Abstract: A thick film thermal head includes a substrate which is provided with a groove on a surface to extend in a main scanning direction and has an electrically conductive portion which faces the groove and extends substantially over the entire length of the groove. A resistance heater strip is embedded in the groove to be in contact with the electrically conductive portion substantially over its entire length. A plurality of discrete electrodes are formed on the surface of the substrate and are in contact with the resistance heater strip at predetermined intervals in the main scanning direction. The discrete electrodes are electrically insulated from the electrically conductive portion of the substrate except through the resistance heater strip, and the electrically conductive portion is connected to a power source to be applied with an electrical potential and forms a common electrode.

Abstract: A protection cover for a thermal printhead includes an elongated body and two bosses formed on the lower surface of the elongated body. These bosses are arranged to slant with each other when the cover is fixed to the thermal printhead. Thus, the protection cover, which is originally flat, is caused to warp so that its central portion is raised above its end portions.

Abstract: A method of making a thermal printhead including a primary substrate and an auxiliary substrate adjacent to the primary substrate. The method comprises the following steps. First, at least one positioning cutout is formed in either one or both of the primary and auxiliary substrates. The positioning cutout is formed at an edge of the selected substrate. Then, the primary and auxiliary substrates are positioned to each other by using a position-adjusting device provided with an upright pin fitted into the positioning cutout. Then, the electrical connection is established between the first and the second substrates via clip pins.

Abstract: The object is to provide a thermal print head that can absorb an expansion due to difference of thermal expansion coefficients of a ceramic substrate and a glass-epoxy based printed circuit board to enable to obtain excellent printing quality, to be high in reliability, and to be capable of downsizing.

Abstract: A thermal printhead 1 according to the present invention includes a multiplicity of heating elements 4a formed in a row on an obverse surface of an elongated substrate 2 at a portion which is offset widthwise toward one longitudinal side of the substrate, and a protective film 8 formed on the obverse surface of the substrate 2 at the widthwise offset portion for covering the heating elements 4a. The protective film 8 is formed to extend on the obverse surface of the substrate 2 continuously from the widthwise offset portion onto one longitudinal side surface 2a of the substrate. A longitudinal edge 8b of the protective film 8 directed toward the other longitudinal side of the substrate 2 is tapered.

Abstract: A thermal printhead according to the present invention includes a substrate, a plurality of heating elements formed on the substrate, at least one drive IC for driving the heating elements, and a sealing portion for sealing the drive IC. The sealing portion contains a resin material and a granular filler having an average grain size not greater than 10 &mgr;m.

Abstract: A thermal head includes a heat radiating plate and an electrical insulating substrate which is provided with a plurality of resistance heater elements arranged in a direction over a predetermined length and a plurality of electrodes for energizing the resistance heater and is integrated with the heat radiating plate. The substrate is smaller than the heat radiating plate in coefficient of thermal expansion and is fixed to the heat radiating plate at a temperature higher than the normal working temperature range of the thermal head. In the normal working temperature range of the thermal head, the thermal head is convex toward the resistance heater in a cross-section taken along a line parallel to the direction in which the resistance heater elements are arranged due to the difference in coefficient of thermal expansion between the heat radiating plate and the substrate.

Abstract: A protective cover (9) is provided which is used for a thermal printhead including a heat sink plate (1) formed with a plurality of fixing holes (10), a head substrate (2), and a circuit board (3). The heat sink plate (1) is formed with a groove (1a) which divides the upper surface of the heat sink plate (1) into a first region (1b) and a second region (1c). The head substrate (2) is provided with a heating resistor (4) and drive ICs (5). The drive ICs (5) are covered with a coating resin layer (6). The circuit board (3) is formed with through-holes (11). The protective cover (9) includes a main body (9a) having an obverse surface and a reverse surface, and a plurality of pins (12) extending from the reverse surface. Each of the pins (12) is formed with a slit (12a), which facilitates press-fitting of the pin (12) into a respective one of the fixing holes (10).

Abstract: The object of the invention is to enhance precision in bonding the heating board and the radiating plate of a thermal print head, in the thermal print head A composed by attaching the heating board 2 on the surface of which a heating resistor for printing 4 is formed on the upper surface of the radiating plate 1, an identification mark M that functions as a positioning reference when the heating board 2 is attached on the radiating plate 1 is provided on the heating board 2 at a fixed interval from the heating resistor 4 and in addition, the identification mark M has a vertical side M1 equivalent to a positioning reference line D perpendicular to a direction in which the heating resistor of the heating board 2 is arranged (the direction of the x-axis).

Abstract: A thick film type thermal head for thermally perforating a stencil material in an imagewise pattern to make a stencil is moved along the stencil material in a sub-scanning direction while energizing a plurality of heater elements arranged in an array extending in a main scanning direction. The thermal head includes an electric heater strip extending in the main scanning direction direction, and a plurality of first and second electrodes which are alternately disposed spaced from each other in the main scanning direction and extend across the heater strip in contact with the electrodes. The parts of the heater strip between adjacent first and second electrodes form the heater elements. An electrical insulating layer is disposed between the first and second electrodes and the heater strip at least on one side of the heater strip so that the width of the electrical contact area between the first and second electrodes and the heater strip becomes smaller than the width of the heater strip.

Abstract: A thermal head, used for an image forming device, comprises a glaze formed at at least a portion of a base plate of the thermal head so that at least a portion of the glaze is protruded, and a plurality of heater portions provided at the glaze, a length of each of the heater portions in a image forming direction of a recording material being less than or equal to 100 .mu.m, wherein an outer surface of each of the heater portions is a convex curved surface and is the outermost portion of the glaze.

Abstract: A thermal head comprises an insulative substrate, heat-generating resistor elements mounted on the insulative substrate, a driver IC mounted on the insulative substrate for driving the heat-generating resistor elements, a heat radiating member connected to the insulative substrate for radiating heat generated by the heat-generating resistor elements, and a flexible circuit board for supplying power to the driver IC. The flexible circuit board has conductor layers interposed between insulating layers, a first portion connected to the heat radiating member, and a second bent portion having one of the conductor layers electrically connected to the insulative substrate.

Abstract: A thermal transfer printing device includes a thermal printing head of the corner-edge type having heating elements disposed on one edge and forming a printing bar. The edge faces a backing roller, is parallel to the axis thereof, and around which an ink ribbon is led directly away from a letter or envelope to be printed. A shell which is provided on the underside of the thermal printing head faces the backing roller. The shell extends immediately up to the printing bar and has a bottom surface with a region adjacent the printing bar at approximately the same height as the printing bar. The thermal printing head including the shell and the backing roller, are adjustable relative to one another. Good ink particle detachment and a relatively low contact force are provided. Disadvantages with regard to soft and sensitive mail can be avoided and the service life of the thermal printing head is prolonged due to a lower contact force.

Abstract: A head device (10), in particular a thermal printhead, is provided which includes an insulating substrate (11) having a first longitudinal edge (11a) and a second longitudinal edge (11b) opposite to the first longitudinal edge (11a), an operating element (12) arranged on the substrate adjacent to the first longitudinal edge (11a), an array of plural drive ICs (13) arranged on the substrate (11) along the second longitudinal edge (11b) for actuating the operating element (12), and a protective resin coating (17) for enclosing the drive ICs (13). The protective coating (17) includes a terminal protrusion (17a) which is made at the time of forming the protective coating (17) by resin application. The terminal protrusion (17a) is located between two adjacent drive ICs (13) and projects toward the second edge (11b) of the substrate (11).

Abstract: A thermal head comprises a number of heating elements arranged on an electrically insulating substrate as a straight line and a plurality of driver ICs which are electrically connected to the heating elements so as to control generation of heat at the respective heating elements, wherein electric resistance values of the respective heating elements are within a range of .+-.1.8% with respect to a reference value, and the electric resistance values of the respective heating elements are distributed in the form of a meandering shape. A maximum value of the distribution of the electric resistance values of the heating elements is set at +0.5% to +1.8% with respect to the reference value and a minimum value of the distribution is set at -0.5% to -1.8% with respect to the reference value. In this manner, it is possible to eliminate inconsistencies in density of the plurality of heating elements connected to the driver ICs and print an image of excellent quality.

Abstract: A thermal printhead is provided which includes a head substrate (11) made of an insulating material, a heating element (12) arranged along an edge of the substrate, drive ICs (13) for driving the heating element, a temperature sensor (18) mounted on the head substrate for temperature monitoring of the heating element, and a heat sink (20) attached to the head substrate. The heat sink has a first surface for attachment to the head substrate and a second surface corresponding in location to the temperature sensor. The second surface faces the head substrate but is spaced therefrom to define a heat-transfer adjusting region (22). The head substrate and the heat sink are attached together by an adhesive member having a desired heat conductivity.

Abstract: An assembly comprising a plurality of thermal heads (10), each thermal head comprising a linear array of resistor elements mounted on a flat substrate (17), and a drum (15) of diameter D mm for supporting a thermographic recording material, said thermal heads being mounted in a staggered fashion in at least two parallel rows (11,12) in which the linear arrays of resistor elements are parallel to one another, characterized in that:i) said resistor arrays of adjacent rows of thermal heads are separated by a spacing, d, greater than 0.2 mm; andii) said substrates of thermal heads in adjacent rows (17', 17") include an angle .THETA. comprised between arc sine (d/2D) and arc sine (2d/D);and a direct thermal printing process therewith.

Abstract: The printing cost is minimized by reducing the number of parts of a thermal print head used for printers, for such as a facsimile, and the quality of a printed product is improved by preventing the warpage of the thermal print head. A base plate mounting surface of a heat radiation plate (2) is provided with a longitudinally extending mounting surface dividing groove (5). A head base plate (3) having a heating resister (6) for printing and a circuit board (4) having a connector (10) for external connection are fixed on the base plate mounting surface. The two plates (3, 4) are arranged so as to be opposed to each other with the mounting surface dividing groove positioned therebetween. Terminal electrodes (8, 11) provided on groove-side edge portions of the head base plate and circuit board are connected together by a terminal lead (9).

Abstract: A thin-film type thermal print head has a resistor layer formed over an insulative substrate, a conductor layer having a specified planar pattern overlapping the resistor layer, a portion of the resistor layer serving as a heat-emitting part which is not covered by the conductor layer, and a protective layer formed over the heat-emitting part and at least a portion of the conductor layer adjacent to the heat-emitting part. The protective layer may be formed as a conductive layer with resistance greater than that of the heat-emitting part such that static electricity which may be generated by the friction with printing paper can quickly escape to the conductor layer. The protective layer may also include a wear-resisting layer of a prior art type between the conductive layer and the conductor layer, a portion of the conductive layer being preferably connected to the conductor layer. The conductive layer is preferably a mixed layer of SiC and ZrB.sub.2 containing ZrB.sub.

Abstract: A thermal printhead (10) includes an insulating head substrate (11) having a first edge (11a) and a second edge (11b) opposite to the first edge, a heating resistor (12) formed on the head substrate (11) along the first edge (11a), at least one drive IC (13) mounted on the head substrate (11) along the second edge (11b), and a protection cover (20) mounted for covering the drive IC (13). The protection cover (20) includes a cover member (22) for covering the drive IC (13) and a fixation member (21) formed integrally with the cover member (22). The fixation member (21) has a positioning wall (23) coming into direct contact with the second edge (11b) of the head substrate (11). The fixation member is designed to attach the protection cover (20) to the head substrate (11) without utilizing separate fixing means.

Abstract: A thermal print head which includes an array of individually addressable resistors on a substrate is provided to substantially reduce undesirable drift in the resistance values of the resistors. The thermal print head includes a thermally stable glaze having a smooth surface formed on the substrate, and an electrically resistive doped-semiconductive layer formed on the smooth glaze surface. An array of first and second electrode pairs is formed on the resistive layer such that each of the electrodes forms a gap therebetween. A protective layer is formed over the electrode pairs and over the resistive layer at the gap. An electrically conductive layer is formed on the protective layer. The thermal print head includes a structure for applying first and second potentials respectively to the first and second electrodes of each of the pairs for selectably heating each of the resistors, and applying a third potential to the conductive layer.

Abstract: A thermal printhead assembly includes a metallic heat sink plate, a head circuit board mounted on an obverse surface of the heat sink plate, and a control circuit board electrically connected to the head circuit board for feeding control signals and power supply to the head circuit board. The head circuit board is formed with a heating resistor. A reverse surface of the heat sink plate is mounted on the control circuit board so that the heat sink plate is sandwiched between the head circuit board and the control circuit board.

Abstract: A thermal printhead according to the present invention includes a stepped heat sink plate (1) having an upper first supporting surface (1a) and a lower second supporting surface (1b), a head substrate (2) mounted on the first supporting surface (1a) of the heat sink plate (1) and formed with printing dots (3), and a printed circuit board (14) mounted on the second supporting surface (1b) of the heat sink plate (1) and formed with various wiring patterns. The head substrate (2) has an edge projecting from the first supporting surface (1a) of the heat sink plate (1) toward the second supporting surface (1b). The printed circuit board (14) overlaps the projecting edge of the head substrate (2) with a predetermined spacing (18) therebetween.

Abstract: A thermal print head includes an auxiliary print head guard disposed in close relationship to the primary print head guard so as to protect from damage by a foreign object the material encapsulating the electrical components and connectors contained on an integrated circuit board.

Abstract: A thermal print head, including a resistance substrate having a front and rear surface, a plurality of heating elements formed on the front surface of the resistance substrate for converting electrical energy into heat energy, a cooling board for dissipating heat generated from the heating elements and the resistance substrate, wherein the cooling board is divided into separable first and second parts, the first part being disposed opposite the rear surface of the resistance substrate and below the heating elements; and a cooling compound with high thermal conductivity inserted between the first part of the cooling board and the rear surface of the resistance substrate.

Abstract: A thermal print head and method of creating the same, in which a metal film and a cooling compound are inserted between a resistance substrate and a cooling board. This construction can prevent the formation of air bubbles in the cooling compound between the resistance substrate and the cooling compound. This construction can also reduce local heat accumulation and thereby reduce uneven priming contrast since even if an air bubble is formed it will have a thickness less than the thickness of a double-sided tape that acts as an adhesive between the resistance substrate and the cooling board. In addition, a clearer image can be obtained even in the hi-speed priming because the metal film having a thermal conductivity higher than that of the cooling compound is inserted inside the cooling compound. This increases the overall thermal conductivity between the resistance substrate and the cooling board and thus improves heat dissipation within the system.

Abstract: In a connector used in a print head, each of a plurality of terminal pins has at one end portion thereof an integral grip portion for gripping a circuit board. The terminal pins are spaced a predetermined distance from one anther in juxtaposed relation to one another, with the grip portions disposed at the same side. Each of the terminal pins is inserted into a connector housing from the other end portion of the terminal pin, so that the terminal pins are attached to the connector housing.

Abstract: A heat sensitive stencil is brought into contact with a thermal head having a plurality of heating resistors arranged in a row, is moved in a sub-scanning direction orthogonal to a direction in which the heating resistors are arranged, and is perforated in the dot matrix shape with selectively heated heating resistors. The heat sensitive stencil is made substantially only of a thermoplastic resin film. A width of a non-perforated portion of the heat sensitive stencil between two adjacent perforations is 20% or more of a pitch between two adjacent heating resistors in the main scanning direction.

Abstract: An integrated input-output device for a data communication terminal equipment including a plurality of photoelectric converting circuits respectively arranged in n aligned blocks each including m aligned photoelectric converting elements, a plurality of first switching circuits respectively arranged in n aligned blocks each including m aligned thin film transistors respectively connected to the photoelectric converting elements of each corresponding one of the photoelectric converting circuits, a plurality of recording circuits respectively arranged in n aligned blocks each including m aligned recording elements, a plurality of second switching circuits respectively arranged in n aligned blocks each including m aligned thin film transistors respectively connected to the recording elements of each corresponding one of the recording circuits, n gate address lines respectively connected in common to gate electrodes of all thin film transistors of the same block-numbered first and second switching circuits, and m

Abstract: A method of and apparatus for sequentially printing lines of image pixels in the thermal printing of a two-dimensional image on a wide receiver media employing a print head arrangement of the type comprising a plurality N of linear thermal print head segments each comprising a set n of thermal print elements, each element having a data bit input terminal, in an alternating, staggered pattern in first and second rows of N.sub.1 and N.sub.2 print head segments arranged across the media in a print line direction such that respective sub-sets of n.sub.1 thermal print elements of the adjacent ends of the N.sub.1 and N.sub.2 print head segments arranged in the first and second rows overlap in the print line direction.

Abstract: A circuit terminal of a thermal head substrate is connected to a flexible printed circuit by an electroconductive adhesive or a solder metal. An overcoating composed of an insulating or extra-low electroconductive material is applied to cover a region containing a connected portion between the circuit terminal and the flexible printed circuit and to cover an exposed portion of the circuit terminal to thereby prevent corrosion of the circuit terminal, improve the mechanical strength of the flexible printed circuit connection, and prevent a short-circuit.

Abstract: A thin-film thermal recording head, used in a facsimile machine or a thermal printer, including heat resistors formed from only a Cr--Si--SiO or Ta--Si--SiO alloy thin-film resistor layer and a chromium, molybdenum, nickel, or tungsten thin-film conductor layer. The heat resistor is formed on a substrate having a linear thermal expansion coefficient from room temperature to 300.degree. C. of 5.times.10.sup.-8 /.degree.C. or less. The heat resistor is also described having a thin anti- abrasion layer with thickness of 0.5 .mu.m or less. The thin-film thermal recording head is also described in monolithic form with a portion of the heat resistor formed to directly contact an output electrode of a drive LSI circuit. In this case, a double-layer thermal-insulation layer can be formed between the substrate and the portion of the heat resistor that contacts and heats heat-sensitive recording paper. The two layers of the thermal-insulation layer are formed from a heat-resistant resin and an inorganic insulator.

Abstract: A thermal head is suitable for use in electronic equipments such as printers and the like and comprises a partially or entirely trapezoidal partial-glaze layer formed on the top of an insulation substrate at one edge, a resistive film layer formed on the partial-glaze layer a pattern of common and discrete electrodes formed on the resistive film layer on the opposite sides of the partial-glaze layer except the area thereof that corresponds to the top of the partial-glaze layer, and a protective film layer formed to cover the resistive film layer and electrodes. In such a manner, a heating section is provided on the top of the trapezoidal partial-glaze layer. The heating section extends further upwards from the surrounding area. Unnecessary dispersion of pressure to the surrounding area other than the heating section can be avoided to improve the printing efficiency and speed.

Abstract: A thermal printing system includes a heating element with an insulation under-layer of optimal thickness. A method for determining the optimal thickness of such insulation under-layer using equations for the transient temperature distribution at the dye donor/image receiver interface is described. These equations account for the printing system parameters which have the most significant impact on the image formation process.

Abstract: The present invention relates to a method of resistive sheet transfer recording using a recording member and an electrode head comprising oppositely aligned electrode pair trains embedded in the insulating support member and also relates to an electrode head use therefor, wherein abrasive wear of the electrode pair by sliding contact of the recording member is optimized in a manner that the resistive sheet usually contacts to a fresh surface of the electrode pair train.The present invention makes it possible to give a high quality image with high recording speed and high sensitivity.