Feed Through Patents (Class 361/302)
  • Publication number: 20090059468
    Abstract: A feedthrough assembly for an implantable medical device includes an insulator element hermitically sealed to a ferrule and a feedthrough member, and a capacitive element spaced apart from the insulator element within the ferrule and coupled to the feedthrough member by a conductive material; the conductive material extends in an area between the capacitive element and the feedthrough member. The assembly further includes a heat and pressure deformed thermoplastic adhesive member that extends around the feedthrough member within the ferrule, is located between the capacitive element and the insulator element, and is sealed to an external surface of the capacitive element in order to isolate the conductive material.
    Type: Application
    Filed: August 29, 2007
    Publication date: March 5, 2009
    Inventor: RAJESH V. IYER
  • Patent number: 7495884
    Abstract: A multilayer capacitor has a capacitor element body of a nearly rectangular parallelepiped shape in which a signal electrode layer and a GND electrode layer are laminated with a dielectric layer in between, and signal terminal electrodes and GND terminal electrodes each set of which is provided on either of two side faces along the longitudinal direction of the capacitor element body. A signal electrode is led to each of the two side faces along the longitudinal direction of the capacitor element body and connected to the signal terminal electrodes. First GND electrode and second GND electrode are arranged alongside as spaced in a direction perpendicular to the longitudinal direction of the capacitor element body. The first GND electrode is led to one side along the longitudinal direction of the capacitor element body and connected to the GND terminal electrode.
    Type: Grant
    Filed: July 30, 2007
    Date of Patent: February 24, 2009
    Assignee: TDK Corporation
    Inventor: Masaaki Togashi
  • Patent number: 7492569
    Abstract: A capacitor cell for reducing noise in a high drive cell includes a plurality of vias for supplying power to an interconnection layer positioned over the capacitor cell from an upper interconnection layer, so that the resistance of the power supply path is reduced.
    Type: Grant
    Filed: June 30, 2006
    Date of Patent: February 17, 2009
    Assignee: NEC Electronics Corporation
    Inventors: Taro Sakurabayashi, Toshikazu Kato
  • Patent number: 7489495
    Abstract: A feedthrough terminal assembly for an active implantable medical device (AIMD) includes magnetic shielding elements to block incident magnetic fields during medical procedures such as Magnetic Resonance Imaging. The assembly includes conductive or ground plate(s) embedded in an insulator surrounding elements of the assembly, a plurality of lead wires extending from electronic circuitry of the AIMD, and a lossy ferrite inductor through which the lead wires extend in non-conductive relation for increasing the impedance of the lead wires at selected RF frequencies. Alternatively, the assembly includes a conductive sleeve or cap surrounding the feedthrough capacitor and/or conductive support.
    Type: Grant
    Filed: November 1, 2005
    Date of Patent: February 10, 2009
    Assignee: Greatbatch-Sierra, Inc.
    Inventor: Robert A. Stevenson
  • Publication number: 20090031543
    Abstract: An exemplary embodiment providing one or more improvements includes a capacitor with a segmented end electrode and methods for segmenting an end electrode of a capacitor for reducing or eliminating instances of thermally induced damage of the capacitor.
    Type: Application
    Filed: October 1, 2008
    Publication date: February 5, 2009
    Inventor: Terry Hosking
  • Publication number: 20090034153
    Abstract: A first signal internal electrode is connected to a first signal terminal electrode and a second signal internal electrode is connected to a second signal terminal electrode. A first ground internal electrode is connected to a first ground terminal electrode and a second ground internal electrode is connected to a second ground terminal electrode. The first signal internal electrode and the first ground internal electrode have their respective opposed regions. The second signal internal electrode and the second ground internal electrode have their respective opposed regions. The first signal internal electrode and the second ground internal electrode are not opposed to each other. The second signal internal electrode and the first ground internal electrode are not opposed to each other. The first signal internal electrode and the second signal internal electrode are connected through a signal throughhole conductor.
    Type: Application
    Filed: July 23, 2008
    Publication date: February 5, 2009
    Applicant: TDK Corporation
    Inventor: Masaaki TOGASHI
  • Publication number: 20090034152
    Abstract: In a feedthrough capacitor, a signal internal electrode layer is so arranged that an opposed portion opposed to a ground internal electrode layer is provided with a projection projecting toward a ground electrode, when viewed from a direction of a stack of dielectric layers. Therefore, if a gap amount G is abnormal between an end face with the ground electrode thereon and the signal internal electrode layer, the projection comes in contact with the ground electrode and a short circuit occurs between the ground electrode and terminal electrodes. This feedthrough capacitor thus permits easy detection of abnormality of the gap amount G, based on the presence/absence of a short-circuit failure.
    Type: Application
    Filed: July 14, 2008
    Publication date: February 5, 2009
    Applicant: TDK CORPORATION
    Inventors: Takashi AOKI, Kenya TAMAKI
  • Publication number: 20090015982
    Abstract: A first signal internal electrode is connected to a first signal terminal electrode and a signal connection conductor. A second signal internal electrode is connected to a second signal terminal electrode and the signal connection conductor. A first ground internal electrode is connected to a first ground terminal electrode and a ground connection conductor. A second ground internal electrode is connected to a second ground terminal electrode and the ground connection conductor. The first signal internal electrode and the first ground internal electrode have their respective regions opposed to each other. The second signal internal electrode and the second ground internal electrode have their respective regions opposed to each other. The first signal internal electrode and the second ground internal electrode are not opposed to each other. The second signal internal electrode and the first ground internal electrode are not opposed to each other.
    Type: Application
    Filed: July 8, 2008
    Publication date: January 15, 2009
    Applicant: TDK CORPORATION
    Inventor: Masaaki TOGASHI
  • Publication number: 20080310076
    Abstract: Disclosed are apparatus and methodology for providing controlled equivalent series resistance (ESR) decoupling capacitor designs having broad applicability to signal and power filtering technologies. Such capacitor designs provide characteristics for use in decoupling applications involving both signal level and power level environments. Controlled equivalent series resistance (ESR) is provided by providing extended length tab connections to active electrode layers within the device.
    Type: Application
    Filed: June 9, 2008
    Publication date: December 18, 2008
    Applicant: AVX CORPORATION
    Inventors: Andrew P. Ritter, Marianne Berolini, Kimberly L. VanAlstine
  • Patent number: 7466533
    Abstract: This invention provides novel capacitors comprising nanofiber enhanced surface area substrates and structures comprising such capacitors, as well as methods and uses for such capacitors.
    Type: Grant
    Filed: August 17, 2007
    Date of Patent: December 16, 2008
    Assignee: Nanosys, Inc
    Inventors: Calvin Y.H. Chow, Robert S. Dubrow
  • Patent number: 7460353
    Abstract: A high-voltage capacitor is intended for use in a high-voltage capacitor device having at least two through conductors. The high-voltage capacitor includes a dielectric porcelain, an individual electrode, and a common electrode. At least two spaced individual electrodes are provided on one surface of the dielectric porcelain and intended to be connected one-to-one to the through conductors positioned outside the dielectric porcelain. The common electrode is provided on the other surface of the dielectric porcelain.
    Type: Grant
    Filed: March 23, 2006
    Date of Patent: December 2, 2008
    Assignee: TDK Corporation
    Inventors: Yukihiko Shirakawa, Tsukasa Sato, Isao Fujiwara, Hisashi Tanaka
  • Publication number: 20080273287
    Abstract: A filtering capacitor feedthrough assembly for an implantable active medical device is disclosed. The filtering capacitor feedthrough assembly includes a capacitor having an aperture defined by an inner capacitor surface. The capacitor is electrically grounded to an electrically conductive feedthrough ferrule or housing of the implantable active medical device. A terminal pin extends into the aperture. An electrically conductive split ring sleeve is disposed within the aperture and between the terminal pin and the capacitor. The split ring sleeve includes a first end, a second end, a sleeve length therebetween. A longitudinal slit through the sleeve extends from the first end to the second end. The electrically conductive split ring sleeve mechanically securing and electrically coupling the terminal pin to the capacitor.
    Type: Application
    Filed: March 21, 2007
    Publication date: November 6, 2008
    Applicant: MEDTRONIC, INC.
    Inventors: Michael G. Marinkov, Micah A. Litow, Rajesh Iyer, Richard P. Millis
  • Patent number: 7446996
    Abstract: A feedthrough capacitor array has first and second terminal electrodes, first and second ground terminal electrodes, first and second signal internal electrodes, and first and second ground internal electrodes. The first signal internal electrode and the first ground internal electrode are arranged so as to be opposed to each other through a part of a dielectric element body. The second signal internal electrode and the second ground internal electrode are arranged to be opposed to each other through a part of the dielectric element body, in an opposed direction of the first signal internal electrode and the first ground internal electrode. The first signal internal electrode and the second ground internal electrode are arranged so as not to overlap each other in the opposed direction of the first signal internal electrode and the first ground internal electrode.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: November 4, 2008
    Assignee: TDK Corporation
    Inventor: Masaaki Togashi
  • Patent number: 7440255
    Abstract: A capacitor construction includes a first electrode and a layer between the first electrode and a surface supporting the capacitor construction. The capacitor construction can exhibit a lower RC time constant compared to an otherwise identical capacitor construction lacking the layer. Alternatively, or additionally, the first electrode may contain Si and the layer may limit the Si from contributing to formation of metal silicide material between the first electrode and the supporting surface. The layer may be a nitride layer and may be conductive or insulative. When conductive, the layer may exhibit a first conductivity greater than a second conductivity of the first electrode. The capacitor construction may be used in memory devices.
    Type: Grant
    Filed: July 21, 2003
    Date of Patent: October 21, 2008
    Assignee: Micron Technology, Inc.
    Inventors: Brent A. McClure, Casey R. Kurth, Shenlin Chen, Debra K. Gould, Lyle D. Breiner, Er-Xuan Ping, Fred D. Fishburn, Hongmei Wang
  • Publication number: 20080247117
    Abstract: Filtering assembly for a feedthrough, for implantable medical devices, having operating conductive pin(s) and a ground conductive pin. The filtering assembly has: first insulating substrate, first conductive layer accommodated at first side of first insulating substrate and second conductive layer accommodated at second side of first insulating substrate opposing first side, first conductive layer comprises a conductive ground ring accommodated that surrounds the circumference of one end of the operating conductive pins and capacitive element(s), wherein each of the capacitive element(s) provides on the first side a connection to the operating conductive pin(s) and on the second side a connection to the ground ring, wherein the ground ring is connected to the ground pin, the second conductive layer comprises a ground plane providing connection to the ground ring of the first conductive layer and a connection to the ground pin.
    Type: Application
    Filed: March 31, 2008
    Publication date: October 9, 2008
    Inventors: Ralph Elam, Philip J. Atkin, Michael J. Ayton, Marion Ronald LeCompte, Dennis Digby, Habib Homayoun
  • Publication number: 20080247116
    Abstract: An interposer including: a substrate including a first layer and second layer, wherein the first layer and second layer are positioned parallel to each other; electrodes each having a concave-convex structure formed on each facing surface of the first layer and second layer of the substrate; a dielectric layer sandwiched between the electrodes which are formed on each facing surface of the first layer and second layer of the substrate; a first conductive part which vertically passes through the first layer of the substrate from a first outer surface of the substrate and is electrically connected to an electrode formed on a surface of the second layer of the substrate that faces the first layer of the substrate; and a second conductive part which vertically passes through the second layer of the substrate from a second outer surface of the substrate and is electrically connected to an electrode formed on a surface of the first layer of the substrate that faces the second layer of the substrate.
    Type: Application
    Filed: December 4, 2007
    Publication date: October 9, 2008
    Applicant: IBIDEN CO., LTD
    Inventors: Shuichi KAWANO, Liyi Chen
  • Publication number: 20080239618
    Abstract: A method is for fabricating an integrated circuit formed from a substrate and including several metallic interconnection levels in which, in a same plane parallel to the main plane of the substrate, is a plurality of thick horizontal metallic interconnection lines, as well as one or several MIM capacitors fitted with metallic electrodes that are orthogonal to the main plane of the substrate.
    Type: Application
    Filed: April 2, 2008
    Publication date: October 2, 2008
    Applicant: STMicroelectronics SA
    Inventors: Sebastien Cremer, Jean-Christophe Giraudin, Emmanuelle Serret
  • Patent number: 7414824
    Abstract: A storage capacitor having a scattering effect is positioned in a substrate for use in a thin film transistor array loop. The storage capacitor is characterized by having a rough layer overlapped by a medium layer and a passivation layer. The storage capacitor further has a reflective layer with high reflectivity so as to provide the storage capacitor with the scattering effect toward an external light source. A method of manufacturing the storage capacitor by two photolithography processes is also shown.
    Type: Grant
    Filed: April 28, 2005
    Date of Patent: August 19, 2008
    Assignee: Wistron Optronics Corporation
    Inventor: Hung-Huei Hsu
  • Patent number: 7410510
    Abstract: A process for producing an activated carbon for an electrode of an electric double-layer capacitor, includes a step of subjecting a carbonized material to an alkali activating treatment, wherein the carbonized material has an average true specific gravity of 1.450 to 1.650 and a variation of the true specific gravities of 0.025 or less.
    Type: Grant
    Filed: September 10, 2004
    Date of Patent: August 12, 2008
    Assignees: Honda Motor Co., Ltd., Kuraray Chemical Co., Ltd.
    Inventors: Takeshi Fujino, Shushi Nishimura
  • Patent number: 7408762
    Abstract: A capacitor feedthrough assembly with a cavity including a capacitor stack, including one or more substantially flat anode layers and one or more substantially flat cathode layers in a case with a cover, the case having a first opening sized for passage of the capacitor stack and a second opening defined by a lip. Additionally, the capacitor includes a conductive member attached to the capacitor stack and disposed at least part way through the second opening in the case, and an isolating element disposed between the lip and at least a portion of the connected stack and conductive member. Also, the capacitor includes a curable resin sealingly disposed in the cavity defined by the second opening, the isolating element, and the conductive member, the curable resin electrically isolating the case from the conductive member.
    Type: Grant
    Filed: July 15, 2005
    Date of Patent: August 5, 2008
    Assignee: Cardiac Pacemakers, Inc.
    Inventors: James A. Taller, Michael J. O'Phelan
  • Patent number: 7405920
    Abstract: A flat type capacitor-use polypropylene film having a Ad(thickness determined by micrometer method—thickness determined by weighing method) of 0.05-0.2 ?m and a lengthwise shrinkage dimensional change rate of 3% or less, or a flat type capacitor-use polypropylene film having a ?d of 0.1-0.3 ?m and a lengthwise F5 value of 50 MPa or more, and a flat type capacitor using it. A film excellent in handling ability in a capacitor element winding process is obtained, and a small, a large-capacity flat type capacitor excellent in withstand voltage characteristics such as self-recovering property, and used suitably under a high rated voltage, is obtained.
    Type: Grant
    Filed: March 16, 2004
    Date of Patent: July 29, 2008
    Assignee: Toray Industries, Inc.
    Inventors: Kimitake Uematsu, Isamu Moriguchi, Masahito Iwashita, Akira Oda
  • Patent number: 7391600
    Abstract: In the capacitor, an insulating structural member 28 is arranged on an earth metal fitting 27. In the earth metal fitting 27, two sets of cylindrical-shaped portions 26 are separately arranged in an interval, and a floating portion 27a is formed. The insulating structural member 28 is arranged opposite to the floating portion 27a of this earth metal fitting 27 in such a manner that both a concave portion 28a and a convex portion 28b are formed on the insulating structural member 28 to be fitted to the cylindrical-shaped portion 26. Since a feedthrough conductor 29 penetrates a through hole 30 of the insulating structural member 28, the earth metal fitting 27, the insulating structural member 28, and the feedthrough conductor 29 are positioned with each other. Then, one opening portion 31a of an insulating case 31 is fitted into the floating portion 27a of the earth metal fitting 27.
    Type: Grant
    Filed: September 16, 2005
    Date of Patent: June 24, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Takanori Handa
  • Patent number: 7391601
    Abstract: A feedthrough filter capacitor assembly for an implantable medical device is provided. The assembly includes a conductive lead, a conductive tube coaxial with and insulated from at least a portion of the lead, a conductive substrate through which the lead and tube pass in non-conductive relation therewith, and a filter capacitor associated with each of the lead and tube. The coaxial design of the filter capacitor assembly increases the number of lead connections while minimizing the footprint of the existing feedthrough layout.
    Type: Grant
    Filed: July 12, 2006
    Date of Patent: June 24, 2008
    Assignee: Pacesetter, Inc.
    Inventor: Reza Imani
  • Publication number: 20080144254
    Abstract: A feedthrough capacitor array has first and second terminal electrodes, first and second ground terminal electrodes, first and second signal internal electrodes, and first and second ground internal electrodes. The first signal internal electrode and the first ground internal electrode are arranged so as to be opposed to each other through a part of a dielectric element body. The second signal internal electrode and the second ground internal electrode are arranged to be opposed to each other through a part of the dielectric element body, in an opposed direction of the first signal internal electrode and the first ground internal electrode. The first signal internal electrode and the second ground internal electrode are arranged so as not to overlap each other in the opposed direction of the first signal internal electrode and the first ground internal electrode.
    Type: Application
    Filed: October 30, 2007
    Publication date: June 19, 2008
    Applicant: TDK CORPORATION
    Inventor: Masaaki Togashi
  • Patent number: 7388739
    Abstract: A green sheet coating material includes ceramic powder and a binder resin containing a butyral based resin as the main component, which furthermore includes a xylene based resin as a tackifier. The xylene based resin is included in a range of 1.0 wt % or less, more preferably 0.1 or more and 1.0 wt % or less, and particularly preferably more than 0.1 and 1.0 wt % or less with respect to 100 parts by weight of ceramic powder.
    Type: Grant
    Filed: March 17, 2004
    Date of Patent: June 17, 2008
    Assignee: TDK Corporation
    Inventors: Kyotaro Abe, Hisashi Kobayashi, Shigeki Sato
  • Patent number: 7388738
    Abstract: A multilayer capacitor comprises a capacitor body; first and second inner electrodes alternately arranged in the capacitor body; and a first outer connecting conductor and first and second terminal electrodes arranged on an outer surface of the capacitor body. Each first inner electrode has a first main electrode portion and a first lead electrode portion for connecting the first main electrode portion to the first outer connecting conductor. Each second inner electrode has a second main electrode portion and a second lead electrode portion for connecting the second main electrode portion to at least one second terminal electrode. The capacitor body includes a first inner connecting conductor arranged outside of at least one set of first and second inner electrodes in the opposing direction of the first and second inner electrodes and connected to at least one first terminal electrode and the first outer connecting conductor.
    Type: Grant
    Filed: March 28, 2007
    Date of Patent: June 17, 2008
    Assignee: TDK Corporation
    Inventors: Masaaki Togashi, Chris T. Burket
  • Patent number: 7365291
    Abstract: A high voltage input apparatus for a magnetron, in which first protrusions formed on lead conductors are caught by insulators and an insulating case, a ground metal is bonded to the insulating case, and expanded portions formed on the insulators are caught by the insulating case and the ground metal, thereby firmly fixing the lead conductors and preventing the lead conductors from being undesirably separated from the insulators and the insulating case.
    Type: Grant
    Filed: November 2, 2004
    Date of Patent: April 29, 2008
    Assignee: LG Electronics Inc.
    Inventors: Yong Soo Lee, Jong Soo Lee
  • Patent number: 7352995
    Abstract: A tunable element in the microwave frequency range is described that may include one or more tunable elements that are directly digitally controlled by a digital bus connecting a digital control circuit to each controlled element. In particular, each digital signal is filtered by a digital isolation technique so that the signal reaches the tunable elements with very low noise. The low noise digital signals are then converted to analog control voltages. The direct D/A conversion is accomplished by a special D/A converter which is manufactured as an integral part of a substrate. This D/A converter in accordance with the invention may consist of a resistor ladder or a directly digitally controlled capacitor. The direct digitally controlled capacitor may be a cantilevered type capacitor having multiple separate electrodes or sub-plates representing binary bits that may be used to control the capacitor.
    Type: Grant
    Filed: October 10, 2002
    Date of Patent: April 1, 2008
    Assignee: Bridgewave Communications, Inc.
    Inventor: Eliezer Pasternak
  • Patent number: 7342766
    Abstract: An on-chip capacitor having a plurality of capacitor layers. Each capacitor layer includes a pair of frames. A first frame of the pair is electrically connected to first frames on each other capacitor layer and a second frame of the pair is electrically connected to second frames on each other capacitor layer. A plurality of tines project from each frame within the respective capacitor layer. The tines from each frame mesh so as to form an array of sequentially alternating tines from each frame to provide a layer capacitance within the capacitor layer. The multi-layer capacitor further includes a plurality of projections from the tines. The projections extend between frames of adjacent capacitor layers so as to provide an interstitial capacitance between the capacitor layers. The total capacitance of the on-chip capacitor is the sum of each layer capacitance and each interstitial capacitance.
    Type: Grant
    Filed: October 4, 2005
    Date of Patent: March 11, 2008
    Assignee: Silterra Malaysia Sdn. Bhd.
    Inventor: Chin B. Cheah
  • Patent number: 7327555
    Abstract: A capacitor structure includes a first electrode structure, a second electrode structure, and a capacitor dielectric. The first electrode structure includes a plurality of first conductive plates vertically disposed and parallel to one another. The second electrode structure includes a plurality of second conductive plates disposed alternately with the first conductive plates. Each first conductive plate includes a plurality of first conductive bars electrically coupled to the first conductive bar stacked thereon with at least a first conductive via. Each second conductive plate includes a plurality of second conductive bars electrically coupled to the second conductive bar stacked thereon with at least a second conductive via.
    Type: Grant
    Filed: March 21, 2006
    Date of Patent: February 5, 2008
    Assignee: Realtek Semiconductor Corp.
    Inventors: Ta-Hsun Yeh, Yuh-Sheng Jean
  • Patent number: 7327551
    Abstract: A capacitor structure is provided. The capacitor structure is configured in a substrate. The capacitor structure includes a plurality of electrode sets, at least a first conductive plug and at least a second conductive plug. The electrode sets correspond with each other and are disposed in different layers of the substrate. Each electrode set includes a first electrode and a second electrode surrounding the former. In addition, the first conductive plug and the second conductive plug are disposed between two adjacent electrode sets. First electrodes of two adjacent electrode sets correspond with each other and are electrically connected to each other through the first conductive plug. Similarly, second electrodes of two adjacent electrode sets correspond with each other and are electrically connected to each other through the second conductive plug.
    Type: Grant
    Filed: November 19, 2006
    Date of Patent: February 5, 2008
    Assignee: Faraday Technology Corp.
    Inventors: Chih-Fu Chien, Chao-Chi Lee, Cheng-Chung Chou
  • Patent number: 7327553
    Abstract: A feedthrough filter capacitor assembly includes a capacitor having first and second sets of conductive electrode plates embedded within a dielectric body and mounted to the hermetic terminal of an implantable medical device. A laminar delamination gap is provided between the capacitor sealing materials and the hermetic terminal assembly to facilitate helium leak detection. At least one feedthrough terminal pin extends through the capacitor in conductive relation with the first set of electrode plates, and an outer ferrule is mounted about the capacitor in conductive relation with the second set of electrode plates. The mounting washer is spaced against the hermetic seal and is adhesively connected to the feedthrough capacitor. The mounting washer forms a laminar flow delamination through which helium molecules can flow during a helium leak detection test. Provision is made for a pre-connection to the gold braze so that the capacitor inside diameter termination is not electrically isolated from the lead wire.
    Type: Grant
    Filed: July 26, 2005
    Date of Patent: February 5, 2008
    Inventor: Richard L. Brendel
  • Patent number: 7310216
    Abstract: An electro-magnetic interference filter terminal assembly for active implantable medical devices includes a structural pad in the form of a substrate or attached wire bond pad, for convenient attachment of wires from the circuitry inside the implantable medical device to the capacitor structure via thermal or ultrasonic bonding, soldering or the like while shielding the capacitor from forces applied to the assembly during attachment of the wires.
    Type: Grant
    Filed: July 14, 2005
    Date of Patent: December 18, 2007
    Assignee: Greatbatch-Sierra, Inc.
    Inventors: Robert A. Stevenson, Richard L. Brendel, Christine Frysz, Haytham Hussein, Scott Knappen, Ryan A. Stevenson
  • Patent number: 7295419
    Abstract: This invention provides novel capacitors comprising nanofiber enhanced surface area substrates and structures comprising such capacitors, as well as methods and uses for such capacitors.
    Type: Grant
    Filed: August 21, 2006
    Date of Patent: November 13, 2007
    Assignee: Nanosys, Inc.
    Inventors: Calvin Y. H. Chow, Robert S. Dubrow
  • Patent number: 7295086
    Abstract: The invention includes an electromagnetic filter for a feedthrough conductor, and a method of making such a filter. At least two dielectric components are supported from a first side of a substrate, such as a housing or a printed circuit board. At least one of the dielectric components is associated with a failsafe link.
    Type: Grant
    Filed: March 11, 2005
    Date of Patent: November 13, 2007
    Assignee: Spectrum Control Inc.
    Inventors: Joseph V. Van Hoyweghen, III, Edward G. Sveda, Jr., Jeffrey D. Chereson
  • Patent number: 7281305
    Abstract: A method for attaching a capacitor to the feedthrough assembly of a medical device having a terminal pin comprises threading a first washer over the terminal pin, and placing a body of epoxy in contact with the first washer. The capacitor is positioned over the terminal pin such that the first washer and the body of epoxy are between the lower surface of the capacitor and a support surface. The body of epoxy is cured to couple the capacitor to the insulating structure. During curing, the body of epoxy is substantially confined between the upper surface and the lower surface by the ferrule, the insulating structure, the capacitor, and the first washer.
    Type: Grant
    Filed: March 31, 2006
    Date of Patent: October 16, 2007
    Assignee: Medtronic, Inc.
    Inventors: Rajesh V. Iyer, Susan A. Tettemer, John P Tardiff, Shawn D. Knowles
  • Patent number: 7277269
    Abstract: A capacitor with conductive layers arranged in parallel relationship. The conductive layers have nickel alloyed or add mixed with a refractory metal in an amount sufficient to raise the melting temperature of said conductive layer at least 1° C. above the melting temperature of nickel. A dielectric layers is between the conductive layers. Alternating layers of said conductive layers are in electrical contact with external terminations of opposing polarity.
    Type: Grant
    Filed: September 23, 2005
    Date of Patent: October 2, 2007
    Assignee: Kemet Electronics Corporation
    Inventors: Daniel E. Barber, Aiyang Wang, Michael S. Randall, Aziz Tajuddin
  • Publication number: 20070217121
    Abstract: A filter capacitor comprising a substrate of at least one layer of a low temperature co-fires ceramic (LTCC) tape supporting alternating active and ground electrode layers segregated by a dielectric layer is described. The substrate is preferably a laminate of three LTCC tapes pieces that are heated under pressure and at a relatively low temperature to become a laminate that maintains its shape and structure dimensions even after undergoing numerous sintering steps. Consequently, relatively thin active and ground electrode layers along with the intermediate dielectric layer can be laid down or deposited on the LTCC substrate by a screen-printing technique. A second laminate of LTCC tapes is positioned on top of the active/dielectric/ground layers to finish the capacitor. Consequently, a significant amount of space is saved in comparison to a comparably rated capacitor or, a capacitor of a higher rating can be provided in the same size as a conventional prior art capacitor.
    Type: Application
    Filed: March 8, 2007
    Publication date: September 20, 2007
    Applicant: Greatbatch Ltd.
    Inventors: Richard Fu, Christine A. Frysz, Mingguang Zhu, Kenneth Billings
  • Patent number: 7265995
    Abstract: An array capacitor is described for use with an integrated circuit (IC) mounted on an IC package. The array capacitor includes a number of first conductive layers interleaved with a number of second conductive layers and a number of dielectric layers separating adjacent conductive layers. The array capacitor further includes a number of first conductive vias to electrically connect the first conductive layers and a number of second conductive vias to electrically connect the second conductive layers. The array capacitor is provided with openings which are configured to enable pins from an IC package to pass through.
    Type: Grant
    Filed: December 29, 2003
    Date of Patent: September 4, 2007
    Assignee: Intel Corporation
    Inventors: Kaladhar Radhakrishnan, Dustin P. Wood, Nicholas L. Holmberg
  • Publication number: 20070183117
    Abstract: Ferrules made of nano-titanium for incorporation into feedthrough filter capacitor assemblies are described. The feedthrough filter capacitor assemblies are particularly useful for incorporation into implantable medical devices such as cardiac pacemakers, cardioverter defibrillators, and the like, to decouple and shield internal electronic components of the medical device from undesirable electromagnetic interference (EMI) signals. Nano-titanium experiences significantly less grain growth after high temperature brazing in comparison to commercially pure (CP) titanium and the titanium alloy Ti-6Al-4V. For that reason, nano-titanium is an ideal material for use in implantable medical applications where high strength, structural integrity even after heating and corrosion resistance are desired.
    Type: Application
    Filed: February 6, 2007
    Publication date: August 9, 2007
    Applicant: Greatbatch Ltd.
    Inventors: Richard Fu, Huadong Lou, Christine Frysz
  • Publication number: 20070183118
    Abstract: Ferrules made of nano-titanium for incorporation into feedthrough filter capacitor assemblies are described. The feedthrough filter capacitor assemblies are particularly useful for incorporation into implantable medical devices such as cardiac pacemakers, cardioverter defibrillators, and the like, to decouple and shield internal electronic components of the medical device from undesirable electromagnetic interference (EMI) signals. Nano-titanium experiences significantly less grain growth after high temperature brazing in comparison to commercially pure (CP) titanium and the titanium alloy Ti-6Al-4V. For that reason, nano-titanium is an ideal material for use in implantable medical applications where high strength, structural integrity even after heating and corrosion resistance are desired.
    Type: Application
    Filed: February 6, 2007
    Publication date: August 9, 2007
    Applicant: Greatbatch Ltd.
    Inventors: Richard Fu, Huadong Lou, Christine Frysz
  • Publication number: 20070165358
    Abstract: A multilayer feedthrough capacitor array is provided with a capacitor element, and first to sixth terminal electrodes. The capacitor element has a plurality of laminated insulator layers, a first signal internal electrode and a first ground internal electrode disposed so as to face each other with the insulator layer in between, and a second signal internal electrode and a second ground internal electrode disposed so as to face each other with the insulator layer in between. The first signal internal electrode includes a first signal lead portion electrically and physically connected to the first terminal electrode, and a second signal lead portion electrically and physically connected to the second terminal electrode. The first ground internal electrode includes a first ground lead portion electrically and physically connected to the fifth terminal electrode, and a second ground lead portion electrically and physically connected to the sixth terminal electrode.
    Type: Application
    Filed: November 13, 2006
    Publication date: July 19, 2007
    Applicant: TDK CORPORATION
    Inventor: Masaaki Togashi
  • Patent number: 7220949
    Abstract: Disclosed herein is a capacitor for a magnetron. The capacitor has dielectric members, which have a converging angle of less than 180° defined between lines extending from both sides of each dielectric member formed between corresponding ends of inner and outer electrodes of the dielectric member. The capacitor is reduced in size while having enhanced capacitance, thereby reducing a manufacturing time. The capacitor also has central conductors having enlarged portions larger than the inner electrode, thereby further enhancing the capacitance.
    Type: Grant
    Filed: August 17, 2005
    Date of Patent: May 22, 2007
    Assignee: LG Electronics, Inc.
    Inventors: Jong Soo Lee, Yong Soo Lee, Seung Won Baek
  • Patent number: 7218504
    Abstract: A capacitor with reduced equivalent series resistance and reduces equivalent series inductance is provided. Capacitors are provided with multiple plate assemblies that couple to a common single first polarity terminal. Capacitors are also provided with multiple plate assemblies that each couple to a respective second polarity terminal. Fan-like plate assemblies are arranged to provide increased capacitance with reduced equivalent series resistance and reduces equivalent series inductance. Capacitors are provided that mount using surface mounting technology. Capacitors are provided that conform to existing capacitor form factors.
    Type: Grant
    Filed: March 2, 2004
    Date of Patent: May 15, 2007
    Assignee: Intel Corporation
    Inventors: Aaron J. Steyskal, Larry E. Mosley, Tony V. Tran
  • Patent number: 7215529
    Abstract: A capacitive sensor having a first and a second polymeric conductor are embedded within a non conducting body, wherein the body maintains a fixed separation distance between the first and the second polymeric conductor. The body can include a non conducting web, wherein the web substantially precludes variation in the spacing of the polymeric conductors during use in the intended operating environment.
    Type: Grant
    Filed: August 19, 2003
    Date of Patent: May 8, 2007
    Assignee: Schlegel Corporation
    Inventor: Keith W. Rosenau
  • Patent number: 7210966
    Abstract: An improved multi-polar feedthrough assembly employs a particular metallic ferrule material for improved dimensional stability during initial fabrication and sustained hermetic operation. In one aspect, the disclosure relates to implantable medical devices (IMDs) including an IMD enclosure fabricated with grade 2 titanium and having a ferrule material fabricated with grade 4 titanium or grade 5 titanium. In one form, the multi-polar feedthrough assembly includes a filtered feedthrough array (e.g., employing capacitive filters coupled to the electrically conductive pins or serpentine conductors of the array). According to another aspect, the improved multi-polar feedthrough assembly incorporates additional pins, thus increasing the footprint of the assembly, and the additional pins provide analog electrical communication between operative circuitry inside an IMD and analog components external to the IMD.
    Type: Grant
    Filed: July 12, 2004
    Date of Patent: May 1, 2007
    Assignee: Medtronic, Inc.
    Inventors: William J. Taylor, Shawn D. Knowles, John C. Olson
  • Patent number: 7199995
    Abstract: A feedthrough filter capacitor assembly includes a conductive terminal pin which extends through a first passageway of a capacitor in conductive relation with a first set of electrode plates, and through a conductive ground plane and an insulator in non-conductive relation. The insulator includes ground plates conductively coupled to the ferrule. A second set of electrode plates of the capacitor are conductively coupled to the insulator ground plates, such as by a ground pin extending through the capacitor in relation with the second set of electrode plates, and at least partially extending through a second passageway of the insulator in conductive relation with the ground plates. In this manner, the exterior electrical/mechanical connection between the capacitor and ground plane or other ground member is eliminated.
    Type: Grant
    Filed: March 21, 2006
    Date of Patent: April 3, 2007
    Assignee: Greatbatch-Sierra, Inc.
    Inventor: Robert A. Stevenson
  • Patent number: 7187536
    Abstract: A structure and method are provided for reducing the equivalent series resistance of a capacitor. A capacitor includes one or more conductive interconnections contacting an active region of a first conductive plate of the capacitor at a plurality of locations along a lengthwise direction, such that every portion of the active region of the first conductive plate lies within a maximum distance from one of the locations, the maximum distance being less than the lateral dimension of the active region.
    Type: Grant
    Filed: August 20, 2004
    Date of Patent: March 6, 2007
    Assignee: Tessera, Inc.
    Inventor: Francis Edward Hawe
  • Patent number: 7187535
    Abstract: A feedthrough assembly for guiding a plurality of terminal pins through the housing of an implantable medical device. The feedthrough assembly comprises a ferrule fixedly coupled to the housing and having an aperture therethrough, and a non-conductive supporting structure fixedly coupled to the plurality of terminal pins and disposed within the aperture. The supporting structure is configured to guide the plurality of terminal pins through the ferrule. A plurality of capacitors, which is fewer in number than the plurality of terminal pins, is fixedly coupled to the supporting structure and electrically coupled between the ferrule and selected ones of the plurality of terminal pins.
    Type: Grant
    Filed: January 30, 2006
    Date of Patent: March 6, 2007
    Assignee: Medtronic, Inc.
    Inventors: Rajesh V. Iyer, Daniel J. Koch, Shawn D. Knowles
  • Patent number: 7184256
    Abstract: A high-voltage feed-through capacitor includes: a capacitor element; a grounding metal fitting; an insulating resin; two through conductors; an insulating cover; and an insulating tube. The capacitor element has two separate electrodes on one side and one common electrode on the other side and is mounted on one side of the grounding metal fitting with the common electrode being connected to the same side of the grounding metal fitting. The insulating resin fills a space inside the capacitor element. Each through conductor has a rod-like conductor portion passing through the grounding metal fitting and the capacitor element and connected to the separate electrode. At least a portion of the insulating tube is attached to the rod-like conductor portion within the capacitor element. The insulating cover is attached to the rod-like conductor portion to have one end thereof in contact with one end of the insulating tube.
    Type: Grant
    Filed: June 1, 2006
    Date of Patent: February 27, 2007
    Assignee: TDK Corporation
    Inventors: Tsukasa Sato, Yukihiko Shirakawa, Isao Fujiwara, Hisashi Tanaka