Abstract: A trace embedded probe device includes a circuit board including an insulating layer unit whose upper surface has first recesses and a second recess located therebetween, grounding traces and a signal trace whose trace main bodies are disposed in the recesses respectively and flush in elevation with the upper surface, and a grounding layer disposed on a lower surface of the insulating layer unit and connected with the grounding traces by conductive vias penetrating through the first recesses and the lower surface and provided therein with conductive layers. The trace main bodies, grounding layer and conductive layers are made of a same metal material. Probes are disposed on the grounding and signal traces respectively. The probe device is easy in control of distance, width, thickness and surface roughness of the traces, and beneficial to achieve the requirements of thin copper traces, fine pitch and high frequency testing.

Abstract: A probe unit includes: first contact probes each coming into contact with a target electrode on one end side in a longitudinal direction; a second contact probe connected to an external ground; a signal pipe disposed around each first contact probes; a ground member provided around each signal pipe and configured to form an air layer with the signal pipe; a probe holder including a plate-shaped first and second members; a first wiring part provided at least on a front surface of the first member and electrically connected to the second contact probe; a second wiring part provided at least on a front surface of the second member and electrically connected to the second contact probe; a first conductive unit configured to electrically connect the first wiring part and the ground member; and a second conductive unit configured to electrically connect the second wiring part and the ground member.

Abstract: A physical property of a test sample with a conductive or semi-conductive material (line/area/volume) is obtained. Periodic Joule heating is induced within the test sample by passing an AC current across a first pair of probe terminals electrically connected to the test sample, measuring the voltage drop across a second pair of probe terminals electrically connected to the test sample at one and three times the fundamental excitation frequency of the current-conducting terminals, and calculating the temperature-modulated property/properties of the test sample as a function of the potential drop measurement(s). This includes: a) determining a value proportional to the TCR of the test sample, b) a geometric parameter of the test sample (affected by coupling of its TCR to heat transport to/from the test sample), or c) the true resistivity of the test sample at the ambient experimental temperature by subtracting measurable and accountable TCR offset(s).

Abstract: A display device includes a display area and a non-display area adjacent to the display area; a first scan line that extends in a row direction and transmits a first scan signal; a first pixel part electrically connected to the first scan line; a second pixel part electrically connected to the first scan line and spaced apart from the first pixel part in the row direction; and a first inspection pad disposed between the first pixel part and the second pixel part and electrically connected to the first scan line.

Abstract: An electronic component measuring equipment includes a first mounting platform, a second mounting platform, an actuating device, a current output module, a switching device and an optical measuring component. Multiple probe pairs are disposed on a probe substrate mounted on the first mounting platform. Multiple under-test electronic components are disposed on a testing substrate mounted on the second mounting platform. The actuating device is configured to make at least partial of the probe pairs on the probe substrate in contact with at least partial of under-test electronic components. The current output module provides a constant current to the probe substrate, and conducting loops are formed between the probe pairs and the under-test electronic components in contact therewith. The switching device switches the constant current to each probe pairs. The optical measuring component measures light signals generated by the under-test electronic components.

Abstract: A probe for an electrical testing device has an independently powered integrated light source. The probe has a plurality of lights oriented in a cross-like configuration and housed in a recessed surface of the probe. The plurality of lights projects light beams that extend toward the tip of the probe and illuminate the area directly in front of the tip from 360 degrees. The integrated light source is connected to a power source that is housed in the probe but is independent from the power source used for the electrical testing device.

Abstract: A contact probe for a testing head for testing electronic devices includes a rod-like body made of a first conductive material and extending along a longitudinal axis, and a contact tip supported by the body at an end portion thereof. The contact tip is made of a second conductive material that is different from the first conductive material. The contact tip includes a contact zone configured to perform mechanical and electrical contact with contact pads of a device under test. The body and the contact tip include respective contact surfaces in contact with each other. The contact surfaces are complementary to each other and include respective connection elements engaging each other. The connection elements include a protruding element projecting from the contact surface of one among the body and the contact tip, and a recess made in the other among the body and the contact tip.

Abstract: An electronic test device includes a test seat and at least one probe. The test seat has a hole-defining surface that defines a probe hole, and has two positioning sections being proximate respectively to two ends of the probe hole opposite to each other, at least one first protrusion that protrudes inwardly from the at least one positioning sections of the hole-defining surface, and at least one second protrusion that protrudes inwardly from the hole-defining surface between the positioning sections. The at least one probe is positioned in the probe hole. A thickness of each of the at least one first protrusion and the at least one second protrusion ranges from five to thirty percent of a depth of the probe hole.

Abstract: Methods of semiconductor arrangement formation are provided. A method of forming the semiconductor arrangement includes forming a first nucleus on a substrate in a trench or between dielectric pillars on the substrate. Forming the first nucleus includes applying a first source material beam at a first angle relative to a top surface of the substrate and concurrently applying a second source material beam at a second angle relative to the top surface of the substrate. A first semiconductor column is formed from the first nucleus by rotating the substrate while applying the first source material beam and the second source material beam. Forming the first semiconductor column in the trench or between the dielectric pillars using the first source material beam and the second source material beam restricts the formation of the first semiconductor column to a single direction.

Abstract: It is described a contact probe for a testing head of an apparatus for testing electronic devices including a body essentially extended along a longitudinal direction between a contact tip and a contact head, that contact probe comprising at least one multilayer structure, in turn including a superposition of at least one inner layer or core and a first inner coating layer, and an outer coating layer that completely covers the multilayer structure and made of a material having a higher hardness than a material realizing the core.

Abstract: A conductive micro pin includes a body having a first end surface, a second end surface, a first side surface connecting the first end surface and the second end surface, and a first corner between the first end surface and the first side surface, in which the first side surface is substantially flat, and the first corner is substantially rounded.

Abstract: A high accuracy electrical test interconnect method employs a tester interface transfer block to enable the transfer of electrical contact from less accurate tester resource probes to target probes which are contained in the tester interface transfer block and can be positioned with high accuracy using the three dimensional printing to enable reliable contact with smaller test pads. The target probes can directly contact the tester resource probes or a transfer plate can be interposed between the target probes and the tester resource probes to allow positional adjustment of the target probes relative to the tester resource probes. This invention also includes the use of specialized shape target probes that can contact circuit board objects, such as vertical conductive surfaces and irregular shape test pads that have not been accessible with traditional methods.

Abstract: A display device including a display panel having panel pad units including a first panel pad unit having first pads arranged in a first column and a second panel pad unit having second pads arranged in a second column; a first member coupled to at least one of the first and second panel pad units; and a second member coupled to the first member and including a plurality of test pads, and wherein the first member includes lines electrically connecting a respective one of the plurality of test pads with a respective one of the first and second pads.

Abstract: A gas turbine engine comprises a turbine within a turbine case defining a hot combustion gas path. The turbine case has an inner port. An outer case is disposed radially outward from the turbine case. The outer case has an outer port. A sleeve releasably engages the outer port and the inner port. A sensor is mounted to a distal end of the sleeve. The sensor has a probe extending through the inner port into the hot combustion gas path.

Abstract: An electrical-test apparatus is provided, which includes a MEMS array. In an example, the MEMS array comprises a plurality of tester interconnect structures cantilevered from first terminals on a first side of a substrate. The tester interconnect structures may have a first diameter. In an example, the MEMS array comprises a plurality of through-substrate vias that extend through the substrate, the vias having a second diameter larger than the first diameter. In an example, individual ones of the vias electrically couple individual ones of the tester interconnect structures to corresponding ones of second terminals on a second side of the substrate.

Abstract: Embodiments relate to the formation of test probes. One method includes providing a bulk sheet of an electrically conductive material. A laser is used to cut through the bulk sheet in a predetermined pattern to form a test probe. Other embodiments are described and claimed.

Abstract: A prober head to interface an E-testing apparatus to a device under test, which may be an unpackaged die, for example. In some embodiments, the prober head includes an array of conductive pins, each of the pins extending outwardly from a first pin end anchored to a substrate. At least a partial length of each of the pins is coated with a hydrophobic monolayer. The conductive pins may be composite metal wires including a core metal encased by one or more peripheral metal. At a tip of the pins, opposite the first pin end anchored to the substrate, the peripheral metals are recessed from the core metal. In further embodiments, the hydrophobic monolayer is disposed on an outer surface of the peripheral metals, but is substantially absent from a surface of the core metal exposed at the tip.

Abstract: An electric power measuring device, consisting of a casing, which is provided with a first end, a second end, and a first through hole; a detection circuit board, which is mounted within the casing, and a switch and an indicator light set are mounted on the detection circuit board; an input pin set, which is mounted on the circuit board, moreover, a contact end of the input pin set passes through the area at the first end and is exposed external of the casing; an output pin set, which is contained within the casing and positioned at the second end; and a coil, which is mounted within the casing and encircles the first through hole. In addition, two ends of the coil are respectively connected to any one of the pins of the input pin set and any one of the pins of the output pin set.

Abstract: The instant disclosure provides a probe assembly and a probe structure thereof. The probe structure includes a metal main portion, a covering layer and an insulating layer. The metal main portion has a first end portion, a second end portion corresponding to the first end portion, a connecting portion connected between the first and the second end portions and a surrounding surface surrounding the first end portion, the second end portion and the connecting portion. The covering layer includes a first covering layer disposed on a surrounding surface located on the first end portion, a second covering layer disposed on a surrounding surface located on the second end portion and a third covering layer disposed on a surrounding surface located on the connecting portion. The insulating layer is disposed on the third covering layer for exposing the first and second covering layer.

Abstract: Described are probe assemblies that include multiple layers, including at least one layer of probe bodies; suspension assemblies and components thereof, e.g., head gimbal assemblies, that include a probe assembly as described; and methods of using the probe assemblies and suspension assemblies.

Abstract: Methods of fabricating semiconductor devices and Radio Frequency (RF) components are provided. The method includes providing a circuit layout on a semiconductor layer and providing one or more sacrificial connections to connect bump pads in the circuit layout. The method also includes testing the circuit layout using the one or more sacrificial connections and removing at least a portion of the one or more sacrificial connections. In this way, the performance of the semiconductor device is improved by reducing or avoiding capacitive or inductive leakage paths that can be caused by leftover materials.

Abstract: An electronic apparatus comprising: 1) a first circuit board; 2) a second circuit board substantially parallel to the first circuit board; and 3) an electrical assembly coupled between the first and second boards. The electrical assembly comprises: i) a housing; ii) a plurality of pogo pin connectors disposed within and projecting from the housing and configured to make electrical contact with the first and second circuit boards; and iii) a plurality of capacitors disposed within the housing and configured to form electrical connections with selected ones of the plurality of pogo pin connectors.

Abstract: A probe for making electrical contact with a device-under-test test point includes a body, a rigid member capable of travelling linearly with respect to the body, a flexible arm having a test point contact at one end and fastened to the rigid member at the other end, and a flexible linkage fixed to the body and to the flexible arm. The flexible linkage is structured to cause the flexible arm to bend in response to travel of the rigid member in one direction, and to cause the flexible arm to unbend in response to travel of the rigid member in the other direction. A second flexible arm may be included, the two arms opening and closing to change the distance between test point contacts. A light source may be disposed on a portion of the flexible linkage that simultaneously articulates to automatically track the orientation of the test point contact.

Abstract: A block has a planar portion abutting a back side of a contact region of a flexible substrate, and a recess that is concave with respect to the planar portion. An electronic component mounted on the flexible substrate is located within the recess. When viewed from a direction perpendicular to the planar portion, the recess is located at a position near a power supply bump, except at a position overlapping the power supply bump, or the recess is filled with a filler. The planar portion of the block abuts only the back side of the power supply bump.

Abstract: To provide a probing device and a probing method for an electronic device capable of confirming whether or not an electrical inspection has been executed appropriately, with an electrode pad being made in contact with a probe with a predetermined pressure, by utilizing a change in external shapes to be formed on the electrode pad when the probe and the electrode pad are pressed onto each other.

Abstract: Assembly methods and apparatus for electrically stable connectors are described herein where a conductive wire assembly generally comprises an insulative substrate having a length, one or more conductive elements formed along a first direction upon the substrate, an insulative coverlay formed upon the one or more conductive elements, and at least one opening or window defined through the insulative coverlay exposing a portion of the one or more conductive elements. A conductive coating is formed upon the insulative coverlay such that the conductive coating is in contact with the portion of the one or more conductive elements through the at least one opening or window and the conductive coating may have at least one region removed along a second direction in proximity to the at least one opening or window such that one or more conductive pads are formed and are electrically isolated from a remainder of the conductive coating.

Abstract: A semiconductor device structure and method for forming the same are provided. The semiconductor device structure includes a substrate and a conductive pad formed over the substrate. The semiconductor device structure includes a protection layer formed over the conductive pad, and the protection layer has a trench. The semiconductor device structure includes a conductive structure formed in the trench and on the protection layer. The conductive structure is electrically connected to the conductive pad, and the conductive structure has a concave top surface, and the lowest point of the concave top surface is higher than the top surface of the protection layer.

Abstract: An integrated apparatus and method to provide test, diagnostics and characterization access to backplane electrical signals during electronic product development is presented. The apparatus removes need for manual and ad hoc connections made in an engineering laboratory or assembly line which make the process prone to damage of the components, inaccurate measurements and arbitrary fluctuations in function. The method and apparatus is a mechanized way to connect backplane signals to corresponding drivers, receivers and test equipment through probes placed on equidistant electrical traces, reducing inter signal variations.

Abstract: A probe pin (100, 100?) for electronic testing of semi-conductor elements is provided. The pin contains an electrically conductive core element (200) made up of a metallic alloy, and an electrically insulating jacket element (300) which surrounds the core element (200) over regions thereof. The core element (200) contains a distal contact section (210) for electrical contacting to a semi-conductor element. The metallic alloy of the core element contains at least 67% by weight rhodium, 0.1% by weight to 1% by weight zirconium, up to 1% by weight yttrium, and up to 1% by weight cerium. A method for producing a probe pin is also described.

Abstract: In a testing device, a method for implementing automatic RF port testing. The method includes attaching a device under test having a plurality of RF pins to a load board, dynamically tuning a plurality of RF ports of the load board to the plurality of RF pins, and automatically matching the plurality of RF ports to the plurality of RF pins with respect to impedance. The method further includes implementing an RF port testing process on the device under test.

Abstract: A manufacturing method of a semiconductor device is provided with an inspecting of a semiconductor substrate by an inspection method, the method including heating the semiconductor substrate, measuring first and second characteristics. The measuring of a first characteristic is performed by bringing a plurality of probes into contact with the heated semiconductor substrate and making a first electric current flow in the semiconductor substrate. The measuring of a second characteristic is performed, after the measuring of the first characteristic, by bringing a plurality of probes into contact with the heated semiconductor substrate and making a second electric current flow in the semiconductor substrate. A number of the plurality of probes used in the measuring of the second characteristic is larger than a number of the plurality of probes used in the measuring of the first characteristic. The second electric current is larger than the first electric current.

Abstract: A semiconductor device includes a first wafer having i) a plurality of semiconductor dies, ii) a plurality of scribe lines adjacent one or more of the semiconductor dies, iii) a test access interface positioned in one or more of the scribe lines, wherein the test access interface has a first plurality of through-substrate conductors with a standardized physical layout, and iv) electrical couplings between at least some of the through-substrate conductors and at least one of the semiconductor dies. Methods, apparatus and systems for testing this and other types of semiconductor devices are also disclosed.

Abstract: An electrical contactor has a contact portion that is pressed onto a terminal of an electronic device and is electrically connected. When the dimension of the contact portion is S1, the contact dimension of the contact portion and the terminal of the electronic device is V, the amount of sliding of the contact portion is W, and the additional element including at least positional accuracy of the contact portion is X, the dimension of the contact portion S1 satisfies S1>V+W+X. In a contact method for the electrical contactor, when the sum of a clearance on the front end side in the sliding direction in starting contact and a clearance on the back end side in the sliding direction in ending contact is X3, the crushed area S2 of the terminal is set to satisfy a relationship of S2<S1?X3.

Abstract: A connection terminal for a power module, includes a conductive wire that is wound to form the connection terminal. The conductive wire includes an insertion part, at least a part of which is closely wound and to be inserted into a hollow part of a holding member of the power module, and includes a press-fitting part having a diameter larger than a diameter of the hollow part, a rough winding part in which the wire is wound at a predetermined interval, and a contact part for coming into contact with an external circuit, the contact pert being provided at an end part of the rough winding part on a side different from the end part on a side of the insertion part.

Abstract: Improved probing of closely spaced contact pads is provided by an array of vertical probes having all of the probe tips aligned along a single contact line, while the probe bases are arranged in an array having two or more rows parallel to the contact line. With this arrangement of probes, the probe base thickness can be made greater than the contact pad spacing along the contact line, thereby advantageously increasing the lateral stiffness of the probes. The probe tip thickness is less than the contact pad spacing, so probes suitable for practicing the invention have a wide base section and a narrow tip section.

Abstract: A probe having a conductive body and a contacting tip that is terminated by one or more blunt skates for engaging a conductive pad of a device under test (DUT) for performing electrical testing. The contacting tip has a certain width and the blunt skate is narrower than the tip width. The skate is aligned along a scrub direction and also has a certain curvature along the scrub direction such that it may undergo both a scrub motion and a self-cleaning rotation upon application of a contact force between the skate and the conductive pad. While the scrub motion clears oxide from the pad to establish electrical contact, the rotation removes debris from the skate and thus preserves a low contact resistance between the skate and the pad. The use of probes with one or more blunt skates and methods of using such self-cleaning probes are especially advantageous when testing DUTs with low-K conductive pads or other mechanically fragile pads that tend to be damaged by large contact force concentration.

Abstract: A multilayer wiring board including a build-up layer, formed from one or more conductor and resin insulation layers that are layered one on top of the other, having conductive pads formed on a surface of at least one resin insulation layer so as to project from the surface are provided. The conductive pads may each include a columnar portion situated at a lower part thereof and a convex portion situated at a higher part thereof, wherein a surface of the convex portion may assume a continual curved shape. A solder layer may be formed over an upper surface of the conductive pads. Certain embodiments make it possible to minimize or eliminate the concentration of stress on the conductive pads, and may inhibit the occurrence of defective connections to a semiconductor element and infliction of damage to the conductive pads.

Abstract: A coated probe is provided. The probe includes a probe body and a cladding layer. The probe body has a terminal. The cladding layer covers the surface of the terminal of the probe body, wherein the cladding layer includes a carbon nano-material layer, and the carbon nano-material layer includes a carbon nano-material.

Abstract: The present invention relates to a probe apparatus for testing the quality of semiconductor chips, wherein the probe apparatus for testing chips has superior reliability and durability. The probe apparatus of the present invention comprises: a printed circuit board having a center with a through-hole; a pin holder which is attached to the front surface of the printed circuit board and which has a plurality of pinholes; a plurality of probe pins, each of which has an L-shape with a horizontal end connected to one side end of a circuit pattern formed on the printed circuit board, and a vertical end exposed outwardly from the upper surface of the pinhole; and a back cover attached to the back surface of the printed circuit board.

Abstract: A tester includes a main body and a removable probe. The main body includes a main body probe and a front panel including selectable options for selecting a tester function. The removable probe may be coupled to the main body via a cord. The removable probe is fixable to the main body via a latch assembly. The latch assembly including a socket disposed on one of the removable probe or the main body and a mating protrusion disposed at the other of the removable probe or the main body, the main body having a probe support ridge associated therewith and the removable probe having an alignment ridge associated therewith, the alignment ridge and the probe support ridge lying in a same plane when the mating protrusion is inserted into the socket.

Abstract: A circuit structure of a test-key and a test method thereof are provided. The circuit structure comprises a plurality of transistors, a first conductive contact, a plurality of second conductive contacts and a plurality of third conductive contacts. The transistors are arranged in a matrix. The first conductive contact is electrically connected to one source/drain of each transistor in each column of the matrix. Each second conductive contact is electrically connected to the other source/drain of each transistor in a corresponding column of the matrix. Each third conductive contact is electrically connected to the gate of each transistor in a corresponding row of the matrix. In the method, a plurality of driving pulses are provided to the third conductive contacts in sequence, and a plurality of output signals are read from the second conductive contacts to perform an element-character analyzing operation when a row of the transistors is turned on.

Abstract: An apparatus and method providing improved interconnection elements and tip structures for effecting pressure connections between terminals of electronic components is described. The tip structure of the present invention has a sharpened blade oriented on the upper surface of the tip structure such that the length of the blade is substantially parallel to the direction of horizontal movement of the tip structure as the tip structure deflects across the terminal of an electronic component. In this manner, the sharpened substantially parallel oriented blade slices cleanly through any non-conductive layer(s) on the surface of the terminal and provides a reliable electrical connection between the interconnection element and the terminal of the electrical component.

Abstract: A variable pressure probe pin device, including: a housing with a channel having a first longitudinal axis; a probe at least partially disposed in the channel and including a plurality of probe pins configured to measure a property of a conductive layer; and a fluid pressure system configured to supply pressurized fluid o the channel to control a position of the probe within the channel. The housing or the probe is displaceable such that the plurality of probe pins contact the conductive layer.

Abstract: An electrical probe comprises a cylindrical body which has a first end including a plurality of claws and a second end opposite to the first end for cooperating with an electrical test machine, wherein a concave contact surface conforming with the curvature of a solder ball of an electronic device under test is formed between the claws, whereby the first end of the cylindrical body can be brought into line contact with the solder ball at a predetermined length to ensure a proper electrical connection, so that the accuracy of an electrical test can be increased.

Abstract: A planar body is configured such that its edges engage the sidewall of a via of a device under test to create point electrical contacts and the planar body resists removal of the planar body from the via after insertion. The edges of the planar body may include barbs that create point electrical contacts and resist removal of the planar body from the via after insertion. The end of the body that is inserted into the via may form a tapered tip to facilitate insertion. The end of the planar body that is inserted into the via may include barbs that resist removal of the planar body from the via after insertion. The edges of the planar body may include stops that prevent further insertion of the planar body into the via beyond the stops.

Abstract: The present invention discloses a voltage applying device for an LCD substrate, and the voltage applying device includes a base, a probe bar, and probe pins. The base includes a first slide rail. The probe bar is movably disposed on the first slide rail of the base, and the probe bar includes a second slide rail. The probe pins are movably disposed on the second slide rail of the probe bar, and the probe pins are utilized to contact a plurality of contact pads of the LCD substrate, so as to apply voltage on the LCD substrate. The voltage applying device of the present invention can overcome a problem of increased costs for a conventional voltage applying device can not be shared.

Abstract: A voltage clamp circuit for reflecting a voltage at an input node includes a circuit for providing at least two currents at its output terminal, and at least two diodes each being connected to an output terminal of the circuit for providing at least two currents. The diodes also are connected to a line of a ground voltage and to the input node respectively. The circuit includes an alternative current path connected to an output terminal of the circuit for providing at least two currents and to a current sinking node. The voltage at the input node thus is reflected as the voltage between two output nodes when the voltage at the input node is lower than a clamping voltage and so that the voltage is fixed between the two output nodes to the clamping voltage when the voltage at the input node is higher than the clamping voltage.

Abstract: An elastic micro high frequency probe includes a conductor, which includes a stationary body and a movable body. The stationary body has a conductive terminal, a contacting end, and a guider. The movable body has a conductive terminal, a spring mechanism, and a guider. The spring mechanism is connected to the stationary body and to one conductive terminal. The second guider connects to the spring mechanism in such a manner that the compression direction of the spring mechanism is confined by a guiding rail. Since the width of the spring mechanism is not limited by the first and second guiders, the width of the spring mechanism can be enlarged to maximize within limited space. Therefore, the HF probe as a whole can have shortest length while acquiring the predetermined total length of the elastic stroke, such that the transmission performance of the high frequency signals can be effectively enhanced.

Abstract: A test device including cobra probes and a method of manufacturing is disclosed. The test device includes a conductive upper plate having an upper guide hole and a conductive lower plate having a lower guide hole. The test device also includes a conductive cobra probe disposed between the upper guide hole of the upper plate and the lower guide hole of the lower plate. A dielectric material insulates the cobra probe from the upper plate and the lower plate.

Abstract: A contact arrangement is provided, including a contact structure and a sense structure. The sense structure may be arranged in proximity of the contact structure. The sense structure may be configured such that a correct mechanical contacting of the contact structure will not impact the sense structure and an incorrect mechanical contacting of the contact structure will impact the sense structure.