Abstract: This topic is related to a waveguide propagation apparatus, converting microstrip propagation to waveguide propagation, providing hermeticity on the mounting area, eliminating the cabling component causing degradation on the overall performance, involving at least a microwave module (2), and comprising a combination of a base part (3) and a cover part (4).

Abstract: A multi-layer circuit board with a waveguide to microstrip transition structure includes a laminated structure having a plurality of dielectric layers, a top metal frame disposed over the laminated structure, a microstrip line disposed over the laminated structure, a bottom metal frame underlying the laminated structure, and a plurality of conductors electrically connecting the top metal frame and the bottom metal frame. The top metal frame defines a top cavity, the bottom metal frame defines a bottom cavity corresponding to the top cavity, and the microstrip line extends into the top cavity. The laminated structure includes an upper dielectric layer and at least one lower dielectric layer, wherein top cavity exposes a top surface of the upper dielectric layer, and the bottom cavity exposes a bottom surface of the at least one lower dielectric layer.

Abstract: Described herein are an apparatus, system, and method having a compact symmetrical transition structure for RF applications. The apparatus comprises: first and second ground planes each of which having respective truncated edges, the first and second ground planes being parallel to one another and separated by a multi-layer substrate; a strip line positioned between the first and second ground planes; and a symmetrical transition structure, coupled to the strip line and the first and second ground planes near their respective truncated edges, and further coupled to a broadside coupled line (BCL).

Abstract: A multi-mode I/O circuit or cell (10) is provided for transmitting and receiving data between ICs, where each IC contains at least one of the I/O circuits. Each data link includes transmitter circuitry (12) and receiver circuitry (14). The transmitter circuitry sends data to a receiver circuitry in another IC, and the receiver circuitry receives data from a transmitter circuitry in another IC. The I/O circuit is constructed with CMOS-based transistors (e.g., CMOS or BiCMOS) that are selectively interconnected together by a plurality of switches to operate as two single-ended, current or voltage mode links, or as a single differential current or voltage mode link. In the preferred embodiment the transmitter circuitry sends data to the receiver circuitry in another IC over a first pair of adjacently disposed conductors, and the receiver circuitry receives data from the transmitter circuitry in another IC over a second pair of adjacently disposed conductors.

Abstract: In a high frequency filter, a multilayer structure includes a plurality of insulator layers, a first transmission line transmits an input signal, and a second transmission line is electromagnetic coupled with the first transmission line on the same insulator layer and transmits an output signal. A conductor layer defines capacitors with the first transmission line and the second transmission line with the insulator layer in between. A dielectric constant of the insulator layer that comes in contact with the first transmission line and the second transmission line is higher than a dielectric constant of an insulator layer other than the insulator layer.

Abstract: Apparatus is provided which allows for the receipt and/or transmission of data signals, and, for the received signals, for the subsequent separation of the same into at least two sets of data signals which are orthogonal and provide these sets of data signals to subsequent processing components, whilst maintaining the isolation between the first and second data signal sets. For the transmission of the data signals the first and second sets of data signals are initially separate and then combined into one data set to allow the same to be transmitted.

Abstract: The invention relates to a circuit for transition from a microstrip line to a slot line. According to the invention, the slot line of the transition circuit is equipped with a filter for providing on the slot line, at the crossover zone of the microstrip line and the slot line, an impedance substantially equal to the impedance of an open circuit for at least one desired frequency of the signal and an impedance substantially equal to the impedance of a short circuit for at least one undesirable frequency of the signal. Advantageously, the microstrip line is also equipped with a filter for providing on the microstrip line, at the crossover zone, an impedance substantially equal to the impedance of a short circuit for the desired frequency and an impedance substantially equal to the open-circuit impedance for the undesirable frequency.

Abstract: An interface for connecting a differential signal circuit having a differential signal output and a reference potential terminal to an input of a single ended signal circuit and a reference potential terminal. The interface includes a differential transmission line having a pair of electromagnetically coupled microwave transmission lines having first ends connected to the differential signal output and second ends, one of the second ends being connected to the single ended circuit input and the other one of the second ends being coupled to the reference potential terminals of the differential signal circuit and the single ended signal circuit.

Abstract: A surface antenna with a single radiation element, which comprises (a) a power source with first and second poles; (b) a phase shifting element, inserted to the path of one of the poles of the power source in such a manner that the phase shifting device shifts the phase of a first signal propagating through said pole such that the shifted phase of the first signal will be essentially identical to the phase of a second signal propagating through the other pole. The shifted first signal is added to the second signal with essentially the same phase of second signal, whenever both poles are connected together to form a single-wire, through which the resulting added signal propagates.

Abstract: A system for injecting and guiding millimeter-waves through a Printed Circuit Board (PCB) including at least two laminas belonging to a PCB, an electrically conductive plating applied on the insulating walls of a cavity formed perpendicularly through the laminas, and optionally a probe located above the cavity printed on a lamina belonging to the PCB. Optionally, the cavity guides millimeter-waves injected by the probe at one side of the cavity to the other side of the cavity.

Abstract: An apparatus may include one or more conductive surfaces, waveguide structures and/or ports. One or more waveguide structures may include a portion disposed above a conductive surface, an outer conductor, and/or an inner conductor. A first portion of an outer conductor may be connected to a conductive surface. A port end of an outer conductor may be connected to an outer conductor port. An inner conductor may be disposed inside and spaced apart from an outer conductor. An inner conductor port may be connected to an inner conductor. An inner conductor of two or more waveguide structures may be connected to each other. A conductive surface may include at least one aperture portion, which may have a width substantially similar to the width of a waveguide structure. A substrate may be disposed between one or more waveguide structures and a conductive surface for a substantial portion of a waveguide structure.

Abstract: A method for constructing millimeter-wave laminate structures using Printed Circuit Board (PCB) processes includes the following steps: Creating a first pressed laminate structure comprising at least two laminas and a cavity, the cavity is shaped as an aperture of a waveguide, and goes perpendicularly through all laminas of the laminate structure. Plating the cavity with electrically conductive plating, using a PCB plating process. Pressing the first pressed laminate structure together with at least two additional laminas comprising a probe printed on one of the at least two additional laminas, into a PCB comprising the first pressed laminate structure and the additional laminas, such that the cavity is sealed only from one end by the additional laminas and the probe, and the probe is positioned above the cavity.

Abstract: A Marchand balun has a primary transmission line with a width smaller than the two secondary transmission lines. The two secondary transmission lines also have different widths and lengths. This arrangement provides an imbalance between the widths and lengths of the transmission lines. It has been found that this imbalance can enable improved amplitude unbalance and phase unbalance.

Abstract: A system for matching impedances of a bare-die Integrated Circuit and bonding wires. A bare-die Integrated Circuit is configured to output or input, at an impedance of Z3, a millimeter-wave signal from three electrically conductive contacts. Three electrically conductive pads, printed on one of the laminas of a Printed Circuit Board (PCB) are connected to the three electrically conductive contacts via three bonding wires respectively, the bonding wires have a characteristic impedance of Z1, wherein Z1>Z3. One of the electrically conductive pads extends to form a transmission line signal trace of length L, the transmission line signal trace having a first width resulting in characteristic impedance of Z2, wherein Z2>Z3. The transmission line signal trace widens to a second width, higher than the first width, after the length of L, decreasing the characteristic impedance of the transmission line signal trace to substantially Z3 after the length L and onwards.

Abstract: A system enabling interface between a millimeter-wave bare-die and a Printed Circuit Board (PCB). A cavity of depth X is formed in at least one lamina of a PCB. Three electrically conductive pads are printed on one of the laminas of the PCB, the pads optionally reach the edge of the cavity. A bare-die Integrated Circuit having a thickness of optionally X, or a heightened bare-die Integrated Circuit having a thickness of optionally X, output a millimeter-wave signal from three electrically conductive contacts arranged in a ground-signal-ground configuration on an upper side edge of the bare-die Integrated Circuit. The bare-die Integrated Circuit is placed inside the cavity, optionally such that the electrically conductive pads and the upper side edge containing the electrically conductive contacts are arranged side-by-side at substantially the same height. Three bonding wires or strips electrically connect each electrically conductive contact to one of the electrically conductive pads.

Abstract: A low-loss interface between a mm-wave integrated circuit and a waveguide comprises a surface having a contact location for said integrated circuit and a waveguide location for fixing a waveguide thereon; a transmission line extending along said surface from said contact location to the waveguide location and extending into the waveguide location as a waveguide feed; and a connection bump on a surface of the mm-wave integrated circuit. The mm-wave integrated circuit RFIC is connected to the surface at the contact location through the connection bump, such as to connect a signal output of the RFIC to the transmission line, thereby providing said low loss interface.

Abstract: A system for directing electromagnetic millimeter-waves towards a waveguide using an electrically conductive formation within a Printed Circuit Board (PCB). The system includes a waveguide having an aperture and at least two laminas belonging to a PCB. A first electrically conductive surface printed on one of the laminas is located over the aperture such that the first electrically conductive surface covers at least most of the aperture. A plurality of Vertical Interconnect Access (VIA) holes, optionally filled or plated with an electrically conductive material, are electrically connecting the first electrically conductive surface to the waveguide, forming an electrically conductive cage over the aperture. Optionally, a probe printed on one of the laminas of the PCB is located inside the cage and over the aperture.

Abstract: To reduce electromagnetic wave transmission loss, a connecting portion is provided on the end portion of a waveguide. A connecting portion has a first half and a second half, each made of a dielectric material. An antenna formed on a printed circuit board is interposed between the first half and the second half. The connecting portion has conductive portions and. The conductive portions have a shape corresponding to the cross-section of the conductive portion of the waveguide in cross-section orthogonal to the direction in which the circuit board extends, and surround the first half and the second half.

Abstract: An adaptor for connecting a microstrip line and a waveguide is disclosed that includes a microstrip line part and a waveguide part. The microstrip line part includes a microstrip port pattern and a patch pattern on an upper portion of a substrate, where the patch pattern is joined to an end portion of the microstrip port pattern. The waveguide part includes a waveguide hole, for transferring a signal provided from the patch pattern; a channel hole, which is formed in an area for joining with the microstrip line part, is formed along a first direction orthogonal to a direction of the waveguide hole in correspondence to the microstrip port pattern, and is connected with the waveguide hole; and a stub hole, which is connected with the waveguide hole and is formed in an area for joining with the microstrip line part along a second direction opposite to the first direction.

Abstract: A feeding structure including a carrier substrate, a top conductor plane of a cavity formed in the carrier substrate, a feedline substrate covering the top conductor plane, a signal conductor of a feedline, the signal conductor being formed in or on the feedline substrate opposite the top conductor plane, a via probe connected to the signal conductor and leading through the feedline substrate and the top conductor plane into the cavity, a ring-shaped aperture formed in the top conductor plane around the via probe, and at least one slot-shaped aperture formed in the top conductor plane starting at the ring-shaped aperture and leading away from the via probe.

Abstract: Disclosed is a balun circuit using defected ground structure. The balun circuit using a defected ground structure includes: a substrate; a ground surface formed on one surface of the substrate, the ground surface being formed with defect structure in a previously set shape; and two transmission lines formed on the other surface of the substrate opposing the ground surface, and separated from each other, and the defect structure of the ground surface is configured to have open circuit impedance characteristics, and one of the two transmission lines is grounded. An even mode signal is removed by using the defect ground structure having the open circuit impedance characteristics, and termination of total reflection characteristics is performed by using the grounding of one of the transmission lines. Accordingly, a balun circuit can be obtained which is small in size, has little loss at high frequency, and shows little change in characteristics due to the process error.

Abstract: The invention relates to a surface mount microwave system, comprising a multilayer arrangement (101) comprising a first conductive layer (103), a second conductive layer (105) and a dielectric layer (107), wherein the first conductive layer (103) is arranged on the dielectric layer (107), and wherein the dielectric layer (107) is arranged on the second conductive layer (105), wherein the first conductive layer (103) comprises a microwave circuit (109) and wherein the second conductive layer (105) forms a reference potential layer, a hollow microwave waveguide (111) being at least partly formed in the second conductive layer (105), and a microwave transition structure (113) for electromagnetically coupling the first conductive layer (103) with the hollow microwave waveguide (111). According to some implementation forms, a reflector on a cover covering the multilayer arrangement (101) may be avoided.

Abstract: An integrated-circuit module includes a package molding compound layer, a radio-frequency (RF) integrated circuit embedded within the package molding compound layer and having an RF port, a waveguide transition structure embedded within the package molding compound layer, and a redistribution layer. The waveguide transition structure includes a transmission line interface section, a waveguide interface section configured for coupling to a rectangular waveguide housing, and a transformer section configured to provide a mode transition between the transmission line interface section and the waveguide interface section. The redistribution layer includes at least one insulating layer and at least one metallization layer, extending between the RF integrated circuit and the waveguide transition structure across a surface of the package molding compound layer.

Abstract: A signal converter configured to convert a signal between a substrate unit and a hollow waveguide includes a substrate unit, including a first conductor layer formed on one face of a dielectric substrate, and a second conductor layer formed on another face of the dielectric substrate, a plurality of conduction units that penetrate the dielectric substrate and provide conduction between the first conductor layer and the second conductor layer, an dielectric waveguide formed by the dielectric substrate, the first and second conductor layers, and the conduction units, and a conversion unit that converts the signal between the hollow waveguide and the dielectric waveguide, the conversion unit including a conductor patch having a separator region between itself and the first conductor layer, with the conductor patch being disposed on the substrate unit within an aperture of the hollow waveguide.

Abstract: A high-frequency module includes a high-frequency component including a high-frequency circuit, a conductor plate including a slot, a first conductive wire, and two second conductive wires. The high-frequency component includes a signal terminal and two reference potential terminals. The signal terminal is used for at least one of input and output of a high-frequency signal. The two reference potential terminals are connected to a reference potential. The first conductive wire is connected to the signal terminal in terms of high-frequency. The first conductive wire crosses over above the slot. The two second conductive wires are connected to the two reference potential terminals in terms of high-frequency. The two second conductive wires are so disposed along the first conductive wire and do not cross over the slot. The first conductive wire and the two second conductive wires form a pair and are electromagnetically coupled to the slot.

Abstract: [Technical Problem] In a dielectric waveguide input/output structure for performing conversion from a dielectric waveguide through a microstrip to a coaxial line, the conversion is performed once to the microstrip line, and then further to the coaxial line, resulting in a greater loss. Thus, there has been a problem that degradation in performance is unavoidable. Further, the microstrip is required to have a certain level or more of length so as to prevent reduction in size of the printed circuit board. This has been an impediment to downsizing of the input/output structure. [Solution to the Problem] Provided is an input/output structure for a dielectric waveguide, comprising a rectangular-parallelepiped-shaped dielectric block, a plate-shaped dielectric plate, and a feeder line comprising a line-shaped electrically conductive foil sandwiched between the dielectric block and the dielectric plate.

Abstract: A metallic waveguide is mounted on a multilayer substrate. The metallic waveguide has an open end formed by a top, bottom and sides configured to receive a core member of a dielectric waveguide, and an opposite tapered end formed by declining the top of the metallic waveguide past the bottom of the metallic waveguide and down to contact the multilayer substrate. A pinnacle of the tapered end is coupled to the ground plane element, and the bottom side of the metallic waveguide is in contact with the multiplayer substrate and coupled to the microstrip line.

Abstract: A transition (100, 300) from microstrip to waveguide, the waveguide comprising first (120) and second (105, 105?, 105?) interior surfaces connected by side walls (115, 116) whose height (h1, h2, h3) is the shortest distance between said interior surfaces, and a microstrip structure (130, 135, 110) extending into the closed waveguide (105). The microstrip structure comprises a microstrip conductor (130, 135) on a dielectric layer arranged on said first interior surface. The microstrip conductor (130,135) comprises and is terminated inside the closed waveguide by a patch (135). The height (h1) of the side walls (115, 116) along the distance that the microstrip conductor (130, 135) extends into the closed waveguide (105) being less than half of the greatest height (h3) beyond the microstrip structure's protrusion into the closed waveguide (105).

Abstract: A balun includes an input port, a first output port, a second output port and a coupling microstrip group including an input line connected to the input port, a first output line connected to the first output port, a first coupling line, a second output line connected to the second output port and a second coupling line. The input line includes a first coupling section connected to the input port, a second coupling section opposite to the first coupling section and a connecting section connected between the first coupling section and the second coupling section. An unbalanced signal is transformed into a first balanced signal via coupling among the first coupling section, the first output line and the first coupling line. An unbalanced signal is transformed into a second balanced signal via coupling among the second coupling section, the second output line and the second coupling line.

Abstract: An arrangement (100, 400, 500, 600) comprising a first plate (110, 410, 510, 610) and a second plate (120, 420, 520, 620) at a first distance (di) from each other with an overlap between them. The arrangement also comprises a third (130, 430, 530, 630) and a fourth (140, 440, 540, 640) plate between the first and second plates in said overlap so that the third and fourth plates do not overlap each other. All plates are made of an electrically conducting material, are essentially flat and plane and are separated from each other by a dielectric material. The first plate comprises an input/output port (111, 411, 511, 611), the second plate comprises a ground port (112), and the third and fourth plates comprise an output/input port (131, 141, 431, 441, 531, 541, 551). The arrangement will serve as a power divider, a power combiner or as a balun.

Abstract: Wideband balun having good performance characteristics for use in feeding differential antenna elements in array antennas, balanced amplifier circuits and other applications is described. Also described is a common mode isolation circuit suitable for integration with the balun.

Abstract: A voltage controlled oscillator includes a split ring resonator (SRR) configured to have meta-material characteristics fabricated on a board, and an energy compensation circuit configured to cause resonant oscillation of the SRR. The energy compensation circuit is fabricated in the form of an integrated circuit.

Abstract: A signal transmission method suppresses a reflected wave of a transmission signal on a transmission line, by obtaining level and time information related to the reflected wave by computing a correlation between a data pattern of the transmission signal and the reflected wave, and correcting a waveform of the transmission signal based on the level and time information related to the reflected wave.

Abstract: A first passive component includes one unbalanced line having one unbalance input terminal, one balanced line installed opposite to the unbalanced line and having two balanced output terminals (first balanced output terminal and second balanced output terminal), and a capacitor formed between the balanced line and a fixed potential (e.g. the ground potential). Furthermore, the relation d1>d2 is satisfied, where d1 is the physical length of the unbalanced line and d2 is the physical length of the balanced line.

Abstract: Aspects of the invention provide for a Marchand balun structure and a related design method. In one embodiment, a marchand balun structure includes: a first trace for an unbalanced port on a first metal layer, the first trace comprising: an unbalanced line including a first width for a first half and a second width for a second half, wherein the second width can be different from the first width; a pair of traces for balanced ports on a second metal layer, the pair of traces comprising: a pair of balanced lines; and a ground plane on a third metal layer, the ground plane comprising: a pair of openings directly under the pair of traces for balanced ports, wherein a center of the unbalanced line of the first trace is offset from a center of the pair of balanced lines of the pair of traces.

Abstract: A transformer between waveguide and transmission-line includes a high-frequency circuit module, transmission-lines, a waveguide, and feed pins. The high-frequency circuit module has differential-pair terminals to input and output a differential signal. The transmission-lines are connected to the differential-pair terminals. The waveguide includes a first to third metal walls. The feed pins are connected to the transmission-lines inside of the waveguide. The feed pins have a first distance of approximately (?g/2) from each other. One of the feed pins has a second distance of approximately (?g*(1+2?)/4) from the third metal plane. “?g” is a wavelength in the waveguide and “?” is an integer which is equal or larger than “0”. Each of the feed pins has a third distance of approximately (a/2) from the first or second wall. “a” is length of the waveguide along the third metal wall.

Abstract: One embodiment of an axial rotary joint having rotary transmission lines for the bi-directional propagation of radio frequency electromagnetic waves and light waves across a rotary interface. Each section is capable of fully independent rotation about a common longitudinal axis. The radio frequency rotary transmission line comprises waveguide tubing at each end that transitions to a coax transmission line at the rotary interface. The waveguide tubing also functions as the axial support structure. The second transmission line for light wave propagation is fully integrated into the waveguide-to-coax transition and the inner coaxial conductor, and uses optical coupling devices to form an optical coupling path across the rotary interface. This embodiment of the rotary joint can be sealed and pressurized to minimize contamination of the optics and to increase the electromagnetic wave power handling.

Abstract: A microwave frequency tunable filtering balun is provided. The microwave frequency tunable filtering balun comprises a first microwave split ring transmission line resonator and a second microwave split ring transmission line resonator arranged in a bilaterally symmetrical manner, a fourth variable capacitor and a fifth variable capacitor of same parameters. It combines two functions of balun and tunable bandpass filter (BPF) into one circuit, resulting in a compact design. The balun characteristic and frequency-tuning mechanism are investigated, and the design equations are derived.

Abstract: A differential transmission transition interface is disclosed which can include first and a second buried conducting tracks providing respectively first and second differential couplings between a differential RF transmission output and a waveguide; the first buried conducting track extending over an opening of the waveguide to provide a first RF coupling element; and the second buried conducting track extending over the opening to provide a second RF coupling element. At least a portion of the first RF coupling element extends over the waveguide opening in a first angular direction; and at least a portion of the second RF coupling element extends over the waveguide opening in a second angular direction that is opposed to the first angular direction.

Abstract: This invention relates to a microstrip to slotline transition circuit operating on two frequency bands, in which a first filtering circuit is connected between a first portion of microstrip line and a first input/output port, said first circuit and the portion of microstrip line being adapted to accept the frequencies from a first frequency band and reject the frequencies of a second frequency band, a second filtering circuit is connected between a second portion of microstrip line and a second input/output port, said second circuit and the portion of microstrip line being adapted to accept the frequencies from the second frequency band and reject the frequencies from the first frequency band, and the slotline is sized to provide an impedance that is substantially equal to the impedance of an open circuit at the coupling zone between the microstrip line and the slotline.

Abstract: An apparatus is provided. Transmission line cells are formed in a first region. A first metallization layer is formed over the transmission line cells within a portion of the first region. At least a portion of the first metallization layer is electrically coupled to the plurality of transmission line cells. A second metallization layer is formed over the first metallization layer with an interconnect portion, and overlay portion, and a first balun. The interconnect portion at least partially extends into the first region, and the overlay portion is within the first region. The first balun winding is electrically coupled to the overlay portion and partially extends into a second region. The first region partially surrounds the second region. A third metallization layer is formed over the second metallization layer having a second balun winding within the second region, where the second winding is generally coaxial with the first balun winding.

Abstract: Dielectric waveguide comprising a circular input/output electrode on its bottom surface and surrounded by an exposed dielectric portion thereof around which a conductor film is disposed. A short stub crosses through the exposed dielectric portion to couple the electrode and film together. The printed circuit board has a front surface formed with a generally-circular island-shaped electrode surrounded by a front surface-side ground pattern in a spaced-apart relation thereto, and a back surface formed with a strip line surrounded by a back surface-side ground pattern in spaced-apart relation thereto. An approximate center of the island-shaped electrode and one end of the strip line are coupled together, and the front surface-side ground pattern and the back surface-side pattern are coupled together. The input/output electrode of the dielectric waveguide and the island-shaped electrode of the printed circuit board are coupled together.

Abstract: Provided is a waveguide-microstrip line converter, including: a waveguide; a dielectric substrate that is connected to cover one end of the waveguide; a strip conductor that is disposed on a front surface of the dielectric substrate; a conductor plate that is disposed the front surface of the dielectric substrate, and connected to the strip conductor; a ground conductor that is disposed on a rear surface of the dielectric substrate; and a plurality of connection conductors that connect a periphery of the conductor plate and the ground conductor, in which: the ground conductor has an opening formed therein in a connection region; the strip conductor and the ground conductor form a microstrip line; and the plurality of connection conductors are arranged so that a distance between two lines of the plurality of connection conductors that are aligned in a longitudinal direction of the microstrip line, and disposed on both opposing sides of the conductor plate in a vicinity of a connection portion is narrower than

Abstract: A compact microstrip to waveguide dual coupler transition includes a multilayer printed circuit board configured with a rectangular region on an upper surface of the multilayer printed circuit board, wherein the rectangular region has a pair of long edges and a pair of short edges; a transition probe configured on the upper surface of the multilayer printed circuit board, wherein a terminal of the transition probe extends into the rectangular region through a long edge of the rectangular region, and another terminal of the transition probe is electrically connected to a power amplifier; a first coupler probe configured on the upper surface of the multilayer printed circuit board, wherein a terminal of the first coupler probe extends into the rectangular region; and a second coupler probe configured on the upper surface of the multilayer printed circuit board, wherein a terminal of the second coupler probe extends into the rectangular region.

Abstract: A surface mountable transition block for perpendicular transitions between a microstrip or stripline and a waveguide. The transition block configuration allows for a reduction in the overall cost of a microwave circuit assembly because the circuit board to which the transition block is attached can be an FR-4 type circuit board as opposed to more expensive microwave circuit board materials.

Abstract: An RF circuit includes a balun circuit comprised of a coaxial cable having a desired characteristic impedance and having a first port coupled to a first port of said RF circuit and a second port and a transformer circuit having a first port coupled to the second port of the balun. The transformer circuit is comprised of a pair of coaxial cables, each having a desired characteristic impedance and each having a ferrite coupled thereto. The interconnects between center conductors and outer conductors in the transformer are made symmetrical such that a resonance with a frequency determined by the inductance and capacitance of the coaxial cables does not occur, preventing any nulls in an insertion loss characteristic of the RF circuit. The ferrite is selected to act as a circuit element having an impedance characteristic which is higher than the impedance characteristic of the coaxial cable.

Abstract: A balun transformer includes an unbalanced terminal, two balanced terminals, a directional coupler, a low pass filter, and a high pass filter. The directional coupler includes first, second, third and fourth terminals. The first terminal is connected to the unbalanced terminal. A predetermined phase difference exists between the output signal of the second terminal and the output signal of the third terminal. The second terminal is connected to the first terminal by a line constituting the directional coupler. The low pass filter is connected between the second terminal and one of the balanced terminals. The high pass filter is connected between the third terminal and the other balanced terminal.

Abstract: A combiner/divider circuit may include a plurality of planar transmission lines that each may have a planar signal conductor and at least a planar signal-return conductor. Ends of different ones of the signal conductors of the plurality of transmission lines may interconnect with the signal conductor of a first transmission line may be connected to the signal conductors of second and third transmission lines. Signal-return conductors of the first, fourth, and fifth transmission lines may be connected along their lengths. Vias may connect signal-return conductors of the second and third transmission lines with respective signal conductors of the fourth and fifth transmission lines. The positions of the fourth and fifth striplines relative to the first strip line may reverse in a transition region spaced from the connection region.

Abstract: An electric transformer device (balun) is formed on a support plate having a first base face and an opposite second base face. The balun includes a first port (40) connectable to an electrical line for a differential signal and a second port connectable to an electrical line for a single-ended signal. A first printed conductive track is associated to the first base face of the support plate for connecting the first port to the second port. A printed conductive path is associated to the second base face of the support plate for connecting the first port to the second port. The printed conductive path is formed of a symmetric second and third printed conductive tracks.

Abstract: A thin film balun that can be made smaller and thinner while maintaining required balun characteristics is provided. A thin film balun 1 includes: an unbalanced transmission line UL including a first coil portion C1 and a second coil portion C2; a balanced transmission line BL including a third coil portion C3 and a fourth coil portion C4 that are positioned facing and magnetically coupled to the first coil portion C1 and the second coil portion C2 respectively; an unbalanced terminal UT connected to the first coil portion C1; a ground terminal G connected to the second coil portion C2 via a C component D; and an electrode D2 connected to the ground terminal G and facing a part of the second coil portion C2. The C component D is formed by the electrode D2 and the part D1 of the second coil portion C2.