Abstract: Automatic selection of region in 3D point cloud is provided. Neighbor points are determined for given seed point of seed points. Responsive to a color difference of a given neighbor point from given seed point being less than neighbor color distance threshold and responsive to an angle between a normal of given neighbor point and a normal of given seed point being less than neighbor normal angle threshold, given neighbor point is added to region in 3D point cloud. Responsive to curvature at given neighbor point being less than curvature threshold, responsive to color difference of given neighbor point from initial seed point being less than initial seed color distance threshold and responsive to an angle between a normal of given neighbor point and a normal of initial seed point being less than an initial seed normal angle, given neighbor point is added to seed points for processing.

Abstract: Systems and methods are disclosed comprising a robotic device, an instrument attachable to the robotic device to treat tissue, a vision device attached to the robotic device or instrument, and one or more controllers. The vision device generates vision data sets captured from multiple perspectives of the physical object enabled by the vision device moving in a plurality of degrees of freedom during movement of the robotic device. The controller(s) have at least one processor and are in communication with the vision device. The controller(s) associate a virtual object with the physical object based on one or more features of the physical object identifiable in the vision data sets. The virtual object at least partially defines a virtual boundary defining a constraint on movement of the robotic device relative to the physical object. In some cases, movement of the robotic device is actively constrained by using the virtual boundary.

Abstract: Provided is a technique capable of more accurately determining a solder protruding defect in an appearance inspection device that acquires an image of an inspection region of an inspection target and measures a height of a predetermined place in the inspection region with a height measurement device. The appearance inspection device includes: an imaging unit (3); a height measurement unit (20); a moving mechanism (5) that moves the imaging unit (3) and the height measurement unit (20). When a restricted region (M) in the inspection target is irradiated with the measurement light emitted from the height measurement unit (20), the determination unit restricts defect determination based on the information on the height of the predetermined place measured by the height measurement unit (20).

Abstract: A three-dimensional measurement apparatus measures measurement targets placed in a target measurement area on a measurement object. The apparatus includes: a measurement module that: is positioned with respect to the target measurement area, and includes: a first irradiator that irradiates the target measurement area with predetermined light for height measurement; a second irradiator that irradiates the target measurement area with predetermined patterned light for three-dimensional measurement; and an imaging device that takes an image of the target measurement area; and a control device that moves the measurement module in a height direction and successively positions the measurement module at a predetermined height position determined by mapping, and performs, based on image data taken by irradiating the target measurement area with predetermined patterned light, three-dimensional measurement to the measurement targets at the predetermined height position.

Abstract: Example implementations relate to an inspection method for training a measurement machine to accurately measure side joint lengths and detecting a defect among a plurality of solder joints. The method includes receiving a first data representing the side joint lengths of the plurality of solder joints measured by a first measurement machine and a second data representing the side joint lengths measured by a second measurement machine. Further, the method includes determining a correlation value based on a statistical analysis of a relationship between the first data and the second data. The method further includes updating an algorithm used by the first measurement machine to measure the side joint lengths, based on the correlation value to reduce deviation between the first data and the second data. Later, the updated algorithm is used as a dimensional metrology in the first measurement machine for detecting the defect in the solder joints.

Abstract: Apparatus and methods to automatically inspect precision tabletops used for vibration isolation are described. An inspection head having an imaging device and/or perturbing device can be positioned automatically at a plurality of locations over a precision tabletop. The inspection head can further include a distance sensor that can be used to determine a flatness of a portion or all of a surface of the precision tabletop. The inspection head may further include marking apparatus to automatically mark non-compliant features formed on the precision tabletop.

Abstract: The present invention is generally directed to systems and methods for preparing and producing a custom-fitted face mask, including, as non-limiting examples, a CPAP nasal mask and a CPAP full face mask. At least one embodiment of the invention utilizes infrared (IR) lasers, such as, for example, those found on smartphone cameras, in order to generate a 3D point cloud model of an individual's face. This point cloud model is then used to produce a custom face mask cushion, which is used to customize a generic face mask to conform to the user's specific facial geometry.

Abstract: A method for measuring a substrate for semiconductor lithography using a measuring device, wherein the measuring device comprises a recording device for capturing at least a partial region of the substrate and, wherein the distance between the substrate and an imaging optical unit of the recording device is varied while the partial region is captured by the recording device.

Abstract: A spatial light modulator (SLM) comprised of a 2D array of optically-controlled semiconductor nanocavities can have a fast modulation rate, small pixel pitch, low pixel tuning energy, and millions of pixels. Incoherent pump light from a control projector tunes each PhC cavity via the free-carrier dispersion effect, thereby modulating the coherent probe field emitted from the cavity array. The use of high-Q/V semiconductor cavities enables energy-efficient all-optical control and eliminates the need for individual tuning elements, which degrade the performance and limit the size of the optical surface. Using this technique, an SLM with 106 pixels, micron-order pixel pitch, and GHz-order refresh rates could be realized with less than 1 W of pump power.

Abstract: A method includes providing a measuring device having a projector, a camera with a photosensitive array, and a processor, projecting with the projector a line of light onto an object, capturing with the camera an image of the projected line of light on the object within a window subregion of the photosensitive array, and calculating with the processor three-dimensional (3D) coordinates of points on the object based at least in part on the projected line of light and on the captured image.

Abstract: When removing portions of a work surface at a worksite with a machine (e.g., such as a cold planer), is useful to know the actual cut depths on each edge of the cold planer and/or the volume of material that has been removed from a work surface. However, determining actual cut depths and/or volume removed is difficult, costly, and can be inaccurate, resulting in increased costs and inefficiencies at the worksite. Accordingly, the present disclosure describes systems and methods for enabling automatic control of cut depth of a machine via a machine-controlled feedback loop and improved determinations of actual volume of material removed by the machine.

Abstract: A metrology apparatus for and a method of determining a characteristic of interest relating to at least one structure on a substrate. The metrology apparatus comprises a sensor and an optical system. The sensor is for detecting characteristics of radiation impinging on the sensor. The optical system comprises an illumination path and a detection path. The optical system is configured to illuminate the at least one structure with radiation received from a source via the illumination path. The optical system is configured to receive radiation scattered by the at least one structure and to transmit the received radiation to the sensor via the detection path.

Abstract: A method for measuring and registering 3D coordinates has a 3D scanner measure a first collection of 3D coordinates of points from a first registration position. A 2D scanner collects horizontal 2D scan sets as 3D measuring device moves from first to second registration positions. A processor determines first and second translation values and a first rotation value based on collected 2D scan sets. 3D scanner measures a second collection of 3D coordinates of points from second registration position. Processor adjusts second collection of points relative to first collection of points based at least in part on first and second translation values and first rotation value. Processor identifies a correspondence among registration targets in first and second collection of 3D coordinates, and uses this correspondence to further adjust the relative position and orientation of first and second collection of 3D coordinates.

Abstract: A calibration method for fringe projection systems based on plane mirrors. Firstly, two mirrors are placed behind the tested object. Through the reflection of mirrors, the camera can image the measured object from the front and other two perspectives, so as to obtain 360-degree two-dimensional information of the measured object. The projector projects three sets of phase-shifting fringe patterns with frequencies of 1, 8, and 64. The camera captures the fringe image to obtain an absolute phase map with a frequency of 64 by using the phase-shifting method and the temporal phase unwrapping algorithm. By using the calibration parameters between the projector and the camera, the absolute phase map can be converted into three-dimensional information of the measured object. Then, the mirror calibration is realized by capturing a set of 3D feature point pairs, so that the 3D information from different perspectives is transformed into a unified world coordinate system.

Abstract: Provided is a method for measuring surface characteristics of at least a portion of an object, including providing a light source; generating a first interference pattern on the at least a portion of the object; capturing an image of the first interference pattern; shifting the phase of the light source to generate a second interference pattern; capturing an image of the second interference pattern; filtering distortion from the interference patterns; extracting a wrapped phase of the at least a portion of the object based on the images; unwrapping the wrapped phase of the at least a portion of the object to generate an unwrapped phase; identifying a computed depth map distance to the at least a portion of the object; and fitting an ideal part to the computed depth map of the at least a portion of the object to measure the surface characteristics.

Abstract: Convenience is improved by enabling an imaging section to capture an image of a measurement element without adjustment of a rotation angle of a measurement object performed by a user. A control unit identifies a reference rotation angle during measurement, and calculates a measurement angle to measure a measurement element based on a relative rotation angle with respect to the reference rotation angle stored in advance. The control unit controls a rotation unit such that a rotation angle of the rotation unit becomes the measurement angle. The control unit executes a process of measuring a dimension of the measurement element based on a measurement object image captured by an imaging section when the rotation angle of the rotation unit becomes the measurement angle.

Abstract: A MEMS scanning device (“Device”) includes at least (1) laser projector(s) controlled by a laser drive to project a laser beam, (2) MEMS scanning mirror(s) controlled by a MEMS drive to scan the laser beam to generate a raster scan, (3) a display configured to receive the raster scan, (4) a thermometer configured to detect a current temperature, (5) a display observing camera configured to capture an image of a predetermined area of the display, and (6) a computer-readable media that stores temperature model(s), each of which is custom-built using machine learning. The device uses the display observing camera to capture image(s) of predetermined pattern(s), which are then used to extract feature(s). The extracted feature(s) are compared with ideal feature(s) to identify a discrepancy. When the identified discrepancy is greater than a threshold, the temperature model(s) are updated accordingly.

Abstract: A substrate manufacturing machine (component mounter) includes a substrate type setting section configured to set next and subsequent substrate types to be manufactured subsequently to a current substrate type currently being manufactured, a substrate type checking section configured to check whether the set next and subsequent substrate types are correct, a manufacturing condition investigation section configured to examine whether a manufacturing condition for manufacturing substrates of the next and subsequent substrate types is satisfied, and a manufacturing authorization section configured to authorize manufacturing of the substrates of the next and subsequent substrate types in a case where the next and subsequent substrate types are correct and the manufacturing condition is satisfied.

Abstract: In a self-propelled construction machine comprising a working device (e.g. milling drum) and a profile sensor device arranged in front of the milling drum as seen in the direction of travel, the following features are achieved: the profile sensor device measures ground pavement profile data in at least one first location, wherein at least one second sensor device is provided which, after the construction machine has traversed a section corresponding to the distance between the milling drum and the profile sensor device, measures or otherwise determines, in at least one point associated with the first location, at least one distance value between the ground surface and the milling drum, wherein a machine control system correlates the determined distance value for the at least one point with a corresponding at least one point associated with the measured ground profile data.

Abstract: The present teaching relates to different configurations for facilitating calibration of multiple sensors of different types. A plurality of fiducial markers are arranged in space for simultaneously calibrating multiple sensors of different types. Each of the plurality of fiducial markers has a feature point thereon and is provided to enable the multiple sensors to calibrate by detecting the features points and estimating their corresponding 3D coordinates with respect to respective coordinate systems of the multiple sensors.

Abstract: Disclosed is a 3D scanner for recording the 3D topography of an object, the 3D scanner including: a projector unit configured for projecting a structured beam of probe light onto the object; an imaging unit arranged to acquire 2D images of the object when the object is illuminated by the structured probe light beam; and an actuator unit arranged to control the position of the structured probe light beam at the object by rotating a movable portion of the projector unit around a pivoting axis, the actuator unit including a rotation motor including or arranged to drive a wheel, where the surface of the wheel operatively coupled to the movable portion of the projector unit has a radial distance from the axis of the rotation motor which changes with the rotation.

Abstract: Disclosed herein is a novel technique that employs non-invasive ultrasound for spatiotemporal modulation of the refractive index in a medium to define and control the trajectory of light within the medium itself, thereby creating a virtual sculpted lens. By varying the amplitude of ultrasonic waves in the medium, the numerical aperture (NA) value of the virtual sculpted lens can be changed. The location of the focus of the virtual sculpted lens can be precisely scanned within a scattering tissue.

Abstract: Various methods and systems for securing imaging systems are provided. In one embodiment, a method for an imaging system comprises monitoring usage of the imaging system in real-time while a user is controlling the imaging system, detecting that the usage of the imaging system is an abnormal usage, and performing one or more corrective actions based on the abnormal usage. In this way, an imaging system may be secured from cyber-attacks that may attempt to maliciously execute in an abnormal context while appearing legitimate to typical security controls.

Abstract: A three-dimensional shape measuring method includes: projecting a first grid pattern based on a first light and a second grid pattern based on a second light onto a target object in such a way that the first grid pattern and the second grid pattern intersect each other, the first light and the second light being lights of two colors included in three primary colors of light; picking up, by a three-color camera, an image of the first grid pattern and the second grid pattern projected on the target object, and acquiring a first picked-up image based on the first light and a second picked-up image based on the second light; and performing a phase analysis of a grid image with respect to at least one of the first picked-up image and the second picked-up image and calculating height information of the target object.

Abstract: Embodiments disclosed herein include a semiconductor manufacturing tool with a hybrid model and methods of using the hybrid model for processing wafers and/or developing process recipes. In an embodiment, a method for developing a semiconductor manufacturing process recipe comprises selecting one or more device outcomes, and querying a hybrid model to obtain a process recipe recommendation suitable for obtaining the device outcomes. In an embodiment, the hybrid process model comprises a statistical model and a physical model. In an embodiment, the method may further comprise executing a design of experiment (DoE) on a set of wafers to validate the process recipe recommended by the hybrid process model.

Abstract: A sensor apparatus includes a sensor having a field of view, a sensor window through which the field of view extends; an air nozzle positioned to direct airflow across the sensor window; a surface fixed relative to the sensor window, the surface including a plurality of heat-dissipation fins; and a cover extending over the fins and including an inlet. The inlet is positioned at an opposite edge of the sensor window from the air nozzle. The air nozzle is aimed at the inlet.

Abstract: A point cloud capture system is provided to detect and correct data density during point cloud generation. The system obtains data points that are distributed within a space and that collectively represent one or more surfaces of an object, scene, or environment. The system computes the different densities with which the data points are distributed in different regions of the space, and presents an interface with a first representation for a first region of the space in which a first subset of the data points are distributed with a first density, and a second representation for a second region of the space in which a second subset of the data points are distributed with a second density.

Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for determining an artificial neural network architecture corresponding to a sub-graph of a synaptic connectivity graph. In one aspect, there is provided a method comprising: obtaining data defining a graph representing synaptic connectivity between neurons in a brain of a biological organism; determining, for each node in the graph, a respective set of one or more node features characterizing a structure of the graph relative to the node; identifying a sub-graph of the graph, comprising selecting a proper subset of the nodes in the graph for inclusion in the sub-graph based on the node features of the nodes in the graph; and determining an artificial neural network architecture corresponding to the sub-graph of the graph.

Abstract: A method and apparatus for performing automated supervision and inspection of an assembly process. The method is implemented using a computer system. Sensor data is generated at an assembly site using a sensor system positioned relative to the assembly site. A three-dimensional global map for the assembly site and an assembly being built at the assembly site is generated using the sensor data. A current stage of an assembly process for building an assembly at the assembly site is identified using the three-dimensional global map. A context for the current stage is identified. A quality report for the assembly is generated based on the three-dimensional global map and the context for the current stage.

Abstract: Disclosed herein is a system and method for facilitating estimation of a spatial profile of an environment based on a light detection and ranging (LiDAR) based technique. In one arrangement, the present disclosure facilitates spatial profile estimation based on directing light over one dimension, such as along the vertical direction. In another arrangement, by further directing the one-dimensionally directed light in another dimension, such as along the horizontal direction, the present disclosure facilitates spatial profile estimation based on directing light in two dimensions.

Abstract: This invention provides a system and method for generating camera calibrations for a vision system camera along three discrete planes in a 3D volume space that uses at least two (e.g. parallel) object planes at different known heights. For any third (e.g. parallel) plane of a specified height, the system and method then automatically generates calibration data for the camera by interpolating/extrapolating from the first two calibrations. This alleviates the need to set the calibration object at more than two heights, speeding the calibration process and simplifying the user's calibration setup, and also allowing interpolation/extrapolation to heights that are space-constrained, and not readily accessible by a calibration object. The calibration plate can be calibrated at each height using a full 2D hand-eye calibration, or using a hand-eye calibration at the first height and then at a second height with translation to a known position along the height (e.g. Z) direction.

Abstract: Methods and systems for modelling pipeline construction, include or implement steps of (a) obtaining ranging data of a pipeline construction location including a pipe; (b) processing the ranging data to produce a spatially organized point cloud; and (c) processing the point cloud to identify at least one geometric feature comprising a point or a two-dimensional feature representative of a pipe centreline, and associating the at least one geometric feature with the pipeline construction location. The ranging data may be data obtained from a lidar device. The pipeline construction may be underground construction, where pipe is laid in a ditch. Relevant information, such as depth-of-cover may be calculated from identified geometric features. Relevant information may be determined in real-time or near-real-time and displayed, communicated or recorded as desired.

Abstract: A metrology system may include an imaging sub-system to image a metrology target buried in a sample, where the sample is formed from bonded first and second substrates with a metrology target at the interface. The metrology system may further include an illumination sub-system with an illumination field stop and an illumination pupil, where the illumination field stop includes an aperture to provide that a projected size of the field-stop aperture on a measurement plane corresponding to the metrology target matches a field of view of the detector at the measurement plane, and where the illumination pupil includes a central obscuration to provide oblique illumination of the metrology target with angles greater than a cutoff angle selected to prevent illumination from the illumination source from reflecting off of the bottom surface of the sample and through the field of view of the detector at the measurement plane.

Abstract: A point cloud capture system is provided to detect and correct data density during point cloud generation. The system obtains data points that are distributed within a space and that collectively represent one or more surfaces of an object, scene, or environment. The system computes the different densities with which the data points are distributed in different regions of the space, and presents an interface with a first representation for a first region of the space in which a first subset of the data points are distributed with a first density, and a second representation for a second region of the space in which a second subset of the data points are distributed with a second density.

Abstract: An imaging system comprises multiple light sources, a beam combiner, an optical array sensor, and a computing device. A first light source forms a first beam of light at a first wavelength. A second light source forms a second beam of light at a second wavelength. The beam combiner combines the first beam of light and the second beam of light into a single beam of light and illuminates a specimen with the single beam of light. The optical array sensor detects reflected light that is reflected from the specimen. The computing device accesses sensor data from the optical array sensor, forms a first image based on the first wavelength and a second image based on the second wavelength, and forms a composite image from the first image and the second image.

Abstract: In a method of measuring a flatness of an object, a laser, which may have a wavelength reflectable from the object, may be converted into a laser array. The laser array may be irradiated to the object. The flatness of the object may be measured using a reflected laser array reflected from the object. Thus, the flatness of the object may be accurately measured to decrease process errors of a display device by correcting the flatness of the glass substrate.

Abstract: There are provided an electric resistance welded steel pipe for producing a high strength hollow stabilizer excellent in fatigue resistance and a high strength hollow stabilizer. In an electric resistance welded steel pipe (5) for producing a hollow stabilizer, an internal weld bead cut portion (30) has a three-peak shape and a depth (H) of a trough portion (30a) of the three-peak shape is 0.3 mm or less and an angle (?) formed by a central portion in the circumferential direction of the trough portion (30a) and the top of right and left peak portions (30b, 30c) located on both the right and left sides of the trough portion (30a) is 160° or more and less than 180°.

Abstract: A system and kit for capturing a 3D image of a body a user includes a plurality of pillar segments being configurable between an assembled configuration and a disassembled configuration. In the assembled configuration, the pillar segments are joined to form one or more upstanding sensing pillars. A plurality of sensors operable to capture image data are distributed along the one or more sensing pillars. The plurality of sensors have fields of view that are overlapping when supported on the sensing pillars. In the disassembled configuration, transportation of the pillar segments is facilitated. The system and kit may be suitable for use at a remote location. Additional functionalities may include a power storage unit, solar charging panels, climate control subsystem, and wireless communication submodule. In operation, the sensing pillars may be enclosed within an enclosure.

Abstract: Provided is a method for manufacturing a semiconductor device utilizing the feature that there are a plurality of semiconductor substrates to measure the thickness thereof, when measuring the thickness of a plurality of semiconductor substrates upon the laser annealing treatment. For each of at least one semiconductor substrate of the plurality of semiconductor substrates, a laser annealing treatment is performed by controlling a laser beam irradiating the semiconductor substrate based on self-thickness data being data of a result of measurement of a thickness of the semiconductor substrate and reference thickness data being data of a result of measurement of a thickness of at least one semiconductor substrate other than the semiconductor substrate among the plurality of semiconductor substrates.

Abstract: Described is a metrology system for determining a characteristic of interest relating to at least one structure on a substrate, and associated method. The metrology system comprises a processor being configured to computationally determine phase and amplitude information from a detected characteristic of scattered radiation having been reflected or scattered by the at least one structure as a result of illumination of said at least one structure with illumination radiation in a measurement acquisition, and use the determined phase and amplitude to determine the characteristic of interest.

Abstract: Systems for generating in-focus color images are provided. Related methods and devices are also provided.

Abstract: Systems and methods for optically measuring a position of a measurement surface relative to a reference position. The system is a wireless network comprising a centrally located data acquisition computer and a multiplicity of remotely located sensor modules mounted at different locations within wireless communication range of a central receiver. Each sensor module is mounted to a clamp that is made specific to a control surface location and embedded with an RFID tag to denote clamp location. The optical components of the sensor modules are selected to enable indication of the linear position of a measurement surface relative to a reference position and then broadcast the measurement results. The broadcast results are received by the central receiver and processed by the data acquisition computer, which hosts human interface software that displays measurement data.

Abstract: A measurement system for matching and/or transmission measurements with respect to a device under test comprising an interface is provided. Said measurement system comprises at least one signal generator comprising at least one signal generator signal path, and at least one receiver comprising at least two receiver signal paths. In this context, a signal of a first signal generator signal path of the at least one signal generator signal path and/or a signal of a first receiver signal path of the at least two receiver signal paths is adaptively phase-shifted and/or amplitude-modified with respect to a signal of a second receiver signal path of the at least two receiver signal paths.

Abstract: A pToF sensor, a pToF pixel array and an operation method therefor are provided. The pToF pixel array includes a plurality of pToF pixels distributed in an array, a control circuit, and a conversion circuit. Each of the pToF pixels includes a photo sensitive unit configured to detect a return signal of a light pulse signal, and a first conversion unit configured to convert a time signal corresponding to each of the pToF pixels to an analog signal. The control circuit is connected to each of the pToF pixels, and configured to control an operation mode of each of the pToF pixels. The conversion circuit is connected to each of the pToF pixels, and configured to calculate a time-of-fight corresponding to each of the pToF pixels according to the analog signal corresponding to each of the pToF pixels.

Abstract: A system and method for obtaining a 3D pose of an object using 2D images from multiple 2D cameras. The method includes positioning a first 2D camera so that it is directed towards the object along a first optical axis, obtaining 2D images of the object by the first 2D camera, and extracting feature points from the 2D images from the first 2D camera using a first feature extraction process. The method also includes positioning a second 2D camera so that it is directed towards the object along a second optical axis, obtaining 2D images of the object by the second 2D camera, and extracting feature points from the 2D images from the second 2D camera using a second feature extraction process. The method then estimates the 3D pose of the object using the extracted feature points from both of the first and second feature extraction process.

Abstract: A metrology system includes an optical assembly portion; an adjustment mechanism configured to change a distance and an angular orientation between the optical assembly portion and a workpiece surface; and a processor configured to control the adjustment mechanism to move the optical assembly portion to position a workpiece surface within a focal Z autofocus range; capture an image stack of the workpiece surface wherein each image of the image stack corresponds to a different autofocus height; determine an autofocus height for at least three locations of the workpiece surface; control the adjustment mechanism based on the autofocus heights to rotate the optical assembly portion relative to the workpiece surface to nominally align the optical axis of the optical assembly portion with a surface normal of the workpiece surface and adjust a distance between the optical assembly portion and the workpiece surface; and execute a defined operation on the workpiece surface.

Abstract: A sensor suitable for detecting specific analytes, a method for manufacturing the sensor, and a method for using the sensor in a diagnostic procedure provided. In an embodiment, the sensor device includes a substrate, a dielectric layer disposed on the substrate, and a probe layer disposed on the dielectric layer. The probe layer is configured to react with an analyte. The reaction may include: binding with the analyte, undergoing a change in a chemical property of the probe layer, or undergoing a change in a structural property of the probe layer. In examples, an attribute of the dielectric layer is configured to identify the device during a process that determines whether the probe layer has reacted with the analyte.

Abstract: A metrology system for characterizing a sample formed from a first wafer and a second wafer bonded at an interface with a metrology target near the interface may include a metrology tool and a controller. The metrology tool may include one or more illumination sources and an illumination sub-system to direct illumination from the one or more illumination sources to the metrology target, a detector, and a collection sub-system to collect light from the sample. The light collected from the sample may include light from the metrology target and light from a top surface of the first wafer, and the collection sub-system is may direct the light from the metrology target to the detector. The controller may execute program instructions causing the one or more processors to generate estimates of one or more parameters associated with the sample based on data received from the detector.

Abstract: The present invention relates to ultrasound imaging, and in particular to a device for imaging bodily tissue under load. The device has a platform (10), for at least partially supporting a part of the body (2), at least one ultrasound device (20) for imaging of the part of the body (2) in contact with the platform (10), and means (32) for measuring the pressure exerted on the platform (10).

Abstract: A structured-light scanning system includes a plurality of switchable projectors that respectively generate emitted lights with a predetermined pattern, each switchable projector being capable of switchably generating either a two-dimensional (2D) emitted light or a three-dimensional (3D) emitted light; an optical alignment device that aligns the emitted lights to generate an aligned light, which is projected onto and reflected from a surface of an object, resulting in a reflected light; and an image sensor that detects the reflected light.