Waveguide Patents (Class 333/208)
  • Patent number: 11901600
    Abstract: A ceramic waveguide filter comprises a plurality of resonant cavities defined by a plurality of through partition walls formed in a single ceramic block to divide sections of the ceramic block according to a pre-designated pattern, a plurality of resonant recesses formed in the sections of the plurality of resonant cavities divided by the through partition walls, a metal layer formed on an inner surface of each of the plurality of through partition walls, and input/output interfaces formed in two resonant cavities inputting and outputting signals among the plurality of resonant cavities.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: February 13, 2024
    Assignee: ACE TECHNOLOGIES CORPORATION
    Inventor: Dong Wan Chun
  • Patent number: 11876273
    Abstract: The present disclosure relates to a cavity filter and a connecting structure included therein. The cavity filter includes: an RF signal connecting portion spaced apart, by a predetermined distance, from an outer member having an electrode pad provided on a surface thereof; and a terminal portion configured to electrically connect the electrode pad of the outer member and the RF signal connecting portion so as to absorb assembly tolerance existing at the predetermined distance and to prevent disconnection of the electric flow between the electrode pad and the RF signal connecting portion, wherein the terminal portion includes: first side terminal contacted with the electrode pad; and the second side terminal connected to the RF signal connecting portion. Therefore, the cavity filter can efficiently absorb assembly tolerance which occurs through assembly design, and prevents disconnection of an electric flow, thereby preventing degradation in performance of an antenna device.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: January 16, 2024
    Assignee: KMW INC.
    Inventors: Nam Shin Park, Joung Hoe Kim, Sung Ho Jang
  • Patent number: 11705612
    Abstract: An elongate flexible waveguide section for radio frequency signals is provided, wherein the waveguide section is corrugated in the longitudinal direction, and the waveguide section is at least partially corrugated in a circumferential direction perpendicular to the longitudinal direction. Also provided is an apparatus for connecting a VHTS antenna system to a spacecraft.
    Type: Grant
    Filed: May 2, 2019
    Date of Patent: July 18, 2023
    Assignee: Airbus Defence and Space Limited
    Inventors: Arthur Bardinet, Richard Roberts, Stephen Mclaren
  • Patent number: 11688938
    Abstract: An antenna array that can include a plurality of antenna cells positioned in a global coordinate system of the antenna array. Each of the plurality of antenna cells has a respective local coordinate system and can include a radiating element having a predetermined angle of rotation defined in the global coordinate system and an antenna port coupled to the radiating element, the antenna port being positioned at a particular set of coordinates in the respective local coordinate system. The particular set of coordinates of the antenna port of each of the plurality of antenna cells can be the same.
    Type: Grant
    Filed: July 28, 2022
    Date of Patent: June 27, 2023
    Assignee: VIASAT, INC.
    Inventor: Frederic Bongard
  • Patent number: 11652264
    Abstract: Microelectronic assemblies that include a lithographically-defined substrate integrated waveguide (SIW) component, and related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate portion having a first face and an opposing second face; and an SIW component that may include a first conductive layer on the first face of the package substrate portion, a dielectric layer on the first conductive layer, a second conductive layer on the dielectric layer, and a first conductive sidewall and an opposing second conductive sidewall in the dielectric layer, wherein the first and second conductive sidewalls are continuous structures.
    Type: Grant
    Filed: January 24, 2022
    Date of Patent: May 16, 2023
    Assignee: Intel Corporation
    Inventors: Georgios Dogiamis, Adel A. Elsherbini
  • Patent number: 11581619
    Abstract: A dielectric waveguide filter includes first resonant cavities, which are connected to form upper resonant cavities, and second resonant cavities, which are connected to form lower resonant cavities, wherein the upper and lower resonant cavities are correspondingly overlapped; each of the first resonant cavities has a first window coupling structure, wherein the first window coupling structure includes a first window opened at a position where the magnetic field distribution of a high-order mode in each of the first resonant cavities is the weakest, and/or a second window opened at a position where the electric field distribution of the high-order mode in each of the first resonant cavities is the strongest; and each of the second resonant cavities has a second window coupling structure corresponding to the first window coupling structure, and the first and second window coupling structures cooperate to eliminate the high-order modes of the dielectric waveguide filter.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: February 14, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ruoming Wang, Haiju Kang, Zhenkun Zhang, Bingjian Niu
  • Patent number: 11509031
    Abstract: Various substrate-integrated waveguide (SIW) filtering crossover systems are described. An example SIW filtering crossover system may include: a substrate; a top metal plate placed on top of the substrate; a bottom metal plate placed beneath the substrate; a plurality of metalized via-holes in the substrate connecting the top metal plate and the bottom metal plate; and a plurality of grounded-coplanar-waveguides (GCPWs) coupled to sidewalls of the crossover system, wherein each of the GCPWs connects the crossover system to a respective microstrip line for signal transmission between the respective microstrip line and the crossover system.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: November 22, 2022
    Assignee: HUAWEI TECHNOLOGIES CANADA CO., LTD.
    Inventors: Kang Zhou, Ke Wu
  • Patent number: 11495871
    Abstract: A multi-layer waveguide device, a multi-layer waveguide arrangement, and a method for production thereof, wherein the multi-layer waveguide comprises at least three horizontally divided layers assembled into a multi-layer waveguide. The layers are at least a top layer, an intermediate layer, and a bottom layer, wherein each layer has through going holes extending through the entire layer. The holes are arranged with an offset to adjacent holes of adjoining layers creating a leak suppressing structure.
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: November 8, 2022
    Assignee: METASUM AB
    Inventors: Abbas Vosoogh, Zhongxia Simon He
  • Patent number: 11482771
    Abstract: A radio-frequency device comprises a semiconductor package, which comprises a radio-frequency chip and a radio-frequency antenna. The semiconductor package is designed to be mechanically and electrically connected to a circuit board via at least one connecting element of the semiconductor package, with one surface of the semiconductor package facing the circuit board. The radio-frequency device also comprises a waveguide structure oriented in a direction parallel to the surface of the semiconductor package, the radio-frequency antenna being designed for at least one of the following: to emit radiation into the waveguide structure in the direction parallel to the surface of the semiconductor package, or to receive signals via the waveguide structure in the direction parallel to the surface of the semiconductor package.
    Type: Grant
    Filed: January 12, 2021
    Date of Patent: October 25, 2022
    Assignee: Infineon Technologies AG
    Inventors: Thomas Lampersberger, Reinhard Feger, Markus Josef Lang, Juergen Minichshofer, Ernst Seler, Andreas Stelzer
  • Patent number: 11462810
    Abstract: Embodiments of the invention include a mm-wave waveguide connector and methods of forming such devices. In an embodiment the mm-wave waveguide connector may include a plurality of mm-wave launcher portions, and a plurality of ridge based mm-wave filter portions each communicatively coupled to one of the mm-wave launcher portions. In an embodiment, the ridge based mm-wave filter portions each include a plurality of protrusions that define one or more resonant cavities. Additional embodiments may include a multiplexer portion communicatively coupled to the plurality of ridge based mm-wave filter portions and communicative coupled to a mm-wave waveguide bundle. In an embodiment the plurality of protrusions define resonant cavities with openings between 0.5 mm and 2.0 mm, the plurality of protrusions are spaced apart from each other by a spacing between 0.5 mm and 2.0 mm, and wherein the plurality of protrusions have a thickness between 200 ?m and 1,000 ?m.
    Type: Grant
    Filed: March 5, 2021
    Date of Patent: October 4, 2022
    Assignee: Intel Corporation
    Inventors: Telesphor Kamgaing, Sasha Oster, Georgios Dogiamis, Johanna Swan
  • Patent number: 11404775
    Abstract: An antenna array that can include a plurality of antenna cells positioned in a global coordinate system of the antenna array. Each of the plurality of antenna cells has a respective local coordinate system and can include a radiating element having a predetermined angle of rotation defined in the global coordinate system and an antenna port coupled to the radiating element, the antenna port being positioned at a particular set of coordinates in the respective local coordinate system. The particular set of coordinates of the antenna port of each of the plurality of antenna cells can be the same.
    Type: Grant
    Filed: June 15, 2020
    Date of Patent: August 2, 2022
    Assignee: VIASAT, INC.
    Inventor: Frederic Bongard
  • Patent number: 11276910
    Abstract: A method for manufacturing a substrate integrated waveguide for a millimeter wave signal is disclosed. In the method, a gold layer is disposed on a top surface of the silicon substrate using a lift-off process. Next, two parallel rows of substantially equal spaced vias are formed in the silicon substrate using a through-silicon-via etching process. Then, a copper layer is disposed on the bottom side of the silicon substrate and on interior surfaces of each via. The separation between the copper layer and the gold layer define a height of the substrate integrated waveguide, while the separation between the two parallel rows of substantially equal spaced vias define a width of the substrate integrated waveguide. In some implementations the length of the substrate defines a length of the substrate integrated waveguide, and the length, width, and height define a resonator that is resonant at a millimeter wave frequency.
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: March 15, 2022
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventor: Kiryung Shin
  • Patent number: 11239537
    Abstract: A microwave resonator comprising a hollow tube comprising fan electrically conductive tube wall which defines a tube bore, the tube extending along a length axis from a first end to a second end; a first electrically conductive closing plate closing the first end of the tube; a second electrically conductive closing plate closing the second end of the tube; a plurality of dielectric resonant pucks, each puck comprising first and second end faces and a side wall extending therebetween, each puck being dimensioned such that its dominant mode is a doubly degenerate mode; the pucks being arranged within the tube bore spaced apart from each other and the closing plates, each puck being arranged with its end faces normal to the length axis and centered on the length axis and its side wall abutting the tube wall such that there is no air gap between the puck and tube wall which extends from one end face to the other of the puck, the puck adjacent to the first closing plate being termed the input puck; each puck bein
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: February 1, 2022
    Assignee: ISOTEK MICROWAVE LIMITED
    Inventors: John David Rhodes, David Ibbetson, Vanessa Walker, Christopher Ian Mobbs
  • Patent number: 11239539
    Abstract: An electromagnetic waveguide including conductive material on upper lower, and side surfaces of a dielectric is disclosed. A conductive excitation member is electrically coupled to the conductive material on the upper surface of the dielectric and extends to the lower surface of the dielectric at or near an end surface of the dielectric. The conductive excitation member includes a host interface flange separated and electrically isolated from the conductive material on the lower surface of the dielectric. The conductive material on the lower surface of the dielectric can be a ground plane and the waveguide can be a surface-mountable component.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: February 1, 2022
    Assignee: Knowles Cazenovia, Inc.
    Inventors: Jared Burdick, Pierre Nadeau
  • Patent number: 11223119
    Abstract: A millimeter wave LTCC filter includes system ground layers, metallized vias, first and second probes, two adjacent ones of the system ground layers define one closed resonant cavity, each closed resonant cavity is provided with a plurality of metallized vias, and the metallized vias of different closed resonant cavities face right to each other, to form concentric hole structures; an aperture of each first metallized via is equal to an aperture of each fourth metallized via, and is smaller than an aperture of each second metallized via that is equal to an aperture of each third metallized via; one end of the first probe is inserted into the first closed resonant cavity and electrically connected with the first system ground layer, and the second probe is coaxially arranged with the first probe, and is inserted into the fourth closed resonant cavity and electrically connected with the second system ground layer.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: January 11, 2022
    Assignee: AAC Technologies Pte. Ltd.
    Inventor: Jianchun Mai
  • Patent number: 11196137
    Abstract: Disclosed herein is a radio frequency filter having a notch structure. The radio frequency filter includes a hollow housing having a plurality of partition walls defining a plurality of cavities and an open surface formed on one side, a cover configured to shield the open surface of the housing, a plurality of resonance elements positioned in the cavities of the housing, a coupling substrate arranged to cross a partition wall between at least two of the plurality of resonance elements, and a tuning screw inserted into the housing through the cover. The partition wall crossed by the coupling substrate includes a support window formed to have a first depth from the open surface, the coupling substrate being arranged through the support window, and a tuning window formed to have a second depth greater than the first depth from the open surface, the tuning screw being inserted into the tuning window.
    Type: Grant
    Filed: July 15, 2020
    Date of Patent: December 7, 2021
    Assignee: KMW INC.
    Inventors: Sung Bae Park, Joung-Hoe Kim, Nam-Shin Park
  • Patent number: 11119042
    Abstract: A system of writing to and reading from a magnetic nanostructure is disclosed which includes an opto-magnetic write arrangement including a polarizer configured to receive incident light and provide a circularly or linearly polarized light, wherein light polarization is controlled by the polarizer and its orientation with respect to polarization of the incident light, a nanomagnetic structure configured to receive the polarized light including a substrate, and a nanomagnetic stack including a nanomagnet, and a capping layer, wherein the nanomagnetic stack is configured to receive the polarized light and thereby switch orientation of a magnetic moment associated with the magnetic nanostructure whereby the magnetic moment direction specifies a bit value held in the magnetic structure, and a magnetic read arrangement, configured to receive and interpret an optical signal from the magnetic nanostructure indicating the magnetic moment orientation from the nanomagnetic stack.
    Type: Grant
    Filed: August 11, 2020
    Date of Patent: September 14, 2021
    Assignee: Purdue Research Foundation
    Inventors: Aveek Dutta, Vladimir M. Shalaev, Alexandra Boltasseva, Esteban E. Marinero-Caceres
  • Patent number: 11081769
    Abstract: An RF dielectric waveguide duplexer filter module with antenna and lower and upper Tx and Rx signal transmission blocks of dielectric material attached together in a side-by-side and stacked relationship. The blocks are covered with conductive material. Antenna and Tx and Rx input/outputs are defined at opposite ends of the filter module. RF signal transmission windows define direct coupling RF signal transmission paths between the antenna and the Tx and Rx blocks and between the lower and upper Tx and Rx blocks. One or more bridges of dielectric material on the lower Tx and Rx blocks define inductive cross-coupling Tx and Rx signal transmission paths. The Tx signal is transmitted only in the direction of the antenna block or between the upper and lower Tx blocks. The Rx signal is transmitted only in the direction of the Rx RF signal input/output or between the upper and lower Rx blocks.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: August 3, 2021
    Assignee: CTS Corporation
    Inventor: Reddy Vangala
  • Patent number: 11056754
    Abstract: A filter antenna device is provided, which including a SIW filter structure, a SIW radiation structure cascaded with the SIW filter structure, a feeding port and a first coplanar waveguide that are provided on a side of the first resonant cavity facing away from the back cavity, a second coplanar waveguide provided on a side of the second resonant cavity close to the back cavity, a transmission wire provided in the back cavity and connected to one end of the second coplanar waveguide, and a probe connecting the transmission wire with the metal patch. The SIW filter structure includes a first resonant cavity and a second resonant cavity that are stacked from top to bottom and communicate with each other.
    Type: Grant
    Filed: December 8, 2019
    Date of Patent: July 6, 2021
    Assignee: AAC Technologies Pte. Ltd.
    Inventors: Jianchun Mai, Zhimin Zhu
  • Patent number: 11031669
    Abstract: A method for producing a waveguide device, including producing a core of a non-conductive material. The core has side walls with outer surfaces and inner surfaces, the inner surfaces defining a waveguide channel. A layer of conductive metal is deposited on the inner surfaces by immersion in a fluid of reactants. The core includes at least one hole between the outer and inner surfaces, specifically used to encourage the removal of bubbles from the channel and/or the circulation of the fluid during the immersion.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: June 8, 2021
    Assignee: SWISSTO12 SA
    Inventors: Emile de Rijk, Mirko Favre, Mathieu Billod, Alexandre Dimitriades, Alessandro Macor
  • Patent number: 10862186
    Abstract: A waveguide device for guiding a radio frequency signal at a determined frequency f, the device including a body having side walls with outer surfaces and inner surfaces, the inner surfaces defining a waveguide channel. A conductive layer covers the inner surface of the body, the conductive layer being formed of a metal having a skin depth ? at frequency f. The conductive layer has a thickness at least twenty times as large as the skin depth ?.
    Type: Grant
    Filed: May 30, 2017
    Date of Patent: December 8, 2020
    Assignee: SWISSTO12 SA
    Inventors: Emile de Rijk, Mirko Favre, Mathieu Billod, Alexandre Dimitriades
  • Patent number: 10818997
    Abstract: A printed circuit board assembly comprising a plurality of layers. At least one of the plurality of layers is formed of a dielectric material and has an extended portion extending beyond the other layers in the plurality of layers. A first metallic layer is located on at least a portion of the extended portion of the dielectric layer. The first metallic layer and the dielectric layer are configured to form a launch transducer comprising one or more transmission lines and a transducer element coupled to the one or more transmission lines. The transducer element is configured to propagate millimeter wave frequency signals.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: October 27, 2020
    Assignee: VUBIQ NETWORKS, INC.
    Inventors: Michael Gregory Pettus, Robert Lee Eisenhart
  • Patent number: 10816740
    Abstract: Conventional hybrid photonic integrated circuits (PIC) combine one type of semiconductor platform for the main PIC, and a different type of semiconductor platform for a secondary chip. Conventional mounting processes include forming a recess in the main PIC, and mating electrical connectors from the secondary chip and the main PIC within the recess. Mating the first and second electrical connectors in the recess increases the complexity of forming the main PIC, and hampers heat dissipation from secondary chip through oxide layers in the main PIC. Providing a conductive, e.g. redistribution, layer from the first electrode along the bottom and sides of the recess eliminates the complexity in forming the main PIC, and enables the first electrical connector to be mounted directly onto a more thermally conductive substrate material.
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: October 27, 2020
    Assignee: Elenion Technologies, LLC
    Inventors: Ari Novack, Saeed Fathololoumi, Michael Caverley
  • Patent number: 10763562
    Abstract: Waveguide devices and methods for radio-frequency applications. In some embodiments, a radio-frequency waveguide can include a dielectric block having a first edge that joins a mounting surface and a first adjacent surface. The waveguide can further include a conductive coating that substantially covers the dielectric block, and defining a wrap-around opening that exposes the dielectric block along the first edge. The wrap-around opening can include a strip on the first adjacent surface along the first edge and a strip on the mounting surface along the first edge, such that the first edge of the dielectric block is continuously exposed within the wrap-around opening.
    Type: Grant
    Filed: May 22, 2018
    Date of Patent: September 1, 2020
    Assignee: Skyworks Solutions, Inc.
    Inventor: John Christopher Deriso
  • Patent number: 10739261
    Abstract: A magneto-plasmonic nanostructure is disclosed. The structure includes a substrate, and a magneto-plasmonic stack, comprising a nano-sized plasmonic resonator, a nanomagnet, and a capping layer, wherein the nano-sized plasmonic resonator is configured to receive circularly polarized light at an intensity to thereby increase normal component of plasmon-generated opto-magnetic field, HOM,z, at least at the interface of one of i) the nano-sized plasmonic resonator and the nanomagnet, or ii) the nanomagnet and the capping layer, whereby the HOM,z direction is perpendicular to the rotational direction of the circularly polarized light and the nanomagnets in the magneto-plasmonic stack switches its magnetic moment in response to a change of the HOM,z direction in response to a change of the rotational direction of the circularly polarized light.
    Type: Grant
    Filed: April 30, 2019
    Date of Patent: August 11, 2020
    Assignee: Purdue Research Foundation
    Inventors: Aveek Dutta, Vladimir M. Shalaev, Alexandra Boltasseva, Esteban E. Marinero-Caceres
  • Patent number: 10727557
    Abstract: A dielectric filter includes a plurality of dielectric resonators. The dielectric filter also includes: a plurality of resonator body portions each formed of a first dielectric and respectively corresponding to the plurality of dielectric resonators, the first dielectric having a first relative permittivity; a peripheral dielectric portion formed of a second dielectric and lying around the plurality of resonator body portions, the second dielectric having a second relative permittivity lower than the first relative permittivity; and a shield portion formed of a conductor. Either one of a temperature coefficient of resonant frequency of the first dielectric at 25° C. to 85° C. and a temperature coefficient of resonant frequency of the second dielectric at 25° C. to 85° C. has a positive value and the other has a negative value.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: July 28, 2020
    Assignee: TDK CORPORATION
    Inventors: Yuta Ashida, Shigemitsu Tomaki, Yousuke Futamata, Shin Takane, Yasuharu Miyauchi, Kazunari Kimura
  • Patent number: 10615473
    Abstract: Waveguides in accordance with embodiments of the invention are disclosed. In one embodiment, a dual-mode circular waveguide includes a cavity, a first end wall including a first handedness-preserving metasurface positioned at a first end of the cavity, and a second end wall including a second handedness-preserving metasurface positioned at a second end of the cavity.
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: April 7, 2020
    Assignee: The Regents of the University of California
    Inventors: Tatsuo Itoh, Xiaoqiang Li, Mohammad Memarian
  • Patent number: 10516196
    Abstract: A dual mode cavity filter installed aboard a satellite having a first and a second waveguide cavity, a first coupling waveguide iris having an input slot and followed by the first waveguide cavity, a second coupling waveguide iris having a coupling slot, following the first waveguide cavity and followed by the second waveguide cavity, and a third coupling waveguide iris having an output slot and following the second waveguide cavity. The dual mode cavity filter is associated with a plurality of devices having at least one respective commanded rod having a certain insertion length with respect of the waveguide cavities and of the slots. The devices are placed in predetermined positions of the cavities and/or of the irises and are arranged to perform a tuning modification and/or a coupling modification of the filter by controlling the insertion length of the rods in outer space.
    Type: Grant
    Filed: May 13, 2016
    Date of Patent: December 24, 2019
    Assignee: AC CONSULTING DI LUCIANO ACCATINO
    Inventors: Luciano Accatino, Giorgio Bertin
  • Patent number: 10305440
    Abstract: A band-pass filter for a wireless communications signal is provided. The band-pass filter includes a first element and a second element that mates with the first element to form a waveguide. The formed waveguide comprises a first linear segment and a second linear segment coupled by a first angular bend. The band-pass filter further includes an insert plate disposed between the first element and the second element along a direction of propagation of the waveguide. The direction of propagation follows the angular bend in the waveguide. In some embodiments, the band-pass filter is an E-plane filter. In some embodiments, the band-pass septum filter has a shorter length along an x-direction than a straight septum filter with the same performance.
    Type: Grant
    Filed: May 5, 2017
    Date of Patent: May 28, 2019
    Assignee: ZTE CORPORATION
    Inventors: Zhiping Feng, Zhou Li, Edwin Nealis, Ying Shen
  • Patent number: 10256518
    Abstract: A pair of joined dielectric resonator components of an RF filter includes a first dielectric resonator component and a second dielectric resonator component. The first dielectric resonator component includes a first block of dielectric material, which has a coating of a first conductive material and at least one planar face. The at least one planar face includes a first aperture formed by removing the coating of first conductive material from a portion of the planar face of the first block. The second dielectric resonator component includes a second block of dielectric material, which has a coating of a second conductive material and at least one planar face. The at least one planar face includes a second aperture formed by removing the coating of second conductive material from a portion of the planar face of the second block.
    Type: Grant
    Filed: January 18, 2017
    Date of Patent: April 9, 2019
    Assignee: Nokia Solutions and Networks Oy
    Inventors: David R Hendry, Steven J Cooper, Chris Boyle, Brian Hurley
  • Patent number: 10209168
    Abstract: A measuring instrument for thermogravimetrically determining the moisture content of a material, which includes a base (12), configured as a balance, with a base surface (22), and a hood (14) pivotably connected to the base. The hood has a weighing chamber lid (50), weighing chamber walls (52-56) and a heating element (44). The hood consists of an electronics module (36) that includes the heating element and an electronic power unit, and of a mechanical module (48) that includes the weighing chamber lid and all of the weighing chamber walls. The mechanical module (48) is rigidly and reversibly coupled to the electronics module so that the heating element, protrudes from a main body (42) of the electronics module and rises through a corresponding opening (58) in the rearward weighing chamber wall (56), with the main body being pivotably connected to the base and surrounding the electronic power unit.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: February 19, 2019
    Assignee: SARTORIUS LAB INSTRUMENTS GMBH & CO. KG
    Inventors: Olaf Dudda, Wilfried Spannagel, Daniel Faerger
  • Patent number: 10205209
    Abstract: A triple-band bandpass filter with at least one cavity resonator. Each cavity resonator has the same three orthogonal resonances modes corresponding to three unique resonance frequencies. The three unique resonance frequencies define the passbands of the filter. The filter has an input probe coupled to an input cavity resonator. The filter has an output probe coupled to an output cavity resonator. The input and output probes are shaped to concurrently couple signal waveforms in each of the resonance modes. Coupling probes that can be used as input or output probes are also provided. An inter-cavity coupling operable to concurrently transmit signal waveforms in each of the resonance modes is also provided. The inter-cavity coupling can be used to transmit signals between adjacent cavity resonators in the filter.
    Type: Grant
    Filed: November 4, 2016
    Date of Patent: February 12, 2019
    Assignee: COM DEV LTD.
    Inventors: Li Zhu, Ming Yu, Raafat R. Mansour
  • Patent number: 10135150
    Abstract: A beamformer comprises a transmission line fed by at least one input feed source, the transmission line comprising two stacked metal plates extending, along two directions, longitudinal X and transverse Y. The transmission line further comprises at least one protuberance extending in the directions X, Y, and in a direction Z orthogonal to the plane XY, the protuberance comprising a metal insert extending in the directions X and Y and extending height-wise in the direction Z, the insert comprising a base fastened to one of the two metal plates and a free end and having a contour of variable length between the two lateral edges of the transmission line. In the protuberance, the transmission line is adjoining the insert and forms, in the direction Z, a circumvolution around the insert.
    Type: Grant
    Filed: June 28, 2016
    Date of Patent: November 20, 2018
    Assignees: THALES, UNIVERSITE DE RENNES 1, CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
    Inventors: Hervé Legay, Ségolène Tubau, Jean-Philippe Fraysse, Etienne Girard, Mauro Ettorre, Ronan Sauleau, Nelson Fonseca
  • Patent number: 10128556
    Abstract: The present invention relates to a transition arrangement (1) between a SIW and a waveguide interface (3). The SIW comprises a dielectric material (4), a first and second metal layer (5, 6) and a first and second electric wall element (7a, 7b) running essentially parallel and electrically connecting the metal layers (5, 6). The transition arrangement (1) comprises a coupling aperture (8) in the first metal layer (5) and a third wall element (7c) running between the first and second electric wall elements (7a, 7b). The transition arrangement (1) further comprises an intermediate transition element (9) with a first and second main surface (10, 11), and a transition aperture (12) having first and second opening (13, 14) with corresponding first and second widths (w1, w2).
    Type: Grant
    Filed: March 24, 2013
    Date of Patent: November 13, 2018
    Assignee: Telefonaktiebolaget LM Ericsson (Publ)
    Inventors: Per Ligander, Valter Pasku, Ove Persson, Pietro Sanchirico, Ola Tageman
  • Patent number: 10096877
    Abstract: In an example embodiment, a waveguide device comprises: a first common waveguide; a polarizer section, the polarizer section including a conductive septum dividing the first common waveguide into a first divided waveguide portion and a second waveguide divided portion; a second waveguide coupled to the first divided waveguide portion of the polarizer section; a third waveguide coupled to the second divided waveguide portion of the polarizer section; and a dielectric insert. The dielectric insert includes a first dielectric portion partially filling the polarizer section. The conductive septum and the dielectric portion convert a signal between a polarized state in the first common waveguide and a first polarization component in the second waveguide and a second polarization component in the third waveguide.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: October 9, 2018
    Assignee: VIASAT, INC.
    Inventors: Anders Jensen, John D Voss, Donald L Runyon
  • Patent number: 10056672
    Abstract: Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: August 21, 2018
    Assignee: International Business Machines Corporation
    Inventors: Bing Dang, Duixian Liu, Jean-Olivier Plouchart, Alberto Valdes-Garcia
  • Patent number: 10038232
    Abstract: Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: July 31, 2018
    Assignee: International Business Machines Corporation
    Inventors: Bing Dang, Duixian Liu, Jean-Olivier Plouchart, Alberto Valdes-Garcia
  • Patent number: 9947980
    Abstract: A terahertz waveguide bandpass filter block assembly including a waveguide iris filter, a pedestal block having a pedestal channel including a first one-half portion of the iris filter, and a cover block having a cover channel including a second one-half portion of the iris filter, where the first and second one-half portions combine to define the iris filter having a plurality of poles when the pedestal block and the cover block are secured together. The assembly also includes first and second ribbon strips positioned on opposing sides and adjacent to the iris filter between the pedestal block and the cover block, where a compression force between the pedestal block and the cover block compresses the first and second ribbon strips and sets an “a” dimension of the iris filter to tune the filter to a frequency band of interest.
    Type: Grant
    Filed: January 14, 2016
    Date of Patent: April 17, 2018
    Assignee: Northrop Grumman Systems Corporation
    Inventors: Shih-En Shih, Ben Gorospe, Kevin Leong, William R. Deal
  • Patent number: 9929454
    Abstract: A circularly polarized wave generator includes a rectangular hollow waveguide (1), a plurality of first protrusions (2) that are provided on one pair of opposing wall surfaces in the waveguide (1), have longitudinal directions orthogonal to an axial direction of the waveguide (1), and are arranged at intervals along the axial direction, and a plurality of second protrusions (3) that are provided between the first protrusions (2) on the wall surfaces and are arranged with longitudinal directions thereof running along the axial direction.
    Type: Grant
    Filed: April 2, 2015
    Date of Patent: March 27, 2018
    Assignee: Mitsubishi Electrics Corporation
    Inventors: Yu Ushijima, Hidenori Yukawa, Tetsu Owada, Shuji Nuimura
  • Patent number: 9799937
    Abstract: The present invention relates to a waveguide E-plane filter component comprising a first and second main part (2) with a corresponding first and second waveguide section part (3). The main parts (2) are mounted to each other, such that a waveguide arrangement is formed. The waveguide arrangement has a height and a width. The waveguide E-plane filter component further comprises at least one electrically conducting foil (10, 11) that is placed between the main parts (3), said foil comprising a filter part (25) with apertures (12a, 12b, 12c, 12d). Each pair of adjacent apertures is separated by a corresponding foil conductor (13a, 13b, 13c) of which at least one is constituted by a tuning foil conductor (13a) that has a first, second and third part (14, 16, 18) with a corresponding first, second and third width (15, 17, 19).
    Type: Grant
    Filed: April 2, 2013
    Date of Patent: October 24, 2017
    Assignee: TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)
    Inventors: Anatoli Deleniv, Piotr Kozakowski
  • Patent number: 9793589
    Abstract: In order to prevent electrical characteristics from degrading, a band-pass filter includes: a dielectric substrate having an upper surface and a lower surface opposed to each other, the dielectric substrate extending in a waveguide axial direction; a pair of conductor layers respectively arranged on the upper surface and the lower surface of the dielectric substrate; two rows of through hole groups for sidewalls, which are formed at predetermined intervals in the waveguide axial direction so as to electrically connect the pair of conductor layers; and a plurality of through holes for electrically connecting the pair of conductor layers, the plurality of through holes being formed in parallel to the waveguide axial direction and arranged in a center of a waveguide formed in a region surrounded by the pair of conductor layers and the two rows of the through hole groups for sidewalls.
    Type: Grant
    Filed: April 1, 2013
    Date of Patent: October 17, 2017
    Assignee: NEC Corporation
    Inventor: Takafumi Kai
  • Patent number: 9786972
    Abstract: In an end surface 32b of the second transmission line forming body 32 forming a second waveguide 30, the height of a central region 33 which includes an opening of the second transmission line 30b is a reference plane. A depressed portion 32e that is depressed to a depth greater than the length of a thread portion of a screw 205 from the reference plane is provided in a region outside the central region 33 and includes a screw hole forming position. A screw hole 32d for fixing an external circuit 200 to be connected is provided at the screw hole forming position in the depressed portion 32e. The height of a region, which is excluding the depressed portion 32e and is further away from the central region 33 than the screw hole forming position, is equal to the reference plane.
    Type: Grant
    Filed: July 2, 2015
    Date of Patent: October 10, 2017
    Assignee: Anritsu Corporation
    Inventors: Takashi Kawamura, Akihito Otani
  • Patent number: 9742052
    Abstract: A device for transmitting millimeter-wave signals between a microstrip formed on a circuit board and a waveguide, characterized by a housing which is soldered onto the circuit board with the aid of solder contacts and which contains a signal line, which is connected to the microstrip via a soldered connection suitable for use at high frequencies, and which connects this microstrip to a coupling point for the millimeter-wave signals, the coupling point facing the waveguide.
    Type: Grant
    Filed: September 11, 2015
    Date of Patent: August 22, 2017
    Assignee: ROBERT BOSCH GMBH
    Inventors: Juergen Hasch, Elena Pancera, Carsten Potratz, Dirk Schmidt
  • Patent number: 9673497
    Abstract: A temperature-compensated high frequency filter of coaxial construction comprises at least one resonator having an inner conductor and an outer conductor housing. A compensation device made of a second material has a second coefficient of thermal expansion. The compensation device comprises a wall section, which extends in an axial direction and is variable in length in this direction in the event of a temperature change. The wall section is part of the housing wall configured in the manner of an intermediate layer or an upper-most layer located adjacent to the housing cover. The wall section may extend in an axial direction or in a direction transversely thereto and be variable in length in this direction in the event of a temperature change. The wall section is an integral part of the housing cover or is connected to the housing cover, or forms the housing cover having convex outwardly directed curvature.
    Type: Grant
    Filed: November 14, 2013
    Date of Patent: June 6, 2017
    Assignee: Kathrein-Austria Ges.m.b.H
    Inventor: Bernd Schöninger
  • Patent number: 9583813
    Abstract: Various embodiments are directed toward systems and method for manufacturing low cost passive waveguide components. For example, various embodiments relate to low cost manufacturing of passive waveguide components, including without limitation, waveguide filters, waveguide diplexers, waveguide multiplexers, waveguide bends, waveguide transitions, waveguide spacers, and antenna adapters. Some embodiments comprise manufacturing a passive waveguide component by creating a non-conductive structure using a low cost fabrication technology, such as injection molding or three-dimensional (3D) printing, and then forming a conductive layer over the non-conductive structure such that the conductive layer creates an electrical feature of the passive waveguide component.
    Type: Grant
    Filed: August 6, 2014
    Date of Patent: February 28, 2017
    Assignee: Aviat U.S., Inc.
    Inventors: Jayesh Nath, Ying Shen, Edwin Nealis
  • Patent number: 9553371
    Abstract: An integrated antenna package includes an interposer, an integrated circuit die, and a cap that forms a cavity within the integrated antenna package. A lossy EBG structure resides at the cap overlying the integrated circuit device. A lossless EBG structure resides at the cap overlying a microstrip feedline. A radar module includes a plurality of receive portions, each receive portion including a parabolic structure having a reflective surface, an absorber structure, a lens, and an antenna.
    Type: Grant
    Filed: November 12, 2010
    Date of Patent: January 24, 2017
    Assignee: NXP USA, INC.
    Inventors: James MacDonald, William McKinzie, III, Walter Parmon, Lawrence Rubin
  • Patent number: 9287598
    Abstract: A high-power microwave RF window is provided that includes a cylindrical waveguide, where the cylindrical waveguide includes a ceramic disk concentrically housed in a central region of the cylindrical waveguide, a first rectangular waveguide, where the first rectangular waveguide is connected by a first elliptical joint to a proximal end of the cylindrical waveguide, and a second rectangular waveguide, where the second rectangular waveguide is connected by a second elliptical joint to a distal end of the cylindrical waveguide.
    Type: Grant
    Filed: May 7, 2014
    Date of Patent: March 15, 2016
    Assignee: The Board of Trustees of the Leland Stanford Junior University
    Inventors: Sami G. Tantawi, Valery A. Dolgashev, Anahid D. Yeremian
  • Patent number: 9282625
    Abstract: A plasma resonant cavity, including a cylindrical resonant cavity casing, cutoff waveguides, and a waveguide inlet circumferentially formed on the cylindrical resonant cavity casing. The cutoff waveguides are arranged at two ends of the cylindrical resonant cavity casing and employ a movable end cover structure. An intermediate through hole is formed on each cutoff waveguide with the movable end cover structure, and a raised round table is arranged on an inner end surface of the cutoff waveguide and configured with the resonant cavity.
    Type: Grant
    Filed: October 9, 2012
    Date of Patent: March 8, 2016
    Assignee: YANGTZE OPTICAL FIBRE AND CABLE COMPANY, LTD.
    Inventors: Zhenyu Li, Songtao Lu, Shanpei Liu, Shengya Long, Gaoqing Lei, Yongtao Liu
  • Patent number: 9190706
    Abstract: Various embodiments are directed toward low cost passive waveguide components. For example, various embodiments relate to passive waveguide components created busing a low cost fabrication technology. In some embodiments, a three-dimensional (3D) printing process is used to create a design mold and a non-conductive structure of the waveguide is formed using a plastic injection molding process. A conductive layer may be formed over the non-conductive structure such that the conductive layer creates an electrical feature of the passive waveguide component.
    Type: Grant
    Filed: September 29, 2011
    Date of Patent: November 17, 2015
    Assignee: Aviat U.S., Inc.
    Inventors: Jayesh Nath, Ying Shen, Edwin Nealis
  • Patent number: 9136579
    Abstract: Provided is a phase shifter using a substrate integrated waveguide (SIW). The phase shifter includes: a substrate; and a waveguide integrated on the substrate, wherein the waveguide includes an input port, an out port, two columns of via walls which are separated by a width of the waveguide and are arranged parallel to each other, and either a plurality of air holes which are formed to shift a phase of a signal between the input port and the output port or a plurality of rods, each including an air hole and a dielectric material inserted into the air hole.
    Type: Grant
    Filed: November 4, 2010
    Date of Patent: September 15, 2015
    Assignee: AJOU UNIVERSITY INDUSTRY COOPERATION FOUNDATION
    Inventors: Hai-Young Lee, Ki-Bum Kang, Jin do Byun