Abstract: A hybrid probe head assembly for testing a wafer device under test includes a housing, at least a portion of a lead frame assembly disposed in the housing, the lead frame assembly including a at least one cantilever portion, the at least one cantilever portion including an undeflected position and a deflected position, where the lead frame assembly hinges between the undeflected position and the deflected position at a lead frame pivot point, and the at least one cantilever portion extends to a wafer contact. In the undeflected position, the at least one cantilever portion is disposed at a 8-12 degree angle, and in the deflected position, the at least one cantilever portion is disposed at a 2-4 degree angle. One or more spring probes are disposed within the housing and have a wafer contact tip.

Abstract: An inspection apparatus for inspecting output signal of a semiconductor device is provided with a monitor device configured to sense a signal on the monitor line and a plurality of inspection circuits connected to the monitor line. Each inspection circuit is provided with a semiconductor device support allowing a semiconductor device to be set thereon and including a signal terminal to which a signal is input from the set semiconductor device, a first resistor connected between the signal terminal and the monitor line, a selector terminal, and a first diode connected between the signal terminal and the selector terminal so that a cathode of the first diode is connected to a selector terminal side.

Abstract: Embodiments of the present invention are directed to adjustable test probe tips that are indexable. In one embodiment a mechanism is coupled to a probe tip so that the mechanism may be used to index the probe tip to a plurality of particular positions. A label portion may be provided to communicate to a user that the length of the exposed probe tip is less than a particular length, such as the maximum length an exposed probe tip may be for a particular application.

Abstract: A testing probe card for wafer level testing semiconductor IC packaged devices. The card includes a circuit board including testing circuitry and a testing probe head. The probe head includes a probe array having a plurality of metallic testing probes attached to a substrate including a plurality of conductive vias. In one embodiment, the probes have a relatively rigid construction and have one end that may be electrically coupled to the vias using a flip chip assembly solder reflow process. In one embodiment, the probes may be formed from a monolithic block of conductive material using reverse wire electric discharge machining.

Abstract: A dual probing tip system uses a slot and rail system to provide variable spacing and lateral and axial compliance of the probing tips mounted on first and second support members. A movable base member is secured on a frame with the base member having a rack of linear teeth and a pair of rails angled toward the front. First and second intermediate carriers each have a slot that engages one of the angled rails. Each of the carriers has stanchions that receive a thumb wheel pinion gear mounted on a shaft. The pinion gear mates with the teeth on the base member for movement of the carriers. Each support member has an axial slot that mated with an axial slot on each one of the carriers. Each support member has a compression spring which allows axial compliance of the support members.

Abstract: A testing probe card for wafer level testing semiconductor IC packaged devices. The card includes a circuit board including testing circuitry and a testing probe head. The probe head includes a probe array having a plurality of metallic testing probes attached to a substrate including a plurality of conductive vias. In one embodiment, the probes have a relatively rigid construction and have one end that may be electrically coupled to the vias using a flip chip assembly solder reflow process. In one embodiment, the probes may be formed from a monolithic block of conductive material using reverse wire electric discharge machining.

Abstract: A contactor includes a contactor base material including a first material and a conductor film including a second material. The conductor film is formed only on a contact surface with an electrode of a semiconductor apparatus at a tip of the contactor film.

Abstract: A testing probe card for wafer level testing semiconductor IC packaged devices. The card includes a circuit board including testing circuitry and a testing probe head. The probe head includes a probe array having a plurality of metallic testing probes attached to a substrate including a plurality of conductive vias. In one embodiment, the probes have a relatively rigid construction and have one end that may be electrically coupled to the vias using a flip chip assembly solder reflow process.

Abstract: A probe card assembly can include a plurality of probes disposed on a substrate and arranged to contact terminals of a semiconductor wafer. Switches can be disposed on the probe card assembly and provide for selective connection and disconnection of the probes from electrical interconnections on the probe card assembly.

Abstract: A probe card includes a plurality of probes that contacts a plurality of electrodes provided in the semiconductor wafer and that inputs or outputs an electrical signal in or from the electrodes, a probe head that holds the probes, a substrate having a wiring which is provided near the surface of the substrate facing the probe head so as to be contactable with the probe head and is connected to the probes, a core layer formed of a material which is buried in the substrate and has a coefficient of thermal expansion lower than that of the substrate, and a connecting member that electrically connects at least some of the probes with an external device via the wiring.

Abstract: Embodiments of the present invention are directed to adjustable test probe tips that are indexable. In one embodiment a mechanism is coupled to a probe tip so that the mechanism may be used to index the probe tip to a plurality of particular positions. A label portion may be provided to communicate to a user that the length of the exposed probe tip is less than a particular length, such as the maximum length an exposed probe tip may be for a particular application.

Abstract: Provided is a probe card which has a space transformer which may be effectively changed to correspond to a change in wafer chip structure and is capable of maximizing acceptable channels of the space transformer.

Abstract: A probe card assembly can include a plurality of probes disposed on a substrate and arranged to contact terminals of a semiconductor wafer. Switches can be disposed on the probe card assembly and provide for selective connection and disconnection of the probes from electrical interconnections on the probe card assembly.