Abstract: Electrical overstress protection of microelectromechanical systems (MEMS) are disclosed herein. In certain embodiments, a MEMS radio frequency system includes a MEMS device electrically connected along a radio frequency signal path that handles a radio frequency signal, and an electrical overstress protection circuit in shunt with the radio frequency signal path and operable to protect the MEMS device from an electrical overstress event, such as an electrostatic discharge (ESD) event received on the radio frequency signal path. The electrical overstress protection circuit includes a metal conductor configured to resonate about at a fundamental frequency of the radio frequency signal.

Abstract: The present invention provides an integrated electro-mechanical actuator and a manufacturing method for manufacturing such an integrated electro-mechanical actuator. The integrated electro-mechanical actuator comprises an electrostatic actuator gap between actuator electrodes and an electrical contact gap between contact electrodes. An inclination with an inclination angle is provided between the actuator electrodes and the contact electrodes. The thickness of this electrical contact gap is equal to the thickness of a sacrificial layer which is etched away in a manufacturing process.

Abstract: A microfabricated RF filter uses a resonant cavity weakly coupled to a transmission line, to attenuate noise sources emitting interference into the RF radiation at the resonant frequency. Radiation at the resonant frequency is leaked into the resonant cavity and build up there, until it is dumped to ground by a switch.

Abstract: A redundancy network is coupled to a first plurality of signal components and to a beam hopping network. The redundancy network has redundancy network signal junctions configurable to define redundancy network signal paths through the redundancy network, with one path for each signal component. The beam hopping network has beam hopping junctions configurable to define beam hopping signals paths from the redundancy network to other signal components. The beam hopping junctions are dynamically adjustable to reconfigure the beam hopping signals paths so signals from the redundancy network are deliverable to at least two of the other signal components. The redundancy network signal junctions are reconfigurable in response to a failure of one of the first signal components to redefine the redundancy network signal paths so that signals from the remaining first signal components are distributable, by the beam hopping network, to all of the other signal components.

Abstract: The present disclosure relates to a tunable waveguide filter input/output coupling arrangement comprising a waveguide part, a coupling iris part and a tunable filter part. The waveguide part runs along a longitudinal extension and has a waveguide width extending perpendicular to the longitudinal extension, and is electrically connected to the tunable filter part by means of the coupling iris part which comprises an opening between the waveguide part and the tunable filter part. The opening is positioned at a certain position along the longitudinal extension. The waveguide part comprises a stub part that has a certain stub length along the longitudinal extension, between an electrical short-circuit end plate and an edge of the opening that is closest to the end plate, where the stub part also has a stub width extending perpendicular to the longitudinal extension.

Abstract: A waveguide rotary joint includes a first waveguide member comprising a first waveguide portion, and a second waveguide member comprising a second waveguide portion, the second waveguide member rotatably connected via a curved circumferential path to the first waveguide member, wherein the second waveguide portion is adjacent to the first waveguide portion to define a first split rectangular waveguide. A first waveguide input/output port is communicatively coupled to the first waveguide portion, and a second waveguide input/output port is communicatively coupled to the second waveguide portion. Relative rotation between the first waveguide member and the second waveguide member changes an angular length of the first waveguide connecting the first waveguide input/output port to the second waveguide input/output port.

Abstract: A method of forming a Micro-Electro-Mechanical System (MEMS) includes forming a lower electrode on a first insulator layer within a cavity of the MEMS. The method further includes forming an upper electrode over another insulator material on top of the lower electrode which is at least partially in contact with the lower electrode. The forming of the lower electrode and the upper electrode includes adjusting a metal volume of the lower electrode and the upper electrode to modify beam bending.

Abstract: A system and method for measuring pressure by using two substrates that are separated by a distance, each substrate having at least one electrode, and wherein touch sensor capacitance circuitry coupled to electrodes on each of the substrates and transmitting a drive signal may be used to detect a bending or deflection of at least one of the substrates by measuring a change in distance between the electrodes on the different substrates when pressure is applied to one of the substrates, and wherein a compressible substrate may be disposed between the two substrates.

Abstract: A method of forming a Micro-Electro-Mechanical System (MEMS) includes forming a lower electrode on a first insulator layer within a cavity of the MEMS. The method further includes forming an upper electrode over another insulator material on top of the lower electrode which is at least partially in contact with the lower electrode. The forming of the lower electrode and the upper electrode includes adjusting a metal volume of the lower electrode and the upper electrode to modify beam bending.

Abstract: A method of forming a Micro-Electro-Mechanical System (MEMS) includes forming a lower electrode on a first insulator layer within a cavity of the MEMS. The method further includes forming an upper electrode over another insulator material on top of the lower electrode which is at least partially in contact with the lower electrode. The forming of the lower electrode and the upper electrode includes adjusting a metal volume of the lower electrode and the upper electrode to modify beam bending.

Abstract: A method of forming a Micro-Electro-Mechanical System (MEMS) includes forming a lower electrode on a first insulator layer within a cavity of the MEMS. The method further includes forming an upper electrode over another insulator material on top of the lower electrode which is at least partially in contact with the lower electrode. The forming of the lower electrode and the upper electrode includes adjusting a metal volume of the lower electrode and the upper electrode to modify beam bending.

Abstract: A latching electromechanical RF switch is formed with an RF switch cavity having at least one inlet port and at least one outlet ports having switch contacts. A leaf contact member moveable between a first contact position connecting the switch contacts and a second position spaced from the switch contacts. A solenoid mounted in the cavity. A housing is formed with a hollow passage. An intermediate permanent magnet provided within the housing. A connecting member assembly is moveable within the hollow passage. The contact leaf member is connected to one end with a permanent magnet provided at another end of the connecting member. The intermediate magnet attracts and retains the permanent magnet and the contact leaf member in the first contact position. Upon reaching the first contact position electric current supply to the solenoid is terminated.

Abstract: A switch comprises a first strip conductor and a second strip conductor, arranged orthogonally in a first plane. Moreover, the switch comprises a first switching conductor, having an orthogonally angled shape relative to the first plane. The switch comprises a switching actuator, which is mechanically connected to the first switching conductor and adapted to move vertically relative to the first plane to a first position and to a second position. The switching actuator is configured, so that in the first position, the first strip conductor is in contact with the first switching conductor and the second strip conductor is in contact with the first switching conductor, and so that in the second position, the first strip conductor and the second strip conductor are not in contact with the first switching conductor.

Abstract: A microelectromechanical systems (MEMS) structure having a stopper integrated with a MEMS substrate is provided. A first substrate has a dielectric layer arranged over the first substrate. The dielectric layer includes a device opening. A second substrate is arranged over and bonded to the first substrate through the dielectric layer. The second substrate includes a deflectable element arranged over the device opening. A stopper is integrated with the second substrate and protrudes from the deflectable element over the device opening. A method for manufacturing the MEMS structure is also provided.

Abstract: A high frequency switch is provided. The high frequency switch comprises a first high frequency connector, comprising a first inner conductor, integrally formed with a first strip conductor. Moreover, the high frequency switch comprises a second strip conductor arranged orthogonally in a first plane relative to the first strip conductor, a third strip conductor, arranged orthogonally in the first plane relative to the first strip conductor, a first switching conductor, having an orthogonally angled shape relative to the first plane, a second switching conductor, having an orthogonally angled shape relative to the first plane. A switching actuator is mechanically connected to the first switching conductor and to the second switching conductor adapted to move vertically relative to the first plane, to a first position and to a second position.

Abstract: Operation identification is obtained from a captured barcode. An authentication criterion is determined whether is satisfied. If the authentication criterion is met, the operation identification and stored account information is sent to server for authenticating based on the account information. The authentication criterion includes whether a similarity degree between an image characteristic of a first surrounding image of a barcode and an image characteristic of a second surrounding image of the barcode is larger than or equal to a present threshold. The second surrounding image is an authenticated surrounding image of the barcode such as a surrounding image when the barcode is generated. The present techniques ensure that a successful authentication is possibly returned only when the first surrounding image is in consistent with the second image. It is difficult for the barcode placed on a fake webpage or sent through group sending by a hacker to pass authentication.

Abstract: A waveguide switch based on alternating short and open loads in a waveguide path. In one embodiment, the switch being made up of four waveguides connected by sections of ridge waveguides where simple short-circuit loads can be activated to control the signal paths. The switch being adapted for the C-, R- and T-type switches. Another embodiment of the same device being adapted for SPT type switched.

Abstract: A transceiver includes an antenna, an impedance adjustment device, an RF (Radio Frequency) front-end circuit, a storage device, and a processor. The antenna receives an RF signal. The impedance adjustment device is coupled to the antenna, and includes a plurality of branch circuit with different impedance values and a switch module. The processor is coupled to the RF front-end circuit and controls the switch modules. In a comparison mode, the switch module selects to connect to the branch circuits individually, and the processor detects each RSSI (Received Signal Strength Indications) value corresponding to the branch circuit and records all of the RSSI values to the storage device respectively. In the comparison mode, the processor further compares the RSSI values to for highest one. Finally, the switch module selects the branch circuit corresponding to the highest RSSI value as a transmission branch.

Abstract: A piezoelectric multiplexer includes an actuator and multiple piezo-morph beams. The actuator includes an actuator conducting head and an actuator stem, and each piezo-morph beam includes a conducting beam contact head and a beam stem manufactured out of piezo-morph material. A control voltage is selectively applied to electrical contacts coupled to the beam stems to create a piezoelectric effect that bends the selected piezo-morph beam and creates an electrical connection between its contact head and the conducting head of the actuator. A control circuit with a controller signals which piezo-morph beam to connect to the actuator. This multi-piezo-morph-beam piezoelectric multiplexer can be affixed to the electrical terminals of different electrical components (e.g., a transistor) to create an electrical cell that can be manufactured on a semiconductor chip or in a microelectromechanical system (MEMS) device.

Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and usage, and design structures are disclosed herein. The method includes applying a first voltage polarity to an actuator of a Micro-Electro-Mechanical System (MEMS) structure to place the MEMS structure in a predetermined state for a first operating condition. The method further includes applying a second voltage polarity which is opposite from the first voltage polarity to the actuator of the MEMS structure during a subsequent operating condition.

Abstract: According to one embodiment, an electrostatic actuator includes a substrate, an electrode unit, a film body unit, and an urging unit. The electrode unit is provided on the substrate. The film body unit is provided to oppose the electrode unit and is conductive. The urging unit is configured to support the film body unit and includes a connection unit connected to the substrate and an elastic unit provided between the connection unit and the film body unit. A contacting state and a separated state are possible for the electrode unit and the film body unit according to a voltage applied to the electrode unit. The elastic unit has a branch portion between one end of the elastic unit connected to the connection unit and multiple one other ends of the elastic unit connected to the film body unit.

Abstract: A transmission cable including a transmission line, at least two electrically conductive line segments separated by a non-conductive gap, a bridging unit including at least one electrically conductive bridge segment capable of bridging the non-conductive gap, and a switching unit arranged to move the bridging unit and/or the transmission line to electrically connect the two line segments by closing the non-conductive gap using the bridge segment or to electrically disconnect the two line segments by opening the non-conductive gap.

Abstract: A high-frequency switch configured to transmit differential signals including first and second signals, has first and second switches each comprising an input terminal configured to receive a signal and two output terminals configured to output the signal, and a substrate comprising a first surface mounted with the first and second switches. The input terminal is arranged between the two output terminals. The first and second switches are arranged on the substrate along a direction intersecting with a direction in which the input terminal and the two output terminals are placed side by side. One terminal of the first switch and one terminal of the second switch are placed side by side along the direction in which the first and second switches are arranged.

Abstract: An electrostatic micro relay has a substrate, a signal line arranged on the substrate and having an input point configured to receive a signal and a plurality of signal channels configured to distribute the signal, the plurality of signal channels being each formed with a fixed contact, a plurality of movable contacts, each provided with respect to each of the fixed contacts and arranged so as to be opposed to a corresponding fixed contact across a space, a plurality of movable electrodes, each connected to each of the plurality of movable contacts and configured to make the connected movable contact brought into contact with and separated from the corresponding fixed contact, a cap, formed with a space configured to house the plurality of movable electrodes, and bonded with the substrate, and a signal input portion.

Abstract: Methods and systems for MEMS switches fabricated in an integrated circuit package are disclosed and may include controlling switching of RF components, and signals handled by the RF components, within an integrated circuit. One or more MEMS switch arrays embedded within a multi-layer package bonded to the integrated circuit may be utilized for the switching and signal control. The RF components and one or more MEMS switch arrays may be integrated in the multi-layer package. The RF components may be electrically coupled to the integrated circuit via the one or more MEMS switch arrays. The MEMS switch arrays may be electrostatically or magnetically activated. The RF components may be coupled to one or more capacitor arrays in the integrated circuit. The RF components may include transformers, inductors, transmission lines, microstrip and/or coplanar waveguide filters and/or surface mount devices. The integrated circuit may be coupled to the multiple-layer package utilizing a flip-chip bonding technique.

Abstract: The RF MEMS crosspoint switch comprising a first transmission line and a second transmission line that crosses the first transmission line; the first transmission line comprises two spaced-apart transmission line portions, and a switch element that permanently electrically connects the said two spaced-apart transmission line portions; the second transmission line crosses the first transmission line between the two spaced-apart transmission line portions; the RF MEMS crosspoint switch further comprises actuation means for actuating the switch element at least between a first position, in which the switch element is electrically connecting the two spaced-apart transmission line portions of the first transmission line and the first and second transmission lines are electrically disconnected, and a second position, in which the switch element is electrically connecting the two spaced-apart transmission line portions of the first transmission line and is also electrically connecting the two transmission lines toge

Abstract: Disclosed are switching circuits and methods that enable a device to switch between two wireless protocols with antenna sharing. In some implementations, the device may use two different wireless protocols concurrently and with high isolation. In some implementations, the device can be provided with insertion loss matched transmission diversity for one of the wireless protocols. In some embodiments, various signal paths and related switches that allow such functionalities can be implemented on a single die such as a silicon-on-insulator (SOI) die.

Abstract: A multiplexor includes an output having a characteristic impedance; a first input having a characteristic impedance equal to the output characteristic impedance; a second input; a first switch path including a first switch operable to connect/disconnect the first input center conductor and the output center conductor; a first input conductive path adjacent to the first switch path and being operable to provide the output characteristic impedance; a second switch path including a second switch operable to connect/disconnect the second input first signal conductor and the output center conductor; and a third switch path including a third switch operable to connect/disconnect the second input second signal conductor and the output intermediate conductor, the third switch path being operable to guard the second switch path when the third switch path is provided with a guard voltage.

Abstract: An electrosurgical system is provided and includes a power source, a microwave applicator, a switching mechanism and a controller. The power source is configured to generate microwave energy. The microwave applicator is configured to deliver microwave energy from the power source to tissue. The switching mechanism includes a housing having input and output ports. The input port is connectable to the power source and the output port is connectable to the microwave applicator. The housing is configured to house one or more switches therein. The controller is in operative communication with the switching mechanism to toggle the switch from a first state, wherein microwave energy generated by the power source is directed to the microwave applicator to a second state, wherein microwave energy is directed to a resistive load operably coupled to the switching mechanism.

Abstract: Methods and systems for MEMS switches fabricated in an integrated circuit package are disclosed and may include controlling switching of RF components, and signals handled by the RF components, within an integrated circuit. One or more MEMS switch arrays embedded within a multi-layer package bonded to the integrated circuit may be utilized for the switching and signal control. The RF components and one or more MEMS switch arrays may be integrated in the multi-layer package. The RF components may be electrically coupled to the integrated circuit via the one or more MEMS switch arrays. The MEMS switch arrays may be electrostatically or magnetically activated. The RF components may be coupled to one or more capacitor arrays in the integrated circuit. The RF components may include transformers, inductors, transmission lines, microstrip and/or coplanar waveguide filters and/or surface mount devices. The integrated circuit may be coupled to the multiple-layer package utilizing a flip-chip bonding technique.

Abstract: Methods and systems for communicating via flip-chip die and package waveguides are disclosed and may include communicating one or more signals between sections of an integrated circuit via one or more waveguides integrated in a multi-layer package. The integrated circuit may be bonded to the multi-layer package. The waveguides may be configured via switches in the integrated circuit or by MEMS switches integrated in the multi-layer package. The signals may include a microwave signal and a low frequency control signal that may configure the microwave signal. The low frequency control signal may include a digital signal. The waveguides may comprise metal and/or semiconductor layers deposited on and/or embedded within the multi-layer package.

Abstract: An electrostatic switch for high frequency and a method for manufacturing the same are disclosed. The electrostatic switch for high frequency in accordance with an embodiment includes: a first substrate module including a first substrate, an electrode part and a pair of CoPlanar Waveguides (CPWs), the electrode part being installed on the first substrate, the pair of CPWs being formed on either side of the electrode part and guiding an RF signal to travel; and a second substrate module being joined to the first substrate module, the second substrate module including a membrane and a bias line, the membrane being installed on a second substrate and bent by bias voltage supplied to the electrode part and being coupled to the pair of CPWs across an upper area of the electrode part in order to be short-circuited to the electrode part, the bias line being connected to the electrode part.

Abstract: Methods and systems for configuring one or more electrical waveguides in an integrated circuit by adjusting a geometry of the one or more electrical waveguides, and communicating one or more electrical signals between components within the integrated circuit via the one or more electrical waveguides. The geometry of the one or more electrical waveguides may be configured by adjusting a length of the one or more electrical waveguides utilizing switches in the integrated circuit. The switches may include CMOS transistors. The one or more signals may include a microwave signal and a low frequency digital control signal that configures the microwave signal. The electrical waveguides may include metal and/or semiconductor layers deposited on and/or embedded within the integrated circuit.

Abstract: Techniques, apparatus and systems for a multiple pole multiple throw (MPMT) RF switch device based on composite left and right handed (CRLH) metamaterial structures.

Abstract: Methods and systems for MEMS switches fabricated in an integrated circuit package are disclosed and may include controlling switching of RF components, and signals handled by the RF components, within an integrated circuit. One or more MEMS switch arrays embedded within a multi-layer package bonded to the integrated circuit may be utilized for the switching and signal control. The RF components and one or more MEMS switch arrays may be integrated in the multi-layer package. The RF components may be electrically coupled to the integrated circuit via the one or more MEMS switch arrays. The MEMS switch arrays may be electrostatically or magnetically activated. The RF components may be coupled to one or more capacitor arrays in the integrated circuit. The RF components may include transformers, inductors, transmission lines, microstrip and/or coplanar waveguide filters and/or surface mount devices. The integrated circuit may be coupled to the multiple-layer package utilizing a flip-chip bonding technique.

Abstract: A micro-electromechanical system (MEMS) device that in one embodiment includes at least two MEMS switches coupled to each other in a back-to-back configuration. The first and second suspended elements corresponding to first and second MEMS switches are electrically coupled. Further, first and second contacts corresponding to the first and second MEMS switches are configured such that a differential voltage between the second suspended element and the second contact is approximately equal to a differential voltage between the first suspended element and the first contact. The MEMS device includes at least one actuator coupled to one or more of the first and second suspended elements to actuate one or more of the first and the second suspended elements. In one example, the MEMS device includes one or more passive elements coupled to one or more of the first and second MEMS switches.

Abstract: A system that incorporates teachings of the present disclosure may include, for example, a process for obtaining a first operational metric for a transmitter of a communication device, determining a range of impedances based on the first operational metric where the range of impedances is associated with an acceptable level of performance for the communication device, obtaining a second operational metric for the transmitter, determining a target impedance within the range of impedances based on the second operational metric, and tuning a first impedance matching network based on the target impedance, where the first impedance matching network is coupled with a first antenna of the communication device, and where the tuning is based on adjusting a first variable component of the first impedance matching network. Additional embodiments are disclosed.

Abstract: A tunable filter and a tunable duplexer are provided, both of which comprise an input terminal, an output terminal, four fixed capacitors, three variable capacitors and three fixed coils; wherein the variable capacitors are grounded at one end and, at the other end, connected to the fixed coils to form three sets of series-connected LC circuit; wherein the connecting points of the three sets of series-connected LC circuit, the input terminal and the output terminal are connected with the fixed capacitors, respectively.

Abstract: A switch matrix module (600) includes programmable stub breakers (508-512, 514-518) which can break off the bus and isolate unused portion of the switch matrix. Using three-way stub breakers (508-512, 514-518) at the matrix front-ends that can either completely isolate a middle matrix or cut off stubs left or right of the destination and source matrices, allows for the formation of very large matrices which have improved operational performance.

Abstract: A circulator with at least three ports (p1, p2, p3) comprises two identical electromechanical micro-switches of the series type (MEMS1, MEMS2) formed on the same substrate, a first micro-switch being disposed in order to allow the transmission of a radiofrequency or microwave signal from an input port (p1) to a port (p2) designed to be connected to an antenna, a second micro-switch being disposed in order to allow the signal transmission between the port (p2) designed to be connected to an antenna and said output port. Application to a radiofrequency or microwave telecommunications system.

Abstract: Systems and methods for controlling a micro electromechanical device using power actuation are disclosed. The disclosed micro electromechanical systems comprise at least one electrostatically actuatable micro electromechanical device and an actuation device. The micro electromechanical device comprises a first conductor and a second conductor having a moveable portion which in use may be attracted by the first conductor as a result of a predetermined actuation power. The actuation device comprises a high frequency signal generator for generating at least part of the actuation power by means of a predetermined high frequency signal with a frequency higher than the mechanical resonance frequency of the moveable portion of the micro electromechanical device.

Abstract: Apparatus and methods are disclosed related to radio frequency (RF) power detection. One such apparatus includes a directional coupler, an RF switch, and an RF power detector. The RF switch can selectively change coupling between the directional coupler and the RF power detector. This can enable accurate power detection based on a ratio of power levels, without factory calibration or laser trimming.

Abstract: Electrostatic devices, systems and methods are presented. One embodiment is an electrostatic device including a substrate, a first electrode disposed on the substrate, a movable element having a second electrode and a control electrode. The control electrode is disposed in electrostatic communication with the movable element. The control electrode includes a protection layer having resistivity in a range of from about 1 ohm-cm to about 10 kohm-cm.

Abstract: A SPDT or SPMT switch may include a transformer having a primary winding and a secondary winding, where a first end of the secondary winding is connected to a single pole port, where a first end of the primary winding is connected to a first throw port; a first switch having a first end and a second end, where the first end is connected to ground; and a second switch, where a second end of the secondary winding is connected to both a second end of the first switch and a first end of the second switch, where a second end of the second switch is connected to a second throw port, where the first switch controls a first communication path between the single pole port and the first throw port, and where the second switch controls a second communication path between the second throw port and the single pole port.

Abstract: A radio frequency (RF) switch using a field effect transistor has 2nd order intermodulation distortion improved through use of a feed forward capacitor electrically connected between the gate and a voltage coupler connected between the source and drain of the FET. With a control voltage provided at the gate through a gate feed resistor for operation of the FET, the feed forward capacitor feeds an RF voltage from the drain terminal and the source terminal to the gate terminal through the gate feed resistor.

Abstract: A feeding device for a smart antenna includes a signal reception terminal, a first antenna feeding terminal, a second antenna feeding terminal, a power divider, and a switching circuit. The signal reception terminal is utilized for receiving a transmitting signal. The first antenna feeding terminal and the second antenna feeding terminal are utilized for outputting feeding signals to the two antennas, respectively. The power divider, having a first input port, a second input port, a first output port, and a second output port, is utilized for distributing energy received by the first input port or the second input port equally to the first output port and the second output port, and making signals of the first output port and the second output port having 90 degree phase difference. The switching circuit performs switching operations to control electrical connections of the power divider according to a control signal.

Abstract: Methods and systems for intra-chip waveguide communication are disclosed and may include configuring one or more waveguides in an integrated circuit and communicating one or more signals between blocks within the integrated circuit via the one or more waveguides. The one or more waveguides may be configured via switches in the integrated circuit by adjusting a length of the one or more waveguides. The one or more signals may include a microwave signal and a low frequency control signal that configures the microwave signal. The low frequency control signal may include a digital signal. The one or more waveguides may include metal layers deposited on the integrated circuit or within the integrated circuit. The one or more waveguides may include semiconductor layers deposited on the integrated circuit or embedded within the integrated circuit.

Abstract: An electrostatic switch for high frequency and a method for manufacturing the same are disclosed. The electrostatic switch for high frequency in accordance with an embodiment includes: a first substrate module including a first substrate, an electrode part and a pair of CoPlanar Waveguides (CPWs), the electrode part being installed on the first substrate, the pair of CPWs being formed on either side of the electrode part and guiding an RF signal to travel; and a second substrate module being joined to the first substrate module, the second substrate module including a membrane and a bias line, the membrane being installed on a second substrate and bent by bias voltage supplied to the electrode part and being coupled to the pair of CPWs across an upper area of the electrode part in order to be short-circuited to the electrode part, the bias line being connected to the electrode part.

Abstract: A transceiver is described that includes a power amplifier (PA), a low noise amplifier (LNA), and an impedance matching circuit having a first and second differential output node. The first and second differential output nodes are coupled to outputs of the PA and to inputs of the LNA. The impedance matching circuit provides a load impedance to the outputs of the PA. The transceiver further includes a first impedance device having an output impedance coupled between the first and second differential output nodes. In this way, the combination of the output impedance and the load impedance matches with an impedance at the inputs of the LNA.

Abstract: An electronic device includes a first and a second micro-electromechanical switch assembly on a substrate, between which first and second switch assembly a first line having a first impedance and a second line having a second impedance are present. The first switch assembly includes an input terminal and a first and a second output terminal connected to the first and the second line, respectively. The second switch assembly includes an output terminal and a first and second input terminal connected to the first and second line, respectively.