Abstract: A method of manufacturing a component carrier includes providing a laminated stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, at least partially covering a component with a transition layer having a thickness in a range from 0.5 nm to 1 ?m, and assembling the component with the stack.

Abstract: A test wafer according to an embodiment of the present disclosure is a test wafer used for simulation of heat emission of devices on a wafer, and includes a silicon wafer and a silicon heater bonded to a surface of the silicon wafer.

Abstract: An ejection head. The ejection head includes first fluid ejectors and second fluid ejectors deposited on a semiconductor substrate. A first flow feature layer is attached to the semiconductor substrate to provide a first fluid supply channels and a first fluid chambers and a first portion of second fluid channel and second fluid chambers therein. A second flow feature layer is attached to the first flow feature layer to provide a first portion of first nozzle holes and a second portion of second fluid supply channels and second fluid chambers therein. A first nozzle plate layer is attached to the second flow feature layer to provide a second portion of the first nozzle holes and a first portion of second nozzle holes therein. A second nozzle plate layer is attached to the first nozzle plate layer to provide a second portion of the second nozzle holes therein.

Abstract: A fluidic die may include a fluid channel layer defining a number of fluid channels therein, a slot layer disposed on a side of the fluid channel layer, and a first fluid slot and a second fluid slot defined in the slot layer. At least one of the fluid channels fluidically couples the first fluid slot to the second fluid slot. The first fluid slot and the second fluid slot are defined in the slot layer along a length of the fluidic die.

Abstract: Examples include a fluid ejection device. The fluid ejection device includes at least one fluid ejection die coupled to a support structure and having a die length and a die width. The at least one fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The at least one fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The at least one fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes at least one fluid feed hole fluidically coupled to each respective ejection chamber.

Abstract: Fin-based thin film resistors, and methods of fabricating fin-based thin film resistors, are described. In an example, an integrated circuit structure includes a fin protruding through a trench isolation region above a substrate. The fin includes a semiconductor material and has a top surface, a first end, a second end, and a pair of sidewalls between the first end and the second end. An isolation layer is conformal with the top surface, the first end, the second end, and the pair of sidewalls of the fin. A resistor layer is conformal with the isolation layer conformal with the top surface, the first end, the second end, and the pair of sidewalls of the fin. A first anode cathode electrode is electrically connected to the resistor layer. A second anode or cathode electrode is electrically connected to the resistor layer.

Abstract: Provided is an element substrate with suppressed variations in resistance though having a high resistance. In an element substrate equipped with a heat generating resistor that generates thermal energy for ejecting a liquid, the heat generating resistor is a stacked structure having stacked a plurality of resistor layers including a first resistor layer and a second resistor layer containing a metal silicon nitride and the first resistor layer and the second resistor layer are different from each other in at least one of a silicon content in the metal silicon oxide and a metal element contained in the metal silicon nitride.

Abstract: A piezoelectric device and method of manufacturing the same and an inkjet head are described. In one embodiment, the inkjet print head comprises a plurality of jets, wherein each of the plurality of jets comprises a nozzle, a pressure chamber connected with the nozzle, a piezoelectric body coupled to the pressure chamber, and an electrode coupled to the piezoelectric body to cause displacement of the piezoelectric body to apply pressure to the pressure chamber in response to a voltage applied to the electrode; and wherein electrodes of two or more of the plurality of jets have different sizes to cause their associated piezoelectric bodies to have a uniform displacement amount when the voltage is applied to the electrodes.

Abstract: Systems and methods provide for the improvement of surface properties via deposition of a film. A typical film may comprise at least three, including at least four components, and typically includes at least one of, including both of, Nitrogen and Oxygen. A film may include at least one of Silicon, Phosphorous, and Boron, and one or more modifiers. For some films, a modifier may include an element having a cationic field strength greater than 10 ?{circumflex over (?)}?2. A film may have a high hardness and/or modulus. A film, may be substantially transparent to visible light. Some films have high refractive indices. Some films have low refractive indices. Some films have very low ultraviolet extinction coefficients.

Abstract: A fluid ejection device includes a fluid ejection chamber, a drop ejecting element communicated with the fluid ejection chamber, an orifice communicated with the fluid ejection chamber, a fluid passage between the fluid ejection chamber and the orifice, and a structure in the fluid passage between the fluid ejection chamber and the orifice.

Abstract: A piezoelectric device and method of manufacturing the same and an inkjet head are described. In one embodiment, the inkjet print head comprises a plurality of jets, wherein each of the plurality of jets comprises a nozzle, a pressure chamber connected with the nozzle, a piezoelectric body coupled to the pressure chamber, and an electrode coupled to the piezoelectric body to cause displacement of the piezoelectric body to apply pressure to the pressure chamber in response to a voltage applied to the electrode; and wherein electrodes of two or more of the plurality of jets have different sizes to cause their associated piezoelectric bodies to have a uniform displacement amount when the voltage is applied to the electrodes.

Abstract: An ejector device that includes one or more ejectors comprises an ejector layer that spans at least one hollow area. The ejector layer has a first surface and an opposing second surface arranged to receive a viscous material with viscosity between 20 and 50,000 centipoise. The ejector layer includes a radiation absorber material configured to thermally expand without phase transition in response to heating by activation radiation transmitted to the first surface. Thermal expansion of the ejector layer causes displacement of the ejector layer and ejection of the material from the second surface of the ejector layer.

Abstract: An electrode material for an electrochemical cell, such as a lithium ion battery or a lithium sulfur battery, is provided. The electrode may be a negative anode. The electrode material comprises a composite comprising a porous matrix comprising a carbonized material. The electrode material further comprises a plurality of silicon particles homogeneously dispersed in the porous matrix of carbonized material. Each silicon particle of the plurality has an average particle diameter of greater than or equal to about 5 nanometers and less than or equal to about 20 micrometers.

Abstract: A metal nitride material for a thermistor consists of a metal nitride represented by the general formula: Mx(Al1-vSiv)y(N1-wOw)z (where “M” represents at least one of Ti, V, Cr, Mn, Fe, and Co, 0.0<v<0.3, 0.70?y/(x+y)?0.98, 0.45?z?0.55, 0<w?0.35, and x+y+z=1), wherein the crystal structure thereof is a hexagonal wurtzite-type single phase. A method for producing the metal nitride material for a thermistor includes a deposition step of performing film deposition by reactive sputtering in a nitrogen and oxygen-containing atmosphere using an M-Al—Si alloy sputtering target (where “M” represents at least one of Ti, V, Cr, Mn, Fe, and Co).

Abstract: A cooling pedestal for supporting a substrate, comprises a support structure having cooling conduits to flow a fluid therethrough to cool the substrate, and a contact surface comprising a coating of a diamond-like carbon. The coating comprises (i) a coefficient of friction of less than about 0.3, (ii) an average surface roughness of less than about 0.4 micrometers, and (iii) a microhardness of at least about 8 GPa.

Abstract: A liquid ejection head substrate includes a heating resistor array including a plurality of heating resistors and a protective film covering at least one of the heating resistors. The liquid ejection head substrate further includes a supply opening array and an electrode. The supply opening array is disposed on a side of a surface of the liquid ejection head substrate on which the protective film is provided. The supply opening array includes a plurality of supply openings through which a liquid is supplied arranged in a direction along the heating resistor array. The electrode is disposed on the side of the surface in a space between the supply openings adjacent to each other in a direction along the supply opening array. The electrode is configured such that a voltage is applied between the electrode and the protective film.

Abstract: A liquid ejection head comprises a semiconductor substrate having an energy generating element arranged thereon to generate energy to be utilized to eject liquid and a laminate including a plurality of insulating layers laid sequentially in the depth direction of the semiconductor substrate. Wiring is formed in the laminate and electrically connected to the energy generating element. The wiring includes a via formed in the insulating layers in the thickness direction of the insulating layers. The energy generating element is arranged between the semiconductor substrate and the laminate in the laminating direction of the insulating layers.

Abstract: Systems for determining a size, extent, and orientation of a hydraulic fracture of a reservoir, are provided. An exemplary system can include a plurality of RFID transponders modified to include an acoustic transmitter, and an RFID reader modified to include both an RF transmitter and a pair of acoustic receivers, to be deployed in a wellbore adjacent a hydraulic fracture. In embodiments, the acoustic transmitter includes a thermo-acoustic device. The system includes program product configured to receive acoustic return signal data to determine the three-dimensional location of each RFID transponder within the reservoir, to map the location of each RFID transponder, and to responsively determine the size, extent, and orientation can be determined.

Abstract: An exposure portion which exposes a protection plate is formed on a back face of a nozzle plate at a part of a position other than an actuator joining face of the nozzle plate.

Abstract: A semiconductor device and method of forming the same is described. In an example, a polysilicon layer is deposited on a substrate having at least one polysilicon ring. The substrate is doped using the polysilicon layer as a mask to form doped regions in the substrate. A dielectric layer is deposited over the polysilicon layer and the substrate. The dielectric layer is etched to expose portions of the polysilicon layer. A metal layer is deposited on the dielectric layer. The metal layer, the dielectric layer, and the exposed portions of the polysilicon layer are etched such that at least a portion of each polysilicon ring is removed.

Abstract: The present disclosure is directed to a microfluidic die that includes a first larger heater and a second smaller heater is a single chamber. The first heater is configured to form a primary bubble that ejects fluid from a nozzle associated with the chamber. The second heater is configured to form a secondary bubble to prevent blow back caused when the primary bubble bursts and ejects fluid from the nozzle. The first and second heater may be coupled to a single input trace and a single ground trace.

Abstract: A method of protecting a magnetic information storage medium is described. The method includes fabricating a film over a surface of the magnetic information storage medium. The film includes an amorphous, uniform, homogeneous solid solution of carbon, hydrogen, silicon, and oxygen. A magnetic storage medium with such a protective film is described.

Abstract: The present disclosure is drawn to a thermal inkjet printhead stack with an amorphous metal resistor, including an insulated substrate and a resistor applied to the insulated substrate. The resistor can include from 5 atomic % to 90 atomic % of a metalloid of carbon, silicon, or boron; and from 5 atomic % to 90 atomic % each of a first and second metal of titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, or platinum, where the second metal is different than the first metal. The metalloid, the first metal, and the second metal can account for at least 70 atomic % of the amorphous thin metal film.

Abstract: An electromechanical transducer element includes a substrate; a common electrode disposed on the substrate; an electromechanical transducer film formed on the common electrode; an individual electrode formed on the electromechanical transducer film; a common electrode pad electrically connected to the common electrode; an individual electrode pad electrically connected to the individual electrode; and an insulation protective film formed on the common electrode and the individual electrode, contacting an upper end of the individual electrode pad, and surrounding a side surface of the individual electrode pad. The insulation protective film has a gradually decreasing thickness outward from an end of the individual electrode pad.

Abstract: The invention provides a liquid ejection head including a member in which an ejection orifice for ejecting a liquid is formed, and a substrate to which the member is joined. The substrate has a heat storage layer containing a silicon compound and an energy-generating element provided at a position corresponding to the ejection orifice for generating heat by electrification to eject the liquid from the ejection orifice. The energy-generating element has a laminate having a metal layer formed of tantalum or tungsten, an Si layer laminated on the metal layer and formed of silicon and an N layer laminated on the Si layer and formed of nitrogen, and the metal layer is in contact with the heat storage layer.

Abstract: A liquid discharge head substrate includes a base; a pair of wiring lines; a heat-generating resistive layer, which is in contact with the wiring lines, and which has a portion corresponding to a space between the wiring lines, the portion forming an electrothermal transducer; an insulating layer which covers the heat-generating resistive layer and the wiring lines and which contains Si; a protective layer which covers at least one region of the insulating layer which contains Ir; and an intermediate layer which is placed between the insulating layer and the protective layer. The intermediate layer contains a material represented by the formula TaxSiyNz, where x is 5 atomic percent to 80 atomic percent, y is 3 atomic percent to 60 atomic percent, z is 10 atomic percent to 60 atomic percent.

Abstract: An inkjet nozzle device for symmetrically constrained bubble formation includes: a firing chamber having and an end wall, opposite sidewalls and a nozzle aperture defined in a roof thereof; a baffle plate positioned between the sidewalls of the firing chamber, such that a pair of firing chamber entrances are defined between side edges of the baffle plate and the sidewalls; and an elongate heating element bonded to a floor of the firing chamber, the heater element extending longitudinally between the baffle plate and the end wall. The baffle plate is wider than the heater element. Further, a centroid of the heater element coincides with a midpoint between the baffle plate and the end wall.

Abstract: An ink jet printhead including a thermo-pneumatic actuator array for ejecting ink from an array of nozzles. The actuator array may include a plurality of channels in fluid communication with a plurality of working fluid chambers. After completing formation of the actuator array, working fluid may be injected into a working fluid inlet on an exterior of the actuator array and into the plurality of working fluid chambers through the plurality of channels.

Abstract: An inkjet printhead that has a supporting substrate, a conductive layer deposited in a pattern on one side of the supporting substrate, an insulating layer deposited such that the conductive layer is between the insulating layer and the supporting substrate, an ink chamber supported on the supporting substrate such that the conductive layer is between the ink chambers and the supporting substrate, a nozzle in fluid communication with the ink chamber, a heater on the insulating layer configured to vaporize some ink in the ink chamber such that a droplet of ink is ejected through the nozzle, the heater having a resistive element extending between a pair of contacts and, at least one metallic via in each of the contacts respectively, the metallic vias extending through the insulating layer to establish and electrical connection between the conductive layer and the contacts. The insulating layer has a planar surface on which the heater is supported.

Abstract: A liquid ejection head that the adverse effect of a heating resistor element due to cavitation is reduced and a printing apparatus employing this liquid ejection head are provided. When a length of a heating resistor element in a direction in which ink is to be supplied is defined by L, the center of an ejection port is shifted, at a distance of equal to or longer than L/7 toward a location of an ink supply port, from the center of the heating resistor element, viewed in a direction in which ink is to be ejected. When a length of the ejection portion in the direction in which ink is to be ejected is defined as l and a length of a bubble generation chamber in the direction in which the liquid is to be ejected is defined as h, l/h is equal to or smaller than 2.

Abstract: An ink jet printhead device includes a substrate and a plurality of thermal resistors on the substrate. Each thermal resistor includes first and second electrodes and a resistive layer extending therebetween. A polarity-changing driver is coupled to the plurality of thermal resistors and configured to change a driving polarity between the first and second electrodes of each of the plurality of thermal resistors.

Abstract: A heating element of a fluid ejection device, the heating element including a ring-type body, an inner edge of the body, and an outer edge of the body, wherein at least one of the inner edge and the outer edge defines an undulated surface contour.

Abstract: A liquid ejection head including: includes an ejection orifice for ejecting liquid, a pressure chamber communicating with the ejection orifice, a flow path for supplying the liquid to the pressure chamber, and a first heat-generating element and a second heat-generating element for generating energy to be used for ejecting the liquid. The first heat-generating element is arranged in the pressure chamber before the second heat-generating element with respect to a supply direction of the liquid from the flow path to the pressure chamber. A portion between the first heat-generating element and the second heat-generating element is located within a projection of an opening of the ejection orifice, when viewed from a direction in which the liquid is ejected from the ejection orifice.

Abstract: The power supply includes a transformer for generating a first output voltage by a first secondary winding, and a superimposing voltage by a second secondary winding, and a driver. Furthermore, the circuit includes first and second rectifying and smoothing circuits for respectively rectifying and smoothing the first output voltage and superimposing voltage, and an adder for adding the rectified and smoothed superimposing voltage on the rectified and smoothed first output voltage to output a second output voltage. The first and second output voltages are fed back respectively by DC coupling, the fed-back first and second output voltages are respectively adjusted by first and second feedback factors, and the adjusted feedback components are combined and amplified to be applied to the driver for PWM-control.

Abstract: There are provided a substrate for an inkjet head, an inkjet head, and an inkjet printing apparatus wherein in a case where current is carried through a protection layer for heating resistors, electrical connection to its periphery is prevented without fail. The substrate for the inkjet head includes a first protection layer disposed to cover a heating resistor layer and having an insulation property and a second protection layer disposed to contact the first protection layer and having conductivity. The second protection layer includes a plurality of individual sections provided to correspond to the plurality of heating resistors, a common section connecting the plurality of individual sections, and fuse sections connecting the individual sections and the common section, the fuse sections being formed to be thinner than the individual sections.

Abstract: A printhead includes a nozzle and a jet control element. The jet control element includes a continuous heater element positioned to surround the nozzle and a plurality of three or more electrical contacts in electrical communication with the continuous heater element. The plurality of three or more electrical contacts define a plurality of three or more continuous heater element portions that are actuatable with sufficient independence so as to control jet steering. The number of the continuous heater element portions equals the number of electrical contacts.

Abstract: A process for forming a metal interconnection in an integrated circuit includes forming a first metal layer and a second metal layer on the first metal layer. Photoresist is placed on the second metal layer and patterned to form a mask. The second metal layer is etched. The mask is then removed and the first metal layer is patterned with the second metal layer acting as mask for the first metal layer.

Abstract: An inkjet printhead includes a plurality of nozzle chambers disposed on a substrate. Each nozzle chamber includes: a floor having an ink inlet defined therein; a roof having a nozzle aperture defined therein; sidewalls extending between the floor and the roof; and a heater element suspended in the nozzle chamber, the heater element being connected to corresponding electrodes so as to heat fluid within the nozzle chamber thereby forming a gas bubble in the fluid which causes ejection of fluid through the nozzle aperture. The ink inlet is laterally offset from the nozzle aperture and a plane of the heater is parallel with a plane of the roof.

Abstract: A continuous printing system includes a printhead and a controller. The printhead includes a nozzle and a jet control element including a continuous heater element positioned to surround the nozzle. A plurality of three or more electrical contacts is in electrical communication with the continuous heater element and define a plurality of three or more continuous heater element portions that are actuatable with sufficient independence so as to control jet steering. The number of the continuous heater element portions equals the number of electrical contacts. A controller is configured to apply a waveform to at least one of the plurality of three or more electrical contacts to affect at least one of the plurality of independently actuatable continuous heater element portions.

Abstract: A method of printing includes providing a printhead including a jet control element including a continuous heater element positioned to surround a nozzle. A plurality of three or more electrical contacts is in electrical communication with the continuous heater element. The plurality of three or more electrical contacts define a plurality of three or more continuous heater element portions that are actuatable with sufficient independence so as to control jet steering. The number of the continuous heater element portions equals the number of electrical contacts. A liquid is provided under a pressure sufficient to eject a jet of liquid through the nozzle. A waveform is applied to at least one of the plurality of three or more electrical contacts using a controller to affect at least one of the plurality of independently actuatable continuous heater element portions to control the jet of liquid.

Abstract: A thermal resistor fluid ejection assembly includes an insulating substrate and first and second electrodes formed on the substrate. A plurality of individual resistor elements of varying widths are arranged in parallel on the substrate and electrically coupled at a first end to the first electrode and at a second end to the second electrode.

Abstract: A heating element of a fluid ejection device, the heating element including a ring-type body, an inner edge of the body, and an outer edge of the body, wherein at least one of the inner edge and the outer edge defines an undulated surface contour.

Abstract: A method for preparing an integrated circuit or micro-electro-mechanical system chip sample for ion cross-section polishing is provided. The method includes preparing a polymer coating formulation. The polymer coating formulation includes a novolac epoxy resin, a bisphenol-A/epichlorhydrin epoxy resin, a photoacid generator, an adhesion promoter, and a mixture of acetophenone, cyclohexanone and butyrolactone organic solvents. The integrated circuit or micro-electro-mechanical system chip sample is encapsulated by the polymer coating formulation, wherein the chip sample is then ready for ion beam cross-section polishing. A cross-section sample of integrated circuit or micro-electro-mechanical system chip is prepared by polishing the obtained polymer encapsulated integrated circuit or micro-electro-mechanical system chip with ion beam cross-section polisher. The disclosed method allows the cross-section sample to be obtained at a reduced polishing time.

Abstract: In one example, an anti-fouling latex ink includes a liquid vehicle, a pigment dispersed in the liquid vehicle, latex dispersed in the liquid vehicle, and a polystyrene anti-fouling additive dispersed in the liquid vehicle as a free solution. An illustrative method of formulating a latex inkjet ink includes forming a liquid vehicle with water as primary solvent, dispersing pigments in the liquid vehicle, and adding 0.01 wt % to 1 wt % of a polystyrene antifouling additive as a free solution to the liquid vehicle.

Abstract: An inkjet printhead has a plurality of nozzles; a bubble forming chamber corresponding to each of the nozzles; and a heater element disposed in each of the bubble forming chambers. The heater element is configured for heating an ejectable liquid above its boiling point to form a gas bubble that causes the ejection of a drop from the nozzle. The heater element is comprised of titanium aluminum nitride.

Abstract: A ring-type heating resistor for a thermal fluid-ejection mechanism includes resistive segments and conductive segments. The resistive segments are rectangular in shape. The resistive segments are separated from one another. The conductive segments are interleaved in relation to the resistive segments such that each conductive segment electrically connects two of the resistive segments. The resistive segments and the conductive segments together form a pseudo-ring that approximates a true ring.

Abstract: A thermal printhead includes a substrate, a resistor layer formed on the substrate, an electrode layer formed on the substrate and electrically connected to the resistor layer, and an insulating layer. The electrode layer includes a first electrically conductive portion and a second electrically conductive portion spaced apart from each other. The resistor layer includes a heater portion that bridges the first electrically conductive portion and the second electrically conductive portion as viewed in the thickness direction of the substrate. The insulating layer includes a portion positioned between the electrode layer and the heater portion. This arrangement reduces formation of a eutectic region between the heater portion and the electrode layer.

Abstract: In one embodiment, a fluid ejection device includes a substrate with a fluid slot and a membrane adhered to the substrate that spans the fluid slot. A resistor is disposed on top of the membrane over the fluid slot, and a fluid feed hole next to the resistor extends through the membrane to the slot. A shelf extends from the edge of the resistor to the edge of the feed hole, and a passivation layer covers the resistor and part the shelf. An etch-resistant layer is formed partly on the shelf and in between the fluid feed hole and the resistor.

Abstract: A thermal fluid-ejection mechanism includes a substrate having a top surface. A cavity formed within the substrate has one or more sidewalls and a floor. The angle of the sidewalls from the floor is greater than or equal to nominally ninety degrees. The thermal fluid-ejection mechanism includes a patterned conductive layer on one or more of the substrate's top surface and the cavity's sidewalls. The thermal fluid-ejection mechanism includes a patterned resistive layer on the sidewalls of the cavity. The patterned resistive layer is located over the patterned conductive layer where the patterned conductive layer is formed on the sidewalls of the cavity. The patterned resistive layer is formed as a heating resistor of the thermal-fluid ejection mechanism. The conductive layer is formed as a conductor of the thermal-fluid ejection mechanism, to permit electrical activation of the heating resistor to cause fluid to be ejected from the thermal fluid-ejection mechanism.

Abstract: A heater for use in a phase change ink printhead reservoir is provided that includes a first insulating layer having at least one ink supply path opening, and a second insulating layer having at least one ink supply path opening that aligns with the at least one ink supply path opening in the first insulating layer. The heater includes a resistance heating trace arranged in a serpentine pattern between the first and the second insulating layers. The resistance heating trace is configured to receive electric current and to convert the electric current to heat. The resistance heating trace includes a trace ring for each ink supply path opening in the first and second insulating layers that forms a continuous perimeter around the corresponding ink supply path opening.