Abstract: A semiconductor device comprising a signal line and ground line is disclosed. The signal line comprises an opening and at least a portion of the ground line is in the opening in the signal line.

Abstract: There is provided a low loss slow wave transmission line that can be miniaturized. A slow wave transmission line of the present invention has a configuration which includes a repeated arrangement of a low impedance line and a high impedance line and in which the high impedance line is longer than the low impedance line in terms of a line length.

Abstract: A high speed flexible interconnect cable for an electronic assembly includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The cable can be coupled to electronic components using a variety of connection techniques. The cable can also be terminated with any number of known or standardized connector packages.

Abstract: A vertical transmission structure for high frequency transmission lines includes a conductive axial core and a conductive structure surrounding the conductive axial core. The vertical transmission structure is applied to a high-frequency flip chip package for reducing the possibility of underfill from coming in contact with the conductive axial core.

Abstract: A radio frequency (RF) transition for a three dimensional molded RF structure is provided. In one embodiment, the invention relates to a radio frequency (RF) transition for an RF structure, the RF transition includes an assembly having a first flexible layer, a second flexible layer, and a third flexible layer, wherein a first section of the assembly includes a microstrip transmission line, wherein a second section of the assembly includes a dielectric stripline transmission line, and wherein a third section of the assembly includes a suspended substrate stripline transmission line.

Abstract: A signal transmission line in which a signal line and a GND, both configured of a conductor foil, are formed within a dielectric, the signal transmission line being influenced by an electrostatic bond in the case where the signal transmission line has been disposed in a housing. In the signal transmission line, the shape of the conductor foil is configured so that a margin from a predetermined mask in an eye pattern in the case where the signal transmission line is disposed in the housing is greater than a margin of a signal transmission line in which the shape of the conductor foil is configured so as to be constant between a transmitting end and a receiving end of the signal transmission line.

Abstract: A substrate with an HF-compatible line arranged in this substrate will be proposed that is formed similar to a tri-plate strip line in which, however, at least one of the ground planes has a slot that follows the profile of the signal line arranged between two ground planes. With the aid of this slot, the capacitive constant of the line can be lowered and thus the impedance of the line can be increased.

Abstract: The invention relates, in particular, to a system for transmitting at least one electric pulse for an apparatus for determining a distribution of charges contained in the thickness of an item (2) made of a dielectric material, said transmission system including a transmitter electrode (1) for transmitting at least one pulse and a generator (3) of said pulse. The system is notable in that said electrode is formed by a transmission line (1) which is substantially level in relation to the item (2) to be analyzed and which includes impedance matching means to keep said impedance substantially constant along said transmission line in the passband of said pulse.

Abstract: A prevention structure to prevent signal lines from time-skew is described. The prevention structure includes a plurality pairs of differential signal lines and a prevention line. The adjacent pairs of differential signal lines are separated from each other by a first gap. Each pair of the differential signal lines includes a positive signal line and a negative signal line each having a first line width. The prevention line has the second line width substantially equal to the first line width and is separated from the outmost differential signal line by a second distance substantially equal to the first distance.

Abstract: Provided is a microstrip transmission line for reducing far-end crosstalk. In a conventional microstrip transmission line on a printed circuit board, a capacitive coupling between adjacent signal lines is smaller than an inductive coupling therebetween, so that far-end crosstalk occurs. According to the present invention, the capacitive coupling between the adjacent signal lines is increased to reduce the far-end crosstalk. A vertical-stub type microstrip transmission line is provided.

Abstract: A balun includes a first, second, and third metallic layers, a first dielectric layer disposed between the second and third metallic layers, and a dielectric substrate. The second metallic layer includes a first spiral line having sequentially connected first line segments and a second spiral line having sequentially connected second line segments. A first distance between each two opposite sides of a first region encircled by the innermost first line segments is greater than a second distance between each two adjacent parallel first line segments. A third distance between each two opposite sides of a second region encircled by the innermost second line segments is greater than a fourth distance between each two adjacent parallel second line segments. The third metallic layer includes a third and a fourth spiral lines. The first metallic layer and other elements as a whole are disposed on an opposite surface of the dielectric substrate.

Abstract: To reduce cross-talk, an integrated circuit may include a uniform signal trace for a first signal; and a pair of non-uniform signal traces forming a differential pair for a differential signal. The pair of non-uniform signal traces near the uniform signal trace.

Abstract: According to one embodiment, a balun includes one or more transformers configured to block DC power between a line and a device at microwave frequencies. The one or more transformers block DC power between the line and the device by electromagnetically coupling the device to the line.

Abstract: An integrated circuit comprising: a substrate; a first transmission line arranged on the substrate, the first transmission line having a first termination; a die having a first surface on the substrate and an opposed second surface, the die being spaced from the first termination; a second transmission line arranged on the second surface of the die, the second transmission line having a second termination; and a bond wire connected between the first termination and the second termination configured to have a length half the wavelength of the signal central frequency.

Abstract: A high frequency device having a membrane structure with improved mechanical strength is provided. The high frequency device includes: a substrate having an aperture; a first dielectric layer that is formed from a material having etching selectivity in relation to a material of the substrate and is provided on the substrate to cover the aperture; a second dielectric layer on the first dielectric layer; and a high frequency element provided in a position opposed to the aperture on the second dielectric layer.

Abstract: Disclosed herein is a flat uniform transmission line having an electromagnetic shielding function. The flat uniform transmission line includes a strip transmission line, an insulating layer, and electromagnetic shielding layers. The strip transmission line is formed on a dielectric layer made of functional polymer material, and includes a plurality of strip lines. The plurality of strip lines are configured to be a ground line, or to transmit signals. The insulating layer is formed on the strip transmission line. The electromagnetic shielding layers are respectively formed on the insulating layer and beneath the strip transmission line.

Abstract: Fundamental interconnect systems for connecting high-speed electronics elements are provided. The interconnect systems consists of signal line, dielectric system with open trench or slot filled up with air or lower dielectric loss material, and the ground plane. The signal line could be for example, microstripline, strip line, coplanar line, single line or differential pairs. The interconnect system can be used for on-chip interconnects or can also be used for off-chip interconnects. The fundamental techniques provided in this invention can also be used for high-speed connectors and high-speed cables.

Abstract: Fundamental interconnect systems for connecting high-speed electronics elements are provided. The interconnect systems consists of signal line, dielectric system with open trench or slot filled up with air or lower dielectric loss material, and the ground plane. The signal line could be for example, microstripline, strip line, coplanar line, single line or differential pairs. The interconnect system can be used for on-chip interconnects or can also be used for off-chip interconnects. The fundamental techniques provided in this invention can also be used for high-speed connectors and high-speed cables.

Abstract: Systems having three coupled transmission lines designed in such a way that any two of which taken together can be used as a differential transmission line with a roughly equal differential mode characteristic impedance while achieving high level of common mode characteristic impedance. The high level of common mode characteristic impedance is achieved by arrangement of the three transmission lines in distinct planes along a transmission axis.

Abstract: A transmission structure having high propagation velocity and a low effective dielectric loss. The structure comprises a dielectric, a first reference conductor disposed below the dielectric, a signal conductor disposed above the dielectric, and a second reference conductor disposed over the signal conductor. The second reference conductor has a recess portion facing the signal conductor, the recess portion defining a gap between the second reference conductor and the signal conductor. The gap may be filled with air which has a relative dielectric constant approximately equal to one (1). Because of the physical and dielectric constant characteristics of the gap, the structure concentrates an electric field in the gap resulting in an effective dielectric constant approximately (approaching) one (1) and an effective dielectric loss approximately equal to zero (0). Thus, the structure exhibits a propagation velocity approximately equal to the speed of light.

Abstract: A balun that includes a first conductor, a second conductor, and a third conductor. The first conductor has a first length. The first conductor also has a first end connected to a first balanced power amplifier output port. The second conductor has substantially the same first length. The second conductor also includes a first end connected to a second balanced power amplifier output port and a second end connected to a second end of the first conductor. The third conductor has substantially the same first length. The third conductor has a first end connected to an antenna port and a second end connected to a ground potential.

Abstract: An on-chip vertical coplanar waveguide with tunable characteristic impedance, a design structure, and a method of making the same. An on-chip transmission line includes a signal line, an upper ground line spaced apart from and above the signal line, and a lower ground line spaced apart from and below the signal line. The signal line, the upper ground line and the lower ground line are substantially vertically aligned in a dielectric material.

Abstract: Fundamental interconnect systems for connecting high-speed electronics elements are provided. The interconnect systems consists of signal line, dielectric system with open trench or slot filled up with air or lower dielectric loss material, and the ground plane. The signal line could be for example, microstripline, strip line, coplanar line, single line or differential pairs. The interconnect system can be used for on-chip interconnects or can also be used for off-chip interconnects. The fundamental techniques provided in this invention can also be used for high-speed connectors and high-speed cables.

Abstract: An overdrive topology structure for transmission of a RGB signal includes a signal sending terminal, a signal receiving terminal, and a transmission line to transmit the RGB signal from the signal sending terminal to the signal receiving terminal. The transmission line is divided into a number of section transmission lines. A node is formed between every two section transmission lines. An impedance of a first section transmission line approaching to the signal sending terminal is less than an impedance of a second section transmission line approaching to the first section transmission line to overdrive the RGB signal at a first node between the first and second section transmission lines. At least one node except the first node is grounded via a resistor. An equivalent resistance of the resistor is equal to a resistance of the first resistor.

Abstract: A multiple-layer signal conductor has increased surface area for mitigation of skin effect. Parallel extending elongated strips of conductive material are placed in parallel layers and are separated by a thin layer of dielectric. The elongated strips are conductively connected to one another by regularly spaced vias such that a single signal conductor with multiple conductive layers is formed. During high-speed signaling, the skin effect causes current to concentrate near the surfaces of conductors. The multiple-layer signal conductor, however, has increased surface area with respect to its total cross-sectional area. The effective cross-sectional area which is conductive during high-speed signaling is therefore increased, leading to positive effects on transmission line resistance, heating, signal integrity and signal propagation delay.

Abstract: A directional coupler (500), which comprises a dielectric substrate (501) on top of a metal plate (510), is functioning as a ground plane. The transmission path is a suspended stripling so that there is a recess on the ground plane below the transmission conductor (520) being on the surface of the substrate. The sensing conductor (530) is a very small-sized conductive strip on the surface of the substrate. It has been connected from its head end to the measurement port (P3) and from its tail end via a termination resistor (550) to a small ground strip (515). The ground strip is next to the sensing conductor on the side of the output port (P2) of the directional coupler. With such an asymmetric structure, some directivity is obtained despite the small size of the sensing conductor. Also below the sensing conductor (530) there is a recess (506) on the ground plane, which joins the recess below the transmission conductor (520).

Abstract: According to one exemplary embodiment, a circuit board for reducing dielectric loss, conductor loss, and insertion loss includes a pair of transmission lines. The pair of transmission lines has sufficient thickness to cause substantial broadside electromagnetic coupling between the pair of transmission lines, where the pair of transmission lines is sufficiently separated from a ground plane of the circuit board so as to cause negligible electromagnetic coupling to the ground plane relative to the substantial broadside electromagnetic coupling. The pair of transmission lines thereby reduce dielectric loss, conductor loss, and insertion loss for signals traversing through the transmission line pair. The pair of transmission lines can be separated from the ground plane by, for example, at least 50.0 mils.

Abstract: Coplanar waveguide structures and design structures for radiofrequency and microwave integrated circuits. The coplanar waveguide structure includes a signal conductor and ground conductors generally coplanar with the signal conductor. The signal conductor is disposed between upper and lower arrays of substantially parallel shield conductors. Conductive bridges, which are electrically isolated from the signal conductor, are located laterally between the signal conductor and each of the ground conductors. Pairs of the conductive bridges connect one of the shield conductors in the first array with one of the shield conductors in the second array to define closed loops encircling the signal line.

Abstract: A signal transmission device is installed on a motherboard and is electrically connected to a signal control unit and a display output interface. The signal transmission device includes a signal receiving port, a signal output port, and a printed circuit connecting port. The signal receiving port is used for receiving a signal transmitted from the signal control unit. The signal output port is used for single output of the signal to the display output interface. The printed circuit connecting port is used for transmitting the signal from the signal receiving port to the signal output port. Thus, the signal transmission device may be used for single signal output so as to replace a switch integrated circuit of selective signal output. In such a manner, related circuit redesign and manufacturing cost may be reduced accordingly when the motherboard signal output design is changed from selective signal output to single signal output.

Abstract: A microwave circuit assembly includes a Liquid Crystalline Polymer (LCP) layer that supports at least one microwave circuit component. First and second ground plane layers form the outer surfaces of the assembly and these are spaced apart at least partially by a gas, a mixture of gases, or a vacuum, from the LCP supporting layer and the at least one microwave circuit.

Abstract: The present invention provides a microstrip line for a printed wiring board such as a flexible printed wiring board which includes a sandwiched thin insulating layer and cannot use a solid grounding conductor, the microstrip line being such that shape of grounding conductors relative to signal lines remains unchanged even in the presence of a curved shape and that overlapping areas of signal lines and grounding conductors located opposite to each other remain unchanged even in case of exposure misalignment or stack misalignment. A printed wiring board with a microstrip line structure in which signal lines are curved include wire-type grounding conductors 5, 9, 12, 15, 19, or 26 located across an insulating layer 3, 10, or 13 from the signal lines 4, 6, 8, 11, 14, 18, or 25, characterized in that wiring pitch of the grounding conductors is 1/n of width of the signal lines (where n is a natural number of 1 or 2).

Abstract: Transmission lines for electronic devices such as microstrip and stripline transmission lines may be provided that include patterned conductive lines and a conductive paint in the patterned conductive lines. The transmission lines may include one or more planar ground conductors. The ground conductors may include conductive lines arranged in a crosshatch pattern with spaces between the conductive lines. The ground conductors may also include conductive paint in spaces within the crosshatched pattern. The ground conductors may form one or more ground planes for the transmission lines.

Abstract: A device including a coplanar waveguide structure is disclosed. A coplanar waveguide structure comprises one or more ground lines proximate to one or more signal lines, the signal lines and the ground lines being essentially parallel to each other and oriented substantially along a first direction; a periodic structure included in at least one of the one or more signal lines comprises alternating segments, wherein at least one of the alternating segments extends in a second direction transverse to the first direction.

Abstract: A substrate having two high frequency components positioned on substrates typically used for lower frequency devices. A coplanar strip transmission line, providing for transmission of high frequency signals, comprises first, second and third parallel, spaced conductive traces positioned on a surface of the substrate, wherein the substrate defines a first slot extending from the first surface into the substrate and between the first and second parallel, spaced conductive traces and a second slot extending from the first surface into the substrate and between the first and third parallel, spaced conductive traces. Optionally, an antenna is coupled to the coplanar strip transmission line and comprises first and second antenna traces, the substrate defining a third slot therebetween.

Abstract: A coupled microstrip line structure having tunable characteristic impedance and wavelength are provided. In accordance with one aspect of the invention, a coupled microstrip line structure comprises a first ground plane having a plurality of first conductive strips separated by a dielectric material, and a first dielectric layer over the first ground plane. The coupled microstrip line further comprises a first signal line over the first dielectric layer, wherein the first signal line is directly above the plurality of first conductive strips, and wherein the first signal line and the plurality of first conductive strips are non-parallel, and a second signal line over the first dielectric layer, wherein the second signal line is directly above the plurality of first conductive strips, and wherein the second signal line and the plurality of first conductive strips are non-parallel, and wherein the second signal line is substantially parallel to the first signal line.

Abstract: A micro-strip transmission line capable of reducing far-end crosstalk is provided. The micro-strip transmission line having a serpentine shape is capable of reducing the far-end crosstalk of the transmission line by increasing capacitive coupling between neighboring transmission lines by allowing parallel micro-strip transmission lines to have serpentine shapes. In the structure of the micro-strip transmission line having the serpentine shape, it is possible to reduce the far-end crosstalk of the transmission line by increasing capacitive coupling between neighboring transmission lines by allowing parallel micro-strip transmission lines to have serpentine shapes.

Abstract: Disclosed herein is a flat uniform transmission line having an electromagnetic shielding function. The flat uniform transmission line includes a strip transmission line, an insulating layer, and electromagnetic shielding layers. The strip transmission line is formed on a dielectric layer made of functional polymer material, and includes a plurality of strip lines. The plurality of strip lines are configured to be a ground line, or to transmit signals. The insulating layer is formed on the strip transmission line. The electromagnetic shielding layers are respectively formed on the insulating layer and beneath the strip transmission line.

Abstract: A high speed flexible interconnect cable for an electronic assembly includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The cable can be coupled to electronic components using a variety of connection techniques. The cable can also be terminated with any number of known or standardized connector packages.

Abstract: Disclosed herein is a flat uniform transmission line having an electromagnetic shielding function. The flat uniform transmission line includes a strip transmission line, an insulating layer, and electromagnetic shielding layers. The strip transmission line is formed on a dielectric layer made of functional polymer material, and includes a plurality of strip lines. The plurality of strip lines are configured to be a ground line, or to transmit signals. The insulating layer is formed on the strip transmission line. The electromagnetic shielding layers are respectively formed on the insulating layer and beneath the strip transmission line.

Abstract: A balun comprises at least two asymmetric coplanar striplines, a first of the striplines coupled to a signal input, and a second of the striplines coupled to a signal output, the at least two asymmetric coplanar striplines configured in a Marchand architecture to receive an unbalanced signal and to output a balanced signal.

Abstract: A semiconductor device comprising a signal line and ground line is disclosed. The signal line comprises an opening and at least a portion of the ground line is in the opening in the signal line.

Abstract: Intermodulation distortion (IMD) is known to be an impediment to progress in superconductor-based filter technology. The present invention's methodology for reducing IMD can open doors to heretofore unseen practical applications involving high temperature superconductor (HTS) filters. Typical inventive practice includes (a) increasing the thickness d, and/or (b) changing the operation temperature T, of the filter's HTS film. The film's thickness d is increased in such a way as to decrease the IMD power PIMD in accordance with the material-independent proportionate relationship PIMD?1/d1.5-6. The film's operation temperature T is bettered or optimized in accordance with the material-independent proportionate relationship PIMD?(?O(T))10(K(2)(T))2/(?O(T))6, and further in accordance with three individual material-dependent relationships, namely, between operation temperature T and each of linear penetration depth ?O, gap maximum ?O, and kernel K(2).

Abstract: A substrate for high frequency includes: a dielectric substrate; a transmission line which is formed on a front surface of the dielectric substrate and includes land portions opposite to each other with a gap therebetween; a grounded conductor which is formed on a rear surface of the dielectric substrate and includes an opening portion in a region corresponding to the land portions; and a metal substrate on which the dielectric substrate is disposed in a state where the grounded conductor is in contact with the metal substrate, and also, a through hole is formed at a portion corresponding to the opening portion.

Abstract: A printed circuit board (PCB) including an impedance-matched strip transmission line includes a strip transmission line including a main line and at least one pair of branch lines branching off from the main line. An upper ground layer is disposed over the strip transmission line and has upper opening parts corresponding in position to the branch lines. A lower ground layer is disposed under the strip transmission line and has lower opening parts corresponding in position to the branch lines. The upper and lower opening parts are symmetric about the branch lines of the strip transmission line.

Abstract: An HF plasma process excitation configuration includes an HF generator that is connected to a plasma load through a directional coupler. The directional coupler includes a transmission line, a first coupling line for detecting reflected power from the plasma load, and a second coupling line for detecting forward power from the HF generator, is the first coupling line is spaced apart from the transmission line and is terminated at least at one end with a termination resistance. The second coupling line is spaced apart from the transmission line and is terminated at least at one end with a termination resistance. Each coupling line has a predetermined and adjusted characteristic impedance, and the termination resistances each have a resistance value that corresponds within a tolerance to the characteristic impedance of the associated coupling line with a tolerance.

Abstract: A multilayer balun comprises first and second transmission lines that constitute a half-wave transmission line are opposed in adjacent layers, with a dielectric substance therebetween, so that, during use, the current of the first transmission line and the current of the second transmission line flow in the same direction. Thus, magnetic shield is formed between the first and second transmission lines. This eliminates the need for a grounding electrode layer for preventing magnetic interference between the first and second transmission lines.

Abstract: High speed printed circuit boards (PCBs) are disclosed comprising a dielectrics systems with the back-side trenches, prepregs, signal lines and ground-plans, wherein the signal line and ground-plan are located on the dielectrics. Using of the open trenches in the substrate help to reduce the microwave loss and dielectric constant and thus increasing the signal carrying speed of the interconnects. Thus, according to the present invention, it is possible to provide a simple high speed PCB using the conventional material and conventional PCB manufacturing which facilitates the design of circuits with controlled bandwidth based on the trench opening in the dielectrics, and affords excellent reliability. According to this present invention, high speed PCB with the interconnect system contains whole portion or portion of interconnects for high speed chips interconnects and that have have the dielectric system with opened trench or slot to reduce the microwave loss.

Abstract: A signal transmission structure includes two power planes, a signal line and a first pillar. The power planes spaced by an interval space provide a first voltage and a second voltage respectively. The signal line, disposed on first surfaces of the power planes, is disposed across the interval space. The first pillar is disposed within the interval space and is aside the signal line, in which the first pillar is apart from the power planes and the signal line.

Abstract: An integrated circuit structure includes a semiconductor substrate; an interconnect structure over the semiconductor substrate; a first dielectric layer over the semiconductor substrate and in the interconnect structure; a second dielectric layer in the interconnect structure and over the first dielectric layer; and a wave-guide. The wave-guide includes a first portion in the first dielectric layer and a second portion in the second dielectric layer. The first portion adjoins the second portion.

Abstract: A carrier for transmitting a high frequency signal and a carrier layout method thereof are provided. The carrier includes a substrate, conducting wires and reference planes both formed on the substrate. The carrier layout method includes defining impedance and thickness of the carrier according to the high frequency signal and defining layout parameters according to the impedance and the thickness. The layout parameters include a conducting layer formed on the conducting wires, a coplanar waveguide formed between the reference planes and the conducting wires, roughness portions formed on the conducting wires, recessed portions formed on the conducting wires, and the substrate being a high loss tangent substrate. The layout is performed according to the layout parameters defined thereabove, so as to increase loss of the high frequency signal in transmission.