Abstract: An electrical collecting cover for covering an electrostatic gun is disclosed. The electrical collecting cover includes a connecting portion for connecting with a main body of the electrostatic gun, a shielding portion connected to the connecting portion for shielding the main body of the electrostatic gun, a sleeve portion connected to the shielding portion for sheathing with a discharging head of the electrostatic gun, and an electrostatic discharge portion connected to the sleeve portion and located on a side of the discharging head for guiding static electricity from the discharging head of the electrostatic gun as the sleeve portion sheathes with the discharging head of the electrostatic gun.

Abstract: A testing finger (1) comprises a finger-shaped rod (2). A sharp end (3) of the finger-shaped rod (2) is connected with a testing part used for measuring a distance. The testing part is a group of testing heads, and the length of each testing head corresponds to minimum safe distances at different voltage levels in intrusion protection. The testing part is connected with the sharp end (3) of the finger-shaped rod (2) in a detachable insertion manner. The testing finger (1) can accurately determine whether the distance between a live part or a live lead which is not insulated in an electrical device and a protective part is greater than or equal to a minimum safety distance, thereby solving the problem in the prior art that the distance between the sharp end (3) of the finger-shaped rod (2) and the live part or the live lead cannot be accurately measured by a clamp in a situation of limited space.

Abstract: A method for manufacturing a probed for an electrical test includes producing by a deposition technique a deposit including a probe main body portion made of a nickel-boron alloy and a probe tip portion projecting downward from the probe main body portion and made of a different conductive material from the probe main body portion. The method further includes annealing the deposit. The average grain diameter of the nickel-boron alloy is between 97 ? and 170 ?. The contained amount of boron is from 0.02 wt % to 0.20 wt %.

Abstract: The present invention is a silver alloy suitable for use in a probe pin made of an Ag-Cu alloy, wherein the silver alloy comprises 30 to 50% by weight of Cu and Ag as balance. This silver alloy further comprises 2 to 10% by weight of Ni to further improve strength. A probe pin made of these materials has stable contact resistance even under low contact pressure. The probe pin has excellent strength and antifouling property to adhesion of a foreign matter from a contact object due to repetitive use. Thereby, the probe pin usable in a stable manner for a long period of time can be obtained.

Abstract: Fine pitch probe array from bulk material. In accordance with a first method embodiment, an article of manufacture includes an array of probes. Each probe includes a probe tip, suitable for contacting an integrated circuit test point. Each probe tip is mounted on a probe finger structure. All of the probe finger structures of the array have the same material grain structure. The probe fingers may have a non-linear profile and/or be configured to act as a spring.

Abstract: Test structures and method for detecting defects using the same. A probe-able voltage contrast (VC) comb test structure that includes first, second and third probe pads, a comb-like structure including grounded tines, floating tines between the grounded tines, switching devices coupled with an end portion of each floating tine, and connecting the floating tines to the second probe pad, and the third probe pad being a control pad which controls the switching devices. A probe-able VC serpentine test structure that includes first, second, third and fourth probe pads, a comb-like structure including grounded tines, floating tines between the grounded tines and each floating tine connected together between the second and third probe pads, switching devices connected to an end portion of each floating tine and connecting the floating tines to the second and third probe pads, and the fourth probe pad being a control pad which controls the switching devices.

Abstract: Disclosed is an improved probe having a spring portion which allows effective contact with a device under test without requiring a lower die portion. The probe includes a slot retention and placement portion, which provides for an improved approach for manufacturing arrangements of probes, where the slot retention and placement portions of the probe facilitate precise placement and alignment of the probes while not excessively increasing the cost or complexity of the probes and probe cards.

Abstract: A test apparatus includes a circuit board. The circuit board includes a number of first golden fingers arranged on a first side of the circuit board, and a first test circuit. The first test circuit includes a first capacitor. A first terminal of the first capacitor is grounded. A second terminal of the first capacitor is electrically connected to a first pin of the first golden fingers. A first test pad is connected to the second terminal of the first capacitor. A second test pad is connected to a second pin of the first golden fingers. The second pin is grounded.

Abstract: A test apparatus includes a circuit board and an expansion slot. A number of golden fingers are arranged on a first side of the circuit board. A second side of the circuit board is connected to a bottom of the expansion slot. The golden fingers are electrically connected to the expansion slot. A number of first test pads and second test pads are arranged on the circuit board between the first side and the second side. The first and second test pads have different shapes, sizes, and/or colors. The first and second test pads are electrically connected to pins in the expansion slot.

Abstract: A method for manufacturing an electronic device is disclosed. A design description of the electronic device is generated using one or more computer aided design tools. Physical device data are generated that represent a physical description of the electronic device, which includes data determining connection points for connecting the electronic device to one or more external circuits. A physical embodiment of the electronic device is produced in accordance with the physical device data. Physical test member data is determined that represents conductors and contact points of a test member for testing the electronic device. The test member is produced in accordance with the test member data. The electronic device is tested with the test member.

Abstract: A method for making a probe card includes: mounting a plurality of probe needles on a probe-mounting seat; forming a conductive protective coating on tips of the probe needles; and bonding the probe needles to a printed circuit board through welding techniques after formation of the conductive protective coating on the tips of the probe needles.