Abstract: A reduced pressure drying apparatus comprises a substrate stage section for disposing thereon a substrate having the surface coated with a coating liquid containing a film-forming component and a solvent, a hermetic vessel having the substrate stage section arranged therein, an exhaust means for reducing the pressure inside the hermetic vessel, a gaseous stream distribution control plate arranged apart from and in a manner to face the surface of the substrate disposed on the substrate stage section and provided with a plurality of gaseous stream-flowing ports through which flow a gaseous stream, each of the plurality of gaseous stream-flowing ports having a gaseous stream-flowing region, and a control means for controlling the distribution pattern of the gaseous stream-flowing regions of the gaseous stream distribution control plate.

Abstract: A sprinkler system and a method for mitigating scaling, microbiological influenced corrosion and oxidative corrosion are disclosed. The system includes a piping network in fluid communication with a source of pressurized water and an air pump. The network is vented to the ambient. The air pump moves initially dry ambient air through the system, either by maintaining a negative or a positive air pressure within the network. The dry air absorbs residual water within the network and exhausts it to the ambient. Rate of air flow through the system is controlled by restrictor elements such as orifices, throttle valves or venturies within the piping network.

Abstract: A lithographic mask is placed in a chamber which is then sealed. The gas pressure in the chamber is reduced to dislodge contaminant particles on the mask surface.

Abstract: A device for degassing a substrate plate in an evacuated environment with two substantially flat, parallel bodies spaced at a distance smaller than their longitudinal extent forming an interspace with the substrate located between the bodies and these projecting beyond the substrate at least in the margin region, wherein in at least one of the bodies a gas delivery is disposed for generating a laminar gas flow in the interspace along the bodies and the substrate in the radial direction toward the periphery of the bodies, and that here a pumping port is provided for pumping off the gas flow.

Abstract: The invention concerns a method for obtaining dry plant extracts under mild conditions, in which a liquid plant extract is introduced into a vacuum drying equipment having a multi-shaft stirrer extending through a cylindrical mixing and drying chamber and with its own drive, together with a chopper rotating through a stator, and the liquid plant extract is dried at a vessel shell temperature of 20° C. to 50° C., a product temperature between 20° C. and 40° C., a pressure between 0.

Abstract: A freeze dryer having a collector chamber is provided with a sensor for detecting the presence of moisture in the chamber so that the vacuum pump cannot be operated if moisture is present. The refrigeration system can also be deactivated. This precludes moisture from being pulled into the vacuum pump where it will mix with pump oil and shorten the life of the pump. The moisture sensor is also coupled with a warning circuit which advises the operator that the system is inoperable and is capable of displaying the reason for inoperability.

Abstract: This invention relates to a vacuum processing apparatus having vacuum processing chambers the insides of which must be dry cleaned, and to a method of operating such an apparatus. When the vacuum processing chambers are dry-cleaned, dummy substrates are transferred into the vacuum processing chamber by substrates conveyor means from dummy substrate storage means which is disposed in the air atmosphere together with storage means for storing substrates to be processed, and the inside of the vacuum processing chamber is dry-cleaned by generating a plasma. The dummy substrate is returned to the dummy substrate storage means after dry cleaning is completed. Accordingly, any specific mechanism for only the cleaning purpose is not necessary and the construction of the apparatus can be made simple.

Abstract: In drying a coating liquid such as a resist applied to a substrate under reduced pressure, a coating film in a peripheral portion tends to lose good shape regardless of duration of a drying period, and it is difficult to set an appropriate exhaust flow rate. After the substrate is loaded in an airtight container, a pressure is reduced from atmospheric pressure to a pressure slightly higher than the vapor pressure of a solvent, for example. Then, the solvent actively evaporates from the coating liquid. Here, evacuation is performed initially based on a first flow rate set value Q1, and thereafter, it is performed based on a second flow rate set value larger than Q1. Rounding of the surface in the peripheral portion is corrected by evacuation based on Q1, and more active evaporation of a solvent component is attained by switching to Q2.

Abstract: A cost effective and environmentally sound method for quickly removing liquid from surfaces of a substrate under manufacture without leaving behind substantial residue (e.g., silicon elements from the substrate, commonly known in the field as “water marks”). The process includes first providing a substrate (e.g., a semiconductor wafer, glass flat panel, or disc media), which has undergone one or more liquid-based processes (e.g., cleaning, scrubbing, rinsing, etc.). An upper surface and a lower surface of the substrate are then subjected to vacuum suction, thereby removing liquid thereon. An apparatus for removing liquid from surfaces of a substrate is also provided. The apparatus includes a plurality of vacuum application members configured for applying vacuum suction to surfaces of a substrate, thereby removing liquid therefrom.

Abstract: A cleaning process for cleaning a thermal processing apparatus includes: a heating step of heating an interior of a reaction tube at 300° C., and a cleaning step of removing deposits deposited in the thermal processing apparatus. In the cleaning step, a cleaning gas containing fluorine gas, chlorine gas and nitrogen gas is supplied into the interior of the reaction tube heated at 300° C. to remove silicon nitride so to clean an interior of the thermal processing apparatus.

Abstract: The invention provides drying apparatus including a first chamber for receiving articles to be dried and having an outlet, a second chamber having an outlet, and a fan having a fan inlet and a fan outlet, the fan inlet communicating with the outlet of the first chamber and the fan outlet communicating with the second chamber. The apparatus further includes a vacuum pump communicating with the outlet of the second chamber so that transfer of thermal energy can take place between the first and second chambers. The invention also provides a method of drying including placing articles into a first chamber, evacuating a significant proportion of the air from the first chamber and from a second chamber, evacuating water vapor from the first chamber to the second chamber, allowing the water vapor to condense in the second chamber, and transferring thermal energy from the second chamber to the first chamber.

Abstract: An instantaneous pressure reducing heating and drying apparatus for an object, such as a wafer, includes a pressure reducing chamber; a vacuum pump for reducing a pressure in the pressure reducing chamber to below atmospheric pressure; a drying chamber installed within the pressure reducing chamber for drying the object that is loaded in the drying chamber; a pressure regulating valve installed in a wall of the drying chamber, wherein when the pressure regulating valve is opened a pressure in the drying chamber is instantaneously reduced to the pressure of the pressure reducing chamber; and a heating means for heating the drying chamber. In operation, the vacuum pump reduces a pressure of the pressure reducing chamber to below atmospheric pressure, and the pressure regulating valve installed in a wall of the drying chamber opens thereby instantaneously reducing the pressure the drying chamber to the reduced pressure of the pressure reducing chamber.

Abstract: This invention relates to a vacuum processing apparatus having vacuum processing chambers the insides of which must be dry cleaned, and to a method of operating such an apparatus. When the vacuum processing chambers are dry-cleaned, dummy substrates are transferred into the vacuum processing chamber by substrates conveyor means from dummy substrate storage means which is disposed in the air atmosphere together with storage means for storing substrates to be processed, and the inside of the vacuum processing chamber is dry-cleaned by generating a plasma. The dummy substrate is returned to the dummy substrate storage means after dry cleaning is completed. Accordingly, any specific mechanism for only the cleaning purpose is not necessary and the construction of the apparatus can be made simple.

Abstract: A method of drying a lactulose solution comprises introducing the solution into a vacuum chamber at elevated temperature and at reduced pressure so that the solution forms a foam, drying the foam under reduced pressure, and milling or grinding or breaking the dried foam into powder.

Abstract: A cost effective and environmentally sound method for quickly removing liquid from surfaces of a substrate under manufacture without leaving behind substantial residue (e.g., silicon elements from the substrate, commonly known in the field as “water marks”). The process includes first providing a substrate (e.g., a semiconductor wafer, glass flat panel, or disc media), which has undergone one or more liquid-based processes (e.g., cleaning, scrubbing, rinsing, etc.). An upper surface and a lower surface of the substrate are then subjected to vacuum suction, thereby removing liquid thereon. An apparatus for removing liquid from surfaces of a substrate is also provided. The apparatus includes a plurality of vacuum application members configured for applying vacuum suction to surfaces of a substrate, thereby removing liquid therefrom.

Abstract: Disclosed is a method of preparing a negative electrode for a rechargeable lithium battery. The steps include vacuum-drying a negative electrode precursor, the negative electrode precursor comprising a negative active material and an aqueous binder. The steps may further include vacuum-drying a lithium cell battery that includes a vacuum-dried negative electrode.

Abstract: A wafer dryer system which is suitable for drying rinse water from substrates in the event of a system malfunction or failure during or after rinsing of the substrates. The wafer dryer system typically includes a pair of drying chambers, each of which is fitted with at least one nitrogen gas inlet, at least one IPA gas inlet and an exhaust opening. A wafer boat which holds multiple wet wafers from an interrupted rinsing process typically in a wet bench system is placed in one of the chambers, after which the chamber is filled with hot nitrogen gas and mixed IPA gas to dry the wafers in the wafer boat. Upon resumption of operation of the wet bench system from which the wafers were taken or upon availability of a second wet bench system, the dried wafers are removed from the chamber for continued rinsing, as necessary.

Abstract: The present invention relates to a process and a device for evaporating liquids, for example black liquor from cellulose cooking, which contain solid and dissolved substances which are to be concentrated, with liquid being heated to close to boiling temperature in a heat exchanger (1) of the falling-film type.

Abstract: A method for drying fibrous webs utilizing a limiting orifice medium with a plurality of pores. The web is disposed on a supporting fluid permeable carrier. The web is pressed between the supporting carrier and the limiting orifice medium. A vacuum greater than the breakthrough pressure of the pores of the medium is drawn through the pores and the web.

Abstract: A method for performing multiple cleaning and vacuum drying operations in enclosed vessels uses cleaning and vacuum drying apparatus, low-dissolved-air cleaning solution, and drain-to-vacuum process to produce vacuum in a cleaning vessel, so that influence of air pressure on the operations is minimized. The method utilizes physical features that boiling points of general liquids lower with reduced pressure, that liquid saturated vapor pressure reduces with lowered temperature, and that two vacuum vessels of different working temperatures would have a pressure differential between their saturated vapor pressures, and uses heat control units and heat egress units to regulate temperature and pressure in the vacuumized cleaning vessel, so that wet clean, dry clean, vacuum heat drying, and vacuum freeze drying can be performed on the same apparatus, and low-pressure gas used in the dry clean and cleaning solution and waste solution can be recovered to achieve environment protection and energy saving.

Abstract: A method for vacuum drying of a substrate which can eliminate not only the moisture adhered to the substrate surface but also the moisture impregnated inside of the films which form the devices in a shot time without deforming nor deteriorating the devices formed on the substrate in the drying. The method for vacuum drying of a substrate, concerning a method for drying a substrate by processing the substrate surface in a desired condition, cleaning the processed substrate with cleaning liquid, and drying the cleaned substrate, comprises the steps of heating the substrate surface to a predetermined temperature to vaporize the moisture of the surface as vapor and thereby detach the moisture from the substrate to outside, and vacuuming the detached vapor at a predetermined vacuum pressure to eliminate the moisture from the wafer.

Abstract: A supporting apparatus for supporting a substrate in drying a substrate surface of the substrate including a supporting rod having a hollow interior portion and a groove configured to support a substrate on the supporting rod, the groove communicating to the hollow interior portion, a porous material disposed in the hollow interior portion of the supporting rod such that the porous material contacts with the substrate being supported in the groove, and a vacuum device configured to provide suction in the hollow interior portion of the supporting rod.

Abstract: The gas components in thermoplastic norbornene resin pellets are suppressed below certain levels by drying the resin under vacuum or under the ordinary pressure and under vacuum. A substrate for magnetic recording media is manufactured by injection-molding the resin dried by the method according to the invention. The magnetic recording medium, employing the substrate manufactured according to the invention, includes at least a magnetic layer, a protection layer on the magnetic layer and a liquid lubricant layer on the protection layer. The magnetic recording medium is manufactured by forming these layers, one after another, on the substrate according to the invention.

Abstract: A wafer dryer system which is suitable for drying rinse water from substrates in the event of a system malfunction or failure during or after rinsing of the substrates. The wafer dryer system typically includes a pair of drying chambers, each of which is fitted with at least one nitrogen gas inlet, at least one IPA gas inlet and an exhaust opening. A wafer boat which holds multiple wet wafers from an interrupted rinsing process typically in a wet bench system is placed in one of the chambers, after which the chamber is filled with hot nitrogen gas and mixed IPA gas to dry the wafers in the wafer boat. Upon resumption of operation of the wet bench system from which the wafers were taken or upon availability of a second wet bench system, the dried wafers are removed from the chamber for continued rinsing, as necessary.

Abstract: An apparatus for drying semiconductor wafers includes a bath for receiving semiconductor wafers and for holding a fluid, a chamber for providing an area where vapor is flowable over the bath, a supply pipeline for supplying vapor to the chamber, a vapor discharging pipeline for expunging vapor in the chamber, a fluid discharging pipeline for draining fluid in the chamber therefrom, and a protector for maintaining a distance between the semiconductor wafers during a drying process.

Abstract: An instantaneous pressure reducing heating and drying apparatus for an object, such as a wafer, includes a pressure reducing chamber; a vacuum pump for reducing a pressure in the pressure reducing chamber to below atmospheric pressure; a drying chamber installed within the pressure reducing chamber for drying the object that is loaded in the drying chamber; a pressure regulating valve installed in a wall of the drying chamber, wherein when the pressure regulating valve is opened a pressure in the drying chamber is instantaneously reduced to the pressure of the pressure reducing chamber; and a heating means for heating the drying chamber. In operation, the vacuum pump reduces a pressure of the pressure reducing chamber to below atmospheric pressure, and the pressure regulating valve installed in a wall of the drying chamber opens thereby instantaneously reducing the pressure the drying chamber to the reduced pressure of the pressure reducing chamber.

Abstract: This invention relates to a method and apparatus for pick and place handling of electronic components that have been formed on a common substrate and then separated on a cutting chuck. A transferring means is provided formed with openings for receiving separated components. The opening is defined by walls of which at least one is movable so as to engage the components and hold them in a fixed configuration and orientation while they are moved by a sliding motion through a processing unit and onto a transfer platform for delivery to an output track.

Abstract: This invention relates to a vacuum processing apparatus having vacuum processing chambers the insides of which must be dry cleaned, and to a method of operating such an apparatus. When the vacuum processing chambers are dry-cleaned, dummy substrates are transferred into the vacuum processing chamber by substrates conveyor means from dummy substrate storage means which is disposed in the air atmosphere together with storage means for storing substrates to be processed, and the inside of the vacuum processing chamber is dry-cleaned by generating a plasma. The dummy substrate is returned to the dummy substrate storage means after dry cleaning is completed. Accordingly, any specific mechanism for only the cleaning purpose is not necessary and the construction of the apparatus can be made simple.

Abstract: Disclosed is a method of drying timbers loaded in a drying chamber, which comprises the steps of heating the drying chamber by a heating system up to a temperature of 80 to 100° C., subjecting the timbers to vacuum blowing by connecting the inside of the drying chamber with a vacuum chamber (receiver) evacuated by a rotary pump until the inside pressure of the drying chamber drops to 1 to 10 mmHg, disconnecting the inside of the drying chamber from the vacuum chamber, connecting the drying chamber with the atmosphere. When the inside of the drying chamber is connected with the vacuum chamber, the moisture content of the timbers is sharply reduced, so that their temperature sharply drops. Thereafter, when it is disconnected from the vacuum chamber, and connected with the atmosphere, the inside temperature of the drying chamber is again increased. Meanwhile, the heating system is worked during the whole process.

Abstract: By a simple apparatus construction and process, it is made possible to “clean precisely” a surface at the molecular/atomic level, and the purification degree of the surface processed minutely is made into 1012 molecules/cm2 or less. A steam-spraying nozzle is disposed such that a line slit nozzle is in a diameter direction, and mist-containing steam is sprayed onto the surface of a substrate. Thereby, particles in the steam-spraying surface (the particles were made to adhere by dipping the substrate in a solution containing polystyrene (particle diameter of 0.6 &mgr;m) or alumina (particle diameter of 0.3 &mgr;m to 0.5 &mgr;m) particles at 105 particles/ml.) are removed by about 90% to 95% after ten-seconds spraying, and by 99% or more, that is, to less than the detection limit of a wafer inspection device, after twenty-seconds spraying.

Abstract: A method for performing multiple cleaning and vacuum drying operations in enclosed vessels uses cleaning and vacuum drying apparatus, low-dissolved-air cleaning solution, and drain-to-vacuum process to produce vacuum in a cleaning vessel, so that influence of air pressure on the operations is minimized. The method utilizes physical features that boiling points of general liquids lower with reduced pressure, that liquid saturated vapor pressure reduces with lowered temperature, and that two vacuum vessels of different working temperatures would have a pressure differential between their saturated vapor pressures, and uses heat control units and heat egress units to regulate temperature and pressure in the vacuumized cleaning vessel, so that wet clean, dry clean, vacuum heat drying, and vacuum freeze drying can be performed on the same apparatus, and low-pressure gas used in the dry clean and cleaning solution and waste solution can be recovered to achieve environment protection and energy saving.

Abstract: A method for vacuum drying of a substrate which can eliminate not only the moisture adhered to the substrate surface but also the moisture impregnated inside of the films which form the devices in a shot time without deforming nor deteriorating the devices formed on the substrate in the drying. The method for vacuum drying of a substrate, concerning a method for drying a substrate by processing the substrate surface in a desired condition, cleaning the processed substrate with cleaning liquid, and drying the cleaned substrate, comprises the steps of heating the substrate surface to a predetermined temperature to vaporize the moisture of the surface as vapor and thereby detach the moisture from the substrate to outside, and vacuuming the detached vapor at a predetermined vacuum pressure to eliminate the moisture from the wafer.

Abstract: The method and apparatus for processing of animal excreta or manure for further use or environmentally friendly disposal introduces a new first stage and ancillary elements for improved processing of manure material. The improvement involves an initial process to rapidly sterilize the material to remove undesirable microorganisms prior to further processing. This new first stage processing results in a refined end product for further use or environmentally friendly disposal. Additionally, ancillary equipment for digesting the initial material input to extract methane gas for use as a fuel in the process is included. Further, a thermal oxidizer to treat extracted gasses created in the new first stage process is used to reduce pathogens, other pollutants and toxic gasses prior to passing the gas to the environment.

Abstract: An apparatus and method for reducing particles in reactors. The apparatus includes an enclosure with a wafer handling chamber connected by an isolation gate valve to a processing chamber. Pipes deliver purge gas into the wafer handling chamber to eliminate particles from the enclosure. A pilot operated back pressure regulator regulates the delivery and removal of the purge gas. The apparatus actuates the isolation gate valve in a controlled rate to reduce disturbances from the purge gas entering into the enclosure. A Bernoulli wand is provided for lifting and holding a single semiconductor wafer. A dome loaded regulator actuated by a pilot gas is used to control the ramp rates of gas to the Bernoulli wand. The ramping rates of the Bernoulli wand gas can be controlled by restrictions and check valves in the pilot gas line. The apparatus also utilizes ionizers in the purge gas lines entering the wafer handling chamber and load locks.

Abstract: Freeze-dried products of high quality produced from materials to be freeze-dried in a freeze-drying apparatus comprising a sealed vessel enclosing a processing chamber provided therein with a rotary cage receiving a gas-permeable container containing frozen pieces of the said material, prepared by freezing the said material with a refrigerant, and a heating device for heating the frozen material by radiant heat rays, wherein the freeze-dried product is produced by a process which can attain, even when dry ice is used as the refrigerant, efficient sublimating removal of large amount of carbon dioxide gas evolved from dry ice and of moisture included in the material, while preventing adhesion of the frozen pieces of the said material to each other and while permitting reduction of the sublimation duration, wherein the frozen material retained in the gas-permeable container placed in the rotary cage is heated uniformly by the heating device under vacuum condition while it is being maintained under rotational mov

Abstract: Freeze-dried products of high quality produced from materials to be freeze-dried in a freeze-drying apparatus comprising a sealed vessel enclosing a processing chamber provided therein with a rotary cage receiving a gas-permeable container containing one or more frozen products of the said material, prepared by freezing the said material with dry ice, and a heating device for heating the frozen product by radiant heat rays, wherein the freeze-dried product is produced by a process which can attain efficient sublimating removal of large amount of carbon dioxide gas evolved from dry ice and of moisture included in the material, while preventing adhesion of the frozen products to each other and while permitting reduction of the sublimation duration, wherein the frozen product retained in the gas-permeable container placed in the rotary cage is heated uniformly by the heating device under vacuum condition while holding it under rotational movement to thereby facilitate the sublimation of dry ice and of the frozen

Abstract: When atmosphere inside a wafer carrier is replaced by introducing a gas into the wafer carrier from a gas inlet provided to the wafer carrier that can accommodate wafers. At the same time, the atmosphere inside the wafer carrier is sucked to make an inside pressure negative relative to an outside pressure.

Abstract: Wood is disposed in a container having at least one flexible wall, and vacuum is applied to the container. The flexible wall presses against a surface of the wood. The container and wood are them immersed in a heated bath (e.g. comprising water, air, or other fluids). The wood is heated by conduction through the flexible wall, and maintained at accurate temperature by the bath. The wood is thereby rapidly dried by heat and vacuum. The present invention is energy efficient, and provides rapid, uniform drying of the wood without checking.

Abstract: This invention relates to a vacuum processing apparatus having vacuum processing chambers the insides of which must be dry cleaned, and to a method of operating such an apparatus. When the vacuum processing chambers are dry-cleaned, dummy substrates are transferred into the vacuum processing chamber by substrates conveyor means from dummy substrate storage means which is disposed in the air atmosphere together with storage means for storing substrates to be processed, and the inside of the vacuum processing chamber is dry-cleaned by generating a plasma. The dummy substrate is returned to the dummy substrate storage means after dry cleaning is completed. Accordingly, any specific mechanism for only the cleaning purpose is not necessary and the construction of the apparatus can be made simple.

Abstract: A low pressure-high hydrogen flow rate process of cleaning a silicon wafer surface is described. The combination of process pressures below about 1 Torr with hydrogen flow rates up to about 3 SLM has been found to remove substantially all oxygen contamination from the silicon wafer surface at process temperatures less than about 800° C. without the use of a reactive gas. After processing at such process pressures and flow rates, even lower levels of oxygen contamination may be achieved by then increasing the process pressure, the hydrogen flow rate, and the process temperature, though the process temperature still remains less than 800° C. The combination of low pressure and high hydrogen flow rate can be achieved using a vacuum pumping speed of at least 30 cubic meters per hour. The present invention also describes an apparatus for cleaning a silicon wafer surface in which the processes of the present invention and other processes can be practiced.

Abstract: A vacuum drying apparatus and a vacuum drying method are provided wherein it is possible to reduce the drying time of an object to be dried and the surface condition of the object to be dried after drying is extremely satisfactory. A vacuum pump is connected to an exhaust port of a vacuum chamber through a suction pipe, and a frequency converter is provided on the input side of an alternating current motor for driving the vacuum pump to form a vacuum drying apparatus. A substrate coated with coating liquid is placed in the vacuum chamber of the vacuum drying apparatus.

Abstract: The present invention relates to an ejector device for vacuum drying having at least first and second passages for connecting a first chamber with a second chamber, wherein the chambers are arranged substantially at right angles with respect to each other, and the ejector is adapted to vacuum dry the inside of the second chamber by means of high speed air flow toward the first chamber. The flow toward the first chamber preferably travels through the second passage from the first passage, on the side opposite the first chamber, to induce a negative pressure in the first passage. This way, the change in kinetic energy draws the stagnant air and steam existing in the second chamber into the inside of the first chamber.

Abstract: This invention relates to a vacuum processing apparatus having vacuum processing chambers the insides of which must be dry cleaned, and to a method of operating such an apparatus. When the vacuum processing chambers are dry-cleaned, dummy substrates are transferred into the vacuum processing chamber by substrates conveyor means from dummy substrate storage means which is disposed in the air atmosphere together with storage means for storing substrates to be processed, and the inside of the vacuum processing chamber is dry-cleaned by generating a plasma. The dummy substrate is returned to the dummy substrate storage means after dry cleaning is completed. Accordingly, any specific mechanism for only the cleaning purpose is not necessary and the construction of the apparatus can be made simple.

Abstract: A transportable skid for drying and testing generator stator windings includes a platform supporting a compressor adapted to supply compressed air to the stator winding; a dryer arranged to receive and dry compressed air from the compressor; a buffer tank arranged to receive a relatively small portion of compressed air from the compressor after passing through the dryer; and a receiving tank arranged to receive compressed air from the buffer tank and the compressor after passing through the dryer.

Abstract: This invention relates to a method and apparatus for pick and place handling of electronic components that have been formed on a common substrate and then separated on a cutting chuck. A transferring means is provided formed with openings for receiving separated components. The opening is defined by walls of which at least one is movable so as to engage the components and hold them in a fixed configuration and orientation while they are moved by a sliding motion through a processing unit and onto a transfer platform for delivery to an output track.

Abstract: A method is disclosed for speeding workpiece thoughput in low pressure, high temperature semiconductor processing reactor. The method includes loading a workpiece into a chamber at atmospheric pressure, bringing the chamber down to an intermediate pressure, and heating the wafer while under the intermediate pressure. The chamber is then pumped down to the operating pressure. The preferred embodiments involve single wafer plasma ashers, where a wafer is loaded onto lift pins at a position above a wafer chuck, the pressure is rapidly pumped down to about 40 Torr by rapidly opening and closing an isolation valve, and the wafer is simultaneously lowered to the heated chuck. Alternatively, the wafer can be pre-processed to remove an implanted photoresist crust at a first temperature and the chamber then backfilled to about 40 Torr for further heating to close to the chuck temperature. At 40 Torr, the heat transfer from the chuck to the wafer is relatively fast, but still slow enough to avoid thermal shock.

Abstract: This invention relates to a vacuum processing apparatus having vacuum processing chambers the insides of which must be dry cleaned, and to a method of operating such an apparatus. When the vacuum processing chambers are dry-cleaned, dummy substrates are transferred into the vacuum processing chamber by substrates conveyor means from dummy substrate storage means which is disposed in the air atmosphere together with storage means for storing substrates to be processed, and the inside of the vacuum processing chamber is dry-cleaned by generating a plasma. The dummy substrate is returned to the dummy substrate storage means after dry cleaning is completed. Accordingly, any specific mechanism for only the cleaning purpose is not necessary and the construction of the apparatus can be made simple.

Abstract: This invention relates to a vacuum processing apparatus having vacuum processing chambers the insides of which must be dry cleaned, and to a method of operating such an apparatus. When the vacuum processing chambers are dry-cleaned, dummy substrates are transferred into the vacuum processing chamber by substrates conveyor means from dummy substrate storage means which is disposed in the air atmosphere together with storage means for storing substrates to be processed, and the inside of the vacuum processing chamber is dry-cleaned by generating a plasma. The dummy substrate is returned to the dummy substrate storage means after dry cleaning is completed. Accordingly, any specific mechanism for only the cleaning purpose is not necessary and the construction of the apparatus can be made simple.

Abstract: This invention relates to a vacuum processing apparatus having vacuum processing chambers the insides of which must be dry cleaned, and to a method of operating such an apparatus. When the vacuum processing chambers are dirty-cleaned, dummy substrates are transferred into the vacuum processing chamber by substrates conveyor means from dummy substrate storage means which is disposed in the air atmosphere together with storage means for storing substrates to be processed, and the inside of the vacuum processing chamber is dry-cleaned by generating a plasma. The dummy substrate is returned to the dummy substrate storage means after dry cleaning is completed. Accordingly, any specific mechanism for only the cleaning purpose is not necessary and the construction of the apparatus can be made simple.

Abstract: This invention relates to a vacuum processing apparatus having vacuum processing chambers the insides of which must be dry cleaned, and to a method of operating such an apparatus. When the vacuum processing chamber are dry-cleaned, dummy substrates are transferred into the vacuum processing chamber by substrates conveyor means from dummy substrate storage means which is disposed in the air atmosphere together with storage means for storing substrates to be processed, and the inside of the vacuum processing chamber is dry-cleaned by generating a plasma. The dummy substrate is returned to the dummy substrate storage means after dry cleaning is completed. Accordingly, any specific mechanism for only the cleaning purpose is not necessary and the construction of the apparatus can be made simple.