attains a minimum when input signals of the detector are either in-phase or antiphase.

Abstract: There is provided a wafer inspection device that is capable of bringing a polishing wafer into proper contact with probes without lowering throughput. The total value T of a thickness t1 of a polishing plate, a thickness t2 of a polishing wafer and a magnitude t3 extending from a lower surface of a main body of a pogo frame to a lower end of each probe of a probe card is set to be larger than a magnitude t4 of a lip seal protruding from an upper surface of a chuck top.

Abstract: An automated testing system for power supply units includes a frame, automated test equipment supported by the frame, a test jig supported by the frame and coupled with the automated test equipment, and a robotic arm coupled to the frame. The robotic arm is configured to move a power supply unit onto the test jig to interface with the automated test equipment. The automated test equipment is configured to perform one or more tests on the power supply unit when the power supply unit is interfaced with the automated test equipment, and the robotic arm is configured to move the power supply unit off of the test jig after the one or more tests are completed. Methods of performing automated testing for power supply units are also disclosed.

Abstract: A probe card includes a circuit board having a through opening therein. A fixing member is at least partially in the through opening of the circuit board and has a through opening therein. The through opening of the fixing member is defined at least partially by opposite first and second sidewalls of the fixing member. A plurality of probes each includes an arm portion and a tip portion. One end of the arm portion is connected to the circuit board. The arm portion extends through the first sidewall of the fixing member into the through opening of the fixing member. The arm portion is angled with respect to a direction perpendicular to the first sidewall of the fixing member when viewed from above. The tip portion extends from the arm portion. The second sidewall of the fixing member is free of probes.

Abstract: An electric connection device includes: a probe (11); a probe head (12) that holds the probe (11); and an electrode substrate (13) on which an electrode pad (131) to be connected to a proximal end of the probe (11) is provided. The probe head (12) is provided with a guide pin (14) for alignment of the probe head (12) and the electrode substrate (13), and the electrode substrate (13) is provided with a guide hole group composed of a plurality of guide holes corresponding to the guide pin (14).

Abstract: An imaging device main-body of an imaging device of the present disclosure includes a first engaged portion, a second engaged portion and a locked portion, and an accessory holding unit includes a first engaging portion, a second engaging portion and a locking portion. When the accessory holding unit is to be mounted to the imaging device main-body, the first engaging portion and the first engaged portion are engaged with each other, the second engaged portion and the second engaging portion are engaged with each other, and the locking portion is locked to the locked portion.

Abstract: A test jig for testing electrical characteristics of a semiconductor product includes a conductive ground block for supporting the semiconductor product thereon; a substrate provided on the ground block, and having a first and a second substrate electrodes formed on the substrate for the respective electrodes to be in contact with leads of the semiconductor; and lead pressers for pressing the leads against the first and the second substrate electrodes, respectively, so that electrical connection is established between the respective leads and the first and the second substrate electrodes in testing the semiconductor product.

Abstract: A probe card device includes a first die, a second die, and a plurality of rectangular probes. Each of the rectangular probes includes a middle segment, two extending segments, and two contact end segments. In each of the rectangular probes, the two extending segments are respectively arranged in the first die and the second die, the two contact end segments respectively extend from two opposite ends of the two extending segments along a direction away from the middle segment, each of the two contact end segments includes a conductive portion, and at least one of the two contact end segments includes a piercing portion partially embedded in the conductive portion thereof. A conductivity of the piercing portion is less than that of each of the two conductive portions, and a Vickers hardness number of the piercing portion is larger than that of each of the two conductive portions.

Abstract: In some embodiments, apparatuses and methods are provided herein useful for testing a touchscreen electronic device. In some embodiments, an attachment for an end effector for use with testing a touchscreen electronic device comprises a body, wherein the body includes a connection portion configured to secure the attachment to the end effector, a first end, an opening, wherein the opening is located adjacent to the first end, and a conductive contact member, wherein the conductive contact member is wrapped about the first end, and wherein the conductive contact member is configured to contact the touchscreen during testing and simulate a touch of a human finger.

Abstract: A position detection switch is provided with a case having a cylindrical part that has a plurality of ribs on an inner circumferential wall thereof along the axial direction thereof. Accordingly, the strength of the case is increased and running of a molten resin for fixing a substrate disposed on the inside are improved when the molten resin is injected from a long groove of the case. The contact surface area between the ribs and a sheath is increased whereby durability against an external force and temperature variation is increased.

Abstract: A test apparatus for testing electronic device comprises a lower base, an upper base and a pressing force generating module disposed between the upper and lower bases. The lower base having a chip socket for receiving a plurality of probes, and a test socket plate having a first guiding device, each of the probes has a spring force stored therein. The upper base having a second guiding device coupled to the first guiding device. When an electronic device is placed in the chip socket, and the upper base is slidably moved with respect to the lower base by the cooperative actions between the first and second guiding devices, so that the pressing force generating module is in alignment with the electronic device for applying a pressing force on the electronic device, and the pressing force being greater than the sum of the spring forces generated by the plurality of probes.

Abstract: There is provided an intermediate connection member which is provided between a first member having a plurality of first terminals and a second member having a plurality of second terminals and electrically connects the plurality of first terminals and the plurality of second terminals, respectively, the intermediate connection member including: a pogo block including a main body and a plurality of pogo pins provided in the main body, the pogo block configured to connect the plurality of first terminals and the plurality of second terminals, respectively; and a pogo frame having an insertion hole into which the pogo block is inserted, wherein the pogo block has a positioning pin, and the pogo frame has a positioning hole into which the positioning pin is inserted, and wherein the pogo block is positioned with respect to the pogo frame when the positioning pin is inserted into the positioning hole.

Abstract: Component for use in mineral processing are described including a substantially electrically conductive layer of elastomeric material; and two or more measurement points in the form of electrical connections are provided at different points of the electrically conductive layer.

Abstract: According to one implementation, a dual-mode augmented reality and virtual reality viewer (AR/VR viewer) includes a device configured to provide AR and VR effects, the device including a display screen, a VR shield, and a transparency control unit coupled to the VR shield. The AR/VR viewer also includes a computing platform for generating the AR and VR effects communicatively coupled to the device. The display screen has a user facing first surface for receiving the AR and VR effects, and a second surface opposite the user facing first surface. The display screen or a transmissive layer adjoining the display screen is configured to have a variable transparency. The VR shield is configured to be one of substantially transparent in an AR mode and substantially opaque in a VR mode under the control of the transparency control unit.

Abstract: A high-frequency testing probe having a probe substrate and at least two probe tips. The probe substrate is a printed circuit board and the probe tips are coupled to and extend outward from the printed circuit board. The first and second probe tips are each communicatively coupled to respective first and second probe connectors through respective first and second conducting traces disposed upon the printed circuit board. The probe connectors are configured to couple the testing probe to at least one of a high-frequency vector network analyzer and a high-frequency time domain reflectometer. The probe tips translate along their respective central longitudinal axes through respective adjustable couplings to modify respective distances the probe tips extend outward from the printed circuit board.

Abstract: A universal test socket including a first sub-layer including a plurality of first through conductors, the plurality of first through conductors arranged at a first pitch in a first substrate, and a second sub-layer including a plurality of second through conductors, the second sub-layer stacked on the first sub-layer so that the plurality of first through conductors are in contact with the plurality of second through conductors, the plurality of second through conductors arranged at a second pitch in a second substrate, the second pitch being less than or equal to the first pitch may be provided.

Abstract: According to one embodiment, there is provided a common test board including a socket board, an IP evaluation board, and a common board. To the socket board, a semiconductor device is to be connected. On the IP evaluation board, the socket board is able to be attached. On the common board, the IP evaluation board is able to be attached.

Abstract: A method of manufacturing a semiconductor package includes obtaining a plurality of individual chips classified according to a test bin item as a result of performing an electrical die sorting (EDS) process including testing electrical characteristics of a plurality of chips at a wafer level, packaging the individual chips on corresponding chip mounting regions of a circuit substrate and forming a plurality of individual packages based on position information of the chip mounting regions, each of the individual packages having test bin item information corresponding to the test bin item, classifying the plurality of individual packages according to the test bin item based on the test bin item information, and testing the individual packages classified according to the test bin item.

Abstract: Methods and apparatus are described relating to a probe assembly having a probe head securing mechanism that includes a lock ring housing and a lock ring disposed in the lock ring housing. In an example, a probe assembly includes a rigid substrate, a circuit board coupled to the rigid substrate, and a probe head securing mechanism. The probe head securing mechanism includes a lock ring housing and a lock ring disposed within the lock ring housing. The circuit board has a surface. The lock ring housing is coupled to the rigid substrate. The circuit board is disposed between the lock ring housing and the rigid substrate. The lock ring is rotatable relative to the lock ring housing. Rotation of the lock ring is configured to move the lock ring in a direction perpendicular to the surface of the circuit board.

Abstract: A method of assessing vulnerability of Integrated Circuit (IC) can include: preparing a list of logic nets of the IC; obtaining rectangular segments from the logic nets; finding a milling exclusion area based on a covering wire; and superimposing the found milling exclusion area onto the rectangular segments of the logic nets. The milling exclusion area is an area that microprobing attack does not succeed without cutting off at least one of the rectangular segments.

Abstract: An interposer includes a substrate having a mounting area and a test area, first conductive plugs separate from each other, the first conductive plugs being disposed along a first direction and into the test area of the substrate, a first line pattern group including first non-conductive patterns disposed on first centers of the first conductive plugs, and first conductive patterns disposed to bridge first peripheries of a first adjacent pair of the first conductive plugs, and first pads connected to the first conductive patterns at both first ends of the first line pattern group.

Abstract: A test instrument performs a power supply stress test by invoking current surges in a device under test. The current surges are invoked by stimulating functional blocks in the device under test with test signals received via a network interface of the device under test.

Abstract: A system and computer implemented method for estimating difficulty of a document includes retrieving a subject document from a storage, setting difficulty of each keyword included in the subject document to locality of the keyword in the subject document as an initial value, estimating, by a processor, difficulty of each subject document by a statistical processing of the difficulties of keywords included in the subject document, and updating the difficulty of each keyword based on the difficulty of each subject document depending on a significance value of the keyword in the subject document.

Abstract: It is described a contact probe for a testing head for a testing apparatus of electronic devices, the probe comprising a probe body extended in a longitudinal direction between respective end portions adapted to contact respective contact pads, the second end being a contact tip adapted to abut onto a contact pad of the device under test, the body of each contact probe having a length of less than 5000 ?m, and including at least one pass-through opening extending along its longitudinal dimension. Conveniently, the at least one pass-through opening is filled by a filling material, in order to define at least one first and one second lateral portions in the body, being parallel and joined to each other by a connecting central portion realized by the filling material at the pass-through opening, the connecting central portion made of the filling material acting as a strengthening element.

Abstract: The disclosure describes a novel method and apparatus for improving silicon interposers to include test circuitry for testing stacked die mounted on the interposer. The improvement allows for the stacked die to be selectively tested by an external tester or by the test circuitry included in the interposer.

Abstract: A probe card device includes a testing circuitry board, a flexible probe needle, a first solder portion, a second solder portion and an interconnected holder electrically connected to the testing circuitry board and the flexible probe needle in which one end of the interconnected holder is coupled to the flexible probe needle with the first solder portion, and the other end of the interconnected holder is coupled to a conductive pad of the testing circuitry board with the second solder portion. A first desoldering melting point of the first solder portion is higher than a second desoldering melting point of the second solder portion.

Abstract: A prober for testing devices in a repeat structure on a substrate is provided with a probe holder plate, probe holders mounted on the plate, and a test probe associated with each holder. Each test probe is displaceable via a manipulator connected to a probe holder, and a substrate carrier fixedly supports the substrate. Testing of devices, which are situated in a repeat structure on a substrate, in sequence without a substrate movement and avoiding individual manipulation of the test probes in relation to the contact islands on the devices, is achieved in that the probe holders are fastened on a shared probe holder plate and the probe holder plate is moved in relation to the test substrate.

Abstract: A device of contacting a substrate with a probe card includes a mounting table 15 that transfers a wafer W together with a wafer plate 24 to a position facing the probe card 19; a lifting device 15a that contacts multiple electrodes of semiconductor devices formed on the wafer W with multiple probes of the probe card 19 by moving the wafer plate 24 and the wafer W toward the probe card 19 and then further moves the wafer W toward the probe card 19; a depressurization path 26 that decompresses a space S between the probe card 19 and the wafer plate 24 and maintains a contact state between the electrodes of the semiconductor devices and probes 19b of the probe card 19; and the lifting device 15a that separates a chuck member 14 on the mounting table 15 from the wafer plate 24.

Abstract: Techniques are described to provide a universal direct docking tester to prober interface between the test head and a prober of semiconductor wafer prober for testing die within semiconductor wafers. In an implementation, a universal direct docking tester to prober interface includes a tray assembly configured to be mounted within an opening of the prober housing and a stiffener assembly configured to be mounted to a test head to support a load board PCB that includes a probe head. The stiffener assembly includes a skirt that is received in the tray assembly when the test head is interfaced with the prober to position the load board PCB within the prober to facilitate engagement of the probe head with the wafer.

Abstract: A method of contacting a substrate with a probe card in a substrate inspection apparatus can inspect electrical characteristics of semiconductor devices on the substrate. A wafer W is transferred to a position facing a probe card 36 while being mounted on a chuck member 22 with a wafer plate 37 therebetween, and electrodes of semiconductor devices on the wafer W are contacted with probes of the probe card 36 by moving the wafer W and the wafer plate 37 toward the probe card 36 through an elevating device 43. Then, the wafer W is overdriven toward the probe card 36 and a contact state between the electrodes of the semiconductor devices and the probes of the probe card 36 is maintained by decompressing a space S between the probe card 36 and the wafer plate 37. Then, the chuck member 22 is separated from the wafer plate 37.

Abstract: A mechanical camera bracket for mounting different accessories to the camera is disclosed that ensures a positive lock through the central hub from which extend a first arm and a second arm, allowing for accessories to be attached and detached without having to remove the entire bracket. The central hub has a clamping knob and defining a common axis about which the first arm and second arm rotate. A first bushing and second bushing are rotatable about the common axis in tandem with the first arm and second arm. The first bushing and second bushing each have a first ramp coupled to a first pressure cup in a first ball head camera mount and a second pressure cup in a second ball head camera mount. The clamping knob is configured to move the ramps along the common axis, thus urging the pressure cups against the ball heads.

Abstract: Provided is a circuit board including an inspection terminal, the circuit board including: a connection terminal, which is arranged on a front surface or in an inner layer of the circuit board and is electrically connected to an object to be inspected; an inspection terminal configured to measure a resistance value of the object to be inspected; and a connection wiring configured to electrically connect the object to be inspected and the inspection terminal to each other, the inspection terminal being arranged on a side surface of the circuit board, at least a part of the connection wiring being formed on a back surface or in the inner layer of the circuit board.

Abstract: A current quantity measuring method of multi-beams irradiates with a charged particle beam, amplifies an electric signal corresponding to multi-beams passed through a plurality of aperture holes of an aperture member having the plurality of aperture holes to form multi-beams by irradiation with the charged particle beam, receives the electric signal amplified in the minute current measurement unit and counting the number of electrons in the multi-beams, calculates a current quantity of the multi-beams passed through the plurality of aperture holes by using a product of the calculated number of electrons in the multi-beams and elementary charge, and corrects irradiation time of the charged particle beam of each of the plurality of aperture holes on the basis of the calculated current quantity.

Abstract: An inspection jig may include a frame, an electrode body provided with electrodes, conductive contactors having a wire shape, a support block having a facing surface opposite to which an inspection circuit board is disposed, guiding one ends of the contactors to the inspection points of the circuit board mounted on the facing surface, guiding other ends to the electrodes, and configured to move relatively to the frame in a moving direction which crosses the facing surface, biasing parts configured to bias the support block in a direction moving away from the electrode body and close to the circuit board, and a regulating plate disposed between the support block and the frame so as to extend in a direction from the support block to the frame, having elasticity, and having regulation of deformation in a first direction which is parallel to the facing surface and which crosses the extending direction.

Abstract: A probe apparatus has probe wires with a contact pattern on one side. The contact pattern is for contacting a respective contact pattern on another test equipment or component, such as a circuit board. The probe wires have tips that probe a device desired for testing. Signals are transmitted through the probe wires from the probe card, for example, through a circuit board to other diagnostic equipment. The contact of the probe card with the circuit board allows signals to be transferred through the probe wires to the other diagnostic equipment. On another side of the probe card is a connector structure. The connector structure includes a retainer that can allow the probe card to be replaced from a test system, such as allowing it to be connected and disconnected from a holder.

Abstract: In a method for determining a set value of a pressure for inspection in a wafer inspection apparatus, a surrounding space sealable between a chuck top and a probe card by a vacuum mechanism is evacuated and a highest negative pressure in the surrounding space is measured as a reference pressure when the chuck top has floated by the evacuation. Then as a reference height position, a height position of the chuck top corresponding to the reference pressure is obtained. Further, a pressure in the surrounding space is decreased to a level lower than the reference pressure, the pressure in the surrounding space, when the chuck top reaches a target height position obtained by adding a preset overdrive amount for a press-contact state between the probe card and the wafer to the reference height position, is measured and the measured pressure is set as the set value of the pressure.

Abstract: A vertical probe device includes upper and lower dies having upper and lower installing holes, probe needles, a lower positioning film disposed between the dies and having lower positioning holes, and a dividing film disposed between the lower positioning film and the upper die and having through holes and dividing ribs. The needle tail is individually inserted through a lower installing hole. The needle head is individually inserted through an upper installing hole. Each lower positioning hole is located under at least one dividing rib and capable of accommodating a plurality of needle heads. Each needle head is inserted through a lower positioning hole and a through hole. Therefore, the films are easily installed, free of irregular hole but passable by narrow needle bodies, and facilitate easy and fast installation and less damage to the probe needles that are well positioned, and facilitate easy installation of the upper die.

Abstract: A probe needle includes a head, a tail and a body connected between the head and the tail and provided with a first flat section curvedly extending from the head towards the tail for providing sufficient deformation when the tail is pressed on a device under test, and a second flat section neighbored to the first flat section for supporting the probe needle in between upper and lower dies. When the probe needles are used in a probe module, the probe needles can be arranged with a pitch same as that of the conventional probe needles even though the probe needles are formed from posts having a relatively greater diameter than that of the posts for making the conventional probe needles, such that the probe needles may have enhanced current withstanding capacity and prolonged lifespan.

Abstract: A removable, permanent or reconfigurable debug probing device for use in debug probing of a printed circuit assembly, the printed circuit assembly having at least one through via, the debug probing device comprising at least one leader thread configured to be threaded through the at least one through via. Using the probing device comprises inserting a selected one of the at least one leader threads through a selected one of the at least one through via to thereby probe a surface of the printed circuit assembly; and responsive to detecting a defect in the selected through via, using a flexible circuit connected to the selected leader thread to repair the detected defect.

Abstract: An electrical testing machine includes a base having two parallel first rails, a platform provided on the base, a probe holder provided on the base and having a plurality of placement locations, a support provided between the first rails and having a second rail thereon, a test arm provided on the second rail and above the platform, a receiving seat provided on the test arm, and a plurality of probe sets, wherein one of the probe sets is engaged on the receiving seat, while the others are respectively provided on the placement locations. The support is movable relative to the base and the platform. The test arm is movable along with the support, and is also movable relative to the support. The receiving seat is movable or rotatable relative to the test arm. The probe set engaged on the receiving seat is movable along with the receiving seat.

Abstract: An apparatus and method for determining performance of system is disclosed. While operating in a test mode, a plurality of test results may be received and stored in a memory. Each test result may be indicative of a performance of the system when the system is operating under a respective test condition. Also, during the test mode, a respective value of an operating parameter of a predetermined system element at each test condition. An association between each test result and a corresponding detected respective value of the operating parameter may be provided. During a normal operating mode, an operating value of the operating parameter may be determined. A performance level of the system based on a test value retrieved from memory dependent upon the operating value and the association may then be determined.