Abstract: A stiffener includes an integrated cable-header recess that couples a semiconductor package substrate flexible cable. The flexible cable connects to a device on a board without using interconnections that are arrayed through the board. A semiconductive die is coupled to the semiconductor package substrate and flexible cable through the cable-header recess.

Abstract: A method for utilizing a probe card includes steps as follows. Providing a probe card having three alignment marks on a reference plane of a circuit board; moving the circuit board to be oriented to a wafer-loading plane of a wafer stage with the reference plane; determining whether a geometric plane defined by the alignment marks is parallel to the wafer-loading plane; and when the geometric plane is not parallel to the wafer-loading plane, adjusting a levelness of the circuit board until the reference plane is parallel to the wafer-loading plane.

Abstract: A probe apparatus has probe wires with a contact pattern on one side. The contact pattern is for contacting a respective contact pattern on another test equipment or component, such as a circuit board. The probe wires have tips that probe a device desired for testing. Signals are transmitted through the probe wires from the probe card, for example, through a circuit board to other diagnostic equipment. The contact of the probe card with the circuit board allows signals to be transferred through the probe wires to the other diagnostic equipment. On another side of the probe card is a connector structure. The connector structure includes a retainer that can allow the probe card to be replaced from a test system, such as allowing it to be connected and disconnected from a holder.

Abstract: An electric machine includes a first active part, which has a plurality of active part segments disposed one behind the other in a direction of movement of the electric machine, with each of the active part segments including a position measuring device, and a second active part with a measuring device for identifying the respective position measuring device. Each position measuring device has at least one position measuring unit having a dielectric constant, wherein the dielectric constant of the position measuring unit in one of the active part segments is different than the dielectric constant in an adjacent one of the active part segments. The measuring device includes at least one measuring unit to determine the dielectric constant of the position measuring units.

Abstract: An inverter device for feeding electrical energy from a DC-power source into a power grid includes a pair of bus lines to be connected to the DC-power source; a plurality of capacitors connected in series between the bus lines; a surveying topology surveying an integrity of the plurality of capacitors, and to provide a signal indicating a loss of integrity of one capacitor of the plurality of capacitors; a voltmeter measuring a voltage drop over the plurality of capacitors; a DC/AC-inverter; and a controller. in case of the signal indicating a loss of integrity of one capacitor of the plurality of capacitors, the controller compares the voltage drop over the plurality of capacitors to a lost integrity threshold voltage value, and reduces a current load to the plurality of capacitors by reducing the power uptake of the DC/AC-inverter, when the voltage drop exceeds the lost integrity threshold voltage value.

Abstract: A method for measuring a capacitance using a capacitance meter. The capacitance meter includes an AC power source with a controllable frequency which is fed to a capacitor to measure its capacitance. A first measurement of the capacitance is performed by the capacitance meter using a first frequency. When the first measurement of the capacitance indicates the capacitance is below a threshold capacitance a lower capacitance measurement is performed in the capacitance meter, using a second measurement of the capacitance using a second frequency. When the first measurement of the capacitance indicates the capacitance is above a threshold capacitance, a higher capacitance measurement is performed in the capacitance meter, using a second measurement of the capacitance using a third frequency, the third frequency being lower than the second frequency.

Abstract: A system and method for testing capacitance of a load circuit connected to an output pin of a driving circuit In one embodiment, the method may comprise driving a voltage at the output pin to a first voltage; a predetermined current to the output pin; comparing the voltage at the output pin to a reference voltage; and when the voltage at the output pin matches the reference voltage, generating an estimate of capacitance present at the output pin based on a number of clock cycles occurring between an onset of a timed voltage change period and a time at which the voltage at the output pin matches the reference voltage.

Abstract: The invention relates to a logging tool (1) for determining properties of a fluid (2) surrounding the tool arranged downhole in a casing (3) comprising a wall (4) and having a longitudinal extension. The logging tool has a substantially longitudinal cylindrical shape with a longitudinal axis and, when seen in cross-section, a periphery (5). Moreover, the logging tool comprises a plurality of electrodes (6) arranged spaced around the longitudinal axis in the periphery of the tool so that the fluid flows between the electrodes and the casing wall and a means for measuring the capacitance between two electrodes in all possible combinations giving n*(n?1)/2 capacitance measurements for n electrodes.

Abstract: A capacitance-sensing device including a current-to-voltage converter and an analog-to-digital converter is described. A sense element is coupled to an input of the current-to-voltage converter. The current-to-voltage converter is configured to convert current changes in the coupled sense element to an output voltage and to maintain a constant voltage at the input. The analog-to-digital converter is configured to convert the output voltage generated by the current-to-voltage converter to a digital value.

Abstract: A capacitive touch sensing device by detecting induced electric field includes a differential amplifier, a resistor and a signal judgment circuit. The differential amplifier is electrically connected to a touch sensor. The resistor is electrically connected to a first input end and a second input end of the differential amplifier. The signal judgment circuit is electrically connected to an output end of the differential amplifier. As the touch sensor receives an induced electric field signal, the induced electric field signal is amplified by the differential amplifier and the signal judgment circuit determines whether the amplified induced electric field signal is a touch input.

Abstract: A sensor has a strip resonator filter that energizes an emitter patch which emits an electric field out from the strip resonator filter (away from the strip resonator filter). The capacitance of the filter, or specifically the coupling capacitance and radiation pattern of the slotted patch, is altered when an object such as a finger is near the sensor. Resulting changes in a signal outputted by the filter can be used to determine how close the object is to the sensor. The strip resonator filter may be a half wavelength strip resonator coupled filter having three separate strips. The patch may have a slot and two accompanying strips. An arrangement of multiple sensors may detect the position of an object in two or three dimensions.

Abstract: A position alignment of a transfer point of a transfer arm is performed by using a position detecting method. The method includes: detecting electrostatic capacitances in relation with a reference object for position alignment by a plurality of electrostatic capacitance detecting electrodes provided on a surface of the substrate body; communicating with each electrostatic capacitance detecting electrode and controlling a detection of each electrostatic capacitance detecting electrode; and calculating coordinates (x, y) of the reference object with respect to the substrate body based on a preset relationship between electrostatic capacitance values of multiple electrostatic capacitance detecting electrodes and a position of the reference object with respect to the substrate body.

Abstract: Methods and structures for testing a microelectronic packaging structure/device are described. Those methods may include placing a device in a floating carrier, wherein the floating carrier is coupled to a socket housing by pin dowels disposed in four corners of the socket housing, and wherein at least two actuating motors are disposed within the socket housing, and micro adjusting the device by utilizing a capacitive coupled or a fiber optic alignment system wherein a maximum measured capacitance or maximum measured intensity between alignment structures disposed in the socket housing and alignment package balls disposed within the device indicate optimal alignment of the device. Methods further include methods for active co-planarity detection through the use of a capacitive-coupled techniques.

Abstract: The testing of a multi-touch sensor panel for opens and shorts on its drive and sense lines is disclosed by placing a substantially ungrounded conductor diagonally over the touch sensor panel so that at least a portion of every drive line and every sense line is covered by the substantially ungrounded conductor. Pixels under the substantially ungrounded conductor can have strongly positive pixels, while pixels outside the substantially ungrounded conductor can have negative pixels. With the substantially ungrounded conductor in place, a backdrop of negative pixels is formed, and an image of touch can be obtained. By analyzing the image of touch, any opens and shorts on the drive and sense lines, any shorts between a drive and a sense line, or any open drive and sense lines can be quickly identified against the backdrop of negative pixels.

Abstract: An input apparatus with integrated detection sections of electromagnetic type and capacitive type is disclosed. The apparatus comprises a substrate, a control device and at least one signal processing device on the substrate. The substrate comprises an electromagnetic sensor coil layout and a capacitive sensor layout.

Abstract: A probe card has a thin film substrate having projection electrodes on a first surface facing the semiconductor wafer and at a position facing the pad electrodes, a non-contact electrode, and first electrodes provided a second surface opposite to the first surface; and a wiring substrate having second electrodes disposed at a side opposite to the semiconductor wafer in the thin film substrate and at a position facing the first electrodes. The wiring substrate and the thin film substrate form a first sealed space and the thin film substrate and the semiconductor wafer form a second sealed space. By reducing the pressure in the first and the second sealed space, the first and the second electrodes are brought into close contact with each other and the pad electrodes and the projection electrodes are brought into close contact with each other, and the pressure of each of the first and second sealed space can be independently adjusted.

Abstract: An input device is disclosed, including a first drive electrode comprising a resistive material and a first sense electrode disposed proximate to the first drive electrode. The input device further includes a processing system which is coupled with the first drive electrode and the first sense electrode. In one embodiment, the processing system is configured for electrically driving a first end of the first drive electrode and electrically driving a second end of the first drive electrode to cause a change in a voltage gradient along a length of the first drive electrode. In such an embodiment, the change in the voltage gradient generates a first electrical signal in the first sense electrode. The processing system also acquires a first measurement of the first electrical signal and determines positional information along the length of the first drive electrode based upon the first measurement, wherein the positional information is related to an input object.

Abstract: A detector circuit for detecting the presence of a remote capacitive sensor having at least two terminals connected via a protection circuit that includes one or more capacitors, the detector circuit comprising: a current supply for changing the charge on the sensor and the protection circuit, a detector for measuring the voltage on one or more of the terminals; wherein the presence of the sensor is determined by changing the charge on the capacitive sensor and the one or more capacitors of the protection circuit in a predetermined manner such that the voltage measurement on the one or more terminals when the sensor is present is significantly different than when the sensor is absent.

Abstract: Embodiments provide systems, devices, methods, and machine-readable medium for automated debugging of a design under test in a verification environment as part of electronic design automation. Embodiments may automatically identify inputs that are relevant to a bug for a device under test. A failing test run may be taken and rerun several times with small changes in the inputs. If the test is passing, the mutated inputs may be important to reproduce the bug and may be marked as “suspicious”. The result of this process may be a list of suspicious inputs and a shorter and simpler test that still fails. The shorter test may be rerun and fields of the inputs recorded. New tests may be created with mutated fields. Mutated fields that result in passing tests may be considered suspicious fields. Suspicious inputs and fields may be presented to a user as part of an electronic design process.

Abstract: A test system for testing a capacitive touch sensor is provided. The test system includes a resistor, a signal generator and a micro controller. A first end of the resistor is electrically connected to a sensing port of the capacitive touch sensor. The signal generator provides a test voltage to a second end of the resistor according to control information. In this way, the resistor generates a test current according to the test voltage, and the capacitive touch sensor provides a voltage difference to the sensing port according to a plurality of switching signals, and converts the test current into test information. The micro controller generates the control information according to a test table, and compares the test information according to the test table, so as to determine whether an operation of the capacitive touch sensor is normal.

Abstract: Methods and related systems are described for determining the casing attenuation factor for various frequencies from measurements of the impedance of the transmitting or receiving coil of wire of. The compensation is based on two relationships. The first relationship is between one or more measured impedance parameters and the product of casing conductivity, casing thickness and electromagnetic frequency. The second relationship is between the casing correction factor and the product of casing conductivity, casing thickness and electromagnetic frequency.

Abstract: In one embodiment, a method for production testing of a capacitive touch sensing device is disclosed. In this embodiment, the present technology for production testing of a capacitive touch sensing device samples a first value corresponding to a first channel of a capacitive touch sensing device when the capacitive touch sensing device is in production. The present embodiment also samples a second value corresponding to the first channel of the capacitive touch sensing device when the capacitive touch sensing device has a self-test capacitive circuit applying a signal thereto. The present embodiment compares the first value and the second value to determine a production testing result for the first channel of the capacitive touch sensing device, wherein the sampling of the second value and the comparing the first value and the second value occur during production of the capacitive touch sensing device.

Abstract: An apparatus includes: a strip line cell 100 having a first conductor board that has the width larger than the width of RFID tag T1 that receives a predetermined radio wave signal and reacts, to which first conductor board an electric signal that corresponds to the radio wave signal is supplied from outside, and a second conductor board opposed to the first conductor board, wherein the RFID tag T1 is arranged on other side with the opposite side opposed to the second conductor board, of the first conductor board that transmits the radio wave signal with an output according to an electric power that the electric signal possesses; a reader writer 20 that supplies the electric signal to the first conductor board of the strip line cell 100; and a computer 30 that confirms presence of reaction in the RFID tag T1.

Abstract: A position alignment of a transfer point of a transfer arm is performed by using a position detecting wafer capable of being loaded into an apparatus having a thin transfer port. The position detecting wafer S includes an electrostatic capacitance detecting sensor 50 for detecting an electrostatic capacitance in relation with a reference object for the position alignment. The electrostatic capacitance detecting sensor 50 includes a plurality of electrostatic capacitance detecting electrodes 52, each forming the electrostatic capacitance in relation with the reference object; and a control circuit 51 for controlling a detection of the electrostatic capacitance by each electrostatic capacitance detecting electrode 52, while communicating with each electrostatic capacitance detecting electrode 52. The electrostatic capacitance detecting electrodes 52 are provided on a rear surface of the position detecting wafer S, and the control circuit 51 is provided on a front surface of the position detecting wafer S.

Abstract: Methods and structures for testing a microelectronic packaging structure/device are described. Those methods may include placing a device in a floating carrier, wherein the floating carrier is coupled to a socket housing by pin dowels disposed in four corners of the socket housing, and wherein at least two actuating motors are disposed within the socket housing, and micro adjusting the device by utilizing a capacitive coupled or a fiber optic alignment system wherein a maximum measured capacitance or maximum measured intensity between alignment structures disposed in the socket housing and alignment package balls disposed within the device indicate optimal alignment of the device. Methods further include methods for active co-planarity detection through the use of a capacitive-coupled techniques.