Abstract: A method for manufacturing a ceramic substrate is characterized in using a preformed trench, a patterned protective layer and a sand blasting process to manufacture a cavity in a ceramic substrate and control the cavity size and shape of the ceramic substrate. The ceramic substrate is collocated with a base substrate to form a package substrate for packaging a semiconductor chip. The manufacturing method set forth above can lower the manufacturing cost and raise the accuracy of the size and shape of the cavity of the ceramic substrate. The abovementioned method can reduce the fabrication cost and increase the precision of the shape and size of a ceramic substrate.

Abstract: An integrated semiconductor heating assembly includes a semiconductor substrate, a chamber formed therein, and an exit port in fluid communication with the chamber, allowing fluid to exit the chamber in response to heating the chamber. The integrated heating assembly includes a first heating element adjacent the chamber, which can generate heat above a selected threshold and bias fluid in the chamber toward the exit port. A second heating element is positioned adjacent the exit port to generate heat above a selected threshold, facilitating movement of the fluid through the exit port away from the chamber. Addition of the second heating element reduces the amount of heat emitted per heating element and minimizes thickness of a heat absorption material toward an open end of the exit port. Since such material is expensive, this reduces the manufacturing cost and retail price of the assembly while improving efficiency and longevity thereof.

Abstract: In a method of manufacturing a liquid discharging head which includes a flow path forming member which has a discharge port for discharging a liquid and a liquid flow path communicating with the discharge port, and a base body having a liquid supply port which supplies the liquid flow path with the liquid, the method includes (1) forming a mold of the liquid flow path and a foundation member formed of a porous inorganic material over the base body, (2) applying an organic resin over the base body so as to cover the mold and the foundation member to form the flow path forming member, (3) forming the discharge port in the flow path forming member to form the liquid supply port in the base body, and (4) removing the mold to form the liquid flow path.

Abstract: A liquid jet head includes a head chip and a circuit board connected to the head chip. The head chip includes common terminals arranged in a reference direction. The circuit board includes shared terminals, an upper common wiring, and a through electrode. The shared terminals are provided on a lower surface of the circuit board on the head chip side and are electrically connected to the common terminals. The upper common wiring extends in the reference direction and is provided on a top surface of the circuit board opposite to the head chip. The through electrode electrically connects each of the shared terminals to the upper common wiring.

Abstract: A liquid ejection head substrate according to an exemplary embodiment of the present invention includes a plurality of ejection heaters arranged in a first region, a drive circuit that is arranged in the first region and configured to supply electric energy to the plurality of ejection heaters, a signal supply circuit that is arranged in a second region and configured to supply an electric signal to the drive circuit, and a substrate heating heater including a first portion arranged in the first region and a second portion arranged in the second region, in which a resistance value per unit length along a direction of a current of the first portion is different from a resistance value per unit length along a direction of a current of the second portion.

Abstract: A manufacturing method of an inkjet head including, forming an insulating layer which is compact compared to a piezoelectric member with respect to a region other than a driving unit which ejects ink, in the piezoelectric member, and forming an electrode for applying a driving voltage to the driving unit, by performing electroless plating with respect to the driving unit and the insulating layer.

Abstract: A method of manufacturing a liquid-discharge-head substrate is provided, which includes a plurality of elements for discharging liquid, and a heating member for heating the liquid-discharge-head substrate, the method including the steps of preparing a substrate having an insulating layer made of an insulating material provided on or above the substrate, providing a conductive layer made of a conductive material, and forming a conductive line being configured to supply current for driving the element and a part of a heating member by using the conductive layer.

Abstract: A method of manufacturing an ejection orifice member includes: preparing a substrate including a first layer, a second layer, and a third layer, the first layer protruding in a first direction crossing a principal surface of the substrate, the second and third layers being formed on the first direction side of the first layer, the preparing a substrate including forming the second layer to follow a contour of a first direction side surface of the first layer, and then forming the third layer on a surface of the second layer which protrudes on the first direction side; performing plating using the second layer as a seed to form a fourth layer on the first direction side of the second layer; removing the third layer from the fourth layer to form a hole as the ejection orifice in the fourth layer; and thinning the fourth layer at least around the hole.

Abstract: Provided are a manufacturing method of an inkjet print head, the inkjet print head and a drawing apparatus equipped with the inkjet print head. The manufacturing method includes: forming a separation assisting layer on a substrate; forming heating resistors, thin-film transistors and nozzles for ejecting liquid, on the separation assisting layer; separating the separation assisting layer from the substrate; forming a first heat-conductive layer on the opposite surface of the separation assisting layer from the nozzles; and forming an ink supply port for supplying ink to the nozzles from a first heat-conductive layer side of the inkjet print head.

Abstract: A method for manufacturing an inkjet recording head includes preparing a substrate having a mold to become an ink flow passage and an orifice layer covering the mold, and immersing the substrate in a solvent, whereby in immersing the substrate in the solvent, the mold at the substrate immersed in the solvent is irradiated with deep-UV light.

Abstract: Provided is a method of manufacturing a liquid ejection head including: a substrate having energy generating elements disposed thereon; and an ejection orifice forming member having ejection orifices, the substrate and the ejection orifice forming member forming a flow path therebetween, the method including: forming, on the substrate, a mold having a recessed portion at a position corresponding to a region in which each of the ejection orifices is formed and in a vicinity of the position; forming a coating layer by chemical vapor deposition so as to cover the mold; and forming the ejection orifices through the coating layer to obtain the ejection orifice forming member.

Abstract: A substrate for an inkjet print head comprises: a base; a plurality of heating resistors for heating ink, the heating resistors being disposed on the base and producing heat in a case where the heating resistors are energized; a first protection layer disposed on the heating resistors and having insulation properties; and a second protection layer disposed on the first protection layer and having conductivity. The second protection layer includes individual sections disposed to individually cover the plurality of heating resistors, a common section connecting the individual sections, and connection sections interposed between the individual sections and the common section and connecting the individual sections and the common section. The connection sections are disposed at positions to be in contact with ink, and include a material which changes to an insulating film by an electrochemical reaction with the ink.

Abstract: Disclosed is a fluid ejection device for an inkjet printer that includes a substrate. The substrate includes at least one trench and a plurality of fluid flow vias configured in at least three parallel rows arranged over each trench of the at least one trench. Each row of the at least three parallel rows includes a set of fluid flow vias from the plurality of fluid flow vias arranged in one of a uniform manner and a non-uniform manner such that each fluid flow via of the set of fluid flow vias is configured in a spaced-apart relation with an adjacent fluid flow via. The each fluid flow via is configured in a diagonal relationship relative to a neighboring fluid flow via of an adjacent row of the at least three parallel rows. The fluid ejection device also includes a flow feature layer and a nozzle plate.

Abstract: An ink jet printhead device includes a substrate and at least one first dielectric layer above the substrate. A resistive layer is above the at least one first dielectric layer. An electrode layer is above the resistive layer and defines first and second electrodes coupled to the resistive layer. At least one second dielectric layer is above the electrode layer and contacts the resistive layer through the at least one opening. The at least one second dielectric layer has a compressive stress magnitude of at least 340 MPa.

Abstract: A substrate for a liquid discharge head includes an upper protection film that covers at least a region corresponding to each of thermal energy generation elements. The upper protection film and at least one of the upper protection films adjacent to the upper protection film within a liquid chamber are respectively connected to different external electrodes, and a voltage can be applied therebetween via the different external electrodes.

Abstract: A liquid ejection head includes a substrate having a supply port that is a through-hole for supplying liquid; an energy generating element for generating energy to be used for ejecting the liquid; a first film that covers the energy generating element; a second film formed on the first film; and a flow path forming member bonded to the substrate, for forming a flow path for supplying the liquid supplied from the supply port to an ejection orifice. When viewed from a direction perpendicular to the substrate, an end portion of the first film extends inwardly from an opening edge of the supply port, and an end portion of the second film is located between the opening edge of the supply port and the end portion of the first film.

Abstract: A fluid ejection apparatus (20, 220, 320, 420, 520, 620, 720, 820, 920, 1020, 1120, 1220, 1320, 1420, 1490, 1720, 1820) and method eject a droplet of fluid using a drop generator (46, 246, 1546) receiving fluid from a passage (44, 244, 1344, 1444, 1494, 1544, 1744) having an inlet (54, 254, 1554) adjacent a fluid slot (40, 240, 1540) and an outlet (56, 256, 1556) spaced from the inlet (54, 254, 1554) and adjacent the fluid slot (40, 240, 1540). Fluid is drawn through a filter (50, 250, 650, 1550) with a pump (48, 248, 1548) within the passage (44, 244, 1344, 1444, 1494, 1544, 1744) that pumps the fluid towards the inlet (54, 254, 1554) to the drop generator (46, 246, 1546).

Abstract: An inkjet nozzle device configured for venting a gas bubble during droplet ejection. The inkjet nozzle device includes: a firing chamber for containing ink, the firing chamber having a floor and a roof defining an elongate nozzle aperture having a perimeter; and an elongate heater element bonded to the floor of the firing chamber, the heater element and nozzle aperture having aligned longitudinal axes. The device is configured to satisfy the relationships A =swept volume/area of heater element=8 to 14 microns; and B=firing chamber volume/swept volume=2 to 6. The swept volume is defined as the volume of a shape defined by a projection from the perimeter of the nozzle aperture to the floor of the firing chamber, and includes a volume contained within the nozzle aperture.

Abstract: Provided are a manufacturing method of an inkjet print head, the inkjet print head and a drawing apparatus equipped with the inkjet print head. The manufacturing method includes: forming a separation assisting layer on a substrate; forming heating resistors, thin-film transistors and nozzles for ejecting liquid, on the separation assisting layer; separating the separation assisting layer from the substrate; forming a first heat-conductive layer on the opposite surface of the separation assisting layer from the nozzles; and forming an ink supply port for supplying ink to the nozzles from a first heat-conductive layer side of the inkjet print head.

Abstract: A liquid discharging recording head includes an element substrate including a plurality of discharge ports configured to discharge liquid and a plurality of energy generating elements configured to generate energy for discharging the liquid, a support member configured to support the element substrate, a first member configured to support an end of the element substrate in an array direction in which the discharge ports are arrayed, the first member having a thermal conductivity lower than a thermal conductivity of the support member, and a second member configured to support an end of the element substrate in an intersecting direction intersecting the array direction, the second member having a thermal conductivity lower than the thermal conductivity of the support member and a thermal resistance lower than a thermal resistance of the first member.

Abstract: A method that includes forming a chamber in a substrate, forming a silicon layer overlying the chamber, etching the silicon layer to remove selected regions and retain a selected portion overlying the chamber, the selected portion being at a location and having dimensions that correspond to a location and to dimensions of a nozzle, and forming a first metal layer adjacent to the selected portion. The method also includes forming a path in the substrate to expose the chamber concurrently with removing the selected portion of the silicon layer to expose the nozzle, the nozzle being in fluid communication with the path, the chamber, and a surrounding environment.

Abstract: A heater stuck includes first strata having a planar configuration supporting and forming a fluid heater element responsive to repetitive electrical activation and deactivation to produce repetitive cycles of fluid ejection from an ejection chamber above the heater element and second strata having a planar configuration coating the heater element of the first strata and being contiguous with the ejection chamber to protect the heater element. The first strata include a substrate and heater strata disposed on it and forming a cavity above the substrate and encompassed on three sides by the heater substrata. The heater substrata includes a pair of conductive layer portions constituting terminal leads disposed on the substrate at opposite sides of the cavity and a resistive layer disposed on the conductive layer portions and defining the fluid heater element that spans the top of the cavity.

Abstract: A substrate for a liquid discharge head includes an upper protection film that covers at least a region corresponding to each of thermal energy generation elements. The upper protection film and at least one of the upper protection films adjacent to the upper protection film within a liquid chamber are respectively connected to different external electrodes, and a voltage can be applied therebetween via the different external electrodes.

Abstract: An inkjet printhead includes a bi-layered nozzle plate having a plurality of nozzle apertures. The bi-layered nozzle plate being includes a lower first nozzle plate formed from a first material and an upper second nozzle plate disposed on the first nozzle plate, the second nozzle plate being formed from a second material. The first and second materials are different from each other and are each independently selected from the group consisting of: silicon nitride, silicon oxide and silicon oxynitride.

Abstract: An ejection liquid capable of being stably ejected based on a system using thermal energy even if the liquid contains at least one selected from the group consisting of proteins and peptides, and a method and an apparatus for ejecting the liquid containing at least one selected from the group consisting of proteins and peptides using this system are provided. The applicability of the liquid for use in an inkjet system using thermal energy is improved by adding at least one selected from the group consisting of amino acids and salts thereof and a surfactant to an aqueous solution containing at least one selected from the group consisting of proteins and peptides.

Abstract: Second etching is performed to the bottom through dry etching of a substrate to suppress image degradation even if an opening position of an ejection opening at a substrate end deviates. Provided is an inkjet printing head substrate including: a first surface, a second surface, and a plurality of ink supply openings, wherein the plurality of the heat resistive elements and the plurality of the ink supply openings are arranged in such a manner that each of distances between a heat resistive element closer to an inclined surface of the recessed portion in the inkjet printing head substrate among the plurality of the heat resistive elements and two ink supply openings adjacent to the heat resistive element is longer than each of distances between a heat resistive element closer to the center of the inkjet printing head substrate and two ink supply openings adjacent to the heat resistive element.

Abstract: An inkjet printer includes: an inkjet printhead having an exposed corrodible structure containing silicon nitride, borophosphosilicate glass (BPSG) or silicon oxide; and an ink reservoir containing said ink which is in fluid communication with said printhead. The ink includes: water; a dye; and a metal additive for minimizing corrosion of the exposed structure.

Abstract: A printhead for an ink jet printer can be formed as a plurality of substructures which are connected subsequent to inspection and/or testing. A substructure can include a semiconductor substrate such as a silicon substrate having a plurality of heater traces which are used to maintain a temperature of melted solid ink within a tolerance of a desired temperature. The traces can be accurately formed using semiconductor processing techniques. Testing and/or inspecting the substructures prior to assembly can reduce rework and scrap, and can allow the formation of printhead structures from a wide variety of materials.

Abstract: A process for forming a metal interconnection in an integrated circuit includes forming a first metal layer and a second metal layer on the first metal layer. Photoresist is placed on the second metal layer and patterned to form a mask. The second metal layer is etched. The mask is then removed and the first metal layer is patterned with the second metal layer acting as mask for the first metal layer.

Abstract: An inkjet printhead includes a plurality of nozzle chambers disposed on a substrate. Each nozzle chamber includes: a floor having an ink inlet defined therein; a roof having a nozzle aperture defined therein; sidewalls extending between the floor and the roof; and a heater element suspended in the nozzle chamber, the heater element being connected to corresponding electrodes so as to heat fluid within the nozzle chamber thereby forming a gas bubble in the fluid which causes ejection of fluid through the nozzle aperture. The ink inlet is laterally offset from the nozzle aperture and a plane of the heater is parallel with a plane of the roof.

Abstract: A liquid discharge head, contains: an energy generating element which generates thermal energy and contains a heat generation resistant layer and a pair of electrode layers whose end surfaces are separated from each other; an insulating layer covering the pair of electrode layers and the heat generation resistant layer and containing an insulating material; a protective layer provided above the insulating layer at least at a position corresponding to the energy generating element and containing a metal material containing iridium or ruthenium; and a covering layer provided at a position covering at least portions of the protective layer corresponding to the end surfaces of the pair of electrode layers in such a manner that a part of the protective layer is exposed and containing a metal material containing tantalum or niobium.

Abstract: The reduction in reliably of a liquid discharge head due to the dissolution of a protective layer is suppressed. A substrate for a liquid discharge head includes a base substrate, a heat-generating resistive layer placed on the base substrate, a pair of lines placed on the base substrate, and a protective layer covering the heat-generating resistive layer and the lines. The protective layer contains a material represented by the formula SixCyNx, where x+y+z=100, 30?x?59, y?5, and z?15 on an atomic percent basis.

Abstract: Apparatus and methods for heating a printer jet stack. The apparatus includes a first layer and a second layer disposed generally parallel to the first layer. The apparatus also includes a heating layer including a thermal epoxy configured to generate heat when an electrical current is applied thereto. The heating layer is disposed between and bonds together the first layer and the second layer.

Abstract: A method enables multiple inkjet printhead dies to be manufactured by bonding a single wafer to a single polymer layer. Multiple die sites on the single wafer are arranged in a predetermined pattern that corresponds to the pattern in which a plurality of aperture arrays are arranged in the polymer layer. The die sites on the wafer and the aperture arrays in polymer layer are aligned, the wafer and polymer layer are bonded, and the bonded wafer and polymer layer are cut to form a plurality of inkjet printhead dies.

Abstract: A fluid ejection device includes a thin film heater resistor portion having a heater resistor, and a two-layer structure disposed over the heater resistor. The two-layer structure includes a top layer and a bottom layer, with the top layer having a hardness that is at least 1.5 times greater than the hardness of the bottom layer.

Abstract: A method for preparing an integrated circuit or micro-electro-mechanical system chip sample for ion cross-section polishing is provided. The method includes preparing a polymer coating formulation. The polymer coating formulation includes a novolac epoxy resin, a bisphenol-A/epichlorhydrin epoxy resin, a photoacid generator, an adhesion promoter, and a mixture of acetophenone, cyclohexanone and butyrolactone organic solvents. The integrated circuit or micro-electro-mechanical system chip sample is encapsulated by the polymer coating formulation, wherein the chip sample is then ready for ion beam cross-section polishing. A cross-section sample of integrated circuit or micro-electro-mechanical system chip is prepared by polishing the obtained polymer encapsulated integrated circuit or micro-electro-mechanical system chip with ion beam cross-section polisher. The disclosed method allows the cross-section sample to be obtained at a reduced polishing time.

Abstract: Disclosed is a substrate structure for an ejection chip that includes a first substrate layer, a second substrate layer disposed beneath the first substrate layer, and an intermediate layer configured between the first substrate layer and the second substrate layer. The substrate structure also includes a plurality of fluid channels configured within the second substrate layer. Further, the substrate structure includes a plurality of fluid ports configured within the first substrate layer. At least one fluid port of the plurality of fluid ports is configured in alignment with a corresponding fluid channel of the plurality of fluid channels. Furthermore, the substrate structure includes a plurality of slots configured within the intermediate layer such that the at least one fluid port is in fluid communication with the corresponding fluid channel. Further disclosed is a method for fabricating the substrate structure and an ejection chip employing the substrate structure.

Abstract: A fluid-ejection printhead die includes a fluid-ejection firing element and an electrochemical cell. The fluid-ejection firing element is to cause droplets of fluid to be ejected from the fluid-ejection printhead die. The electrochemical cell is to measure an electrical property of the fluid. The fluid-ejection firing element and the electrochemical cell are both part of the fluid-ejection printhead die.

Abstract: Disclosed is a fluid ejection device that includes a nozzle plate. The nozzle plate includes a plurality of nozzles. Further, the fluid ejection device includes a flow feature layer. The flow feature layer includes a plurality of flow features. The fluid ejection device further includes an ejection unit. The ejection unit includes a first layer. The first layer includes a plurality of fluid vias. Further, the ejection unit includes a second layer. The second layer includes a plurality of fluid channels. Further, the second layer is attached to the first layer through a first intermediate silicon oxide layer. The ejection unit also includes a third layer. The third layer includes a plurality of ports. The third layer is also attached to the second layer through a second intermediate silicon oxide layer. Further disclosed are an ejection unit for a fluid ejection device and a method for fabricating the fluid ejection device.

Abstract: An inkjet printhead has a plurality of nozzles; a bubble forming chamber corresponding to each of the nozzles; and a heater element disposed in each of the bubble forming chambers. The heater element is configured for heating an ejectable liquid above its boiling point to form a gas bubble that causes the ejection of a drop from the nozzle. The heater element is comprised of titanium aluminum nitride.

Abstract: A multi-dimensional data registration integrated circuit is configured for driving array-arrangement devices. The array-arrangement devices comprise a plurality of first hierarchy sets, each which comprises a plurality of second hierarchy sets. The multi-dimensional data registration integrated circuit comprises a first hierarchy address selection circuit, a second hierarchy address selection circuit and a data supply circuit. The first hierarchy address selection circuit scans the first hierarchy sets, and selects a unit of the first hierarchy sets to activate it. The second hierarchy address selection circuit scans the second hierarchy sets. The data supply circuit writes a plurality of data into each designated unit of the second hierarchy sets according to the scanning sequence of the second hierarchy address selection circuit.

Abstract: Apparatus and methods for heating a printer jet stack. The apparatus includes a first layer and a second layer disposed generally parallel to the first layer. The apparatus also includes a heating layer including a thermal epoxy configured to generate heat when an electrical current is applied thereto. The heating layer is disposed between and bonds together the first layer and the second layer.

Abstract: An inkjet printhead is provided for a digitally controlled inkjet printing apparatus wherein the inkjet printhead is comprised of a material layer and a drop formation mechanism positioned in or on the material layer, that is substantially improved in chemical resistance and thermally stability. A chemically resistant and thermally stable multilayer coating is provided onto and in contact with the inkjet printhead, wherein the multilayer coating includes one or more thin film layers comprised primarily of hafnium oxide or zirconium oxide and one or more thin film layers comprised primarily of tantalum oxide, the multilayer coating being located on the material layer.

Abstract: An inkjet nozzle assembly includes a nozzle chamber having a planar roof spaced apart from a floor. A heater element is suspended in the nozzle chamber and is configured as a planar beam extending longitudinally and parallel with a plane of the roof. A nozzle aperture defined in the roof has a centroid offset from a longitudinal centroid of the planar beam.

Abstract: A thermal printhead die is formed from an SOI structure as a MEMS device. The die has a printing surface, a buried oxide layer, and a mounting surface opposite the printing surface. A plurality of ink delivery sites are formed on the printing surface, each site having an ink-receiving and ink-dispensing structure. An ohmic heater is formed adjacent to each structure, and an under-bump metallization (UBM) pad is formed on the mounting surface and is electrically connected to the ohmic heater, so that ink received by the ink-delivery site and electrically heated by the ohmic heater may be delivered to a substrate by sublimation. A through-silicon-via (TSV) plug may be formed through the thickness of the die and electrically coupled through the buried oxide layer from the ohmic heater to the UBM pad. Layers of interconnect metal may connect the ohmic heater to the UBM pad and to the TSV plug.

Abstract: A printhead for an ink jet printer can be formed as a plurality of substructures which are connected subsequent to inspection and/or testing. A substructure can include a semiconductor substrate such as a silicon substrate having a plurality of heater traces which are used to maintain a temperature of melted solid ink within a tolerance of a desired temperature. The traces can be accurately formed using semiconductor processing techniques. Testing and/or inspecting the substructures prior to assembly can reduce rework and scrap, and can allow the formation of printhead structures from a wide variety of materials.

Abstract: A liquid ejector includes a substrate, a heating element, a dielectric material layer, and a chamber. The substrate includes a first surface. The heating element is located over the first surface of the substrate such that a cavity exists between the heating element and the first surface of the substrate. The dielectric material layer is located between the heating element and the cavity such that the cavity is laterally bounded by the dielectric material layer. The chamber, including a nozzle, is located over the heating element. The chamber is shaped to receive a liquid with the cavity being isolated from the liquid.

Abstract: A nozzle assembly for an inkjet printhead includes: an ink chamber having an elliptical nozzle opening defined in a roof of the ink chamber and an ink inlet; a heater element positioned in the ink chamber, the heater element having an elongate linear beam for generating a vapour bubble in the ink chamber, the elongate linear beam having a longitudinal axis extending parallel with a major axis of the elliptical nozzle opening; and a pressure-diffusing structure positioned relative to the ink inlet. The pressure-diffusing structure is configured for diffusing pressure pulses in ink supplied to the ink chamber via the ink inlet.

Abstract: In an ink jet head using a thermal energy for ejecting ink, this invention aims to reliably and uniformly remove kogations deposited on a heat application portion in contact with the ink. To realize this objective, the upper protective layer is arranged in an area including the heat application portion so that it can be electrically connected to serve as an electrode which causes an electrochemical reaction with the ink. The upper protective layer is formed of a material containing a metal which is dissolved by the electrochemical reaction and which does not form, on heating, an oxide film which hinders the dissolution. With this arrangement, a reliable electrochemical reaction can be produced to dissolve a surface layer of the upper protective layer, thereby removing kogations on the heat application portion reliably and uniformly.

Abstract: A method of hydrophobizing a frontside surface of an integrated circuit. The method includes the steps of: (a) depositing a hydrophobic polymeric layer onto the frontside surface; (b) depositing a protective metal film onto the hydrophobic polymeric layer; (c) depositing a sacrificial material onto the metal film; (d) patterning the sacrificial material; (e) etching through the metal film, the hydrophobic polymeric layer and the frontside surface; (f) performing MEMS processing steps on a backside of the integrated circuit; (g) subjecting the integrated circuit to an oxidizing plasma, wherein the metal film protects the hydrophobic polymeric layer from the oxidizing plasma; and (h) removing the protective metal film to provide an integrated circuit having a relatively hydrophobic patterned frontside surface.