Abstract: An assembly has at least two conducting surfaces and a dielectric therebetween formed of a plastic nonwoven fabric that is impregnated with cast resin. A corresponding feed-through for high voltages has a central conductor, around which conducting intermediate layers concentrically spaced from each other are arranged as conducting surfaces. A plastic nonwoven fabric impregnated with cast resin is located between the conducting intermediate layers as a dielectric.

Abstract: A capacitive element for an implantable medical device feedthrough element includes a bore, to receive a feedthrough member, or pin of the filtered feedthrough element, an external surface extending laterally outward from a first opening of the bore, and a recessed area formed in the external surface and extending about an outer perimeter thereof. The recessed area may provide a location on which to apply a conductive material to form a joint that electrically couples the capacitive element to a ferrule of the filtered feedthrough element.

Abstract: A seal design provides positive compression to produce a hermetic seal around a feedthrough pin in a hermetically sealed device, including an implantable medical device. One embodiment of the seal design uses a plurality of “micro-flanges” placed along the length of a feedthrough pin, which micro-flanges grabs and compresses the insulator material to form a hermetic seal. Because the seal design produces positive compression of the insulator, the seal is relatively insensitive to changes in temperature and to differences in thermal expansion coefficients (“TCEs”) between the metal feedthrough and the insulator. It is therefore possible to use a wider variety of materials for the insulator and the feedthrough with the described sealing design, while achieving a superior hermetic seal.

Abstract: Density-conforming vertical plate capacitors exhibiting enhanced capacitance and methods for fabricating density-conforming vertical plate capacitors exhibiting enhanced capacitance are provided. An embodiment of the density-conforming vertical plate capacitor comprises a first conductive interconnect and a second conductive interconnect. The second conductive interconnect overlies the first conductive interconnect and is substantially aligned with the first conductive interconnect. A via bar electrically couples the first conductive interconnect and the second conductive interconnect. The via bar has a width and a length that is larger than the width and contributes to the capacitance of the vertical plate capacitor.

Abstract: A filtering capacitor feedthrough assembly for an implantable active medical device is disclosed. The filtering capacitor feedthrough assembly includes a capacitor having an aperture defined by an inner capacitor surface. The capacitor is electrically grounded to an electrically conductive feedthrough ferrule or housing of the implantable active medical device. A terminal pin extends into the aperture. An electrically conductive split ring sleeve is disposed within the aperture and between the terminal pin and the capacitor. The split ring sleeve includes a first end, a second end, a sleeve length therebetween. A longitudinal slit through the sleeve extends from the first end to the second end. The electrically conductive split ring sleeve mechanically securing and electrically coupling the terminal pin to the capacitor.

Abstract: A stable power, low electromagnetic interference (EMI) apparatus and method for connecting electronic devices and circuit boards is disclosed. The apparatus involves a capacitor which includes a body member, a set of power terminals and a set of ground terminals connected to the top of the body member. The set of power terminals and the set of ground terminals alternate one with another. As a result of this configuration, a high inductance on the PCB side is achieved. The capacitor further includes a set of terminals connected to the bottom of the body member and includes metal planes within the body member. The metal planes are positioned to electrically connect either the set of power terminals or the set of ground terminals to the set of terminals.

Abstract: A feedthrough flat-through capacitor includes a capacitor having a first and second set of electrode plates, a first feedthrough passageway through the capacitor, a first lead disposed within the first feedthrough passageway and conductively coupled to the first set of electrode plates, a second feedthrough passageway through the capacitor disposed remote form the first feedthrough passageway, and a second lead disposed within the second feedthrough passageway and conductively coupled to the first set of electrode plates. The second set of electrode plates are typically conductively coupled to a ground. An EMI shield may be provided to electromagnetically isolate the first lead from the second lead.

Abstract: A shielded three-terminal flat-through EMI/energy dissipating filter includes an active electrode plate through which a circuit current passes between a first terminal and a second terminal, a first shield plate on a first side of the active electrode plate, and a second shield plate on a second side of the active electrode plate opposite the first shield plate. The first and second shield plates are conductively coupled to a grounded third terminal. In preferred embodiments, the active electrode plate and the shield plates are at least partially disposed with a hybrid flat-through substrate that may include a flex cable section, a rigid cable section, or both.

Abstract: A multilayered feedthrough for an implantable medical device includes a substrate having a first edge, a second edge, and a substrate length. A plurality of traces is formed on the substrate and extends along the substrate length. The plurality of traces extends to the first and second edges of the substrate. An insulator layer is formed on the substrate and the plurality of traces. A ground plane layer is formed on the insulator layer.

Abstract: A capacitive element for an implantable medical device feedthrough element includes a bore, to receive a feedthrough member, or pin of the filtered feedthrough element, an external surface extending laterally outward from a first opening of the bore, and a recessed area formed in the external surface and extending about an outer perimeter thereof. The recessed area may provide a location on which to apply a conductive material to form a joint that electrically couples the capacitive element to a ferrule of the filtered feedthrough element.

Abstract: An EMI filter capacitor assembly and implantable passive electronic network components utilize biocompatible and non-migratable materials to adapt the electronic components for direct body fluid exposure. The assembly includes a capacitor having first and second sets of electrode plates which are constructed of non-migratable biocompatible material. A conductive hermetic terminal of non-migratable and biocompatible material adjacent to the capacitor is conductively coupled to the second set of electrode plates. One or more conductive terminal pins having at least an outer surface of non-migratable and biocompatible material are conductively coupled to the first set of electrode plates, while extending through the hermetic terminal in non-conductive relation. The terminal pins may be in direct contact with the first set of electrode plates, or in contact with a termination surface of conductive connection material. The termination surface is also constructed of non-migratable and biocompatible materials.

Abstract: A capacitor assembly for use in, and a method of assembling, a filtered feedthrough. The termination material present on the inner and outer diameters of the capacitor is absent from a portion of the outer diameter of the capacitor proximate an unfiltered terminal pin, such that high voltage arcing between the unfiltered terminal pin and capacitor is inhibited.

Abstract: A feedthrough capacitor having a pair of first terminal electrodes and a second terminal electrode is mounted on a mounting surface of a substrate. The substrate is an insulating substrate internally having first and second conductor portions isolated from each other, and has a plurality of first via holes, a plurality of second via holes, a plurality of first land electrodes, and a second land electrode. The first via holes and the second via holes, when viewed from the mounting surface side, are arranged in a matrix pattern and alternately arranged in a row direction and in a column direction. The feedthrough capacitor, when viewed from the mounting surface side, is located between a pair of said first via holes adjacent to each other in a direction intersecting with the row direction and also adjacent to each other in a direction intersecting with the column direction.

Abstract: A feedthrough capacitor assembly for attachment to a mount having an opening is disclosed. The assembly includes a feedthrough terminal adapted for insertion through said opening for coupling a signal from a first side of the mount to a second side of the mount. The assembly includes a first conductive region extending about and electrically coupled to the feedthrough terminal and a second conductive region extending about the first conductive region. A plurality of capacitors are electrically coupled between the first conductive region and the second conductive region. The plurality of capacitors are arranged about the feedthrough terminal with each capacitor having about the same capacitance as each of the other capacitors.

Abstract: A seal design provides positive compression to produce a hermetic seal around a feedthrough pin in a hermetically sealed device, including an implantable medical device. One embodiment of the seal design uses a plurality of “micro-flanges” placed along the length of a feedthrough pin, which micro-flanges grabs and compresses the insulator material to form a hermetic seal. Because the seal design produces positive compression of the insulator, the seal is relatively insensitive to changes in temperature and to differences in thermal expansion coefficients (“TCEs”) between the metal feedthrough and the insulator. It is therefore possible to use a wider variety of materials for the insulator and the feedthrough with the described sealing design, while achieving a superior hermetic seal.

Abstract: A solder joint between a capacitive element and a ferrule of a filtered feedthrough assembly for an implantable medical device is formed from a solder pre-form mounted on a portion of an external surface of the capacitive element, which portion of the external surface may be overlaid with a layer including a noble metal. Another solder joint may be formed between the capacitive member and each feedthrough pin; and, for an assembly including a plurality of feedthrough pins, each of the other solder joints may be formed from a solder pre-form mounted onto the external surface of the capacitive element by inserting each pin through a corresponding ring of a plurality of rings connected together to form the solder pre-form.

Abstract: A capacitor assembly for use in, and a method of assembling, a filtered feedthrough. The capacitor includes an insulative member fixedly attached to its bottom portion to inhibit high voltage arcing. The termination material present on the inner and outer diameters of the capacitor is absent from a portion of the capacitor proximate the bottom portion, e.g., at the insulative member.

Abstract: A hybrid capacitor includes a body of dielectric material having spaced-apart first and second surfaces. A first electrode is associated with the first surface. A second electrode is associated with the second surface. One or more third electrodes are transversely disposed within the dielectric body between the first and second electrodes. Either the first or second electrode is not conductively coupled to any electrode transversely extending into the body. The resulting arrangement provides a hybrid capacitor having characteristics of both a tubular capacitor and a discoidal capacitor.

Abstract: A multi-layer imbedded capacitance and resistance substrate core. At least one layer of resistance material is provided. The layer of resistance material has a layer of electrically conductive material embedded therein. At least one layer of capacitance material of high dielectric constant is disposed on the layer of resistance material. Thru-holes are formed by laser.

Abstract: A system and method for sealing a capacitor bottom in a filtered feedthrough. The feedthrough comprises a ferrule, a capacitor, at least one terminal pin and a support structure. The support structure includes at least one projection that extends into an aperture of the capacitor. The projection includes an opening through which the at least one terminal pin extends such that, in an assembled state, the terminal pin extends through the opening of the projection and the aperture of the capacitor.

Abstract: A filtered feedthrough assembly includes a capacitor comprising a top portion, a bottom portion, an outer diameter portion and an inner diameter portion. The inner diameter portion defines at least one aperture extending from the top portion to the bottom portion. An conductive pad of conductive material is applied to the top portion around the at least one aperture. A feedthrough pin extends through each of the apertures and is soldered to the inner diameter portion of the capacitor by application of a solder preform upon the conductive pad of conductive material.

Abstract: A filtered feedthrough assembly includes a capacitor comprising a top portion, a bottom portion, an outer diameter portion and an inner diameter portion. The inner diameter portion defines at least one aperture extending from the top portion to the bottom portion. A conductive annular member is placed onto the top portion around the at least one aperture. A feedthrough pin extends through each of the apertures and is soldered to the inner diameter portion of the capacitor by application of a solder preform upon the conductive pad of conductive material.

Abstract: A filtered feedthrough assembly having at least one terminal pin therethrough is provided. The feedthrough assembly comprises a ferrule having a cavity therethrough for receiving the terminal pin, and insulating structure having an upper surface. The insulating structure is disposed within the cavity and around the terminal pin for electrically isolating the pin from the ferrule. A capacitor is disposed around the pin and electrically coupled thereto. The capacitor has a lower surface that is disposed proximate the upper surface, and at least one washer is disposed between the upper surface and the lower surface. To attach the capacitor to the insulating structure, a body of epoxy is substantially confined between the upper surface and the lower surface by the ferrule, the insulating structure, the capacitor, and the at least one washer.

Abstract: A capacitor is presented that includes a housing, an electrode stack, a liner, and a fill port. The liner is located between the housing and the electrode stack. The liner includes a recessed portion. A fill port extends through the housing across from the recessed portion in the liner. A gap is formed between the recessed portion and the fill port.

Abstract: A discoidal feedthrough capacitor has its active electrode plates disposed within a dielectric body so that an edge of the active electrode plates is exposed at a surface of a through-hole for a conductive lead. The conductive lead is conductively coupled to the exposed edge of the electrode plates without an intervening conductive termination surface. Similarly, a ground electrode plate set of the feedthrough capacitor may have an edge exposed at the outer periphery of the capacitor for conductively coupling the exposed edge of the ground electrode plate to a conductive ferrule without an intervening conductive termination surface.

Abstract: An electronic component includes an electronic component main body including opposed first and second main surfaces, opposed first and second side surfaces, and opposed first and second end surfaces and also includes first and second external terminal electrodes disposed on the first main surface. The first and second external terminal electrodes are spaced apart by a gap region. When a dimension in a longitudinal direction being a direction linking the first and second end surfaces of the electronic component main body is L, a dimension in a width direction being a direction linking the first and second side surfaces is W, and a dimension of the gap region along the longitudinal direction is g, W<L?g<2W and L?g+W?{2(L?g)W}1/2>(L?g)/2 are satisfied.

Abstract: A feedthrough assembly for use with implantable medical devices having a shield structure, the feedthrough assembly engaging with the remainder of the associated implantable medical device to form a seal with the medical device to inhibit unwanted gas, liquid, or solid exchange into or from the device. One or more feedthrough wires extend through the feedthrough assembly to facilitate transceiving of the electrical signals with one or more implantable patient leads. The feedthrough assembly is connected to a mechanical support which houses one or more filtering capacitors that are configured to filter and remove undesired frequencies from the electrical signals received via the feedthrough wires before the signals reach the electrical circuitry inside the implantable medical device.

Abstract: A circuit structure is provided. The circuit structure includes a capacitor including a top capacitor electrode; a bottom capacitor electrode parallel to the top capacitor electrode; and an insulating layer between the top and the bottom capacitor electrodes. The insulating layer includes a dielectric rod enclosed by a dielectric material. The dielectric rod has a higher dielectric constant than that of the dielectric material. The circuit structure may be a printed circuit board or packaging substrate, wherein the capacitor is formed between the two layers of the capacitor. Additional dielectric rods may be formed in the insulating layer of the capacitor and spaced apart from the dielectric rods.

Abstract: A feed-through capacitor is constructed in a printed wiring board using alternating layers of metal capacitive layers and plastic dielectric layers of the printed wiring board. The large number of layers, the avoidance of ceramic layers and the flexible geometry of this device allow it to be used in many applications, particularly in those involving high power high current. Also, because it utilizes a printed wiring board, the capacitor can be made in numerous sizes and shapes.

Abstract: Disclosed herein is an EMI filtered feedthru for an implantable pulse generator. The EMI filtered feedthru may include a filter assembly, which has a chip capacitor and a body. The body may include a cavity in which the chip capacitor resides.

Abstract: A feedthrough terminal assembly for active implantable medical devices includes a structural wire bond pad for a convenient attachment of wires from either the circuitry inside the implantable medical device or wires external to the device. Direct attachment of wire bond pads to terminal pins enables thermal or ultrasonic bonding of lead wires, while shielding the capacitor or other delicate components from the forces applied to the assembly during attachment of the wires.

Abstract: A method of manufacturing a sensor for in vivo applications includes the steps of providing two wafers of an electrically insulating material. A recess is formed in the first wafer, and a capacitor plate is formed in the recess of the first wafer. A second capacitor plate is formed in a corresponding region of the second wafer, and the two wafers are affixed to one another such that the first and second capacitor plates are arranged in parallel, spaced-apart relation.

Abstract: The self-resonance insertion loss dip of a feedthrough capacitor is reduced or eliminated by raising the equivalent series resistance of the capacitor, thus minimizing the capacitor Q. The equivalent series resistance of the capacitor can be raised by forming voids in the active and/or ground electrode plates of the capacitor. The electrode plates may be formed so as to have a relatively reduced thickness, or a relatively increased thickness. A conductive material having a relatively high resistivity may be used to form the active and/or ground electrode plates of the capacitor. Alternatively, the conductive material forming the electrode plates may have a dielectric material added thereto.

Abstract: A feedthrough capacitor has: a capacitor element body of a substantially rectangular parallelepiped shape in which a plurality of insulator layers are laminated together; a signal internal electrode arranged in the capacitor element body; a ground internal electrode arranged in the capacitor element body and opposed to the signal internal electrode; signal terminal electrodes connected to the signal internal electrode; and a ground terminal electrode connected to the ground internal electrode. The signal terminal electrodes are provided on first and second end faces, respectively, in a longitudinal direction of the capacitor element body. The ground terminal electrode is provided on at least one side face out of first to fourth side faces extending along the longitudinal direction of the capacitor element body. Furthermore, the ground terminal electrode is located nearer at least one end face out of the first end face and the second end face.

Abstract: An electronic module assembly for an implantable medical device includes a non-conductive block having an opening for accepting a feedthrough conductor. The block has opposite first and second ends and opposite first and second sides. A bond pad is located on the first end of the block for electrical connection to a feedthrough conductor, and the bond pad extends to the first side of the block to provide an electrical connection region there.

Abstract: An electrical component that is surface mountable includes a base body having first inner electrodes and second inner electrodes. A first outer electrode extends along the base body in a first direction, and a through connection extends along the base body in a second direction that is different from the first direction. The first inner electrodes are electrically connected to the first outer electrode. The second inner electrodes are electrically interconnected via the through connection.

Abstract: Terminal pins comprising an outer coating of palladium coating a core material other than of palladium for incorporated into feedthrough filter capacitor assemblies are described. The feedthrough filter capacitor assemblies are particularly useful for incorporation into implantable medical devices such as cardiac pacemakers, cardioverter defibrillators, and the like, to decouple and shield internal electronic components of the medical device from undesirable electromagnetic interference (EMI) signals.

Abstract: A multi-segment capacitor fabricated on a semiconductor substrate includes M×N capacitor segments arranged in a matrix of M rows and N columns. Each capacitor segment includes two groups of conductive fingers preferably made of metal wires. The metal wire fingers are distributed within multiple metal layers in such a manner that two neighboring parallel metal wire fingers within a particular metal layer are electrically insulated and connected to different terminals of the capacitor. Further, at least the longitudinal axes of the parallel metal wire fingers within two different metal layers are not parallel to each other within the same capacitor segment.

Abstract: A feed through capacitor, includes an electrical conductor having a first end being in electrical communication with a second end, the first and second ends being couplable to respective means for conveying electrical energy, a groundable electrically conductive housing enclosing at least a portion of the conductor and being spaced apart from the conductor, and a capacitor bank having at least one capacitor element, the capacitor element being in electrical communication with both the conductor and the housing. A method of forming a feed through capacitor is further included.

Abstract: A feedthrough capacitor having a pair of first terminal electrodes and a second terminal electrode is mounted on a mounting surface of a substrate. The substrate is an insulating substrate internally having first and second conductor portions isolated from each other, and has a plurality of first via holes, a plurality of second via holes, a plurality of first land electrodes, and a second land electrode. The first via holes and the second via holes, when viewed from the mounting surface side, are arranged in a matrix pattern and alternately arranged in a row direction and in a column direction. The feedthrough capacitor, when viewed from the mounting surface side, is located between a pair of said first via holes adjacent to each other in a direction intersecting with the row direction and also adjacent to each other in a direction intersecting with the column direction.

Abstract: A method for coupling a capacitor to a feedthrough assembly that includes a ferrule and a terminal pin therethrough is provided. The method comprises dispensing an epoxy onto an outer surface of the feedthrough assembly. A capacitor, which has an opening therethrough for receiving the terminal pin and cooperates therewith to form a cavity, is placed over the ferrule to contact the epoxy. A weight is placed on the capacitor to position it with respect to the terminal pin, and the epoxy is cured.

Abstract: A hybrid capacitor includes a body of dielectric material having spaced-apart first and second surfaces. A first electrode is associated with the first surface. A second electrode is associated with the second surface. One or more third electrodes are transversely disposed within the dielectric body between the first and second electrodes. Either the first or second electrode is not conductively coupled to any electrode transversely extending into the body. The resulting arrangement provides a hybrid capacitor having characteristics of both a tubular capacitor and a discoidal capacitor.

Abstract: A first signal internal electrode is connected to a first signal terminal electrode and a second signal internal electrode is connected to a second signal terminal electrode. A first ground internal electrode is connected to a first ground terminal electrode and a second ground internal electrode is connected to a second ground terminal electrode. The first signal internal electrode and the first ground internal electrode have their respective opposed regions. The second signal internal electrode and the second ground internal electrode have their respective opposed regions. The first signal internal electrode and the second ground internal electrode are not opposed to each other. The second signal internal electrode and the first ground internal electrode are not opposed to each other. The first signal internal electrode and the second signal internal electrode are connected through a signal throughhole conductor.

Abstract: An EMI filter capacitor assembly utilizes biocompatible and non-migratable materials to adapt electronic components for direct body fluid exposure. The assembly includes a capacitor having first and second sets of electrode plates which are constructed of non-migratable biocompatible material A conductive hermetic terminal of non-migratable and biocompatible material adjacent to the capacitor is conductively coupled to the second set of electrode plates. One or more conductive terminal pins having at least an outer surface of non-migratable and biocompatible material are conductively coupled to the first set of electrode plates, while extending through the hermetic terminal in non-conductive relation. The terminal pins may be in direct contact with the first set of electrode plates, or in contact with a termination surface of conductive connection material. The termination surface is also constructed of non-migratable and biocompatible materials.

Abstract: A composite electronic component has: a first multilayer section including an electrode layer; and a second multilayer section laid on the first multilayer section and including at least one ground electrode layer on which a ground electrode is formed, and at least one hot electrode layer on which a hot electrode is formed. In the second multilayer section, the hot electrode layer is interposed between the ground electrode layer nearest to the first multilayer section, and the first multilayer section and in the ground electrode on the ground electrode layer nearest to the first multilayer section, at least a part of an exposed portion exposed from the hot electrode to the first multilayer section side is a narrow portion narrower than a width of an unexposed portion not exposed therefrom.

Abstract: A metal capacitor in which an electric conductivity is significantly improved by applying a metal material for an electrolyte and a manufacturing method thereof is provided. The metal capacitor includes a metal member comprising a through-hole forming portion where a plurality of through-holes is formed, an electrode withdrawing portion formed on the through-hole forming portion, and a sealing portion; a metal oxide layer being formed on the metal member; a main electrode layer being formed on the metal oxide layer that is formed on the through-hole forming portion of the metal member, to fill the plurality of through-holes; an insulating layer being formed on the main electrode layer and the metal member to externally expose the electrode withdrawing portion of the metal member.

Abstract: A multilayer polymer film capacitor block, adapted to accept high currents. At least one multilayer polymer film capacitor is fit into a cavity defined in a rigid, thermally conductive structure. The cavity is sized and shaped to receive said multilayer polymer film capacitor when said capacitor is at a temperature below 40° C., but fitting said capacitor in a conformal manner so that as said capacitor is raised to temperatures above 40° C., said cavity constrains expansion of said capacitor.

Abstract: A technique for enhancing circuit density and performance is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for enhancing circuit density and performance of a microelectronic module. The method may comprise forming a discrete package, wherein the discrete package comprises one or more passive devices that are desirable for the performance of the microelectronic module. The method may also comprise coupling the discrete package to the microelectronic module.

Abstract: Filtering assembly for a feedthrough, for implantable medical devices, having operating conductive pin(s) and a ground conductive pin. The filtering assembly has: first insulating substrate, first conductive layer accommodated at first side of first insulating substrate and second conductive layer accommodated at second side of first insulating substrate opposing first side, first conductive layer comprises a conductive ground ring accommodated that surrounds the circumference of one end of the operating conductive pins and capacitive element(s), wherein each of the capacitive element(s) provides on the first side a connection to the operating conductive pin(s) and on the second side a connection to the ground ring, wherein the ground ring is connected to the ground pin, the second conductive layer comprises a ground plane providing connection to the ground ring of the first conductive layer and a connection to the ground pin.

Abstract: A solder joint between a capacitive element and a ferrule of a filtered feedthrough assembly for an implantable medical device is formed from a solder pre-form mounted on a portion of an external surface of the capacitive element, which portion of the external surface may be overlaid with a layer including a noble metal. Another solder joint may be formed between the capacitive member and each feedthrough pin; and, for an assembly including a plurality of feedthrough pins, each of the other solder joints may be formed from a solder pre-form mounted onto the external surface of the capacitive element by inserting each pin through a corresponding ring of a plurality of rings connected together to form the solder pre-form.