Abstract: An apparatus and method for acquiring image data from a scanned, multi-bank time-delay and integrate (TDI) focal plane array (FPA) detector. Specifically a method and apparatus for warping and combining sequentially-acquired image data of a scene portion from multiple TDI detector banks into a single image having improved image quality, thereby providing improved FPA sensitivity. Also, a method and apparatus for enabling sensitivity and areal rate trade-offs in a multi-bank, scanning TDI FPA based on the number of TDI banks being used for sequential imaging of the same scene portion.

Abstract: An time-delay-integration image sensor comprises a matrix of photosensitive pixels organized in rows and columns, a first matrix of memory cells associated with control and adding means to store accumulated brightness levels of several rows of pixels in a row of memory cells. The first memory cell matrix is provided with the control and adding means to store in its rows accumulated brightness levels of the rows of a first half of the pixel matrix. The sensor comprises a second memory cell matrix associated with the control and adding means to store accumulated brightness levels of the rows of the second half of the pixel matrix in a row of the second memory cell matrix. Means are provided for adding the levels accumulated in a row of the first memory cell matrix to the levels accumulated in a corresponding row of the second memory cell matrix.

Abstract: A time delay integration (TDI) sensor (22) comprises a sequence of cells (42, 44, 42, 44) numbered 1 to N. The TDI sensor is configured for transferring a charge from the cell numbered 1 via the cells numbered 2 to N?1 to the cell numbered N. Each cell (42; 44) in the sequence of cells is either sensitive or insensitive in the sense that when the TDI sensor (22) is evenly illuminated by light (46) having a first spectrum, the intensity of the light (46) incident on any of the insensitive cells (44) is at most 90% of the intensity of the light (46) incident on any of the sensitive cells (42). The sequence of cells (42, 44, 42, 44) comprises, in this order: a first sensitive cell (42), at least one insensitive cell (44), and a second sensitive cell (42). An imaging system comprising a TDI sensor and a method of imaging an object are also disclosed.

Abstract: In various embodiments, a time-delay-and-integrate (TDI) image sensor includes (i) a plurality of integrating CCDs (ICCDs), arranged in parallel, that accumulate photocharge in response to exposure to light, (ii) electrically coupled to the plurality of ICCDs, a readout CCD (RCCD) for receiving photocharge from the plurality of ICCDs, and (iii) electrically coupled to the RCCD, readout circuitry for converting charge received from the RCCD into voltage.

Abstract: A device and method for continuous vertical clocking a charge-coupled device image sensor operating in a time delay and integration and binning mode of operation is disclosed. The method includes providing a charge-coupled device image sensor with a continuous charge transfer signal to a vertical charge-coupled device register for shifting charge continuously to more closely approximate the speed of movement of the target object of capture by the image sensor in order to eliminate artifacts in the TDI imaging direction. The control module of the CCD image sensor provides the continuous charge transfer signal to the vertical charge-coupled device register.

Abstract: Imaging devices and techniques that utilize multiple optical detectors are described and, in particular, imaging geometries for imaging devices that include three or more optical detectors with overlapping fields of regard. The imaging geometries are determined and provided in consideration of one or more performance criteria evaluated over multiple different operating conditions for a process of generating a reconstructed image from the captured images. Imaging systems and methods utilizing the imaging geometries are also described.

Abstract: An imaging system may include an imager with pixels and with reset lines that can be selectively deactivated and floated. When the reset lines are deactivated and floated, the reset lines may be connected to floating diffusion nodes in the pixels to increase the capacitance of the floating diffusion nodes. The reset lines may have parasitic capacitances that are used to supplement the capacitances of the floating diffusion nodes, when the reset lines are connected to the floating diffusion nodes. The imager may be used to capture high dynamic range images by simultaneously capturing a first image with a long integration time and a second image with a short integration time. The first and second images may be combined into a high dynamic range image.

Abstract: In certain embodiments, compensating for misalignment comprises receiving, at a detector array, electromagnetic (E-M) radiation from a target object. The detector array comprises time delay and integration (TDI) detectors organized into segments. Each segment comprises one or more rows of detectors perpendicular to a designed scan axis, and comprises columns of detectors parallel to the designed scan axis. The detector array moves in a relative scan direction relative to the target object. The following is performed for each segment and for each column of each segment. If there is misalignment at a segment, a signal is passed to a correcting next column of a next segment in the direction of the misalignment, where the signal accumulates scan data of a portion of the target object. Otherwise, the signal is passed to a designed next column of the next segment in the direction of the designed scan axis.

Abstract: An inspection system includes a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing an inspection output representing an object to be inspected. A defect analyzer is operative to receive the inspection output and to provide a defect report.

Abstract: A continuously-arranged sensor system is provided that can eliminate a shift in timing between a determination signal of each sensor unit and sensor information relating to the determination signal. The continuously-arranged sensor system includes a network unit and a plurality of sensor units, which are connected by a serial transmission line and a parallel transmission line. In accordance with a command sent from the network unit, each sensor unit transmits the determination signal and the sensor information, provided at the same time as the determination signal, to the network unit via the serial transmission line. Therefore, the network unit can obtain the determination signal and the sensor information exhibited at the same time.

Abstract: An inspection system includes a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing an inspection output representing an object to be inspected. A defect analyzer is operative to receive the inspection output and to provide a defect report.

Abstract: An integrated application specific integrated circuit having a detection layer, a time delayed integration capability, data acquisition electronics, and a readout function is provided for detecting breast cancer in women. The detection layer receives x-ray radiation and converts the received energy to electron pairs, one of which is received by pixels. The time delay integration is on the chip and a part of the readout architecture. The detector may be a hybrid silicon detector (SiPD), a CdZnTe detector, or a GaAs detector.

Abstract: Circuits and methods of generating control signals for transistors in a pixel row of a pixel array are disclosed. The circuits include a transfer transistor control signal row driver that includes a plurality of output branches and a reset transistor control signal row driver that includes a plurality of output branches. The row drivers output positive boosted control signals to selected pixel rows during a photosensor-to-floating diffusion region charge transfer phase and during a floating diffusion region reset phase and to unselected pixel rows during an initial part of an integration phase. The row drivers output positive non-boosted control signals to unselected non-integrating pixel rows.

Abstract: A time delay integration (TDI) sensor (22) comprises a sequence of cells (42, 44, 42, 44) numbered 1 to N. The TDI sensor is configured for transferring a charge from the cell numbered 1 via the cells numbered 2 to N-1 to the cell numbered N. Each cell (42; 44) in the sequence of cells is either sensitive or insensitive in the sense that when the TDI sensor (22) is evenly illuminated by light (46) incident on any of the insensitive cells (44) is at most 90% of the intensity of the light (46) incident on any of the sensitive cells (42). The sequence of cells (42, 44, 42, 44) comprises, in this order: a first sensitive cell (42), at least one insensitive cell (44), and a second sensitive cell (42). An imaging system comprising a TDI sensor and a method of imaging an object are also disclosed.

Abstract: A timing signals generator, a frequency divider, an oscillator, and a signals processing IC generates driving signals and transfer signals of a CCD. When the CCD is exposed through a long time exposure in which exposure is performed for not less than a predetermined time, each of a clock frequency of driving signals during an exposure period and a clock frequency of each of driving signals and transferring signals during a transferring period is adjusted to be lower than a clock frequency of thereof in an exposure state in which exposure is performed for less than the predetermined time period.

Abstract: The disclosure relates to a process of controlling a pixel cell of an image sensor of the CMOS type, comprising the steps of: initializing a sense node and a read node of the pixel cell; partially transferring electrical charges accumulated at the sense node to the read node; completely evacuating electrical charges accumulated at the read node; partially transferring electrical charges accumulated at the sense node to the read node; measuring the electrical charges accumulated at the read node to obtain a pixel signal corresponding to a quantity of electrical charges accumulated during a short integration period; completely transferring electrical charges accumulated at the sense node to the read node, without a prior initialization of the read node, and measuring the electrical charges at the read node to obtain a pixel voltage corresponding thus to the sum of the electrical charges accumulated during the short and long integration periods.

Abstract: The following configuration is preferable for providing a digital broadcast-enabled recording and reproducing device involving no lip-sync error and offering good usability. For example, the recording and reproducing device includes a receiver that receives digital broadcast data, a video/audio signal generator that generates a video signal and an audio signal included in the digital broadcast data received by the receiver, an image processing unit that executes image processing of the video signal input from the video/audio signal generator; and a delay unit that receives the audio signal generated by the video/audio signal generator to adjust time lag between the received audio signal and the video signal processed by the image processing unit.

Abstract: In an imaging apparatus according to the present invention, the driving unit drives each of the pixels in the non-readout region in the first mode such that the setting unit sets the input unit to a third electric potential with the transfer unit being ready to transfer the electric charge to reset the photoelectric conversion unit in a first period and that the setting unit sets the input unit to a fourth electric potential for the pixel to be deselected in a second period later than the first period.

Abstract: A solid-state imaging device includes: a plurality of pixels arranged in a matrix, the matrix defining columns of the pixels, and each of the pixels outputting an analog signal by performing photoelectric conversion; an analog-digital converter provided for each of columns which sequentially converts a plurality of analog signals outputted from the pixels in a column into a plurality of digital signals; a memory circuit provided for each column which includes memories and performs, in parallel, a process of storing a one of the digital signals in one of the memories and a process of outputting another of the digital signals previously stored in another of the memories; and data buses connected to the memory in each column.

Abstract: In certain embodiments, compensating for misalignment comprises receiving, at a detector array, electromagnetic (E-M) radiation from a target object. The detector array comprises time delay and integration (TDI) detectors organized into segments. Each segment comprises one or more rows of detectors perpendicular to a designed scan axis, and comprises columns of detectors parallel to the designed scan axis. The detector array moves in a relative scan direction relative to the target object. The following is performed for each segment and for each column of each segment. If there is misalignment at a segment, a signal is passed to a correcting next column of a next segment in the direction of the misalignment, where the signal accumulates scan data of a portion of the target object. Otherwise, the signal is passed to a designed next column of the next segment in the direction of the designed scan axis.

Abstract: A method and apparatus for propagating charge through a sensor and implementation thereof is provided. The method and apparatus may be used to inspect specimens, the sensor operating to advance an accumulated charge between gates of the TDI sensor. The design implementation provides a set of values representing a plurality of out of phase signals, such as sinusoidal or trapezoidal signals. These out of phase signals are converted and transmitted to the sensor. The converted signals cause the sensor to transfer charges in the sensor toward an end of the sensor. Aspects such as feed through correction and correction of nonlinearities are addressed.

Abstract: A signal processing system distributes an input signal over a plurality of shaped signal distribution structures that are interconnected with a plurality of shaped signal pickup units. The signal distribution structures and/or the signal pickup units include delay lines. The shape of the signal distribution structures and the shape of the signal pickup units and the configuration of the interconnections between the shaped structures and the pickup units determine the type of analysis performed on the signals. The signal possessing is distributed across the shaped structures. Input information is diffracted or spread, such that statistical correlations can be found by reconverging the diffracted information. Signals propagated through the system can be a combination of analog, digital and pulse signals. Optionally, feedback is used to amplify or attenuate earlier stages, such that outputs or actions are based on the relative importance of the input signals.

Abstract: An inspection system includes a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing an inspection output representing an object to be inspected. A defect analyzer is operative to receive the inspection output and to provide a defect report.

Abstract: A time delay integration (TDI) based MOS photoelectric pixel sensing circuit (TDIPSC) is proposed. The TDIPSC includes multi-element photoelectric pixel sensor (MEPS) having sub-pixel sensor elements SPSE1, . . . , SPSEM respectively converting a portion of pixel light into sub-pixel photoelectric signals (SPPES1, . . . , SPPESM). The TDIPSC also includes intermediate photoelectric signal accumulators (PESA1, . . . , PESAM) where any PESAk can be switchably coupled to any SPSEj via switching transistors for receiving a corresponding SPPESj from it and accruing an accumulated photoelectric signal ACPESk. A readout circuit (ROC) switchably coupled to any PESAk serves to remove and read the ACPESk. A TDI-sequence controller (TDISC) coupled to the SPSEs, the PESAs and the ROC executes a time sequence of cyclic coupling among them. The TDISC produces, via the ROC, a final time signal SQTS equal to the time delayed summation of the (SPPES1, . . . , SPPESM) with a reduced SNR.

Abstract: A patterned TDI sensor comprising an array of pixels having respective sensitivities to light that varies according to a periodic pattern across said array of pixels, for high throughput applications of imaging and measurement with patterned illumination such as structured illumination, Moire techniques, 3D imaging and 3D metrology. An object is measured by scanning the object with illumination that varies periodically across the object, imaging the object with a patterned TDI sensor having a repetition length matched with the repetition length of the illumination and analyzing the output signal of the TDI sensor to extract information such as height or image of the object.

Abstract: Vertical and horizontal smear in images produced by a CCD imager can be compensated for by detecting the boundaries of the smear and substituting data from an alternative part of the image, or interpolated data within those boundaries. Vertical, or frame transfer, smear can also be compensated for by producing an error signal from charge accumulated during frame transfer and corresponding to one or more masked rows of the CCD imager. This error signal can be subtracted from the line signals corresponding to each row of the CCD images receiving radiation during image acquisitions. The CCD imager includes a multiplication register. The dynamic range of the imager may be extended by varying the gain of the multiplication register, for example on a line-by-line or frame-by-frame basis.

Abstract: A solid-state imaging device for high-speed photography includes an imaging element area in which a plurality of pixel portions having photodetectors for photography are disposed in a matrix form. The solid-state imaging device generates image data by capturing pixel information obtained from the photodetectors for photography. The solid-state imaging device for high-speed photography further includes: a change detection element that detects a change in an amount of incident light, which is disposed in the imaging element area or at a predetermined position surrounding the imaging element area; and a controller that controls starting or stopping of capturing of pixel information obtained from the photodetectors for photography in accordance with a trigger signal based on a detection signal output from the change detection element.

Abstract: The present invention relates to imaging systems that generally include at least a first substrate, on which a charge coupled device imaging sensor array is formed, and a second substrate on which readout circuitry is formed. Information related to the amount of light incident on pixels included in the imaging sensor array is passed to the readout circuitry as a voltage signal over an interconnection between the imaging sensor array and the readout circuitry. Accordingly, the readout circuitry may sample the output of the imaging sensor array multiple times. The system allows different processes to be used for forming the imaging sensor array and the readout circuitry, while also supporting multiple samples of information provided by the imaging sensor array.

Abstract: A drive mode is switched after readout for one frame is completed, and the reset operation for the following frame is started. In this manner, the reset operation for the following frame will not be performed during the readout period for the preceding frame. Therefore, the accumulation period for the following frame can be made consistent in that frame.

Abstract: In certain embodiments, an imaging device includes an image sensor that includes a detector array. The detector array includes a plurality of detectors operable to receive a charge generated by light. The detector array also includes a plurality of detector sub-arrays each including one or more of the plurality of detectors. The one or more detectors of each detector sub-array are in a time delay and integration (TDI) configuration. The image sensor of the imaging device is operable to, for each of the plurality of detector sub-arrays of the detector array, generate an image signal corresponding to a scan of an object.

Abstract: A circuit for generating a timing signal, the circuit having a memory and a pulse generator, the timing signal consisting of a number of pulses. The memory stores pulse count data, including an indication of the number of pulses in the timing signal, and rising edge and falling edge position data of the timing signal. The pulse generator produces the timing signal in accordance with the pulse count data and has a first circuit for generating rising edge signals, a second circuit for generating falling edge signals, an active control circuit for setting, in correspondence only with the pulse count data, corresponding rising edge signals as active state rising edge signals, and corresponding falling edge signals as active state falling edge signals, and a third circuit for generating said timing signal corresponding to the active state rising edge signals and the active state falling edge signals.

Abstract: A time delayed integration image sensor provides over-sampled image data on a time-shared column bus to maintain data synchronization.

Abstract: Provided is an image sensor capable of outputting an image signal in accordance with a data loading position of a signal processing IC. In the image sensor that can arbitrarily select the start position of an output signal of a first photoelectric conversion element, a first input terminal of a scanning circuit of a photoelectric conversion circuit is connected to a selector circuit of a signal start position, and the selector circuit is controlled by a start signal through a start signal terminal and a delay circuit according to an external control signal.

Abstract: A method and apparatus for propagating charge through a time division and integration (TDI) sensor is provided. The method and apparatus may be used with the TDI sensor to inspect specimens, the TDI sensor operating to advance an accumulated charge between gates of the TDI sensor. The design comprises controlling voltage waveform shapes for waveforms advancing the accumulated charge between gates in a substantially nonsquare waveform, such as a composite, sinusoidal, or other shaped waveform. Controlling voltage waveform shapes operates at different voltage phases in adjacent gates to provide a substantially de minimis net voltage.

Abstract: An image sensor includes a plurality of pixels for capturing an image; a sample and hold circuit array having a plurality of units for receiving signals from the plurality of pixels representing the captured image; a decoder for selecting each of the units of the sample and hold circuit array for output; and a delay circuit that includes an adjustable time delay to the decoder for compensating for time delays.

Abstract: A series of time delay integration TDI stages each integrate a photocurrent from a separate detector such as detectors in an array. In a first stage 20, a first integrator is initialized with a fixed bias 30, and integrates a signal from a first detector 22 during a first time interval. Next, a reset switch 26n causes that integrated first detector signal to bias a second integrator 24n. During a second integration interval, the second integrator integrates a signal from a second detector 22n. Multiple stages may be arranged in series so that an integrated signal from a previous stage biases an integrator in the current stage. At a final stage, an Nth integrator outputs the resulting signal Vfinal. Any bias used to initialize the first integrator is removed from Vfinal to achieve a total integrated signal from the detectors. A bi-directional switch 38 at each stage enables a forward or backward scan of the detectors.

Abstract: An electron beam apparatus comprises a TDI sensor 64 and a feed-through device 50. The feed-through device has a socket contact 54 for interconnecting a pin 52 attached to a flanged 51 for separating different environments and the other pin 53 making a pair with the pin 52, in which the pin 52, the other pin 53 and the socket contact 54 together construct a connecting block, and the socket contact 54 has an elastic member 61. Accordingly, even if a large number of connecting blocks are provided, the connecting force may be kept to such a low level as to prevent the breakage in the sensor. The pin 53 is connected with the TDI sensor 64, in which a pixel array has been adaptively configured based on the optical characteristic of an image projecting optical system. That sensor has a number of integration stages that can reduce the field of view of the image projecting optical system to as small as possible so that a maximal acceptable distortion within the field of view may be set larger.

Abstract: An address generator that generates, in an image capturing device including a photoelectric conversion unit having arrayed therein in a matrix plural photoelectric conversion elements that convert received light into charges and accumulate the charges and a rolling shutter function, an address indicating a line position of each of the photoelectric conversion elements that are processing objects of readout processing and reset processing for accumulated charges includes address counters provided at least in a number same as a number of time divisions of the readout processing and the reset processing, a control unit that independently controls an operation of each of the address counters, a selecting circuit that sequentially selects each of the address counters in a time division manner and outputs a count value of the selected address counter to an address decode circuit as the address, and the address decode circuit that outputs a signal for changing the photoelectric conversion element in a line position

Abstract: An inspection system includes a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing an inspection output representing an object to be inspected. A defect analyzer is operative to receive the inspection output and to provide a defect report.

Abstract: In a digital camera 1, when a lagged-timing is recorded (Yes at Step S9), from the frame image picked up when the shutter is fully depressed, a frame image picked up at a timing equivalent to the lagged-timing is displayed (Step S10). When the cross-shaped key is operated before the SET key is operated, the displayed frame image is changed based on the operation (Step S12 and Step S13). Next, when the SET key is operated, the displayed frame image is recorded. In addition, a lag between the timing at which the recorded frame image is picked up and the timing at which the frame image picked up when the shutter is fully depressed is picked up is recorded (Step S15).

Abstract: Scanning type device for detection of a photonic flux emitted by a scene containing at least one acquisition channel (V) comprising: several useful detectors (1) aligned with the scanning, each associated with a preamplifier (2), each receiving the same fraction of photonic flux from the scene and supplying information to the preamplifiers, a time delay integration device (4), integrating signals emitted by preamplifiers. The channel (V) cooperates with at least one calibration device (8) comprising: a calibration detector (9) on the input side of the useful detectors (1), receiving the fraction of photonic flux before the detectors (1), a device for generating a stimulus (11) from a fraction of the flux, and with at least one stimulus distribution device (13) for applying it to preamplifiers (2) before they have received the information from the associated useful detectors. Application particularly to imagery or to spectrometry.

Abstract: A time delayed integration image sensor provides over-sampled image data on a time-shared column bus to maintain data synchronization.

Abstract: An imaging system controller (5) outputs a control signal (VC). The control signal (VC) gives a command to output driving clocks (?Vn, ?Hm) of an imaging element (1) in a signal transmission period, and a command to suspend output of the clocks (?Vn, ?Hm) in an idle period subsequent to the signal transmission period. The length of the idle period is a multiple of the length of the signal transmission period by a natural number. The imaging system controller (5) periodically repeats output of the control signal (VC) giving these commands a number of times corresponding to the number of horizontal lines of the imaging element (1). In response to the commands of the control signal (VC), a timing generator (2) generates and outputs the clocks (?Vn, ?Hm), and suspends generation and output of the same. An imaging device (10) thereby intermittently drives the imaging element (1), to generate and output a picked-up image signal (V2).

Abstract: A flicker detection apparatus takes in a plurality of images having different shutter times from the image sensing element and judges whether flicker occurs or not based on a variation of flicker components extracted from these images so that the accuracy of flicker detection on picking up a normal image can be improved.

Abstract: The present invention implements an automated blank time function, which calculates a horizontal and/or a vertical blank time for a desired integration time and window size. Input data and control signals for predetermined integration time and window size are provided to a register interface, which generates configuration signals. The configuration signals are applied to machines, which generate reset control signals and read control signals from the configuration signals for controlling the imager.

Abstract: Imaging techniques and devices for performing time-delayed integration based on active pixel sensors. An integrator array is integrated on the chip with the active pixel sensors to perform correlated double sampling and the signal summing based switching capacitor banks.

Abstract: Methods and apparatus for imaging spectral lines are disclosed. Spectral lines are imaged using an imager that includes photosensitive cells. The photosensitive cells are arranged to form channels including banks of photosensitive cells. Horizontal blooming barriers and drains are coupled to one or more of the banks to limit accumulated charge in the banks such that the amount of charge accumulated and retained in at least one subsequent bank is incrementally increased. Charge is accumulated for spectral lines that are received by the channels to image those spectral lines.

Abstract: A TDI sensor includes a first readout register and a plurality of sensor columns. The first readout register includes a plurality of first readout register elements. A first sensor column includes a photogate and a diode photodetector at an end. The diode photodetector is either a photodiode or a pinned photodiode. The photogate is coupled through the diode photodetector and from there through a transfer gate to a corresponding readout register element.

Abstract: An inspection system includes a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing an inspection output representing an object to be inspected. A defect analyzer is operative to receive the inspection output and to provide a defect report.

Abstract: A circuit includes a circuit chip and a plurality of clock drivers external to the circuit chip. The circuit chip includes a plurality of isolated clocking subunits and a corresponding plurality of terminals. Each clocking subunit is electrically isolated from any other clocking subunit. Each clocking subunit is coupled to a respective terminal. For each of the plurality of terminals, an output from one and only one clock driver of the plurality of clock drivers is coupled to the corresponding terminal of the plurality of terminals, and inputs of all clock drivers are coupled together.