Abstract: Provided is a control device for controlling an imaging condition of a sensor having one or more pixels, comprising an event detection unit for detecting an event indicating that a luminance signal changes in excess of a predetermined threshold value in one or more pixels, and for outputting an event detection signal; a counter for counting a number of events detected by the event detection unit; and a control unit for controlling the imaging condition of the sensor, based on the event detection signal. In addition, provided is a control method for controlling an imaging condition of a sensor having one or more pixels. The control method comprises detecting an event indicating that a luminance signal changes in excess of a predetermined threshold value in one or more pixels; counting a number of events; and controlling the imaging condition of the sensor, based on the detection of events.

Abstract: A photoelectric conversion device according to an embodiment of the present disclosure includes an avalanche photodiode, a pulse generation unit that converts an output from the avalanche photodiode into a pulse signal, a pulse count unit that counts the pulse signal and outputs a pulse count value, a time count unit that outputs a time count value indicating a time from the start of operation of the pulse generation unit, an output unit that, when the pulse count value does not exceed a threshold value, outputs the pulse count value, and when the pulse count value exceeds the threshold value, ends counting in the pulse count unit and outputs the time count value at the time of the pulse count value exceeding the threshold value, and a threshold calculation unit that calculates the threshold value using the time count value.

Abstract: To reduce power consumption in a solid-state image sensor that detects weak light. The solid-state image sensor includes a photodiode, a resistor, a measuring unit, and a control unit. The photodiode photoelectrically converts incident light and outputs a photocurrent. The resistor drops a potential of one end of the photodiode to a value lower than a power supply potential every time a photocurrent is output. The measuring unit measures illuminance of the incident light on the basis of a frequency of dropping of the potential of one end. The control unit controls the power supply potential to a lower value as the measured illuminance is higher.

Abstract: In a solid-state image sensor that detects an address event, the detection sensitivity for the address event is controlled to an appropriate value. The solid-state image sensor includes a pixel array unit and a control unit. In the solid-state image sensor, multiple pixel circuits are arranged in the pixel array unit, each detecting a change in luminance of incident light occurring outside a predetermined dead band as the address event. The control unit controls the width of the dead band according to the number of times the address event is detected in the pixel array unit within a fixed unit cycle.

Abstract: A system for image acquisition with reduced noise using SPADs is configured to perform a plurality of sequential exposure and readout operations. Each exposure and readout operation includes (i) applying a set of shutter operations to configure each SPAD pixel of the SPAD array to enable photon detection, and (ii) for each SPAD pixel of the SPAD array, reading out a number of photons detected during the set of shutter operations. The system is also configured to generate an image based on the number of photons detected for each SPAD pixel during each of the plurality of sequential exposure and readout operations.

Abstract: The present disclosure provides a time delay integration (TDI) sensor using a rolling shutter. The TDI sensor includes multiple pixel columns. Each pixel column includes multiple pixels arranged in an along-track direction, wherein two adjacent pixels or two adjacent pixel groups in every pixel column have a separation space therebetween. The separation space is equal to a pixel height multiplied by a time ratio of a line time difference of the rolling shutter and a frame period, or equal to a summation of at least one pixel height and a multiplication of the pixel height by a time ratio of the line time difference and the frame period. The line time difference of the TDI sensor is changeable without changing the separation space.

Abstract: An imaging device with low power consumption is provided. It includes a pixel capable of outputting difference data between two different frames, a circuit determining the significance of the difference data, a circuit controlling power supply, an A/D converter, and the like; obtains image data and then obtains difference data; and shuts off power supply to the A/D converter and the like in the case where it is determined that there is no difference, and continues or restarts the power supply to the A/D converter and the like when it is determined that there is a difference. Determining the significance of the difference data can be performed row by row in a pixel array or at nearly the same time in all the pixels included in the pixel array.

Abstract: A motor control system includes a first MCU and a second MCU. The first MCU includes an error detection unit, a resolver digital converter, and a first PWM generation unit. The resolver digital converter includes an encoder unit, which generates encoder pulses based on angle information and outputs the encoder pulses to the second MCU. The error detection unit outputs an error signal to the second MCU, when an error is detected in the first MCU. The first MCU controls the resolver digital converter to operate using a backup clock supplied from the second MCU.

Abstract: A smartphone includes a camera, a control section, and a storage section. The control section determines favorability of a composition of a target frame which is an arbitrary frame among a plurality of frames constituting the moving image. Then, in accordance with a result of determining the favorability of the composition of the target frame, the control section stores, in the storage section, a still image which corresponds to the target frame.

Abstract: A dynamic vision sensor includes a pixel unit, including a plurality of pixels outputting an activation signal in response to dynamic input, a first reading unit outputting a first signal, based on the activation signal, a second reading unit outputting a second signal, based on the activation signal, an event counter counting the number of events generated, based on the activation signal, and generating and outputting a selection signal, based on the number of events, and a selecting unit outputting one of the first signal and the second signal, based on the selection signal.

Abstract: An inspection system includes an illumination sub-system, a collection sub-system, and a controller. The illumination sub-system includes an illumination source configured to generate a beam of illumination and a set of illumination optics to direct the beam of illumination to a sample. The collection sub-system includes a set of collection optics to collect illumination emanating from the sample and a detector configured to receive the collected illumination from the sample. The controller is configured to acquire a test image of the sample, reconstruct the test image to enhance the resolution of the test image, and detect one or more defects on the sample based on the reconstructed test image.

Abstract: A device for imaging comprising an image sensor is disclosed. The image sensor includes rows and columns of pixels. The image sensor further includes a first control structure for controlling transfer of accumulated electric charges from photo-active regions to transmission regions in pixels. The image sensor further includes a second control structure for controlling transfer of accumulated charge in the transmission region of each row to the adjacent row below. The first and second control structures control the image sensor to alternately transfer accumulated charges in photo-active regions to the transmission regions and transfer charges to the adjacent row below. The control structure includes a plurality of row structures which are arranged to select whether the charge in the photo-active regions of respective rows are added to the transmission region. Each row of pixels is controlled by one of the row structures of the first control structure.

Abstract: A module for high speed image processing includes an image sensor for generating a plurality of analog outputs representing an image and a plurality of HDDs for concurrently processing the plurality of analog outputs. Each HDD is an integrated circuit configured to process in parallel a predetermined set of the analog outputs. Each channel of the HDD can include an AFE for conditioning a signal representing one sensor analog output, an ADC for converting a conditioned signal into a digital signal, and a data formatting block for calibrations and formatting the digital signal for transport to an off-chip device. The HDDs and drive electronics are combined with the image sensor into one package to optimize signal integrity and high dynamic range, and to achieve high data rates through use of synchronized HDD channels. Combining multiple modules results in a highly scalable imaging subsystem optimized for inspection and metrology applications.

Abstract: A method of operating an image sensor with a continuously moving object is described. In this method, a timed delay integration mode (TDI-mode) operation can be performed during an extended-time illumination pulse. During this TDI-mode operation, charges stored by pixels of the image sensor are shifted only in a first direction, and track the image motion. Notably, a split-readout operation is performed only during non-illumination. During this split-readout operation, first charges stored by first pixels of the image sensor are shifted in the first direction and second charges stored by second pixels of the image sensor are concurrently shifted in a second direction, the second direction being opposite to the first direction.

Abstract: A method of inspecting a sample at high speed includes directing and focusing radiation onto a sample, and receiving radiation from the sample and directing received radiation to an image sensor. Notably, the method includes driving the image sensor with predetermined signals. The predetermined signals minimize a settling time of an output signal of the image sensor. The predetermined signals are controlled by a phase accumulator, which is used to select look-up values. The driving can further include loading an initial phase value, selecting most significant bits of the phase accumulator, and converting the look-up values to an analog signal. In one embodiment, for each cycle of a phase clock, a phase increment can be added to the phase accumulator. The driving can be performed by a custom waveform generator.

Abstract: An inspection system for inspecting a surface of a wafer/mask/reticle can include a modular array. The modular array can include a plurality of time delay integration (TDI) sensor modules, each TDI sensor module having a TDI sensor and a plurality of localized circuits for driving and processing the TDI sensor. At least one of the localized circuits can control a clock associated with the TDI sensor. At least one light pipe can be used to distribute a source illumination to the plurality of TDI sensor modules. The plurality of TDI sensor modules can be positioned capture a same inspection region or different inspection regions. The plurality of TDI sensor modules can be identical or provide for different integration stages. Spacing of the modules can be arranged to provide 100% coverage of the inspection region in one pass or for fractional coverage requiring two or more passes for complete coverage.

Abstract: In various embodiments, a time-delay-and-integrate (TDI) image sensor includes (i) a plurality of integrating CCDs (ICCDs), arranged in parallel, that accumulate photocharge in response to exposure to light, (ii) electrically coupled to the plurality of ICCDs, a readout CCD (RCCD) for receiving photocharge from the plurality of ICCDs, and (iii) electrically coupled to the RCCD, readout circuitry for converting charge received from the RCCD into voltage.

Abstract: To provide a photodetector circuit capable of obtaining signals in different periods without being affected by characteristics of a photoelectric conversion element. The photodetector circuit has n signal output circuits (n is a natural number of 2 or more) connected to the photoelectric conversion element. Further, the n signal output circuits each include the following: a transistor whose gate potential varies in accordance with the amount of light entering the photoelectric conversion element; a first switching element which holds the gate potential of the transistor; and a second switching element which controls a signal output from the transistor. Thus, after data based on the amount of light entering the photoelectric conversion elements is held as the gate potentials of the transistors, the second switching elements are turned on, whereby signals in different periods can be obtained without being affected by characteristics of the photoelectric conversion element.

Abstract: A method for characterizing an optical focusing defect of an image capture instrument is based on contrast values. Said contrast values are calculated for two images of a same scene portion, captured in respective overlapping length segments of two image sensors. To this end, the sensors are mounted in an image capture instrument so that the overlapping length segments between the sensors are situated at different heights along a focusing direction perpendicular to said sensors.

Abstract: A system may include one or more camera modules each containing one or more image sensors. The system may be configured to capture images from light spectra outside the visible band. Therefore, the pixel integration times, and frame rates of the one or more image sensors may be unique and distinct. An image sensor may respond to a trigger control signal by beginning integration of a subset of pixels some duration after an appropriate trigger control signal transitions from low to high. The image sensor may output the frame captured by the pixels a predetermined duration after the trigger control signal transitions, to ensure a deterministic response. Pixels used to generate the image of a subsequent frame may begin integrating during the readout of the current frame. The pixels may be integrated for exactly their programmed integration time, even when the frame rate is varied.

Abstract: The invention relates to an image sensor with N rows of P active photosensitive pixels using MOS technology. The sensor comprises digitizing circuits organized with N rows of P processing circuits, each processing circuit of row rank i and of column rank j comprising a respective sampler for carrying out a correlated double sampling of the signals present on a column conductor of rank j and corresponding to the observation of an image dot over the same integration time for all the rows, and an analog-digital conversion means in order to supply digital values of the analog signals sampled. The sensor is particularly suited to operating in TDI (image scanning and integration) mode.

Abstract: An imaging device of the present invention, for taking and storing movies and still pictures, comprises an image sensor, an imaging processing section, and a control section for controlling exposure of the image sensor and controlling taking of an optical image, wherein the control section, when taking still pictures while shooting a movie, carries out exposure by dividing a time corresponding to a single frame of the movie into a plurality of times, applies processing by the imaging processing section to acquire a plurality of image data, performs positional alignment of the subject image of the plurality of image data and combines a plurality of image data, and stores as still picture data, and combines a plurality of image data without carrying out positional alignment of the subject image of the priority of image data and stores as a single frame of the movie data.

Abstract: The present invention relates to the field of design of analog digital hybrid integrated circuit. The object of the invention is to reduce ADC conversion rate thus further reducing power consumption of the sensor while not reducing line frequency of the CMOS-TDI. To this end, a digital domain accumulative CMOS-TDI image sensor with low power consumption is provided. It includes a pixel array of n+k lines multiplied m columns, a column parallel signal pre-processing circuit, a column parallel successive approximation (SAR) ADC, a column parallel digital domain accumulator, a column parallel divider, a timing control circuit and an output shift register, wherein n+k+1 coarse quantification memory units are provided to the column parallel digital domain accumulator for storage of coarse quantification results; and memory units for storage of n times of fine quantification results are also provided, thus realizing n stages of TDI signal accumulation after accumulation of n times of fine quantification results.

Abstract: The invention may be embodied in a time delay integration (TDI) based sensor wafer inspection system that introduces controlled blur into the sampled image to suppress high spectral frequencies and thereby mitigate the occurrence of aliasing in the sampled image. Image blur may be introduced in the scan direction by desynchronizing the image motion (scan rate) from the charge transfer rate within the TDI sensor (sample clock rate). The scan rate may be desynchronized from the TDI sample clock rate by altering the speed of wafer movement, the sample clock rate, or the magnification of the imaging optics. Image blur may be introduced in the cross-scan direction by imparting a small alignment difference between the direction of image motion (image scan direction) and the direction that charges transfer within the TDI sensor (sensor direction).

Abstract: An imaging system may include an image sensor having an array of image pixels. Each image pixel may include an electronic shutter for controlling when a photosensor in the image pixel accumulates charge. The electronic shutter may be operable in an open state during which charge is allowed to accumulate on the photosensor and a closed state during which charge is drained from the photosensor. The electronic shutter may be cycled through multiple open and closed states during an image frame capture. At the end of each open state, the charge that has been acquired on the photosensor may be transferred from the photosensor to a pixel memory element. By breaking up the total exposure time for a pixel during an image frame into shorter, non-continuous periods of exposure time, dynamic scenery image artifacts may be minimized while maintaining the desired total exposure time.

Abstract: The present invention relates to the field of design of analog digital hybrid integrated circuit. The object of the invention is to reduce ADC conversion rate thus further reducing power consumption of the sensor while not reducing line frequency of the CMOS-TDI. To this end, a digital domain accumulative CMOS-TDI image sensor with low power consumption is provided. It includes a pixel array of n+k lines multiplied m columns, a column parallel signal pre-processing circuit, a column parallel successive approximation (SAR) ADC, a column parallel digital domain accumulator, a column parallel divider, a timing control circuit and an output shift register, wherein n+k+1 coarse quantification memory units are provided to the column parallel digital domain accumulator for storage of coarse quantification results; and memory units for storage of n times of fine quantification results are also provided, thus realizing n stages of TDI signal accumulation after accumulation of n times of fine quantification results.

Abstract: Provided are a photoelectric conversion element, wherein the processing speed can be increased and resolution can be changed without increasing cost, and a defect inspecting apparatus and a defect inspecting method using the photoelectric conversion element. A photoelectric conversion element having a plurality of sensor pixels has a multiplexer and a plurality of horizontal transfer registers. Sensor pixels are divided into a plurality of blocks such that the sensor pixels correspond to each of the horizontal transfer registers. The photoelectric conversion element is configured such that charges of the blocks are read by means of the multiplexer via respective corresponding horizontal transfer registers, and are outputted via the multiplexer.

Abstract: A data processing device includes a clock converter, a data converter, and an error detector. The clock converter is configured to receive a first clock signal, convert the first clock signal into a second clock signal, and output the second clock signal. The data converter is configured to receive first data, convert the first data into second data using the second clock signal, and output the second data. The error detector is configured to check whether the first clock signal is in a first clock state or a second clock state upon the first data transitioning to a first data state, and output an enable signal to the clock converter upon determining that the first clock signal has transitioned to the first clock state from the second clock state.

Abstract: An image sensor for reducing a sampling time by shortening a stabilization duration is provided. The image sensor includes a pixel unit, a sampling unit sampling a signal from an output node of the pixel unit, a sinking unit sinking current from the output node of the pixel unit, and a current controller controlling the amount of current in the sinking unit.

Abstract: A focal plane staring sensor is provided that includes an M×N sensor, where M is a number of rows of sensor pixels in the sensor and N is a number of columns of sensor pixels in the sensor, where M and N are integers greater than one. A control circuit samples in each sensor pixel value for each sensor pixel of the M×N sensor at a plurality of different integration times corresponding to an amount of time that a photonic charge can be acquired in each sensor pixel of the M×N sensor, wherein the control circuit selects in each sensor pixel one sample from a set of samples to generate a scaled value to facilitate an equalization of a signal to noise ratio between the sensor pixels.

Abstract: In various embodiments, an image sensor and method of using an image sensor are described. In an example embodiment, the image sensor comprises a semiconductor substrate and a plurality of pixel regions with each pixel region comprising an optically sensitive material over the substrate and positioned to receive light. There is a bias electrode for each pixel region, with the bias electrode configured to provide a bias voltage to the optically sensitive material of the respective pixel region. Also included is a pixel circuit for each pixel region with each pixel circuit comprising a charge store formed on the semiconductor substrate and a read out circuit, the charge store being in electrical communication with the optically sensitive material of the respective pixel region.

Abstract: A system for creating a contiguous digital image of a fluorescence microscope sample. In an embodiment, the system comprises a both a macro camera and a time delay integration (TDI) line scan camera. The system may also comprise a motorized stage, an illumination module, a light source, an excitation filter, an objective lens, an emission filter, and at least one processor configured to assemble a plurality of digital images of portions of the fluorescence microscope sample, generated by the TDI line scan camera, into a contiguous digital image of at least a portion of the fluorescence microscope sample.

Abstract: An image capturing apparatus comprises an optical system, an image sensor having pixels each including a plurality of photoelectric converters capable of outputting image signals independently, a driving unit which controls driving of the image sensor, a focus detection unit, and an addition unit which adds the output image signals on a per-pixel basis. In each pixel, the photoelectric converters are divided into groups each including at least two photoelectric converters and a charge accumulation period for one group is delayed from and partially overlaps a charge accumulation period for another. The driving unit drives the image sensor so that image signals are read from the groups in turn, and the focus detection unit detects a focus state using a phase difference method based on the read image signals independently output from the photoelectric converters.

Abstract: A module for high speed image processing includes an image sensor for generating a plurality of analog outputs representing an image and a plurality of HDDs for concurrently processing the plurality of analog outputs. Each HDD is an integrated circuit configured to process in parallel a predetermined set of the analog outputs. Each channel of the HDD can include an AFE for conditioning a signal representing one sensor analog output, an ADC for converting a conditioned signal into a digital signal, and a data formatting block for calibrations and formatting the digital signal for transport to an off-chip device. The HDDs and drive electronics are combined with the image sensor into one package to optimize signal integrity and high dynamic range, and to achieve high data rates through use of synchronized HDD channels. Combining multiple modules results in a highly scalable imaging subsystem optimized for inspection and metrology applications.

Abstract: A camera adapted for taking pictures of a moving scene is disclosed. The camera includes an imaging array, a plurality of charge-coupled device (CCD) shift registers, and a controller. The imaging array includes a plurality of CMOS pixel sensors organized as a plurality of columns and rows. The image moves in the column direction. One CCD shift register corresponds to each of the columns. Each CMOS pixel sensor includes a first transfer gate that transfers charge accumulated in the pixel sensor to a corresponding cell in the CCD shift register. The controller controls the CCD shift registers such that charge stored in a first cell in a CCD shift register is moved to a second cell in the CCD shift register where the charge is combined with charge accumulated by the pixel sensor that is connected to the second cell, the combined charge being generated from the same image pixel.

Abstract: A time-delay-integration image sensor comprises a matrix of pixels organized in rows and columns. Each pixel comprises a first photosensitive element, a storage node and a first transfer element connected between the first photosensitive element and the storage node, Each pixel further comprises a second photosensitive element, a second transfer element connected between the second photosensitive element and the storage node, and a third transfer element connected between the storage node and the second photosensitive element of an adjacent pixel of the column. A control circuit is configured to simultaneously command the first and second transfer elements to on state and the third transfer element to off state, and, in a distinct phase, to simultaneously command the first and third transfer elements to on state and the second transfer element to off state.

Abstract: A method for continuously generating a (grayscale) map of a scene in electronic form, characterized by high time resolution and minimal data volume, is presented. The method involves repeated measurement of the instantaneous exposure of the image elements in an image sensor, the start of every exposure measurement being determined autonomously and asynchronously by every image element independently, and hence the redundancy which is typical of synchronous image sensors in the image data to be transmitted being largely suppressed. The stimulation for the purpose of exposure measurement is provided by the autonomous detection of a relative light intensity change in the scene detail which the image element views, by the transient detector in the respective image element. To increase the signal-to-noise ratio and the dynamic range, the exposure measurement is preferably performed on the basis of time, that is to say the exposure of an image element is represented by the period between two asynchronous events.

Abstract: A photographing apparatus and method. The apparatus including: an image pickup unit configured to capture an image of a subject to create image data; a image pickup unit controller configured to set a photographing time that is longer than an exposure time required for photographing the subject, and configured to divide the overall photographing time into a plurality of unit photographing times, and configured to control the image pickup unit to sequentially perform a plurality of unit photographing operations corresponding to the plurality of unit photographing times to create unit images; a storage unit; a user inputting unit; an image synthesis unit configured to sum up the image data of the unit images to create preparatory images and configured to sum up the unit images of a preparatory image to create a final image; and a display unit configured to display the preparatory images and the final image.

Abstract: A module for high speed image processing includes an image sensor for generating a plurality of analog outputs representing an image and a plurality of HDDs for concurrently processing the plurality of analog outputs. Each HDD is an integrated circuit configured to process in parallel a predetermined set of the analog outputs. Each channel of the HDD can include an AFE for conditioning a signal representing one sensor analog output, an ADC for converting a conditioned signal into a digital signal, and a data formatting block for calibrations and formatting the digital signal for transport to an off-chip device. The HDDs and drive electronics are combined with the image sensor into one package to optimize signal integrity and high dynamic range, and to achieve high data rates through use of synchronized HDD channels. Combining multiple modules results in a highly scalable imaging subsystem optimized for inspection and metrology applications.

Abstract: An image sensor comprising a row of light sensors registering incident light as electric signals, and a shift register including first and second register places per each light sensor is used for recording frames in fast succession. The image sensor allows for transferring the electric signals from the light sensors to the respective first register places and for shifting the electric signals on selected ones of the first and second register places forward in the shift register. After a first exposure time, the electric signals from each of a plurality of pairs of neighboring light sensors are added on one register place. After a second exposure time, the electric signals from each of the same pairs of neighboring light sensors are added on one register place located between two of the register places on which added electric signals from the first exposure time are present.

Abstract: A method for operating a focal plane array in a Time Delay Integration (TDI) mode, the method including: shifting a number of rows during TDI integration, wherein the number of rows shifted is less than a total number of rows of the focal plane array; and reading out a number of rows equal to the total number of rows of the focal plane array minus the number of rows shifted, leaving behind the partially-integrated rows.

Abstract: Imaging systems may include an image sensor and processing circuitry. An image sensor may include a pixel array having rows and columns. The array may include short and long-exposure groups of pixels arranged in a zig-zag pattern. The short-exposure group may generate short-exposure pixel values in response to receiving control signals from control circuitry over a first line and the long-exposure group may generate long-exposure pixel values in response to receiving control signals from the control circuitry over a second line. The processing circuitry may generate zig-zag-based interleaved high-dynamic-range images using the long and short-exposure pixel values. If desired, the array may include short and long-exposure sets of pixels located in alternating single pixel rows. The processing circuitry may generate single-row-based interleaved high-dynamic-range images using pixel values generated by the short and long-exposure sets.

Abstract: An integrated circuit for generating image data comprises a focal-plane array of unit cells, a controller, and a memory structure having a plurality of storage locations. Each unit cell may store charge based on detected photons. The controller may read a value based on the stored charge from at least some of the unit cells, and either add the read value to an existing value in the corresponding storage location when operating in frame-sum mode, or add the read value to an existing value in a shifted storage location when operating in time-delay integration (TDI) mode. This may allow faint objects as well as objects moving in the field-of-view of the focal-plane array to be observed. The integrated circuit may be fabricated from radiation-hardened CMOS technology and may be a layer of a sensor chip assembly.

Abstract: An imaging device includes an image capturing unit configured to capture an optical image of a corresponding one of pixels included in a screen, and the image capturing unit of part of the pixels in the screen includes an adjustment unit which contains an electric field responsive material and is configured to adjust a transmittance of light by the electric field responsive material, and a light-receiving unit configured to receive the light for which the transmittance has been adjusted by the adjustment unit.

Abstract: An inspection system includes a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing an inspection output representing an object to be inspected. A defect analyzer is operative to receive the inspection output and to provide a defect report.

Abstract: The invention relates to image sensors of scanner type observing one image line at a time. According to the invention, only two lines of pixels are used, operating in TDI mode (summation of the charge of two pixels seeing the same image point successively) but using active pixels with a charge-voltage conversion within the pixel. The pixels of like rank of the two lines each use a photodiode and a charge storage node with a transfer gate adjacent to the photodiode and to the storage node for transferring the charge accumulated in the photodiode to the charge storage node. The storage node is shared between the two pixels of like rank, and the charge of the two photodiodes is transferred successively into this node before the reading of the potential taken by the node. The time interval which separates the two charge transfers corresponds substantially to the time which separates the transit of an image line past the first line of pixels and then past the second.

Abstract: Imaging systems may be provided with stacked-chip image sensors. A stacked-chip image sensor may include a vertical chip stack that includes an array of image pixels and processing circuitry. The image pixel array may be coupled to the processing circuitry through an array of vertical metal interconnects. The image pixel array may be partitioned into image pixel sub-arrays configured to capture image data using one or more integration times. The processing circuitry may determine motion information for the image data captured by each pixel sub-array and may determine integration times for each pixel sub-array. The pixel sub-arrays may capture additional image data using the determined integration times. The additional image data may be combined to generate final image frames having short integration pixel values and long integration pixel values. The processing circuitry may output the final image frames to off-chip image processing circuitry.

Abstract: Time delay and integration sensor comprising a matrix of photosensitive pixels organized in rows and columns. Each pixel of a column comprises a photosensitive element, a storage node, and a first transfer transistor connecting the photosensitive element to the storage node. Each pixel of a column, except for the last one, further comprises a second transfer transistor which connects the storage node of the pixel to the photosensitive element of the next pixel of the column. The two transfer transistors are connected to be active at the same time. With such a configuration, it is possible to define a sliding group of several consecutive pixels in a column, to expose the group of pixels, to aggregate the information of the pixels of the group, and to start again after shifting the group of pixels by one pixel.

Abstract: An inspection system includes a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing an inspection output representing an object to be inspected. A defect analyzer is operative to receive the inspection output and to provide a defect report.

Abstract: In a solid state image sensor having a pixel array, a first frame is imaged using varying exposure times in a series of zones. The exposure time for a subsequent frame is selected from the results of the first frame, The exposure times are controlled in a rolling blade manner by controlling the number of lines between reset and readout. The sensor is particularly suited to use in bar code readers.