Abstract: A wire bonding apparatus including a bonding tool that performs bonding on a bonding part, a position detection camera which has a lens barrel and images the bonding part, a light source which emits illuminating light downward through the lens barrel, and a light path conversion device that directs an image of an area near the lower end of the tool to the position detection camera. The light path conversion device includes a wavelength-selective filter that is provided so as to be within a light path of the image of the area near the lower end of the tool. The wavelength-selective filter allows illuminating light of the light path conversion device to pass therethrough but prevents the illuminating light from the lens barrel side from passing therethrough.

Abstract: By rendering a special test image and applying flat-field correction for a device under test (DUT) non-uniformity, the E-O response of a reflective LCOS microdisplay can be quickly determined through an image processing algorithm. The measurement is made in a spatial domain instead of in a temporal domain. From the measurement, the driving voltage of maximum brightness, Vbright, can be determined. The use of Vbright enhances the visibility of pixel and sub-pixel defects to the test system. Other defect visibility enhancements are achieved through appropriate sampling rate, optical axis rotation and improved parallelism between the DUT and the CCD sensor camera. By modeling a sub-pixel defect as a local non-uniformity, a near neighborhood algorithm may be used for detection. The neighborhood algorithm does not rely on the alignment between the display pixels and the camera pixels.

Abstract: A machine vision method for locating a leaded electronic device, such as integrated circuit chips, includes searching the image with a template depicting only a portion—e.g., one or two “side” edges—of each of one or more of the leads expected on the device. The template can include portions representing expected leads, as well as unexpected leads or unexpected lead positions. Positive and negative weightings are applied to such portions, as appropriate. A location of the device, or of one or more of its leads, is based on the results of the search.

Abstract: A method and system for fast on-line electro-optical detection of wafer defects featuring illuminating with a short light pulse from a repetitively pulsed laser, a field of view of an electro-optical camera system having microscopy optics, and imaging a moving wafer, on to a focal plane assembly optically forming a surface of photo-detectors at the focal plane of the optical imaging system, formed from six detector ensembles, each ensemble including an array of four two-dimensional CCD matrix photo-detectors, whereby each two-dimensional CCD matrix photo-detector produces an electronic image of a large matrix of two million pixels, such that the simultaneously created images from the different CCD matrix detectors are processed in parallel using conventional image processing techniques, for comparing the imaged field of view with another field of view serving as a reference, in order to find differences in corresponding pixels, indicative of the presence of a wafer die defect.

Abstract: A system and method for object inspection that includes an image recognition program stored on a tangible medium for classifying and subclassifying regions of interest on an image. The image recognition program can be used in an image inspection system to determine defects on objects such as printed wiring assemblies. The image recognition program is executable to collect raw image data, segment out rectangular regions of interest that can be component sites defined by CAD data, preprocess each region of interest by scaling, gain and offset correction, and gamma correction, generating a set of image spaces for each region of interest using a set of spatial image transforms, generating features on the image spaces, scoring the features, comparing the feature scores to a knowledge base of feature scores to make a class determination for the features, generating a presence/absence decision confidence for the features, calculating a class determination and decision confidence for each region of interest.

Abstract: An LCC inspecting device includes a mirror having non-parallel front and rear surfaces, and reflective coatings on the front and rear surfaces. The reflective coatings reflect light of frequencies different from each other such that light of a first frequency reflects off the front surface of the mirror and light of a second, different frequency reflects off the rear surface. The LCC device may therefore be inspected from different angles by selectively using light of the first and second frequencies.

Abstract: An apparatus to attach to a Multifunction Bond Strength Test Machine 1 to incorporate a digital camera 13 with zoom optics 14 and integrating software incorporated in a computer 16, including; A secure and reliable mounting system 15 that attaches the camera 13 and optics 14 to the Multifunction Test System 1, computer with embedded frame grabber circuitry 16 and software controls for the coordination of automatic positioning of test sites 9 under the camera 13 and identification of the specific test sites 9, software for capture and manipulation of the digital image of the test site 18, and software for quantification of image features.

Abstract: The present invention relates to a method and system of inspecting a product, including extracting defects from the product, classifying the defects on the basis of information about the extracted defects representing the analogy of the defects, extracting the feature data of the defects on the basis of the result of defect classification, and feeding back the feature data of the extracted defects for inspection. The method and system is characterized in that the extracted feature data of the defects is fed back for inspecting the product.

Abstract: A system for inspection components that are sealed within tape is provided. The system includes a light source that can illuminate the components through a tape layer. A polarizer is used to polarize light from the light source, the components, and the tape layer, so as to reduce glare and reflected light. An image system receives light from the polarizer and stores image data for each component.

Abstract: A method and apparatus, and variations of each, for inspecting a wafer defining at least one die thereon is disclosed. The present invention first obtains the electronic image equivalent of two die, and then determines the x and y offset between those electronic images. Prior to inspection for defects, those two electronic images are aligned by adjusting the x and y positions of one electronic image of one die with respect to the electronic image of the other die. Once that is accomplished, the those electronic images are compared to detect any defects that may exist on one of the die.

Abstract: An illuminating and optical apparatus for inspecting soldering of an inspecting part on a PCB includes an illuminating and optical apparatus collecting light emitted by first and second illuminating units. The first and second illuminating units each includes lamps arranged in rows around a view axis of large and small view cameras at a predetermined angle, wherein the large and small view cameras draw sufficient light reflected by the inspecting part and obtain different view sizes of images in accordance with the sizes of the inspecting part. An illuminating and optical apparatus collects light emitted by the first and second illuminating units.

Abstract: To provide an inspecting apparatus of a printed state or the like in a flexible printed circuit board which requires no skill, generates no error by oversight and further improves an operation efficiency, a substrate feeding out unit (2), a substrate inverting unit (4), a camera inspecting unit (5), a substrate inverting unit (9) and a defect point marking unit (10) for a printed state or the like are sequentially placed on working tables (1, 1) along a moving direction of a flexible printed circuit board, in this order, the substrate inverting units (4, 9) respectively invert the flexible printed circuit board, the camera inspecting unit (5) detects a print defect point by means of a camera (8), and the defect point marking unit (10) applies a marking to the print defect point by a laser marker (13) on the basis of a signal output from the camera inspecting unit (5).

Abstract: The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

Abstract: A method and apparatus are disclosed for refining a rough geometric description (GD) and a rough pose of an object having extensions. The invention locates anchor points within an image of the object and uses the anchor points to align in at least one dimension the rough GD. In one embodiment, the anchor points are the tips of the extensions of the object; the rough GD of the object is then aligned along the angular orientation indicated by the tips. Thereafter, other dimensions of the rough GD and the rough pose are measured, measuring the dimensions having less unknowns first. The rough GD and the rough pose are then updated to provide the refined GD and refined pose. For one measurement, an extent of a region is measured using the expected area of region to threshold the region and segment it from the remainder of the image before measuring the extent of the region. An application of refining a GD of a leaded object is disclosed.

Abstract: The invention is directed to techniques for inspecting a circuit board having a surface that includes at least one circuit board component. The apparatus includes a base, and a set of reflective members that includes at least one reflective member. Each reflective member of the set of reflective members is (i) supported by the base and (ii) movable relative to the base to enable that reflective member to move to an angle that reflects light from a respective portion of a circuit board component (e.g., a solder region between the component and the circuit board) in a direction away from the surface of the circuit board when the base rests on the surface of the circuit board. Since the base can rest on the surface of the circuit board, a technician does not need to hold the apparatus.

Abstract: An inspection apparatus and method is provided for inspecting external lead connectors in a grid array of an electronic package. The inspection apparatus includes a plurality of reflecting devices for directing a plurality of different oblique images to a partially reflective beam splitter, wherein each of the plurality of images corresponds to a different perspective view of the grid array. The apparatus is further configured such that each of the plurality of images share a single, common X,Y coordinate system for describing point locations within each image. An image capturing device captures each oblique image from the beam splitter. By comparing the relative location of image points in at least two captured images, the spatial coordinates and physical parameters of each solder ball may be calculated. The calculated values are converted to absolute values and compared against predetermined values for determining whether the electronic package meets manufacturing standards.

Abstract: An improved bonding strip for a printed circuit to facilitate quality inspection. The bonding strip has functional regions and non-functional regions. A functional region is indicated by an area of the bonding strip having a first dimension in width. A non-functional region is indicated by an area of the bonding strip having a second dimension in width. The first dimension may be either wider or narrower than the second dimension.

Abstract: A Time Delayed Integrator (TDI) sensor obtains images of a plurality of areas with the same pattern of an object of inspection such as a semiconductor wafer, and the obtained images are stored in an image storage part. The plurality of areas are designated in airs, and an image comparison part compares the images of the areas in each pair to detect a suspected pair including at least one possible defective area. A central processing unit (CPU) compares the images of the areas in the suspected pair with images of areas in other pairs to thereby find which area in the suspected pair is defective.

Abstract: A method and apparatus is provided for inspecting a semiconductor wafer for field-to-field critical dimension (CD) variations using statistical techniques, such that an optimal number of fields on the wafer under inspection are measured, thereby increasing the accuracy of the results of the inspection procedure and avoiding unnecessary sampling. Embodiments include randomly selecting a predetermined number of fields on a semiconductor wafer to be inspected, and measuring the CD of a comparable feature in each of the sample fields, as by a critical dimension scanning electron microscope (CD-SEM). A statistical function, such as an average or standard deviation, of the measured CDs is calculated. Further fields are the randomly selected, CDs measured, and the running average or standard deviation calculated after each CD is measured. If the last acquired CD does not change the average or standard deviation by a predetermined amount, the inspection procedure for the wafer under inspection is terminated.

Abstract: A novel wafer or circuit board automatic scanning optical inspection system and technique using the reference comparison principle for finding defects in scanned sample images, that enables a new degree of universality in finding all defects including very small single pixel conductor breaks and shorts and defects of irregular shapes, and together with simultaneous design rule processing, through the use of processed skeletal reference images and with separately programmable alignment tolerance and detection parameters.

Abstract: A ball grid array inspection and location method and apparatus includes a raw feature finding processor which uses a feature finding algorithm to find ball features (irrespective of number) and generate a list of raw features as an X and Y location for each feature located. An angle estimation processor receives the list of raw features, a user estimated orientation angle, and ball-to-ball pitch information and determines an estimated grid angle. An on-grid check processor receives the estimated grid angle, the list of raw features and the ball-to-ball pitch information and produces a set or list of on-grid features in the form of a list X and Y translation parameters for each feature/ball found on-grid.

Abstract: Disclosed is a method of realizing machining results of a given workpiece. It comprises the steps of: obtaining an image of a selected area in the workpiece before a required machining is performed; obtaining an image of the selected area in the workpiece after the required machining has been performed; making a comparison between these pre- and post-machining images of workpiece to derive non-common portions from the comparison; and realizing how the machined portion or portions in the selected area are like.

Abstract: An electronic parts mounting apparatus for divisionally recognizing an electronic part (2) even when the apparatus is arranged in such that the relative positional relation between a recognition camera (4) and a nozzle (1) cannot be varied. The electronic part (2) is vacuum-clamped by a nozzle (1), the posture of the nozzle (1) or the posture of the electronic part (2) is changed a plurality of times by a rotary driving member (3), and a part of the electronic part (2) imaged by the recognition camera (4) every time the posture of the electronic part (2) is changed, whereby the part is recognized. Thus, the recognition of the contour of the electronic part (2) becomes possible, and the electronic part can be mounted accurately on a circuit board by making a positional correction on the basis of the amount of deviation obtained.

Abstract: The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

Abstract: A defect judgement processing method and apparatus which can optimize image processing and defect judgement parameters for a detection image cut out by each inspection window to avoid erroneous judgement and defect missing and to realize reliable defect judgement.

Abstract: A flying prober having at least one prober head for contacting test sites on a unit under test which is programed for measuring isolations and continuities of test sites through the prober head. The prober heads include a camera and a test probe wherein the camera views and verifies contact between the test probe and the test sites. A display screen illustrates at least a real time camera view of the unit under test and a computer generated detail view of the unit under test for comparison.

Abstract: The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

Abstract: A method and apparatus for illuminating the end portions of downwardly extending features of a component without substantially illuminating the body of the component. At least one light source is configured to direct a fan-shaped sheet of light at the downwardly extending features of the component at a low angle of incidence with respect to the component body. A camera or other image capture device captures an image of the illuminate downwardly extending features and signal processing means determine the position of the downwardly extending features from the image thus formed with respect to a desired position.

Abstract: A method for controlling a polar coordinate stage moves an object relative to an imaging system. While moving the object, the image of the object is rotated to compensate for rotation of the object. Accordingly, the orientations of features in the image are preserved, and removal of apparent rotation in the image reduces confusion an operator experiences while directing movement of the object. The angular velocity of the motion of the object is controlled so that image shift speed is independent of the radial position of the point being viewed. Use of a polar stage, reduces the required foot print for a stage and facilitates prealignment. In particular, an edge detector measures the position of the edge of the object while the polar coordinate stage rotates the object. A prealignment process determines the position and orientation of the object from the measured edge positions.

Abstract: A system is disclosed for determining the rotational orientation of an object. An image of the object is digitally captured. The digital image is filtered through an edge detection operation to enhance the edge information contained in the image. The filtered image is rotated through a series of incremental angles to produce a series of rotated images. Each rotated image is projected onto an x-axis and y-axis defined by pixel grid axes defined by the original image. The projection of the rotated images produces projected pixel counts formed by the summation of pixel value differences of the x-axis and y-axis on the projected image. For each rotated image, a score corresponding to the sum of the difference of gray-scale values for adjacent projected pixels is computed. The scores for the projections of each rotated image are plotted on a score-angle graph. A curve which includes the highest score and the neighboring next highest scores is interpolated to determine the peak score.

Abstract: The present invention includes a system for providing a signal related to a physical condition of an object, such as an electronic component. Various types of electronic components may be used with the present invention, including leaded components, column, pin or grid array packages, and the like. The system includes a quill for releasably holding the object. The object has a major surface defining a plane, and a motion control system for rotating the quill about a central axis. Control electronics in the invention provide a plurality of trigger signals to each of two detectors, each detector adapted to view the same stripe in the plane upon receipt of a trigger signal and to output an image of the stripe. The detectors view a plurality of stripes while the motion control system rotates the quill, and the output from the detectors is received by processing circuitry for processing the plurality of images of the stripes to provide the signal related to the physical condition of the object.

Abstract: A system and method allow for associating a descriptive label with an anomaly on a manufactured object, such as a semiconductor wafer. The method includes placing the manufactured device on a moveable stage; capturing and preparing a digital-pixel-based representation of the image; symbolically decomposing the digital-pixel-based representation of the image to create a primitive-based representation of the image; analyzing the primitive-based representation of the image to detect and locate the anomaly; isolating primitives associated with the anomaly; comparing the isolated primitives associated with the anomaly with primitives in a knowledge base to locate a set of primitives in the knowledge base most like the isolated primitives associated with the anomaly; and assigning a label associated with the set of primitives in the knowledge base that was most similar to the isolated primitives associated with the anomaly.

Abstract: There is provided an image information processing apparatus capable of detecting a defect on a device even from an unclear SEM image thereof, and without using a golden device or a CAD data, at high speed. A two dimensional Wavelet transform is applied to an input digital image data. A threshold value process (a binarization process) is then applied to longitudinal line detection components and lateral line detection components obtained by the two dimensional Wavelet transform to create respective binarization images of the longitudinal line detection components and the lateral line detection components. A Hough transform is applied to each binarization image to obtain a position and a size of an object to be detected. If a threshold value process is applied to an image in a parameter space obtained by the Hough transform, a detection of particular figure information becomes easy. With respect to the binarization image, active pixels are grouped such that the same label is given to adjacent active pixels.

Abstract: A hybrid surface mount component inspection system which includes both vision and infrared inspection techniques to determine the presence of surface mount components on a printed wiring board, and the quality of solder joints of surface mount components on printed wiring boards by using data level sensor fusion to combine data from two infrared sensors to obtain emissivity independent thermal signatures of solder joints, and using feature level sensor fusion with active perception to assemble and process inspection information from any number of sensors to determine characteristic feature sets of different defect classes to classify solder defects.

Abstract: The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

Abstract: An X-ray examination apparatus is provided including: an X-ray image means for providing an X-ray image composed of pixels each having a grey value, and a brightness control system which is coupled to the X-ray image means in order to apply a brightness control signal of the image to the X-ray image means. The brightness control system comprises an X-ray image analyzing means for deriving the brightness control signal from a maximum in the number of times that a grey value occurs in the X-ray image. The apparatus provides optimized brightness in the visual image such that a physician is capable of properly examining changes in weakly absorbing tissues or body parts, such as lungs or the like, thus enabling optimized visual analysis.

Abstract: An image capture system in which images of a plurality of divided parts of an object are photographed includes at least one movable mirror disposed over the object so as to reflect a part of the object to be photographed, a mirror driver for changing an angle of the movable mirror relative to the object so that the part of the object reflected on the movable mirror is changed to another part of the object to be photographed, a camera for photographing the part of the object reflected on the movable mirror, and an image processor capturing an image signal from the camera every time the angle of the movable mirror is changed. The movable mirror is located a predetermined value or above higher than the object so that the image photographed by the camera is prevented from being unfocused upon angular change of the movable mirror. The movable mirror is preferably located higher than the object by 30 cm or more.

Abstract: An improved bonding strip for a printed circuit to facilitate quality inspection. The bonding strip has functional regions and non-functional regions. A functional region is indicated by an area of the bonding strip having a first dimension in width. A non-functional region is indicated by an area of the bonding strip having a second dimension in width. The first dimension may be either wider or narrower than the second dimension.

Abstract: A variable intensity lighting system for use with a machine vision apparatus for capturing high contrast images of articles to be inspected, such as semiconductor packages, includes an LED or optical fiber element and flash lamp array configured in multiple segments which are operable to be controlled as to light output intensity by a programmable intensity control circuit operably connected to a microprocessor. The intensity control circuit includes multiple digital potentiometers operable to control selected segments of the lighting array. The control circuit is adapted to control up to 64 segments of the lighting array individually at 64 incremental intensity levels, respectively. The control circuit may include a light failure module to detect a segment failure or a reversed connection.

Abstract: An inspection system and method uses a first illumination apparatus to illuminate one or more features, such as solder balls on an electronic component or other protruding surfaces or features on an object being inspected. Once the object being inspected is illuminated, a first reflected image of the plurality of features is captured by an illumination detection device. The first reflected image is stored in an image buffer. The object being inspected is then illuminated by at least one additional illumination apparatus. Each additional illumination apparatus is selected so that it differs from the other illumination apparatuses in either geometrical arrangement, degree of diffusion or illumination characteristic. An additional reflected image of the object is then captured by the illumination detection device while the object is illuminated by each additional illumination apparatus. Each additional reflected image is also stored in an image buffer.

Abstract: An image signal of a large number of patterns of the same shape on an LSI wafer obtained by an image sensor is held in a memory circuit, by using a CMOS image sensor chip incorporating a one-dimensional CMOS photodiode array, an analog-to-digital conversion circuit, a memory circuit and a processing circuit. Then, the image signal and one-cycle and two-cycle displaced image signals cyclically displaced from the image signal by the processing circuit are algebraically processed by a defect detection algorithm in the processing circuit of the CMOS image sensor. By this processing, a defect image is extracted without using a normal inspection pattern. Thus, a high-speed processing, a simplification of a configuration of an apparatus and a miniaturization of the apparatus become possible.

Abstract: An apparatus and method for inspecting a printed circuit board, whereby a list of windows encompassing respective regions of the printed circuit board are generated. The windows are then scanned, and data representing the respective regions is captured and stored. The captured data includes data relating to a plurality of pixels for each window. Next, data relating to a plurality of adjacent pixels is retrieved, and values of the adjacent pixels are summed. Finally, either the data relating to the plurality of adjacent pixels or the sum of adjacent pixel values is selected for use in subsequent processing. The apparatus and method is especially useful for determining an average brightness level for each window.

Abstract: An improved wafer surface inspection system is disclosed. In one embodiment, the object surface inspection system includes a translation stage that generates relative motion between an object viewing device such as an objective lens and the surface of the object being inspected. A translation stage controller controls the relative movement of the object surface and the object viewing device. The translation stage controller determines current coordinates for the object surface and the object viewing device, compares the current coordinates to target coordinates generated by a processor, and generates a trigger signal in response to a match between the current coordinates to the target coordinates. A camera receives an image through the object viewing device and captures the image in response to the trigger signal while the translation stage generates relative motion between the object surface and the object viewing device.

Abstract: A ball grid array inspection and location method and apparatus includes a raw feature finding processor which uses a feature finding algorithm to find ball features (irrespective of number) and generate a list of raw features as an X and Y location for each feature located. An angle estimation processor receives the list of raw features, a user estimated orientation angle, and ball-to-ball pitch information and determines an estimated grid angle. An on-grid check processor receives the estimated grid angle, the list of raw features and the ball-to-ball pitch information and produces a set or list of on-grid features in the form of a list X and Y translation parameters for each feature/ball found on-grid.

Abstract: A method and apparatus, and variations of each, for inspecting a wafer defining at least one die thereon is disclosed. The present invention first obtains the electronic image equivalent of two die, and then determines the x and y offset between those electronic images. Prior to inspection for defects, those two electronic images are aligned by adjusting the x and y positions of one electronic image of one die with respect to the electronic image of the other die. Once that is accomplished, those electronic images are compared to detect any defects that may exist on one of the die.

Abstract: A system of optics, cameras and image processor arrangement capable of capturing images of lead tips of object fields resulting in accurate 3 dimensional positions of all the leads on a Integrated Circuit such as a Quad Flat Package (QFP). The system comprises of a telecentric lens attached to a camera working with an arrangement of mirrors and lighting. The telecentric lens and mirror optical layout splits the acquired image into 2 orthogonal viewing fields of the same lead tips of the QFP. The QFP is placed flat on a pedestal, and for any given side of the QFP, the first field views the lead tips from the front. The second field views the lead tips from the bottom of the IC package. Enhanced lead tip images are acquired by a lighting arrangement that casts illumination on the lead tips only. Electronic processing techniques are used to compute the geometry of the laeds such as global coplanarity, lead standoff and inspection of other lead defects.

Abstract: An inspection system determines if leads of a semiconductor device are in proper positions. Images from at least two sides of the semiconductor device are captured along with calibration marks formed in the side of a track upon which the semiconductor device is mounted. All leads and calibration marks are captured in a single video image, the images from one side of the semiconductor device being off set from the image from the other side.

Abstract: An illumination apparatus and method illuminates one or more reflective elements, such as solder balls on an electronic component or other protruding surfaces or objects. The illumination apparatus includes one or more arc shaped or arc shape arranged light sources that provides a substantially even illumination across the one or more reflective elements. An illumination detection device detects light beams reflecting off of the illuminated reflective elements for forming a reflected image. A method of processing the reflected image includes locating one or more points on each reflected image element representing an illuminated reflective element. The points on the reflected image elements are used to located the pattern of the reflected image elements and/or to fit an outline around each image element corresponding to a known percentage of the true dimensions of each solder ball or other reflective element.

Abstract: A computer vision apparatus and methods for automatically inspecting 2-dimensional (2D) and 3-dimensional (3D) criteria of objects using a single camera and laser sources. A camera views the object under inspection which is illuminated by a first source of light to highlight the region of interest. This provides image data for 2d analysis by a computer coupled to the system. Subsequently, multiple laser sources mounted on a positioner provide the illumination for collecting images for 3 dimensional analysis. A computer with a monitor is connected to the camera to perform the inspection and analysis and for operator supervision of the system. Specific implementations provided refer to embodiments for inspecting packaged semiconductor devices such as Ball-Grid Arrays (BGAs) packages and Quad Flat Packages (QFPs) packages for package mark inspection, package defect inspection, and solder ball or lead defects.

Abstract: A method and an apparatus for examining wafers includes a wafer cassette having a capacity for holding a plurality of wafers located on each of first and second locaters. The wafer cassettes are fixedly held on the first and second locaters during the wafer examination. A first indicator shows that the wafer cassettes are fixedly held on the first and second locaters. A robot arm sequentially carries each of the wafers between the first locator, an aligner, a scanning chamber and the second locater to examine the wafers. The wafer cassettes are released when the examination is complete, and a second indicator shows that the examination is complete.