Abstract: A resistor unit has a case with an opening face, a resistor housed in the case, cement that is filled inside the case to bury the resistor, and a lead-out terminal that is connected to the resistor in the cement and is led out of the cement through the opening face of the case. A lead-out terminal has a protrusion portion that protrudes in an opening direction that is across the opening face, and an extension portion that extends parallel to the opening face from the protrusion portion.

Abstract: The invention relates to apparatus and associated methods for conversion of silicon tetrachloride (STC) to trichlorosilane (TCS). The converter features a relatively thin annular heating zone surrounding a reaction chamber. Within the annular heating zone is a heating element that has an annular conformation about the reaction chamber. The design allows high convective heat transfer, which facilitates the use of lower heating element surface temperatures, prolonging the life of the equipment, reducing capital cost by allowing use of a smaller reactor, and greatly improving heating efficiency. A heat exchanger with a plurality of heat exchanger blocks provides further efficiency.

Abstract: A method for manufacturing a planar sensor, comprises disposing a film of a material on a substrate, wherein the material is selected from the group consisting of platinum, rhodium, palladium and mixtures and alloys comprising at least one of the foregoing materials; annealing the material; measuring a resistance value of the material; laser trimming the annealed material; heat treating the laser trimmed material; and laser trimming the heat treated material to form the sensor.

Abstract: An electrical component includes a base, connector elements connected to the base, an intermediate layer on a surface of the base, and a protective layer on the intermediate layer. The intermediate layer and the protective layer are produced from a same material. The material contains a solvent. The solvent has a negative affect on electrical properties of the component. The intermediate layer has a lower content of solvent than the protective layer.

Abstract: An electronic component includes a main element such as a thermistor having electrodes formed on its surfaces, and lead terminals are electrically connected to these electrodes. A resin coating covers the main element, and both the main element and the lead terminals, except their tip parts away from the main element, are covered with another resin coating of an electrically insulating and flexible resin material.

Abstract: Solderless RF power film resistor and termination assemblies which include a flat film resistor or termination pressed by a nonmetallic clamping plate into thermal contact with a base plate functioning as a heat sink. A substrate such as a BeO ceramic substrate provides an RF power film resistor or termination, and has a flat mounting surface positioned against a flat mounting surface of the base plate. A clamping plate clamps the ceramic substrate securely against the base plate, thereby eliminating a soldered interface connection between the flat mounting surfaces of the ceramic substrate and the base plate. The clamping plate includes at least one lug, and the base plate includes at least one lug hole. The lug is larger than, and is plastically deformed into and through the hole to clamp the flat surface of the ceramic substrate securely against the flat surface of the base plate. The hole in the base plate preferably includes an undercut shoulder through and around which the lug is plastically deformed.

Abstract: Disclosed are a structure and a method of manufacture of a one-chip electronic composite component which is reduced of size while providing a resistance value properly adjusted. A resistor is formed on an insulator substrate. The resistor has a trimming groove by which a resistance value thereof is adjusted. An electronic element is in electrical connection with the resistor on the substrate. A protection layer covers at least the trimming groove. The resistor is disposed close to one side edge of the substrate with respect to a centerline extending lengthwise of the substrate. The trimming groove extends toward the one side edge of the substrate from a side defining the resistor remote from the one side edge of the substrate.

Abstract: A resistor element has a ceramic substrate and a metallic resistor coated onto the substrate. The metallic resistor has varied electrical resistance depending on temperature. A pair of leads are electrically connected to the metallic resistor. A plurality of glass layers having different compositions are coated onto the metallic resistor. The second glass layer fills a hole formed in the first glass layer, thereby improving response of the resistor element. The second glass layer has a softening point lower than the first glass layer, thereby small bubbles remain dispersed in each glass layer without aggregation. An outermost glass layer is composed of a glass resisting chemicals or a glass resisting abrasion. An innermost glass layer is composed of a glass containing up to 3 percent by mole of a sum of Na.sub.2 O and K.sub.2 O.

Abstract: The film-type electrical power resistor includes a flat chip of aluminum oxide, having a resistive film screen-printed onto one of its sides. Leads are bonded to that side and electrically connected to the film, the leads being such that the chip may be cantilevered by the leads in a mold cavity before introduction of synthetic resin into the cavity, and with the lower chip surface spaced above the bottom cavity wall. A molded body is molded in the cavity to fully encapsulate the chip, film, and inner ends of the leads, there being no mold cup around the molded body. The molded body is formed of high thermal-conductivity thermosetting synthetic resin. Provided through the body is a bolthole for clamping of the resistor to an external chassis or heatsink. The space between the bottom surface of the chip and the flat bottom surface of the molded body is a heat-sinking volume formed of the high thermal-conductivity resin; and the bottom surface of such volume of resin is the bottom surface of the resistor.

Abstract: Sheathing for a resistance-tape level sensor which provides a multiplicity of enclosing envelopes for guarding the critical inner electrical sensing element, and multiple venting paths for respiration and pressure-equalization of chambers formed by the separate envelopes.

Abstract: A high voltage electrical component can be insulated by placing such component into a first sleeve of preformed insulative material dimensioned to receive and telescope over the component. An internal abutment in the first sleeve positions the component for reception of both the first sleeve and component by a second sleeve of preformed insulative material dimensioned to receive and telescope over the first sleeve and component within. An internal abutment in the second sleeve further secures and centers the component and the first sleeve for subsequent encapsulation by insulative materials used with injection molding to form an outer insulative jacket. Once encapsulated within the insulative jacket the telescoping sleeves form a convoluted path outwardly from the component to the exterior of the jacket thereby minimizing high volt leakage.

Abstract: An electrical temperature sensing device for food heating appliances such as toasters and the like which is constructed to provide rapid thermal response, significant resistance variation as a function of temperature, and good mechanical strength so as to be suitable for mounting within the food heating compartment of said appliances in close thermal coupling with the bread or other food article to be heated. The temperature sensing device is in the form of an elongated tubular structure shaped in a U configuration, comprising a central core of low mass insulating material upon which is wound a helical wire of temperature sensitive resistance material. A thin walled sleeve of insulating material fits tightly over the wire wound core, and a thin walled metal tubing of good heat conduction characteristics fits tightly over the insulating sleeve.

Abstract: Self-regulating heating element comprising one or more PTC resistors enveloped by a synthetic-material/filler mixture which has a good heat conductivity such as an MgO-SiO.sub.2 -silicon rubber mixture.

Abstract: A sensor for detecting a rapid temperature rise comprises a thermistor chip electroded on opposing faces and having lead-in wires electrically connected to the faces. The thermistor chip is encapsulated between two ribbons of plastic film which, in turn, are encapsulated between two sheets of copper foil which, in turn, are encapsulated between two layers of plastic film.