Abstract: An electronic device and process of making the device is disclosed. The device includes a multi-sided body defined by a plurality of electrode plates arranged in a stack. A resin layer is applied to both conductive and semiconductive regions of the device, and metal is plated upon terminals to create a conductive element. The device may be a varistor, thermistor, resistor, or other microelectronic component having a multi-sided body and terminal structures that are capable of receiving a resin coating. The multi-sided body has a resin coating on at least a portion of an exterior surface, the resin coating substantially preventing plating of metal onto the exterior surface of the body. One suitable resin coating that may be employed is a thermoset resin comprising a B-staged divinylsiloxane-bis(benzocyclobutene)(i.e. “BCB”) resin dissolved in mesitylene solvent.

Abstract: The passive component (1) has a first part (22) of a material with a first resistance value, which value can be lowered to a second value by laser trimming. The second value is at most one tenth of the first value and preferably less. The material crystallizes in a laser trimming process, which locally heats the material to at least a transition temperature. The material contains at least two different elements, which are preferably aluminum and germanium. The passive component (1) may be, for example, a resistor or a capacitor and may be part of a thin-film network of resistors, capacitors and/or inductors. In a resistor, it is preferred to have a second part (4) which contains a different resistance material with a resistance value lower than the first value and preferably higher than the second value.

Abstract: A precision surface mounted foil resistor has a substrate having top and bottom planar surfaces. A resistance foil is secured to the bottom surface of the substrate and extends over the bottom. A bending protector plate of non-conductive material is superimposed over the resistance foil. A solder material is located at two areas of the foil to provide electrical contact with the PCB. The bending protector element is thicker than the solder contact areas and is provided between the solder material.

Abstract: Resistive materials having resistivities that are axis dependent are provided. Such resistive materials having a resistivity in a first direction and a very different resistivity in an orthogonal direction. These resistive materials are particularly suitable for use as resistors embedded in printed wiring boards.

Abstract: There are provided a pair of upper surface electrodes 21, 31 at both end sections, which are opposed to each other, of the insulating substrate 1 made of alumina. There is provided a resistor body 4 on the substrate 1 so that the upper surface electrode 21 and both the end sections can be electrically connected with each other. On the pair of upper surface electrodes 21, 31, there are provided a pair of upper surface auxiliary electrodes 24, 34 made of material, the heat-resistance with respect to solder of which is superior to that of the upper surface electrodes 21, 31, so that the exposed sections of the upper surface electrodes 21, 31 can be completely covered with the pair of upper surface auxiliary electrodes 24, 34, wherein the pair of upper surface auxiliary electrodes 24, 34 are not directly connected with the resistor body 4. On the surface of the resistor body 4, there is provided a protective film 5 (a first protective film 51 to a third protective film 53).

Abstract: A resistance layer, a buffering layer and a protective layer are formed in a predetermined area of a dielectric layer. An insulating layer is formed on the semiconductor wafer to cover the upper and side surfaces of the protective layer, the side surfaces of the buffering layer and the resistance layer, and the surface of the dielectric layer outside of the predetermined area. Two openings extending down to the protective layer are formed by performing a dry-etching process on the insulating layer. Two openings extending down to the buffering layer are formed by performing a first wet-etching process on the protective layer below the two openings of the insulating layer. Two openings extending down to the resistance layer are formed by performing a second wet-etching process on the buffering layer below the two openings of the protective layer.

Abstract: A low resistance high current sense resistor is formed on a semiconductor die using conventional semiconductor processing techniques. The resistor die has one or two resistive layers which are photolithographically divided into a plurality of series and parallel resistor sections connected to first and second main terminals. First and second sense terminals are connected across one or a pattern of plural ones of the resistors to produce an output related to the current between the main terminals. Fusible links permit the trimming of the final resistance value.

Abstract: A temperature control device comprising a heater element and a power source. The heater element having a conductive ink affixed to a substrate. The power source connected to the conductive ink to supply power to said conductive ink, thereby heating the heater element.

Abstract: A resistive element includes a resistive film disposed on an insulating film, a current collector disposed apart from the resistive film at a given space, and an electrode conductive to the resistive film and the collector respectively. The insulating board is punched to form slits which split the electrode. The slits allow the resistive element to maintain creepage distances between the electrode. The resistive element accommodates downsizing requirement while restraining silver migration for eliminating shorts between the electrodes. As a result, a highly reliable resistive element is obtainable.

Abstract: An image heating device includes a heater; a film having a surface in slidable contact with said heater and an opposite surface contactable to a recording material carrying an image; wherein the image on the recording material is heated by heat from said heater through said film; wherein said heater includes an elongated base material, a plurality of resistor extended in a longitudinal direction on said base material, and a temperature detecting element provided on said base material: wherein a resistance of a first portion of said resistor which is opposed to said temperature detecting element in the longitudinal direction of said resistor, has a resistance value higher than that in said second portion.

Abstract: A high density resistor structure and a method for forming the structure are disclosed. The high density resistor structure can be constructed by an electrically insulative substrate; a refractory metal-silicon-nitrogen layer deposited on the top surface; and at least one resistor element patterned in the refractory metal-silicon-nitrogen layer in a plane parallel to the top surface. The method can be carried out by first providing the electrically insulative semiconductor substrate or a glass substrate, then sputter-depositing a TaSiN layer having a thickness between 200 Å and 2000 Å on top of the substrate; and then forming by a reactive ion etching technique at least one resistor element in the TaSiN film in a plane that is parallel to the top surface of the substrate.

Abstract: A method and apparatus for heating a charging unit to an appropriate temperature in a uniform manner is provided. In accordance with one example embodiment of the present invention, a heater for use in a charger includes a base. First and second contacts are disposed on the base. A heating element couples the first contact and the second contact. The heating element has an energy density that increases approximately exponentially from a first energy density at locations distal from the first and second heat sink locations to a relatively higher second energy density at locations proximal to the first and second heat sink locations. The heater, according to further embodiments of the present invention, is disposed on an opposite side of the substrate layer from the AC electrode layer, and underneath the charger.

Abstract: A resistor includes a mixture of at least one of a metal conductive oxide and a transition metal material with an insulating oxide. A method for producing such a resistor includes the steps of forming an electrode on one of an alumina substrate, a glass substrate and a glass tube; and flame-spraying a mixture of at least one of a metal conductive oxide and a transition metal material with an insulating oxide, thereby depositing the mixture on the one of the alumina substrate, the glass substrate and the glass tube.

Abstract: An electronic device includes a first conductive polymer layer sandwiched between a first external metal foil electrode and a first internal metal foil electrode, a second conductive polymer layer sandwiched between a second internal metal foil electrode and a second external metal foil electrode, a layer of fiber-reinforced epoxy resin bonding the first and second internal electrodes together, a first terminal providing electrical contact between the first internal electrode and the second external electrode, and a second terminal providing electrical contact between the second internal electrode and the first external electrode. In a preferred embodiment, the polymer layers exhibit PTC behavior, and the terminals are formed by a solder layer applied over a plated layer of conductive metal. Insulative layers are preferably provided on the external electrodes, and located so as to insulate the first and second terminals from each other.

Abstract: A fast heat rise resistor comprising a substrate, a foil bridge on the surface of the substrate, the foil bridge having an elevated portion and a contact portion, the elevated portion above the substrate, the contact portion in contact with the substrate, a conductive layer attached to the contact portion of said foil bridge. The activation energy and/or response time is reduced as the foil bridge is suspended over the substrate. Another aspect of the invention include a method of manufacturing the foil bridge and application to autoignition vehicle airbags.

Abstract: A method of fabricating high resistivity thin film resistors. An isolation region is formed on a substrate to isolate the active regions. A polysilicon layer is formed above the substrate. A diffusion barrier layer is formed above the polysilicon layer. Lightly doped ions are implanted in the polysilicon layer. The substrate is annealed at a high temperature. The diffusion barrier layer and the polysilicon layer are patterned to form a high-resistive thin film resistor. Spacers are formed on the sidewalls of the high-resistive thin film resistor.

Abstract: A heater for a gas sensor has a first thermistor element and a second thermistor element arranged in an electrically parallel configuration. Each thermistor element may be deposited onto a substrate such that the first thermistor element extends about a perimeter of the substrate and the second thermistor element extends across a portion of the substrate intermediate the perimeter of the substrate. The thermistor elements are preferably fabricated of materials having differing thermal coefficients of resistivity. A method of heating the gas sensor includes disposing the two thermistor elements in an electrically parallel configuration over a surface of the substrate and passing an electric current through the elements.

Abstract: In thin layer resistors comprising a patch of a layer of resistive material on an insulating substrate and means at spaced apart locations on the patch, the resistive material is formed of 95 to 99.5 wt % of a zero valence metal and between 5 and 0.5 wt % of a dielectric material.

Abstract: A resistor card for a potentiometer to measure the fuel in a fuel tank consists of a non-conductive substrate with a plurality of elongate conductive contacts deposited thereon. The contacts have an elevation above the surface of the substrate and the contacts are oriented in parallel relationship to each other to form a wiper track across which a wiper is moveable. To reduce the rate at which the upper surfaces of the contacts are worn away by movement of the wiper, an insulating or highly resistive filler material is deposited between the conductive materials which form the lands.

Abstract: A chip thermistor is produced by first preparing green sheets containing a thermistor ceramic material and an organic binder, then applying a resistor paste on one or more of these green sheets and an inner electrode paste on some others, and forming a layered structure by stacking and compressing together specified numbers of these green sheets. The layered structure is then subjected to a firing process and outer electrodes are formed on oppositely facing pair of outer end surfaces of the layered structure. The chip thermistor thus produced has a main body of a thermistor ceramic material having a specified resistance-temperature characteristic, a pair of outer electrodes on its end surfaces, at least one resistor having resistance greater than 1&OHgr;, and at least one pair of inner electrodes opposite each other and separated from each other with the thermistor ceramic material in between.

Abstract: The invention relates to a power module with a circuit arrangement provided with active semiconductor components and passive components and with a circuit substrate, whereby at least a portion of the active semiconductor components are soldered onto a DCB substrate and at least a portion of the passive components are printed in thick film technology on at least one ceramic substrate. The upper side of the DCB substrate is structured to form track conductors and connecting surfaces for receiving the active semiconductor components and passive components of the circuit arrangement. On the ceramic substrate, for each passive component, a first print layer is printed in thick film technology and at least one contact surface as additional print layer laterally adjoining the first print layer.

Abstract: A thin-film resistor that enables a pattern to be simply formed by means of wet etching, that has an excellent resistance temperature characteristic, and that can be easily manufactured, and a method for manufacturing this thin-film resistor, as well as a wiring substrate with this thin-film resistor formed therein. A thin resistor film according to this invention has a structure in which crystal grains deposit in the matrix of amorphous titanium nitride. The thin resistor film is formed on a substrate. The crystal grains includes at least one of crystal titanium nitride and crystal titanium. The thin resistor film can be manufactured using a simple process and can provide a wide range of resistance values with a small tolerance and a temperature coefficient of resistance close to zero.

Abstract: A method is provided for forming a patterned layer of resistive material in electrical contact with a layer of electrically conducting material. A three-layer structure is formed which comprises a metal conductive layer, an intermediate layer formed of material which is degradable by a chemical etchant, and a layer of resistive material of sufficient porosity such that the chemical etchant for said intermediate layer may seep through the resistive material and chemically degrade said intermediate layer so that the resistive material may be ablated from said conductive layer wherever the intermediate layer is chemically degraded. A patterned photoresist layer is formed on the resistive material layer. The resistive material layer is exposed to the chemical etchant for said intermediate layer so that the etchant seeps through the porous resistive material layer and degrades the intermediate layer. Then, portions of the resistive material layer are ablated away wherever the intermediate layer has been degraded.

Abstract: For producing a heating element with a high heat-up rate and a predetermined resistance value for igniting airbag systems, a base member made of an aluminum oxide ceramic material is provided with a glass or glass ceramic coating. A layer of AuPd resinate is applied by screen printing over a large area of the ceramic coating which, if necessary, can be lapped and polished. The resinate layer is subsequently etched to form a resistive path having area-wise constrictions. The ends of the resistive path are subsequently contacted by a AgPd thick-film conductive paste, wherein the Pd content of a conductive paste determines the desired resistance value. After the thick-film conductive paste is dried and fired, the coated base member is subjected to a thermal treatment at temperatures in the range of 850-950° C. until the palladium in the resistor layer is uniformly distributed and the resistance value is stable.

Abstract: A resistor 1 is used in high-fidelity amplifiers for audio equipment. The resistor 1 includes a cylindrical resistor body 2, a tubular sheath 3 into which the resistor body 2 is coaxially inserted, and a conductive film portion 31a formed on the inside surface 3a of the sheath 3. The conductive film portion 31a faces to a resistance film 22 covering the surface of the resistor body 2 with an annular space 6. An insulating slit 32 is formed at a central point along the resistor axis 1a, separating the conductive film 31 into left and right parts that are electrically isolated from each other. The sheath covering the resistor body 2 prevents distortion of signals in the resistance film 22 caused by extraneous electrostatic induction charges.

Abstract: A printed circuit board having resistors formed therein. A conductive layer composed of two different metals is provided on top of an insulating layer in a printed circuit board. The first metal layer is highly conductive and the second metal layer is highly resistive. For a major portion of the layer, both layers are connected electrically in parallel so that they provide a highly conductive path. At selected locations throughout the printed circuit board, the highly conductive metal is removed providing only the high resistivity metal to act as a resistor between selected locations in the conductive layer. Many resistors are formed at the same time, thus providing ease of fabrication and precision in resistor values across the entire printed circuit board. Following the formation of the resistor, additional insulating and conductive layers are formed to complete the printed circuit board.

Abstract: A resistor for use in high density printed circuit board, having low current noise and improved resistance accuracy, and a method of manufacturing the resistor. A resistor of the present invention includes a substrate, a pair of upper-surface electrode layers formed on the end sections of the upper surface of said substrate, a resistor layer formed so that the layer is connected electrically to said upper-surface electrode layers, a first trimming groove formed by cutting said resistor layer, a resistance restoring layer which is formed to cover at least said first trimming groove, a second trimming groove formed by cutting the resistance layer and resistance restoring layer, and a protective layer provided to cover at least the resistance layer and second trimming groove. In this way, the resistors having a superior property in both the current noise characteristic and the resistance accuracy are obtained.

Abstract: A resistor includes an insulating substrate, a resistive layer formed on the substrate, and first and second terminal electrodes connected to the resistive layer. The resistive layer is divided into at least a first portion of greater resistance and a second portion of smaller resistance. The first portion is closer to the first terminal electrode than the second portion is. A trimming groove is formed in the second portion for adjustment of the resistance of the resistor.

Abstract: A resistor network for terminating active electronic circuits such as stub series terminated logic and emitter coupled logic circuits. The network has a substrate with top and bottom surfaces and a common via extending through the substrate. Several resistor pairs are located on the first surface surrounding the common via. Each resistor pair has first and second vias. Resistors are connected between the first and second vias. Several solder spheres are located on the bottom surface. Each of the solder spheres are electrically connected to one of the first, second or common vias.

Abstract: A pair of upper electrode layers 12, connected to resistor layer 14, is formed with a gold system electro-conductive material containing glass frit on the side portion towards the edge of the upper surface of substrate 11. The adhesive strength of which electrode layer to the substrate 11 is strong enough and the electrode layer withstands a thermal stress and a corrosive environment. A resistor thus manufactured maintains its superior electrical characteristics with a high operational reliability even in the harsh operating environment where there is a thermal amplitude lasting for a long term, in a corrosive atmosphere, etc.

Abstract: A limit-level sensor for measuring level of a liquid has a resistance element which has an electric resistance which suddenly varies a transition temperature which lies above the maximum liquid temperature. The resistance element is first heated by electric current. Thereupon, the electric resistance of the resistance element is measured. When the resistance element is covered with liquid, the heat generated by the electric current is led away so that the temperature of the resistance element is less than its transition temperature. If the resistance element is not covered by liquid, this heat is scarcely led away, so that the temperature of the resistance element remains above the transition temperature.

Abstract: A method for manufacturing resistors comprising the steps of forming a top electrode layer on a top face of a substrate, a resistance pattern connected to the top electrode layer, a protective layer covering the resistance pattern, a thin metal film side electrode layer on a side face of the substrate which is electrically connected to the top electrode layer, and a concavity by removing a part of the side electrode layer and substrate.

Abstract: An FBT (fly-back transformer), its bleeder resistor (installed on the top of the FBT), and a device for coupling the bleeder resistor are disclosed. The bleeder resistor 100 is accommodated within a resistor case 180, and the resistor case 180 is installed on the top of an FBT case 110. A resistor pattern 140 is printed on the substrate 130 of the bleeder resistor 100. Openings 150 are formed within the wavy portions of the resistor pattern 140, and the resistor case 180 has a plurality of isolating sheets 160 within its interior 170, so that the isolating sheets 160 can be inserted into the openings 150. When manufacturing the bleeder resistor, the glass coating, the baking, the epoxy resin dipping are eliminated, but the voltage breakdown resisting property is improved. Further, the manufacturing cost is lowered owing to the simplification of the process.

Abstract: A method of fabricating a monolithic chip varistor includes the steps of preparing a varistor body including a plurality of varistor layers and at least one pair of internal electrodes; forming a first layer for each of a pair of external electrodes by applying a metal component and a glass component to an exterior portion of the varistor body, followed by heat treatment; forming a second layer for the external electrode on the first layer by applying a glass component, followed by heat treatment; forming a third layer for the external electrode on the second layer by applying a glass component that is different from the glass component used for forming the second layer, followed by heat treatment; forming a fourth layer for the external electrode on the third layer by applying a metal component that is different from the metal component used for forming the first layer, followed by heat treatment under the same heat treatment conditions as those used for the formation of the first layer; and forming a fifth

Abstract: A range cook top is provided with circular heating zones having a layer of resistive thin film thereon. Slots in the cook top separate the heating zones from the surrounding areas of the cook top. The heating zone includes a resistive layer elements formed by a rectangular layer surrounded by annular arcuate segments. Power supply bus bars are disposed around edges of the resistive layer elements. A dual heater has separately controlled rectangular and annular resistive elements. Temperature sensors are also provided.

Abstract: A thin-film metal resistor (44) suitable for a multilayer printed circuit board (12), and a method for its fabrication. The resistor (44) generally has a multilayer construction, with the individual layers (34, 38) of the resistor (44) being self-aligned with each other so that a negative mutual inductance is produced that very nearly cancels out the self-inductance of each resistor layer (34, 38). As a result, the resistor (44) has a very low net parasitic inductance. In addition, the multilayer construction of the resistor (44) reduces the area of the circuit board (12) required to accommodate the resistor (44), and as a result reduces the problem of parasitic interactions with other circuit elements on other layers of the circuit board (12).

Abstract: A conductive polymer device has three or more conductive polymer layers sandwiched between two external electrodes and two or more internal electrodes. The electrodes are staggered to create a first set of electrodes, in contact with a first terminal, alternating with a second set of electrodes in contact with a second terminal.

Abstract: A vehicle window assembly includes one or more resistance heating lines for electrically heating a section of the window area corresponding to a window wiper rest area. An opaque obscuration band is formed so as to define one or more elongate, relatively narrow wiper alignment apertures along a portion of the window at the wiper rest area. The aperture(s) defined by the obscuration band are positioned so as to be aligned with at least a portion of a heating line. In this manner, at least a portion of the heating line is visible from the exterior of the vehicle through the outer surface of the window.

Abstract: A thick-film resistor and a process for forming the resistor to have accurate dimensions, thereby yielding a precise resistance value. The resistor generally includes an electrically resistive layer and a pair of terminals, a first of which is surrounded by the second terminal, so as to form a region therebetween that surrounds the first terminal and separates the first and second terminals. The terminals are preferably concentric, with the second terminal and the region therebetween being annular-shaped. The resistive layer electrically connects the first and second terminals to complete the resistor. Each of the terminals has a surface that is substantially parallel to an upper and/or lower surface of the resistive layer and contacts the resistive layer. The surfaces of the terminals may be embedded in the resistive layer by printing the resistive material over the terminals, or may contact the upper or lower surface of the resistive layer by locating the terminals above or below the resistive layer.

Abstract: An encapsulating device having a material encapsulated therein comprises a asic body provided with a recess for receiving therein the material and formed by microsystem technology in such a way that the material is fully arranged within the recess. A diaphragm extends across the basic body and is implemented in microsystem or thin-film technology. The diaphragm is used for encapsulating the material in the recess of the basic body in such a way that the diaphragm extends in spaced relationship with the material. An electrically actuable heating means is provided for destroying the diaphragm so as to expose the material.

Abstract: The present invention is directed towards a resistor which has higher load-, surge-, and pulse-resistant characteristics and is capable of having a resistance adjusted at a higher rate of precision. A pair of electrodes 12 and a main resistance path 13 between the two electrodes 12 are mounted on a substrate 11. The main resistance path 13 is joined to a set of first rungs 14 which extend parallel to the main resistance path 13 and are joined with two first connecting paths 15 to form a first ladder-like resistance path for rough adjustment of the resistance which is connected to a part of the main resistance path 13. Also, a second ladder-like resistance path for fine adjustment of the resistance which comprises a set of second rungs 16 extending vertically from the main resistance path 13 and two second connecting paths 17 joining the second rungs 16 together is formed and connected to a part of the main resistance path 13.

Abstract: A heating element 2 comprises a substantially planar substrate 4 having a heating track or tracks 8 and a thermal sensor 10, in the form of a track or discrete component, disposed on one side of the substrate 4. The thermal sensor 10 is separated from the heating track 8 by a locally thinner portion 12 of the substrate 4. The sensor 10 may be located in, or surrounded by, the thinner portion 12.

Abstract: An integrated circuit inverted thin film resistor structure and method of manufacture having interconnect defining resistor contacts and leads resident within and coplanar with a supporting layer, resistive material uniformly overlaying the supporting layer and contacts, the resistive material diffused into the resistor/interconnect contact region.

Abstract: A resistor card for a potentiometer to measure the fuel in a fuel tank consists of a non-conductive substrate with a plurality of elongate conductive contacts deposited. The contacts have an elevation above the surface of the substrate and the contacts are oriented in parallel relationship to each other to form a wiper track across which a wiper is movable. To reduce the rate at which the upper surfaces of the contacts are worn away by movement of the wiper, a non-conductive filler is deposited between the conductive materials which form the lands.

Abstract: A resistor comprising a substrate, a pair of first top electrode layers disposed at least on the top face of the substrate, a resistance layer disposed so as to electrically connect with the first top electrode layers, a protective layer disposed so as to cover at least the resistance layer, and a pair of second top electrode layers disposed at least on the top faces of the pair of first top electrode layers. At least one of the pairs of first top electrode layers or second top electrode layers partially extends to the substrate side faces.

Abstract: A frequency dependent resistor in which the length of the current path across the resistor varies as a function of the frequency of the electrical signals being passed therethrough. The resistor uses the principal known as skin effect to direct relatively higher frequency signals through a longer path through the resistor than is experienced by signals having a relatively low frequency.

Abstract: A thick-film resistor and a process for forming the resistor to have accurate dimensions, thereby yielding a precise resistance value. The resistor generally includes an electrically resistive layer and a pair of terminals, a first of which is surrounded by the second terminal, so as to form a region therebetween that surrounds the first terminal and separates the first and second terminals. The terminals are preferably concentric, with the second terminal and the region therebetween being annular-shaped. The resistive layer electrically connects the first and second terminals to complete the resistor. Each of the terminals has a surface that is substantially parallel to an upper and/or lower surface of the resistive layer and contacts the resistive layer. The surfaces of the terminals may be embedded in the resistive layer by printing the resistive material over the terminals, or may contact the upper or lower surface of the resistive layer by locating the terminals above or below the resistive layer.

Abstract: A thick film resistor assembly comprising: (a) an insulation substrate, (b) a resistor layer being formed on surface of the insulation substrate, (c) a pair of conductor pads comprising a first Ag conductor layer comprising Ag powder and palladium or platinum or mixtures thereof, disposed on the insulation substrate with predetermined spaces from the resistor layer to sandwich the resistor layer in a direction of its conductive resistance path; and (d) a second Ag conductor layer comprising a Ag conductor composition devoid palladium or platinum or mixtures thereof, disposed over the resistor layer and conductor pads at their respective edges to connect electrically the resistor layer to the conductor pads forming a conductive resistance path.

Abstract: The present invention minimizes the deviations of desired fuse time in the resistors with fuse function, and this is made of a resistor layer 21 consisting of fine electro-conductive particles, fine glass particles having a melting temperature higher than the forming temperature of the fine electro-conductive particles, a solvent dispersing these particles uniformly, and metal caps 23 connecting resistor film 21 at the ends of substrate 22.

Abstract: A resistance element which is formed on a substrate by resistors and which divides and supplies high voltage to an electron gun of a cathode ray tube, wherein part or all of the substrate is covered by a high resistance conductive material layer as a topmost layer, and a cathode ray tube having the same.