Abstract: Disclosed is a resistor comprising a nonconductive substrate on which is disposed a rectangularly-shaped coating of resistive material having a negative TCR. Oppositely disposed along the longer sides of the coating is a pair of elongated, parallel strips of resistive material having a positive TCR. Electrical connection is made to the opposed ends of the coating and to an end of each strip. The strips and electrical connections are so disposed that at low temperatures, current flow is predominantly across a relatively wide, short path in the coating between the strips, and at higher temperatures, current flow is predominantly along a longer, narrower path in the coating which is parallel to the strips.

Abstract: Disclosed is a method for providing electronic semiconductor devices and the devices produced thereby utilizing an orientation dependent etch to selectively provide grooves in a monocrystalline silicon substrate having a crystal orientation of (110). By selectively etching with an orientation dependent etch to provide deep grooves having substantially parallel sidewalls and thereafter refilling with an appropriate material of the appropriate conductivity, a plurality of semiconductor electronic devices are provided.

Abstract: This electromagnetic coil is composed of concentric multi-turn windings in magnetic aiding relationship, one winding being formed of copper wire and the other of wire made of copper contaminated with a minor percentage of a metal having a different coefficient of resistance than copper. The wires of both windings having a positive temperature coefficient of resistance, one being less than the other so that the power demands of the coil at low temperatures will be reduced with a minimum loss in hot ampere turns. The wire of copper contaminated with the other metal is of a smaller gage size and the thickness of the winding of such wire bears a predetermined ratio to the total of both windings whereby they will have substantially equal heat densities.

Abstract: A resistor with a low temperature coefficient comprises, by way of example, a main wire wound resistor having a low temperature coefficient on the order of -4.0 PPM and a resistance on the order of 1 K.OMEGA. connected in series with an auxiliary resistor having a temperature coefficient the magnitude of which is substantially greater than that of the main resistor and the polarity of which is opposite to that of the latter, for example, on the order of 4000 PPM and having a resistance which is greatly reduced as compared with that of the main resistor, for example, on the order of 1.OMEGA.. The composite resistor has a resistance of approximately 1 K.OMEGA. and a temperature coefficient which is less than 0.5 PPM.

Abstract: A printed resistor is proposed which has a laminated structure comprising a substrate and a foil current-carrying pattern attached to the substrate and provided with two current terminals and with at least one potential terminal. The current-carrying pattern is made as a network of series-parallel arms. A section of one of the parallel arms of the pattern is made of a material whose temperature coefficient of resistance exceeds that of the material of the rest of the current-carrying pattern. One side of said section is connected to one of the current terminals and the other, to one of the potential terminals. Proposed also is a method of manufacturing such printed resistors which consists in that, first, an area of the foil with a size sufficient for the temperature compensating element of the resistor to be accommodated thereon is coated with a metal layer whose temperature coefficient of resistance and the rate of solution in an etching substance are higher than those of the foil material.