With Terminal Patents (Class 338/322)
  • Patent number: 6489880
    Abstract: A thermistor with positive resistance-to-temperature characteristic used in a overcurrent protection circuit has electrodes on mutually opposite main surfaces and is mounted to a substrate having electrically conductive members such that deterioration of its voltage resistance due to heat emission can be controlled. A spacer with smaller thermal conductivity than the substrate and penetrated by a conductor piece with a small cross-sectional area is inserted between solder materials connecting to one of the thermistor electrodes. The other electrode is contacted by an elongated connecting member through its sectional surface transverse to its longitudinal direction such that the cross-sectional area of electrical conduction is reduced.
    Type: Grant
    Filed: September 21, 2001
    Date of Patent: December 3, 2002
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Michio Miyazaki, Haruyuki Takeuchi, Tadao Bekku
  • Patent number: 6404324
    Abstract: A resistor having a generally planar substrate with a resistive element located on each side of the substrate and a plurality of terminals for connecting opposing portions of each of the resistive elements to an electronic circuit. The resistive elements have substantially equal dimensions and resistive properties such that they have substantially equal resistance values and exhibit substantially equal current densities for any given applied voltage. The substrate can be a ceramic-coated metal core with the resistive elements silk-screened onto opposite sides of the substrate. The resistive elements have a substantially uniform thickness so that they exhibit a uniform current density when subjected to an applied voltage. With this dual resistive layer design, thermal bending of the resistor due to differential thermal expansion at one of the ceramic layers is substantially offset by thermal bending due to differential thermal expansion at the other ceramic layer.
    Type: Grant
    Filed: September 7, 1999
    Date of Patent: June 11, 2002
    Assignee: General Motors Corporation
    Inventors: David B. Witt, Scott E. Crawford
  • Publication number: 20020021203
    Abstract: Chip PTC thermistors that can easily be inspected the soldered portions after it is mounted on a printed circuit board and that can be used in a flow soldering process, and methods of making same. A chip PTC thermistor of the present invention includes: a first main electrode and a first sub-electrode on first surface of a cuboidal form conductive polymer having the PTC characteristics, a second main electrode and a second sub-electrode on a second surface opposite the first surface of the conductive polymer. Between the first sub-electrode and the second sub-electrode, and between the first sub-electrode and the second main electrode are electrically connecting with a first side electrode and a second side electrode, respectively.
    Type: Application
    Filed: February 16, 2000
    Publication date: February 21, 2002
    Inventors: JUNJI KOJIMA, KOHICHI MORIMOTO, TAKASHI IKEDA, TOSHIYUKI IWAO
  • Patent number: 6311390
    Abstract: Thermistor chips are produced by first obtaining elongated strips made of a sintered ceramic plate having a specified resistance-temperature characteristic and having thereon a plurality of mutually parallel grooves extending perpendicularly to its direction of elongation. On each of these strips, ohmic electrodes are formed, one extending continuously from one of its main surfaces to one of its side surfaces and another extending continuously from the other oppositely facing main surface to the opposite side surface. This may done by covering the strip completely with an electrically conductive film and separating it into two areal parts by forming a longitudinally extending slit on each of the main surfaces. These strips are then stacked one on top of another by aligning the grooves on each of these strips and adhesively attached together with a glass paste in between.
    Type: Grant
    Filed: October 8, 1999
    Date of Patent: November 6, 2001
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yoshiaki Abe, Takahiko Kawahara, Toshiharu Hirota
  • Patent number: 6252200
    Abstract: This invention relates to a process for sealing of the terminal-side end area of the glow tube of a glow plug, this area of the glow tube (3) being crimped.
    Type: Grant
    Filed: March 31, 2000
    Date of Patent: June 26, 2001
    Assignee: Beru AG
    Inventors: Rudi Heinz, Rainer Hain
  • Patent number: 6229098
    Abstract: A process for forming a thick-film resistor whose dimensions can be accurately obtained, thereby yielding a precise resistance value. The method includes providing on a substrate a photoimageable layer that preferably forms a permanent dielectric layer of a multilayer structure. An opening is photodefined in the surface of the photoimageable layer, and then overfilled with an electrically-resistive material to form a resistive mass having an excess portion that lies on the surface of the photoimageable layer surrounding the opening. Following curing which causes the surface of the resistive material to become recessed below the surface of the photoimageable layer, the excess portion of the resistive mass is removed, preferably by abrading or a similar operation, such that the lateral dimensions of the resistive mass are determined by the lateral dimensions of the opening in the photoimageable layer.
    Type: Grant
    Filed: July 21, 2000
    Date of Patent: May 8, 2001
    Assignee: Motorola, Inc.
    Inventors: Gregory J. Dunn, Steven M. Scheifers
  • Patent number: 6215388
    Abstract: A plurality of PTC material layers and a plurality of metal plates are sandwiched together with one adjacent pair of metal plates connected in series through one layer of PTC material. The remaining PTC material layers are connected in parallel with the one layer by selectively interconnecting the other metal plates with the one adjacent pair of metal plates.
    Type: Grant
    Filed: September 27, 1996
    Date of Patent: April 10, 2001
    Assignee: Therm-Q-Disc, Incorporated
    Inventor: Jeffrey A. West
  • Patent number: 6181234
    Abstract: A monolithic resistor is provided with a central resistive metallic foil strip positioned between and attached to a pair of wings formed from an electrically conductive metallic foil. The wings include large surface areas to dissipate heat. A plurality of terminal pins are formed in the conductive strips for connection to an integrated circuit board, as well as a current source.
    Type: Grant
    Filed: December 29, 1999
    Date of Patent: January 30, 2001
    Assignee: Vishay Dale Electronics, Inc.
    Inventors: Joseph Szwarc, Joel J. Smejkal
  • Patent number: 6040755
    Abstract: A chip thermistor is produced by providing a planar rectangular thermistor block with a pair of electrodes formed on its surfaces, each of the electrode being formed so as to be in part on a different one of the main surfaces and extending continuously at least onto one of the side surfaces. The thermistor block thus prepared is cut transversely to obtain a plurality of thermistor elements. A specified number of these thermistor elements are then aligned and stacked one on top of another with their main surfaces facing each other. A layer of an insulating material such as glass with thickness greater than 10 .mu.m is inserted between each mutually adjacently stacked pair of these thermistor elements. Outer electrodes are formed on the outer surfaces of the stacked structure so as to electrically connect to the electrodes on the stacked thermistor elements on their aligned end surfaces.
    Type: Grant
    Filed: June 8, 1999
    Date of Patent: March 21, 2000
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yoshiaki Abe, Toshiharu Hirota
  • Patent number: 6020809
    Abstract: A thermistor with positive resistance-to-temperature characteristic used in a overcurrent protection circuit has electrodes on mutually opposite main surfaces and is mounted to a substrate having electrically conductive members such that deterioration of its voltage resistance due to heat emission can be controlled. A spacer with smaller thermal conductivity than the substrate and penetrated by a conductor piece with a small cross-sectional area is inserted between solder materials connecting to one of the thermistor electrodes. The other electrode is contacted by an elongated connecting member through its sectional surface transverse to its longitudinal direction such that the cross-sectional area of electrical conduction is reduced.
    Type: Grant
    Filed: February 9, 1999
    Date of Patent: February 1, 2000
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Michio Miyazaki, Haruyuki Takeuchi, Tadao Bekku
  • Patent number: 5929745
    Abstract: A high-voltage variable resistor unit including a terminal connection structure capable of preventing upward movement or rotation of the terminal by simple construction. A terminal is provided with a connecting portion between a held portion and a lead wire connected portion. A terminal fixing portion of the insulating casing is provided adjacent to a terminal holding portion with a connecting portion receiving recess in which the connecting portion of the terminal is received. An insulating resin is charged in the connecting portion receiving recess and hardened. The walls surrounding the connecting portion receiving recess have a pair of grooves each formed on a pair of walls facing to a first linear connecting portion and a second linear connecting portion of the terminal.
    Type: Grant
    Filed: March 26, 1997
    Date of Patent: July 27, 1999
    Assignee: Hokuriku Electric Industry Co., Ltd.
    Inventors: Ichiro Tsunezawa, Motoharu Higami
  • Patent number: 5929743
    Abstract: A thermistor with positive resistance-to-temperature characteristic used in a overcurrent protection circuit has electrodes on mutually opposite main surfaces and is mounted to a substrate having electrically conductive members such that deterioration of its voltage resistance due to heat emission can be controlled. A spacer with smaller thermal conductivity than the substrate and penetrated by a conductor piece with a small cross-sectional area is inserted between solder materials connecting to one of the thermistor electrodes. The other electrode is contacted by an elongated connecting member through its sectional surface transverse to its longitudinal direction such that the cross-sectional area of electrical conduction is reduced.
    Type: Grant
    Filed: November 8, 1996
    Date of Patent: July 27, 1999
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Michio Miyazaki, Haruyuki Takeuchi, Tadao Bekku
  • Patent number: 5909168
    Abstract: A housing contains a PTC element which can be easily inserted and removed. Conductive metal retaining elements of the housing are secured to the base of the housing, and retain the PTC element with a generally planar portion parallel to the electrodes of the PTC component. The retaining elements also have slidable contact between the elements and the top of the housing so as to modify the elastic deformation of the element and allow for insertion and removal of the PTC element.
    Type: Grant
    Filed: February 9, 1996
    Date of Patent: June 1, 1999
    Assignee: Raychem Corporation
    Inventors: Naofumi Miyasaka, Takashi Hasanuma, Syozo Fukuyama
  • Patent number: 5903207
    Abstract: A wire-wound inductor includes a dielectric core, terminals including wire staples that are crimped around the core, and a wire winding disposed about the perimeter of the core and connected to the terminals. A coating such as an adhesive coating is disposed over the wire winding and between the terminals. The process for manufacturing the inductors in a continuous process. Beginning with a spooled material, which may be extruded, inductors are formed on a core material sequentially. The inductors are not physically separated until the final stages of manufacturing, which is in contrast to the prior art method in which each inductor is individually constructed on an individual core that has been manufactured with tight tolerances and wound individually. By virtue of the characteristics of the inductor components, extremely tight tolerances (typically about 0.0005") can be obtained, resulting in highly controlled inductance values.
    Type: Grant
    Filed: December 30, 1996
    Date of Patent: May 11, 1999
    Assignee: Ericsson Inc.
    Inventors: Ross Warren Lampe, Jr., Gerard James Hayes
  • Patent number: 5850171
    Abstract: The present invention discloses a resistive circuit. The resistive circuit includes a plurality of resistor networks disposed on a substrate. The resistor networks also includes a plurality of resistive circuit elements. The resistor networks further includes a plurality of termination contacts each connected to one of the resistive circuit elements. Each of the termination contacts is disposed on an edge of the substrate and each of the termination contacts is separated from a next termination contact by an edge trench disposed on the edge of the substrate whereby a distance across the edge trench defining a pitch between the termination contacts.
    Type: Grant
    Filed: August 5, 1996
    Date of Patent: December 15, 1998
    Assignee: CYNTEC Company
    Inventors: Barry Lin, Shih Chang Liao, Duen Jen Cheng
  • Patent number: 5847640
    Abstract: A variable resistor includes a first housing, a second housing formed of resin and having a connector part and a circuit board whose surface has an electrode and a resistance pattern thereon. A metallic terminal is molded in the second housing as one body and a brush is mounted on a moving member and is disposed in sliding engagement with the resistance pattern. An end of the terminal is in contact with the electrode on the surface of the circuit board and the other end of the terminal is disposed in the connector part.
    Type: Grant
    Filed: September 29, 1995
    Date of Patent: December 8, 1998
    Assignee: Aisin Seiki Kabushiki Kaisha
    Inventors: Kiyohiro Fukaya, Yukihiro Kato, Kouji Akashi, Akikazu Matsumoto, Yukihisa Oda
  • Patent number: 5631624
    Abstract: A dielectric ceramics contains, at least, two kinds of metal ions and a dielectric constant changes continuously or step by step as a function of position. The metal ions contained in the dielectric ceramics are, at least, two kinds which are selected from Mg, Ca, Sr, Ba, Zn, Pb, Bi, Y, La, Ce, Nd, Sm, Gd, Er, Ti, Zr, Sn, Si and Mn, and the dielectric constant .epsilon. changes in the range of 7.ltoreq..epsilon..ltoreq.90. This dielectric ceramics is used in a dielectric substrate for stripline device, a dielectric substrate for monolithic IC and a dielectric block for polarizer. For example, when used as the dielectric substrate for stripline device, it is so formed that a dielectric constant at its center portion is constant, and that those at an outer portion becomes smaller step by step or continuously towards ends.
    Type: Grant
    Filed: August 28, 1995
    Date of Patent: May 20, 1997
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Seiji Kanba, Kazuya Kawabata, Hiroshi Takagi
  • Patent number: 5557251
    Abstract: A thermistor includes a plate-like thermistor body and a first and a second electrode formed on each of the main surfaces of said plate-like thermistor body. The first electrode is formed so that its outer periphery reaches the outer peripheral edge of the thermistor and the second electrode is formed to extend from the area encircled by said first electrode onto the first electrode but not reach the outer periphery of the first electrode. The first and second electrodes are made of material which can make an ohmic-contact with the main surface of said thermistor body. The first electrode is made of the material which is hard to generate inter-electrode migration and said second electrode is made of the material which is easy to generate the inter-migration compared with the first electrode. Thus, the thermistor can prevent short-circuiting due to inter-electrode migration without deteriorating the characteristic such as a current capacity.
    Type: Grant
    Filed: March 28, 1994
    Date of Patent: September 17, 1996
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Yuichi Takaoka
  • Patent number: 5543601
    Abstract: A multiple terminal assembly includes a plurality of connectors secured within a housing in close proximity to and electrically insulated from each other. The terminals include an electroconductive strip extending outwardly from one side of the housing and an electroconductive tab extending outwardly from an opposite side of the housing. The terminals are spaced apart a fixed, predetermined distance along the housing so that when the assembly is used to supply electrical power to a structure having current carrying members extending to a connection area along an edge portion of the structure, each of the terminal strips is aligned with one of the current carrying members at the connection area and each of the tabs is aligned with a corresponding connector of a multiple connector harness assembly.
    Type: Grant
    Filed: May 3, 1993
    Date of Patent: August 6, 1996
    Assignee: PPG Industries Inc.
    Inventors: Bruce A. Bartrug, Harry S. Koontz, John A. Winter
  • Patent number: 5525956
    Abstract: An electrical component has a terminal construction allowing it to be electrically and mechanically connected to an electrode. A terminal made of a metal material is mounted on an insulating substrate which has front and rear surfaces and is mounted on the front surface thereof with an electrode. The terminal includes a clamp section for clamping the substrate through front and rear surfaces thereof. The clamp section includes a first contact element contacted with the electrode and a second contact element contacted with the rear surface of the substrate. The first contact element is adhesively bonded to the electrode. Electrical connection between the first contact element and the electrode is carried out by direct contact therebetween. The second contact element of the clamp section is adhesively bonded to the rear surface of the substrate.
    Type: Grant
    Filed: March 30, 1994
    Date of Patent: June 11, 1996
    Assignee: Hokuriku Electric Industry Co., Ltd.
    Inventors: Shouichi Hashizume, Masanori Urayama
  • Patent number: 5517171
    Abstract: A high-voltage electronic component including a terminal connection structure capable of connecting a lead wire to a terminal fitment without soldering. An insulating substrate having a resistance element for a variable resistor formed on a front surface thereof and a high-voltage resistor are received in a hollow insulating casing. The insulating substrate is mounted on a rear surface thereof with a terminal fitment. The terminal fitment is formed with a press-fit channel in which a lead wire is press-fitted. Upon press fitting of the lead wire, the insulating casing is formed with an opening, through which insulating resin is charged in the insulating casing to form an insulating resin layer in which the terminal fitment and lead wire are embedded.
    Type: Grant
    Filed: March 17, 1994
    Date of Patent: May 14, 1996
    Assignee: Hokuriku Electric Industry Co., Ltd.
    Inventors: Hirokazu Kotani, Hiromasa Saikatsu, Hitoshi Ishiwari, Kenichi Hiraki
  • Patent number: 5488348
    Abstract: A PTC thermistor including ceramic body having a positive temperature coefficient of resistivity, a pair of electrode layers provided on both major surfaces of the ceramic body so as to be opposed to each other with the ceramic body interposed therebetween, a ceramic reinforcing plate provided on at least one of the major surfaces of the ceramic body, and an output electrode having a connecting portion for making electrical connection with the electrode layer on an inner major surface of the ceramic reinforcing plate and extending to an outer major surface of the reinforcing plate from the connecting portion.
    Type: Grant
    Filed: March 8, 1994
    Date of Patent: January 30, 1996
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Shyoji Asida, Haruo Takahata, Takayo Katsuki
  • Patent number: 5455555
    Abstract: A chip varistor formed of a single layer varistor element includes a pair of non-ohmic contact electrodes and a pair of ohmic contact electrodes. The varistor element is a rectangular shape having top and bottom surfaces, two opposite edges and two opposite ends. Each of the non-ohmic contact electrodes covers one of the opposite ends of the varistor element and extends over a majority portion of either one of the top or bottom surfaces. Each of the ohmic contact electrodes is arranged at the center of corresponding one of the top and bottom surfaces of the varistor element. The ohmic contact electrodes directly contact the surfaces of the varistor element to form a ohmic contact relative to the varistor element. Each of the pair of non-ohmic contact electrode is electrically connected to each of the pair of ohmic-contact electrodes while forming a non-ohmic contact with respect to the varistor element.
    Type: Grant
    Filed: November 24, 1993
    Date of Patent: October 3, 1995
    Assignee: TDK Corporation
    Inventor: Shuichi Onabuta
  • Patent number: 5430429
    Abstract: A resistor 1 in which at least one resistance film 4 is embedded in a ceramic sintered body 3, glass is diffused into the sintered body 3 to form a glass diffusion layer 6, and both end faces 4a and 4b of the resistance film 4 are respectively exposed to both end faces 3a and 3b of the ceramic sintered body 3.
    Type: Grant
    Filed: September 27, 1993
    Date of Patent: July 4, 1995
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kazutaka Nakamura, Hiroyuki Kubota, Yasunobu Yoneda, Akinori Nakayama, Tohru Tominaga, Tomoaki Ushiro
  • Patent number: 5351026
    Abstract: A thermistor includes a rectangular parallelepiped thermistor element, electrodes formed over the entire top and bottom surfaces of the thermistor element, and leads connected to the electrodes. The leads have connecting portions for deriving signals, and are bent such that the connecting portions are positioned on substantially the same plane. A sealing resin completely surrounds the thermistor element, the electrodes, and all of the leads except for the connecting portions.
    Type: Grant
    Filed: February 18, 1993
    Date of Patent: September 27, 1994
    Assignee: Rohm Co., Ltd.
    Inventors: Shigeru Kanbara, Hitoshi Fukui
  • Patent number: 5339065
    Abstract: A miniature potentiometer suitable for mechanical adjustment of microwave circuits is provided. Furthermore, there is provided a dual, ganged potentiometer also suitable for mechanical adjustment of microwave circuits. The dual, ganged potentiometer provides reliable tracking of tapers between the two variable resistance elements. Yet further, there is provided a complete, microwave, T-pad attenuator circuit which is mechanically adjustable. The T-pad attenuator uses two ganged potentiometers, whose tapers track in a known non-linear fashion. The tapers may be logarithmic.
    Type: Grant
    Filed: June 10, 1993
    Date of Patent: August 16, 1994
    Inventor: Stephen A. Slenker
  • Patent number: 5336990
    Abstract: An electrical test shunt having a pair of female contacts each having two contact points for relocating voltage sensing points of a test shunt to provide a first circuit path with an adequate current flow that is independent of a second circuit path for reading the voltage drop across the same electrical test shunt. The voltage is read by a high input impedance voltage comparator. The input impedance of the voltage comparator is great enough to negate the affect of the internal resistance inherent in the mating terminals of the shunt. The two circuit paths are made possible in part by the implementation of a pair of terminals which each have two independent electrical contact areas. The terminal contact is typically inserted into the female receptacle formed by the two separate (i.e. electrically isolated) electrically conducting contact points. The female terminal is preferably mounted in a suitable printed circuit board.
    Type: Grant
    Filed: January 13, 1993
    Date of Patent: August 9, 1994
    Assignee: United Technologies Automotive, Inc.
    Inventor: H. Winston Maue
  • Patent number: 5331305
    Abstract: A chip network resistor includes a plurality of discrete electrodes and common electrodes which are connected to a plurality of resistance elements according to a predetermined pattern. The configuration of the common electrodes is larger more than that of the discrete electrodes. Thereby, the contact resistance between the terminal of a measuring instrument and a common electrode is reducible when a value of resistance is measured.
    Type: Grant
    Filed: April 21, 1993
    Date of Patent: July 19, 1994
    Assignee: Rohm Co., Ltd.
    Inventors: Shigeru Kanbara, Toshihiro Hanamura
  • Patent number: 5296835
    Abstract: A Neuro device is a representation of a nerve cell constituting human brains, eyes and the like, that is, a neuron by an electronic circuit. A circuit of the Neuro device according to the present invention comprises n (n : natural number) input terminals 4, n variable resistors 8 (the resistance values of the n variable resistors 8 are respectively set to R1, R2,..., Rn) respectively connected to the input terminals 4, and an arithmetic circuit 100 to which signals from the variable resistors 8 are together applied, and an output terminal 5 to which a signal from the arithmetic circuit 100 is outputted. The variable resistor 8 is so constructed that a chalcogenide semiconductor is interposed between a pair of electrodes. The chalcogenide semiconductor can be reversibly transferred to a high resistive amorphous state and a low resistive crystallized state by applying a predetermined write voltage.
    Type: Grant
    Filed: June 30, 1993
    Date of Patent: March 22, 1994
    Assignee: Rohm Co., Ltd.
    Inventor: Takashi Nakamura
  • Patent number: 5287081
    Abstract: Multilayer, thin film multijunction integrated micropotentiometers are formed in an integral multifilm membrane form over a through opening in a nonmagnetic, dielectric substrate. Through the use of conventional photolithographic and etching techniques, integrated structures are formed to include either single elongate heater elements, bifilar heater elements, or trifilar heater elements with multiple return paths. Multijunction thermopiles and resistors are formed with the heater. The individual layers of silicon oxide or silicon nitride, are formed with conventional chemical vapor deposition, sputtering and other known techniques.
    Type: Grant
    Filed: January 13, 1993
    Date of Patent: February 15, 1994
    Assignee: The United States of America as represented by the Secretary of Commerce
    Inventors: Joseph R. Kinard, De-xiang Huang, Donald B. Novotny
  • Patent number: 5280264
    Abstract: A resistor element for determining a parameter, including a ceramic support, an electrically resistive body formed on the ceramic support, at least one lead wire electrically connected to the electrically resistive body, and an adhesive containing platinum for securing the lead wire(s) to the ceramic support. Each lead wire includes a wire rod having a lower thermal conductivity than platinum, and a covering layer which covers the wire rod and is formed of an alloy including platinum as a major component.
    Type: Grant
    Filed: August 13, 1992
    Date of Patent: January 18, 1994
    Assignee: NGK Insulators, Ltd.
    Inventors: Yasuhito Yajima, Fujio Ishiguro, Zenji Ishikawa
  • Patent number: 5278535
    Abstract: A thin flexible laminate for overlay application on the pins of a connector or other circuit element, having an electrically insulating substrate, a conductive lamina of apertured pin receiving pads and a separate ground strip adjacent the pads, and an electrically insulating cover lamina, the substrate and cover having apertures aligned with the pad apertures, the cover having second apertures exposing adjacent edges of said pads and ground strip, with an electrical overstress pulse responsive composite material positioned in the second apertures and bridging the pads and the ground strip.
    Type: Grant
    Filed: August 11, 1992
    Date of Patent: January 11, 1994
    Assignee: G&H Technology, Inc.
    Inventors: Antai Xu, Roger C. Stephenson
  • Patent number: 5264819
    Abstract: A varistor with a body including an outer perimeter and substantially parallel opposed ends is surrounded on its outer perimeter by a collar formed from a high temperature polymer. Electrodes are fixed to the parallel opposed ends of the varistor such that they extend at least to the interior edge of the collar. A method of making the varistor is also described.
    Type: Grant
    Filed: December 9, 1992
    Date of Patent: November 23, 1993
    Assignee: Electric Power Research Institute, Inc.
    Inventors: Herman F. Nied, Howard F. Ellis
  • Patent number: 5260549
    Abstract: An laminated article heater terminal assembly and connector for electrically uniting a source of electricity with a conductive polymer film laminated between two nonconductive materials. The terminal assembly includes a conductive metal foil tab and a terminal body further including dimples and first and second foldable shoulders which act in unison to mechanically grasp the conductive metal foil tab. A plurality of terminal assemblies are then captivated in a connector.
    Type: Grant
    Filed: December 23, 1991
    Date of Patent: November 9, 1993
    Assignee: Methode Electronics, Inc.
    Inventor: Mario Garritano
  • Patent number: 5243318
    Abstract: A low noise miniature potentiometer utilizes thick film deposits of resistive material which extend adjacent to deposits of conductive material. The conductive region is sliced into a plurality of spaced-apart conductive elements. Electrical paths through resistive elements can be lengthen by laser trimming of the resistive material thereby providing for very precise incremental resistances between pairs of spaced apart conductive elements. If desired, an increased range of resistivity can be achieved by utilizing a second deposited thick film region extending along the conductive region and in contact therewith. Laser trimming can be used to increase conductive path lengths in the second resistive element thereby providing a broader range of resistance values.
    Type: Grant
    Filed: April 12, 1991
    Date of Patent: September 7, 1993
    Assignee: Beltone Electronics Corporation
    Inventor: Bernard Greenstein
  • Patent number: 5231372
    Abstract: A method of making a compact high-voltage, high-power, thick-film screen-printed cylindrical resistor. A V-serpentine pattern is formed and adapted to fit on a cylindrical substrate having a diameter range of about 1/10 inch to about 1/2 inch. Such pattern is caused to have adjacent sections at a small acute angle to each other. Furthermore, the pattern is caused to have gaps at the open ends of the loops that are substantially wider than the gaps at the closed ends of the loops. In addition, the pattern is caused to have a sufficient number of undulations, and sufficient gap size, to achieve a predetermined voltage rating. Thereafter, the height of the pattern is changed to achieve a voltage coefficient substantially corresponding to the desired voltage coefficient. Furthermore, the resistive film material is altered to cause it to have a different resistivity, said latter resistivity being such that the same resistance value is achieved.
    Type: Grant
    Filed: October 9, 1991
    Date of Patent: July 27, 1993
    Assignee: Caddock Electronics, Inc.
    Inventor: Richard E. Caddock, Jr.
  • Patent number: 5210517
    Abstract: A self-resetting overcurrent protection element uses an element body made up of a mixture of polymers and carbon black grafted with polymers. A resilient sheathing material covering the element body permits free expansion of the element body to permit the resistance of the overcurrent protection element to increase substantially in response to Joule's heating from high current. The sheathing materials preferably are made of elastic epoxy resins or silicone resins that allow significant expansion of the element body at the time of overcurrent protection, thus increasing the ratio of resistance in the element between an overcurrent state and a normal operating state.
    Type: Grant
    Filed: June 3, 1991
    Date of Patent: May 11, 1993
    Assignee: Daito Communication Apparatus Co., Ltd.
    Inventor: Toshiaki Abe
  • Patent number: 5208444
    Abstract: A terminal connector for a heated window, a heated window provided with a plurality of terminal connectors constructed and arranged for simultaneous engagement to corresponding terminals of a multiple terminal housing and a method of assembling a heated window provided with at least two of said terminal connectors in a terminal connection area along a side edge of said heated window.
    Type: Grant
    Filed: November 1, 1990
    Date of Patent: May 4, 1993
    Assignee: PPG Industries, Inc.
    Inventors: John A. Winter, Bruce A. Bartrug, Harry S. Koontz
  • Patent number: 5196822
    Abstract: A resistance stack for terminating a data bus cable includes a stack of resistor chips, each having two conductively plated through holes. The resistance elements are kept in alignment and electrically connected to leads of the data bus cable by elongated members extending through the through holes. The elongated members may be discrete conductive rods, or soldered and pre-tinned leads of the cable. To facilitate assembly, solder preforms are provided between each of the resistor chips. The resistance stack is enclosed in a package which includes a cylindrical shell, a cable clamp, a cable strain relief member, and an end cap including a track for accommodating extensions of the elongated members beyond the last resistor in the stack, thereby aligning the elongated members. The package may be both electrically shielded and environmentally sealed.
    Type: Grant
    Filed: December 12, 1991
    Date of Patent: March 23, 1993
    Assignee: Amphenol Corporation
    Inventors: David O. Gallusser, Jon P. Bixby, James B. LeBaron
  • Patent number: 5192940
    Abstract: A flat resistance for a blower control unit of an automobile air conditioner, and a blower control unit using the same. The flat resistance includes: a porcelain enameled metallic substrate including a flat head portion, having an edge and one surface, and parallel terminal supporting portions projecting outwardly from the edge of the head; a resistance circuit printed on the one surface of the head portion, the resistance circuit including a plurality of resistances electrically connected in series; a temperature fuse, interposed in the resistance circuit, for being tripped to break the resistance circuit when the porcelain enameled metallic substrate becomes overheated; and terminals, printed on both the head portion and the terminal supporting portions, each terminal being connected to one end of a corresponding one of the resistances.
    Type: Grant
    Filed: December 31, 1990
    Date of Patent: March 9, 1993
    Assignees: Fujikura, Ltd., Calsonic Corp., Kohwa Mfg. Co.
    Inventors: Kiyoshi Yajima, Takao Suzuki, Masanori Itoh, Hitoshi Okuyama, Ken-ichi Uruga, Hisanaga Hirabayashi
  • Patent number: 5189387
    Abstract: A nonlinear resistive surface mount device for protecting against electrical overvoltage transients is disclosed which includes a pair of conductive sheets and a foldback switching material disposed between the pair of conductive sheets. This configuration serves to connect the conductive sheets by a foldback switching mechanism thereby providing predetermined resistance when the voltage between the conductive sheets exceeds a predetermined voltage.
    Type: Grant
    Filed: July 11, 1991
    Date of Patent: February 23, 1993
    Assignee: Electromer Corporation
    Inventors: Richard K. Childers, John H. Bunch
  • Patent number: 5168257
    Abstract: A 4-terminal resistor apparatus which includes a body of resistive material having opposed first and second ends and opposite first and second sides. The distance between the opposed ends is no greater than the distance minimum width of the body intermediate opposed ends. Preferably, the width is 3 or 4 times greater than the distance intermediate the opposed ends. The first and second ends have respective first and second metal contact surfaces disposed thereon. The first and second pairs of leads each include first and second leads, each pair of leads engages one of the metal contact surfaces. The apparatus also includes means for holding the leads in each of the pairs of leads apart even if one of the leads in a given pair should become detached from the body of resistive material. In many forms of the invention the body is disc shaped.
    Type: Grant
    Filed: October 23, 1990
    Date of Patent: December 1, 1992
    Inventor: Klaus H. Frielinghaus
  • Patent number: 5142263
    Abstract: A nonlinear resistive surface mount device for protecting against electrical overvoltage transients which includes a pair of conductive sheets and a quantum mechanical tunneling material disposed between the pair of conductive sheets. This configuration serves to connect the conductive sheets by quantum mechanical tunneling media thereby providing predetermined resistance when the voltage between the conductive sheets exceeds a predetermined voltage.
    Type: Grant
    Filed: February 13, 1991
    Date of Patent: August 25, 1992
    Assignee: Electromer Corporation
    Inventors: Richard K. Childers, John H. Bunch
  • Patent number: 4965538
    Abstract: A microwave attenuator is constructed on an insulative substrate which supports a resistive region, input/output electrodes and shunt electrodes. The shunt electrodes are preferably constructed using trapezoidally shaped portions on the face of the insulative substrate, on which the resistive region is formed, to increase the width of the electrodes. The shunt electrodes extend down to a ground plane on the face of the insulative substrate opposite the face on which the resistive region is formed. In one embodiment, the shunt electrodes form a wide strip on the outside of a rectangular substrate. In another embodiment, the shunt electrodes extend from the resistive region through holes positioned close to the resistive region.
    Type: Grant
    Filed: February 22, 1989
    Date of Patent: October 23, 1990
    Assignee: Solitron Devices, Inc.
    Inventor: Joseph J. Mickey, III
  • Patent number: 4878850
    Abstract: The terminal for encapsulated glazing having coverings or equipment requiring an electric power supply. The terminal, for example of the hollow rivet type, is fastened, particularly by soldering or brazing, in the area of the edges of the glazing on a zone having a conductive covering, embedded in the encapsulation material of the glazing. The terminal makes it possible to supply power to the heating glazings.
    Type: Grant
    Filed: July 15, 1988
    Date of Patent: November 7, 1989
    Assignee: Saint-Gobain Vitrage
    Inventors: Bernard Letemps, Gerard Huchet, Jacques Leclercq
  • Patent number: 4823461
    Abstract: A method of manufacturing a fluidic angular rate sensor of the type wherein fine wires, such as tungsten wires, are mounted in tension over the heads of two pairs of spaced apart metal supports which are mounted on a ceramic disc having fluid passage apertures therein, comprising plating gold on the wires; fixedly mounting the wires between the spread apart metal supports by means of thermocompression bonding or the like; and heating the mounted gold plated wires in a predetermined atmosphere for removing the plated gold from the wires and to recrystallize the wires.
    Type: Grant
    Filed: May 24, 1988
    Date of Patent: April 25, 1989
    Assignees: Honda Motor Co., Ltd., Stanley Electric Co., Ltd.
    Inventors: Fumitaka Takahashi, Kunio Okazaki, Masaru Shiraishi, Masayuki Takahashi
  • Patent number: 4794229
    Abstract: A flexible heating cable using positive temperature coefficient thermistors as a primary heat source with the thermistors being electrically and mechanically connected to substantially flat, preferably braided, electrical conductors with dielectric material preferably separating the conductors. A covering of dielectric material preferably is used to electrically separate the cable from the environment. The cable construction improves the heat transfer from the thermistors to the environment and improves the temperature distribution of the cable.
    Type: Grant
    Filed: April 24, 1987
    Date of Patent: December 27, 1988
    Assignee: Thermon Manufacturing Company
    Inventors: David C. Goss, Chandrakant M. Yagnik
  • Patent number: 4742325
    Abstract: A thin-film circuit including integrated resistors and conductors. The conductors consist of two superposed Au layers having a Pd layer sandwiched between them. The conductors have a sheet resistivity of R 10 m and are solderable and bondable. The thin-film circuit is suitable for applications in the GHz range.
    Type: Grant
    Filed: February 20, 1987
    Date of Patent: May 3, 1988
    Assignee: Standard Elektrik Lorenz AG
    Inventors: Siegfried Muller, Helmut Hanisch
  • Patent number: 4721845
    Abstract: In an electrically heatable automobile glass pane with heating conductors printed onto and baked into a surface, which conductors are connected to printed-on and baked-in collecting conductors, metal strips are disposed on the baked-in collecting conductors and are electrically connected with these collecting conductors. The baked-in collecting conductors and the metal strips connected with them are furnished with a plastic coating which jointly covers them and is glued to them and to the glass surface.
    Type: Grant
    Filed: September 10, 1986
    Date of Patent: January 26, 1988
    Assignee: Saint-Gobain Vitrage
    Inventors: Heinz Kunert, Gerd Sauer, Hans Ohlenforst
  • Patent number: 4719317
    Abstract: To form a sturdy, environmentally essentially unaffected and high-temperature resistance electrical connection between a connection wire (4) and a conductive track (2) on the substrate (1), a portion of the wire (4) is embedded in a unitary bonding element (3). The bonding element comprises about 70% of metal particles and 30% of glass particles to form a bonding spot. The bonding spot is made by applying a paste of glass and platinum powder, with the glass powder having a grain size several times larger than the platinum powder on the conductive track (2), pressing the end portion of the connection wire (4) into the spot so that the wire will be completely surrounded, and then firing the bonding spot. If the conductive track (2) is applied by film technology, firing of the conductive track (2) and of the bonding spot (3) can be carried out in a single operating step.
    Type: Grant
    Filed: March 18, 1986
    Date of Patent: January 12, 1988
    Assignee: W. C. Heraeus GmbH
    Inventors: Quentin Reynolds, Karl Deckelmann