Abstract: An antenna duplexer is provided, which can be built with a smaller size and lower height than ever without compromising out-of-band attenuation characteristic and isolation characteristic between a transmit terminal and a receive terminal. The antenna duplexer includes a transmit filter provided between an antenna terminal and the transmit terminal, and a receive filter provided between the antenna terminal and the receive terminal. The filters are enclosed by a package, in which a ground pattern for the receive filter is separated from other ground patterns.

Abstract: To provide a transmission line capable of absorbing the reflection caused by mismatching between impedances and restraining the attenuation value of a signal. The following wiring patterns are formed out of a connector mounting area in which a connector is mounted: a wiring pattern designed so as to gradually increase the wiring width and the interval between wirings of a wiring portion (B) and gradually decrease the characteristic impedance of the wiring portion (B) and a wiring pattern designed so as to gradually decrease the wiring width and the interval between wirings of the wiring portion (B?) and gradually amplify the characteristic impedance of the wiring portion (B?).

Abstract: A differential transmission line includes: a substrate; a ground conductor layer; and a first and a second signal conductor disposed in parallel to each other on the substrate. The first signal conductor and the ground conductor layer compose a first transmission line, whereas the second signal conductor and the ground conductor layer compose a second transmission line. The first transmission line and the second transmission line compose a differential transmission line. The differential transmission line includes a curved region, with a straight region being connected to each end of the curved region. In the ground conductor layer in the curved region, a plurality of slots orthogonal to a local transmission direction of signals in the curved region are formed, and the slots are connected to one another on the inner side of the curvature.

Abstract: A balance filter includes a first filter having first multimode surface acoustic wave (SAW) filters connected in parallel, a second filter that is connected to the first filter and includes a second multimode SAW filter, a first terminal connected to the first filter, and second terminals connected to the second filters. An input terminal of the balance filter is one of the first and second terminals, and an output terminal thereof is the other. Electric signals transmitted from the first to second filters or vice versa are in opposite phase. Electric signals are input or output via the second terminals in opposite phase.

Abstract: A compact RF differential circuit has a first differential I/O port comprising a first pair of signal carrying terminals which is connected to a source termination and a second differential I/O port comprising a second pair of signal carrying terminals which is connected to a load termination. The common mode impedance measured at either the first or second differential I/O port is zero. The differential mode impedance measured at the first differential I/O port is equal to the differential mode impedance of the source termination, and the differential mode impedance measured at the second differential I/O port of the circuit is equal to the differential mode impedance of the load termination.

Abstract: An improved method and apparatus for altering the effective electrical length of trace on a circuit board. In the present invention small tabs of etch are routed perpendicular to the trace in the unused areas between adjacent traces. In an embodiment of the invention, a method of tuning the delay characteristics of a transmission line is implemented by inserting compensation tabs into the unused area between the segments of adjacent straight traces or a serpentine run. Utilizing the method and apparatus of the present invention, it is possible to achieve significantly greater electrical length for an electrical trace without introducing coupling problems or utilizing large amounts of space on a circuit board.

Abstract: A transmission line apparatus includes: a substrate 101 with a ground conductor plane; and first and second signal strips 102a, 102b supported on the substrate 101 in parallel with each other. The apparatus further includes at least one additional capacitance element 301 that connects the first and second signal strips 102a, 102b together. The element 301 includes: a first additional conductor 303 spaced from the first signal strip 102a; a second additional conductor 305 spaced from the second signal strip 102b; and a third additional conductor 307 connected to the first and second additional conductors 303, 305 at respective points. When measured in a signal transmission direction, the smallest width W3a of the third additional conductor 307 is shorter than the length L1 or L2 of the first or second additional conductor 303 or 305. And the additional capacitance element 301 has a resonant frequency that is higher than the frequency of a signal being transmitted.

Abstract: A non-uniform transmission line, including at least a first section with length L1, uniform width W1 and thickness h1, and a second section with length L2, uniform width W2 and thickness h2, joined together to form a composite structure and arranged in any of at least three distinct configurations. The composite structure (first section plus second section) may be periodic or non-periodic. Length and/or width and/or thickness of each of the two sections may be varied to provide desired values for characteristic impedance, cutoff frequency and/or time delay for signal propagation.

Abstract: A printed circuit board includes two differential signal traces, a layer of core material, a layer of filler material, and a ground plane. The filler material is replaced by an air core under the differential signal traces.

Abstract: A differential transmission line includes: a substrate; a ground conductor layer; and a first and a second signal conductor disposed in parallel to each other on the substrate. The first signal conductor and the ground conductor layer compose a first transmission line, whereas the second signal conductor and the ground conductor layer compose a second transmission line. The first transmission line and the second transmission line compose a differential transmission line. The differential transmission line includes a curved region, with a straight region being connected to each end of the curved region. In the ground conductor layer in the curved region, a plurality of slots orthogonal to a local transmission direction of signals in the curved region are formed, and the slots are connected to one another on the inner side of the curvature.

Abstract: Apparatus and associated systems and methods may include one or more features for high speed transmission line structures that may substantially reduce signal degradation due to effects, such as dielectric loss, parasitic capacitance, cross-talk, and/or reflections. For example, one such feature may include a dielectric layer having a reduced thickness within at least a part of a region that extends between two conductors fabricated on a PCB (printed circuit board). In some embodiments, the dielectric layer may include a solder mask layer that is partially or substantially absent in the region between two coplanar conductors. In another embodiment, a substrate layer made of a dielectric material may include a trench in the region between the two conductors. Another such feature, for example, may include a conductor having vias spaced less than a quarter wavelength apart to substantially reduce resonance effects on propagating high frequency signals.

Abstract: A printed circuit board for a high-speed semiconductor package uses bonding wires as a shield structure, e.g., to shield an open portion of signal transmission lines, and thereby reduce the likelihood of coupling noises, e.g., between signal transmission lines.

Abstract: A differential transmission line includes: a substrate; a ground conductor layer; and a first and a second signal conductor disposed in parallel to each other on the substrate. The first signal conductor and the ground conductor layer compose a first transmission line, whereas the second signal conductor and the ground conductor layer compose a second transmission line. The first transmission line and the second transmission line compose a differential transmission line. The differential transmission line includes a curved region, with a straight region being connected to each end of the curved region. In the ground conductor layer in the curved region, a plurality of slots orthogonal to a local transmission direction of signals in the curved region are formed, and the slots are connected to one another on the inner side of the curvature.

Abstract: A method of determining characteristics for electromagnetic shielding for a signal interconnect is disclosed. The electromagnetic shielding is to comprise a shielding dielectric layer and a shielding conductive layer. The method includes determining a set of harmonic frequencies associated with an operating frequency of a signal to be transmitted via the interconnect, identifying a dielectric material based on a loss tangent of the dielectric material and the set of harmonic frequencies, determining an expected appreciable electromagnetic field generated by a transmission of the signal, and determining a maximum extent of the expected appreciable electromagnetic field from the interconnect.

Abstract: An impedance matching device comprises a dielectric material having a ground plane affixed to one surface, a microstripline conductor disposed on an opposite surface, and a movable dielectric plate. The movable dielectric plate has a higher dielectric constant than the dielectric material, a user-selectable shape, and a conductive coating on the top surface. The bottom surface of the movable dielectric plate engages a portion of the microstripline conductor, and is movable transversely to the microstripline conductor to increase or decrease the impedance of the microstripline conductor and linearly to change the phase of the microstripline conductor.

Abstract: The present invention provides a matched-impedance jumper that is operable to connect pairs of differential signal conductors to provide improved signal transmission characteristics. In an embodiment of the invention, the impedance-matched jumper is used to connect a first pair of differential signal conductors to a selected pair of differential signal conductors selected from a plurality of second pairs of differential signal conductors. The impedance-matched jumper comprises a plurality of input pins that are operable to connect with a plurality of connection pads on the first pair of differential signal conductors and a plurality of output pins operable to connect with a plurality of connection pads on the predetermined second pair of differential signal conductors. A plurality of internal conductors are operably connected to the input pins and the output pins to define a signal path therebetween.

Abstract: There is provided a bandpass filter for a differential signal applicable to a device having a wide passband, being a device for transmitting a signal using a differential signal. Respective lines 1 and 2 and lines 3 and 4 are provide on two surfaces P1 and P2 at an inner layer of a dielectric body 9. Each two lines are arranged symmetrically about the same plane of symmetry C, and the length of each line is a quarter wavelength at the center frequency of a used band. Reference numerals 5 and 6 are input/output ends of the lines 1 and 2, and 7 and 8 are input output ends of lines 3 and 4. Opposite ends to the input output ends are open. If a differential signal is input to terminals 5, 6, a differential output appears at the terminals 7, 8. This device works as a bandpass filter.

Abstract: A power combiner/divider is disclosed that employs triaxial transmission line structures operatively coupled to provide a desired number of input/output ports. A balun is operatively coupled to the triaxial transmission line structures, and is adapted to couple out unbalanced currents flowing therebetween.

Abstract: An adaptor includes a connector interface having a first coaxial structure with a first center pin configured to be coupled to a first center conductor of a first coaxial transmission line and a second coaxial structure with a second center pin configured to be coupled to a second center conductor of a second coaxial transmission line. A nut surrounds the first coaxial structure and the second coaxial structure.

Abstract: A printed circuit board includes two differential signal traces, a layer of core material, a layer of filler material, and a ground plane. The filler material is replaced by an air core under the differential signal traces.

Abstract: There is provided a bandpass filter for a differential signal applicable to a device having a wide passband, being a device for transmitting a signal using a differential signal. Respective lines 1 and 2 and lines 3 and 4 are provide on two surfaces P1 and P2 at an inner layer of a dielectric body 9. Each two lines are arranged symmetrically about the same plane of symmetry C, and the length of each line is a quarter wavelength at the center frequency of a used band. Reference numerals 5 and 6 are input/output ends of the lines 1 and 2, and 7 and 8 are input output ends of lines 3 and 4. Opposite ends to the input output ends are open. If a differential signal is input to terminals 5, 6, a differential output appears at the terminals 7, 8. This device works as a bandpass filter.

Abstract: The present invention relates to a regulator for impedance balancing of first (104) and second wires (106) of a transmission wire pair having respective first and second impedances, the regular comprising: means (108) for determining a first signal (116) being representative of an average of square value of a first current (i1) flowing through the first wire, means (118) for determining a second signal (126) being representative of the average of square value of a second current (i2) flowing through the second wire, means (128, 130) for determining first and second coefficients (k1, k2) on the basis of the first and second signals, first feedback means (132, 134, 136) for regulating the first current on the basis of the first coefficient, second feedback means (138, 140, 142) for regulating the second current on the basis of the second coefficient.

Abstract: Termination assemblies for terminating high-frequency data signal transmission lines include housings with one or more cavities that receive ends of the transmission line therein. The transmission line typically includes a dielectric body and a plurality of conductive elements disposed thereon, with the plurality of conductive elements being arranged in pairs for differential signal transmission. The termination assemblies, in one embodiment include hollow end caps that are formed from a dielectric and which have one or more conductive contacts or plated surfaces disposed on or within the cavity so that they will frictionally mate with the conductive traces on the transmission line. In another embodiment, a connector housing is provided with a center slot and a plurality of dual loop contacts to provide redundant circuit paths and low inductance to the termination assembly. A coupling element may be utilized in the slot to achieve a desired level of coupling between the termination contacts.

Abstract: A transmission line for high-frequency differential signals and having a transforming impedance is formed into a substrate. The transmission line is comprised of a slot, the opposing surfaces of which carry a conductive surface capable of carrying electrical signals. The conductive surface on the opposing surfaces is gradually receded along a length of the slot. An The transmission line of claim 1, further including a non-air dielectric filling the space between the opposing faces in said second length of said slot, said non-air dielectric having a thickness that extends from the depth D, to the bottom of the slot at the first end of said second length, the thickness of the non-air dielectric continuously increasing along said second length up to the substrate surface at the second end of the second length. equivalent amount of metallization is applied on the substrate's surface and electrically continuous with conductive surfaces on the slot's opposing sidewalls.

Abstract: An electro-magnetically shielded slot-transmission line is formed by metallizing the opposing sides of a slot cut through a dielectric substrate. A ground plane is deposited on the bottom of the substrate. Conductive vias through the substrate and that contact the ground plane are located on both sides of the metallized slot surfaces. Conductive pads on the upper surface and which contact the vias provide additional shielding.

Abstract: A differential signal transmission cable structure for transmitting differential signals having GHz frequency band in the present invention is provided with a differential signal transmission pair cable 30 connecting a driver circuit 23a and a receiver circuit 23b, for transmitting differential signals having GHz frequency band, and a power supply ground transmission pair cable 31 connecting ground and a first power supply 26a connected to the driver circuit and ground and a second power supply 26b connected to the receiver circuit. Further characteristic impedance of the differential signal transmission pair cable is matched to that of the driver circuit and the receiver circuit, thereby enabling TEM waves of differential signals having GHz frequency band transmission mode to be maintained when the differential signals are transmitted.

Abstract: A system is provided for rapidly prototyping monolithic microwave integrated circuit modules to provide an experimental structure that can be physically made to operate by stereolithographically rendering an SLA part directly from the designer's drawings and by coating the part with a conductive layer, with the smoothness being better than 0.001 inch and with the dimensional accuracy being better than 3 mils for some applications. In one embodiment, the coating for the SLA model is made from either rhodium or gold having a thickness of less than 1/10,000th of an inch, with a nickel barrier being first deposited followed by the gold. The particular SLA plastic is a high temperature plastic to prevent bubbling during the metal deposition step which in one embodiment involves sputtering. The coated model has a microfinish of Ra<0.001 inch, with active devices being electrically attached to the coating through the use of conductive adhesives or eutectic solder.

Abstract: A method of controlling a characteristic impedance of a transmission line, and a transmission line implementing the method. According to a basic version of the invention a distance between longitudinal currents are controlled, thereby controlling a characteristic inductance of the transmission line. This without hindering transversal currents on which a characteristic capacitance is dependent upon. This is achieved by cutting longitudinal currents within a minimum distance between the longitudinal currents and leaving longitudinal currents that have a distance greater than the minimum distance alone. This is done without cutting transversal currents to any significant degree. The longitudinal currents can be cut in the return conductor and/or in the signal strip, in dependence on the type of transmission line.

Abstract: A method and structure are provided to control common mode impedance in fan-out regions for printed circuit board applications. A differential pair transmission line includes a narrow signal trace portion in the fan-out region and a wider signal trace portion outside of the fan-out region. A dielectric material separates the differential pair transmission line from a reference power plane. A thickness of the narrow signal trace is increased and a thickness of the dielectric material is correspondingly decreased in the fan-out region.

Abstract: A system and method for transferring information at a fast rate between add-in cards in a rack mount system are described. In one embodiment, the invention allow all the add-in cards within the rack mount system to be interconnected. All the main cards within the rack mount system connect to a switch card using point-to-point differential copper pairs. All communication over these differential copper pairs use a messaging protocol that provides a messaging protocol destination address that is used to route the information to the intended destination main card. The messaging protocol may be the Ethernet protocol. In an alternative embodiment, data redundancy is provided by having two switch cards in the rack mount system. A particular main card transmits one set of information to the first switch card and a second set of information (that is identical to the first set of information) to the second switch card.

Abstract: According to one embodiment, a printed circuit board (PCB) is disclosed. The PCB includes a first functional unit block (FUB) and differential traces coupled to the first FUB. The first FUB transmits high-speed serial data. The differential traces carry the high-speed serial data from the first FUB. In addition, the differential traces crossover on the same layer of the PCB while maintaining a constant impedance.

Abstract: A system is provided for rapidly prototyping monolithic microwave integrated circuit modules to provide an experimental structure that can be physically made to operate by stereolithographically rendering an SLA part directly from the designer's drawings and by coating the part with a conductive layer, with the smoothness being better than 0.001 inch and with the dimensional accuracy being better than 3 mils for some applications. In one embodiment, the coating for the SLA model is made from either rhodium or gold having a thickness of less than 1/10,000th of an inch, with a nickel barrier being first deposited followed by the gold. The particular SLA plastic is a high temperature plastic to prevent bubbling during the metal deposition step which in one embodiment involves sputtering. The coated model has a microfinish of Ra<0.001 inch, with active devices being electrically attached to the coating through the use of conductive adhesives or eutectic solder.

Abstract: An engineered transmission line for transmitting high-frequency data signals between two points of connection includes a dielectric body and a plurality of conductive elements disposed thereon, with the plurality of conductive elements being arranged in pairs for differential signal transmission. In one embodiment, the dielectric body is solid and has its conductive elements supported on its exterior surface. In another embodiment, the dielectric body is extruded and has grooves or raised lands formed therein. The grooves or lands support conductive elements formed thereon by a suitable plating process. A ground plane may be provided as a base layer of the dielectric body. Enlarged conductive surfaces may also be provided on the body which have a greater surface area than those intended for use with the signal channels. The enlarged surfaces are utilized to carry power.

Abstract: A parallel plate wave-guide structure in a layered flexible/formable medium for transmitting complementary signals, including: at least two parallel signal conductor plates, placed in substantially close proximity, separated by a conductor-to-conductor dielectric material, and having a controlled impedance contained between the at least two parallel complementary signal conductor plates dominated by odd mode propagation of transverse wave components between the at least two parallel complementary signal conductor plates; at least two parallel reference plates forming a parallel plate reference system parallel to and surrounding the at least two parallel complementary signal conductor plates; dielectric materials that are contained between each of the at least two parallel complementary signal conductor plates and a corresponding parallel reference plate; a partial rectangular wave-guide structure comprised of the parallel plate reference system, such that each of the at least two parallel reference plates are

Abstract: A technique for facilitating signal transmission at high signal frequencies in a multi-layer substrate is disclosed. In one embodiment a multi-layer substrate comprises a conductor or pair of conductors, a first dielectric layer on a first side of the conductor or pair of conductors and a second dielectric layer on a second side of the conductor or pair of conductors. An air channel is provided in the first dielectric layer, the air channel formed to be substantially coextensive with the conductor or pair of conductors. A conductive shield surrounds the conductor or pair of conductors, the first dielectric layer, and the second dielectric layer in order to eliminate crosstalk. The conductor or pair of conductors may have discrete spaced edges and the width of the conductor or pair of conductors may be increased in order to adjust the impedance because of the low dielectric constant of air. Furthermore, additional air channels and a supporting layer may be included in the structure.

Abstract: A technique for facilitating signal transmission at high signal frequencies in a multi-layer substrate is disclosed. In one embodiment a multi-layer substrate comprises a conductor or pair of conductors, a first dielectric layer on a first side of the conductor or pair of conductors and a second dielectric layer on a second side of the conductor or pair of conductors. An air channel is provided in the first dielectric layer, the air channel formed to be substantially coextensive with the conductor or pair of conductors. A conductive shield surrounds the conductor or pair of conductors, the first dielectric layer, and the second dielectric layer in order to eliminate crosstalk. The conductor or pair of conductors may have discrete spaced edges and the width of the conductor or pair of conductors may be increased in order to adjust the impedance because of the low dielectric constant of air. Furthermore, additional air channels and a supporting layer may be included in the structure.

Abstract: A wired transmission path includes first and second differential transmission paths. The first differential transmission path is composed of two strip lines, and the second differential transmission path is composed of two strip lines. Each of the strip lines of the first differential transmission path is disposed at an equal distance from the strip lines of the second differential transmission path. Thus, there is provided a wired transmission path including a plurality of differential transmission paths in such a manner so as to cancel crosstalk.

Abstract: A connector interface provides high-frequency differential connection to a balanced cable or balanced electronic device, such as a balanced probe. The connector interface includes two coaxial structures in a single connector. When the connector interface is used in a package launch, the closeness of the center pins of the two coaxial structures facilitate connection to a balanced circuit. When used in conjunction with a balanced vector network analyzer, the connector interface can simplify calibration and testing of devices by reducing the number of connections to the calibration standards or devices being tested, and provide improved measurement accuracy.

Abstract: According to one embodiment, a printed circuit board (PCB) is disclosed. The PCB includes a first functional unit block (FUB) and differential traces coupled to the first FUB. The first FUB transmits high-speed serial data. The differential traces carry the high-speed serial data from the first FUB. In addition, the differential traces crossover on the same layer of the PCB while maintaining a constant impedance.

Abstract: A printed circuit board includes two differential signal traces, a layer of core material, a layer of filler material, and a ground plane. The filler material is replaced by an air core under the differential signal traces.

Abstract: A flexible printed circuit improves data transfer rates by disposing ground wires in a ground plane proximate to signal wires disposed in a signal channel plane. One or more ground wires is associated with each signal wire pair or each signal wire for imaging of the return currents of the signal pairs. An overlapping alignment minimizes loop area between a ground wire and its associated signal wire. An offset alignment provides a reduced loop area and reduced breakage risk since movement of the flexible circuit does result in compression of the signal wire and its associated ground wire. A combination of overlapping and offset alignment balances signal transfer effectiveness with breakage risk by offsetting ground and signal wires is stress sensitive regions and overlapping ground and signal wires in stress tolerant regions.

Abstract: A balanced line switching apparatus that provides high isolation at an expense of a marginal increase of loss. Practical implementation can give as much as 40 dB isolation in a single stage.

Abstract: A differential signal transmission cable structure for transmitting differential signals having GHz frequency band in the present invention is provided with a differential signal transmission pair cable 30 connecting a driver circuit 23a and a receiver circuit 23b, for transmitting differential signals having GHz frequency band, and a power supply ground transmission pair cable 31 connecting ground and a first power supply 26a connected to the driver circuit and ground and a second power supply 26b connected to the receiver circuit. Further characteristic impedance of the differential signal transmission pair cable is matched to that of the driver circuit and the receiver circuit, thereby enabling TEM waves of differential signals having GHz frequency band transmission mode to be maintained when the differential signals are transmitted.

Abstract: A high speed switching apparatus comprises first and second parallel balanced lines each directed from an input line end to an output line end and adapted to receive equal and opposite currents to provide balanced operation. Third and fourth parallel balanced lines are spaced apart one from the other and each directed from an input line end to an output line end and adapted to receive equal and opposite currents to provide balanced operation. A first switch is coupled between the output end of the first line and the input end of the third line, and operative in a first high impedance off state and a second low impedance on state. A second switch is coupled between the output end of the second line and the input end of the fourth line, and operative in a first high impedance off state and a second low impedance on state.

Abstract: A method and structure are provided for implementing enhanced differential signal trace routing in a printed circuit board. The structure includes a differential signal trace pair and a differential pair via arrangement including a pair of vias. The pair of vias is coupled to the differential signal trace pair for routing the differential signal trace pair between first and second layers of the PCB. The vias are laterally offset by a predefined spacing sharing overlapping clearance holes and are diagonally oriented to allow minimal separation of the differential signal trace pair and matched signal trace lengths of the differential signal trace pair.

Abstract: In high-speed semiconductor packaging, differential pair transmission lines 605 are used to receive incoming signals carried using differential signaling. Common mode noise can decrease the frequency at which these signals are clocked. The use of slots 620 formed in the ground (or power plane) 609 of the substrate and lying perpendicularly (and equally spaced) underneath the differential pair 605 improves the common mode rejection of the differential pair 605 by increasing the common mode impedance without affecting the differential mode impedance. The use of slots 620 does not require modifications to the packaging, and only minor modifications to the substrate.

Abstract: An engineered transmission line for transmitting high-frequency data signal s between two points of connection includes a dielectric body and a plurality of conductive elements disposed thereon, with the plurality of conductive elements being arranged in pairs for differential signal transmission. In one embodiment, the dielectric body is solid and has its conductive elements supported on its exterior surface. In another embodiment, the dielectric body is extruded and has grooves or raised lands formed therein. The grooves or lands support conductive elements formed thereon by a suitable plating process. A ground plane may be provided as a base layer of the dielectric body.

Abstract: A connector interface provides high-frequency differential connection to a balanced cable or balanced electronic device, such as a balanced probe. The connector interface includes two coaxial structures in a single connector. When the connector interface is used in a package launch, the closeness of the center pins of the two coaxial structures facilitate connection to a balanced circuit. When used in conjunction with a balanced vector network analyzer, the connector interface can simplify calibration and testing of devices by reducing the number of connections to the calibration standards or devices being tested, and provide improved measurement accuracy.

Abstract: A wired transmission path 1 includes first and second differential transmission paths 12 and 13. The first differential transmission path 12 is composed of two strip lines 121 and 122, and the second differential transmission path 13 is composed of two strip lines 131 and 132. Each of the strip lines 121 and 122 is disposed at an equal distance from the strip lines 131 and 132. Thus, there is provided a wired transmission path including a plurality of differential transmission paths in such a manner as to cancel crosstalk.

Abstract: An electronic apparatus with a high inductive reactance for differential signals per unit area and a small inductive reactance for common-mode signals relative to its inductive reactance for differential signals with predictable and scalable characteristics. This may be achieved by configuring transmission line pairs such that currents associated with the differential component of a source signal in the first and second transmission lines are aligned and currents associated with the common mode component of a source signal in the first and second transmission lines are counter-aligned. Advantageously, the current invention may be implemented using currently available technology and integrated into a variety of different devices such as broad-band and narrow-band amplifiers, high-speed logic gates, mixers, oscillators, wireless local area networks, global positioning systems and modern communication systems.