Abstract: Certain exemplary embodiments can comprise a system, which can comprise a basepan comprising a banding stud. The banding stud can be configured to releasably attach a heat sink to the basepan. The heat sink configured to increase a current carrying capacity of a system associated with the basepan from a first predetermined level to a second predetermined level.

Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

Abstract: In one embodiment, a liquid immersion cooled multichip module is provided which includes a substrate having chips mounted thereon and which is adapted to mount with a printed circuit board. A lid is adapted to secure to the printed circuit board so as to mount with the substrate to form a fluid chamber between the lid and the substrate, and to cause the substrate to mate with the printed circuit board. In one embodiment, a cambered bolster plate is located on a side of the printed circuit board opposite the lid and the lid is fastened to the bolster plate to secure the lid to the printed circuit board. A baffle, which may be removable in some embodiments, is located within the lid and directs coolant flow through the fluid chamber.

Abstract: The invention relates to an improvement to the thermal load capacity of generator switches (20, 21, 22). As is known, radiation plates (5, 50, 51, 52) are used between generator switches (20, 21, 22) for different phases (R, Y, B) for convective dissipation of radiated heat from adjacent encapsulation side walls (30b). According to the invention, in the vicinity of the encapsulation cover (3a) of a generator switch (20, 21, 22), the radiation plate (5, 50, 51, 52) has at least one angled metal sheet (50a) which is used to guide at least one air flow element (9) of the rising air flow (9) in the direction of the encapsulation cover (3a) and in order to direct the flow along the encapsulation cover (3a).

Abstract: The present invention provides a cable-air management adapter system (“CAMAS”) that addresses airflow, heat buildup and cable routing concerns in enclosures that house electronic equipment. The CAMAS allows users to work from a single frame to increase an enclosure's size by adding multiple expansion channels that form a platform on which multiple airflow, heat dissipation and cable support management options are installed, eliminating the need to replace the enclosure.

Abstract: A waterproof housing of a junction box has at least one vent piece penetrating through a wall of the housing for ventilation of the junction box. The vent piece has an inner wall formed with a baffle projection to prevent invasion of a splashing water. The waterproof housing has a plurality of the vent pieces. The waterproof housing also has a drain hole provided in the housing. The vent piece has an inside opening positioned higher than the drain hole when the junction box is mounted at a usage position. The baffle projection is positioned at an axial inner end portion of the vent piece. The vent piece has a central axis inclined relative to an invasion direction of an expected splashing water.

Abstract: An improved rework nozzle includes an open housing which when lowered onto the surface of a board forms a closed cavity. The housing includes venting means which expend air that is input to the cavity, thereby using flow through concepts to maintain a uniform temperature in the cavity. The housing also positioning mechanisms for both aligning a the housing and a captive integrated circuit to a desired footprint on the circuit board, and for limiting movement of the integrated circuit during rework.

Abstract: An arc resistant switchgear assembly is provided having a front wall, a rear wall, a bottom surface, an upper surface, a first side wall, and a second side wall opposed to the first side wall and spaced a first distance from the first side wall, with each of the first and second side walls having an upper portion and a lower portion, and with each of the first and second side walls having an inner and an outer surface, with at least the lower portion of both the first side wall and the second side wall having at least one blow-off panel detachably secured thereto by fastening means. Each of the panels is detachably secured to the outer surface of the side wall to which each is secured. The assembly has a vertical plenum formed directly adjacent both the first and the second side walls, with the outer surface of each of the first and second side walls defining an inner side wall of each of the vertical plenums.

Abstract: A power choke or transformer has an iron core, windings, and a cooling apparatus having a heat exchanger with a heat absorber and a cooling fluid duct operationally connected to the heat absorber, wherein the iron core is operationally connected to the heat absorber to remove heat emitted by the iron core.

Abstract: A cooling system is provided for electrical components in which cooling assemblies (11, 45) are inserted in non-magnetic cores of the electrical components, and in which tubes provide both inflow and outflow of a cooling medium. The non-magnetic cores may be bobbins (30) for an inductor assembly or the core of a capacitor (40). The tubes may form a loop (11) in more than one plane to prevent inducing current in a single turn, or they may be split-flow closed-end tubes (45) inserted from one end of the electrical component. The bobbin cores (31) are also constructed with a non-conductive portion to prevent inducing a current in a single turn of a conductor.

Abstract: An inlet with a heat-isolation element to be disposed in an opening of an electronic apparatus is disclosed. The inlet comprises a conductive terminal disposed on one surface thereof and a connecting element having one end connecting to the conductive terminal and the other end connecting to a printed circuit board of the electronic apparatus. A heat-isolation element is employed to cover the conductive terminal of the inlet and has at least one hole for passing the connecting element therethrough. By employing the heat-isolation element to cover the conductive terminal of the inlet, the heat-isolation is provided between the inlet and the internal circuit of the electronic apparatus.

Abstract: The aim of the invention is to prevent an unwanted conduction of a flow of gas inside a channel that connects an inner space of an enclosed switchgear (1) to another space. To this end, the channel is closed by means of a closing mechanism according to an increase in pressure in the inner space.

Abstract: Back plane and mid-plane assemblies and related systems and methods are described. In one embodiment, a system comprises an enclosure and a plane assembly mounted within the enclosure and configured to connect with multiple pluggable devices. The plane assembly comprises a first plane portion having multiple connectors; and at least a second plane portion having multiple connectors, with the second plane portion being offset from the first plane portion.

Abstract: A cooling device for a high voltage electrical unit for a motor of a vehicle, includes: an inverter for controlling the motor that drives the vehicle; an electrical energy storing device for supplying electrical energy to the motor via the inverter; a downverter for decreasing source voltage of the electrical energy storing device, the downverter, the inverter, and the electrical energy storing device disposed under a seat of the vehicle in a concentrated manner; a fan, disposed under the seat, for moving cooling air to the electrical energy storing device and the inverter; an air inlet disposed under the seat and at an end of the seat as viewed in a width direction of the vehicle; and an air outlet disposed under the seat and at the other end of the seat as viewed in a width direction of the vehicle.

Abstract: A water-cooling heat dissipation system includes a heat sink mounted on a heat generating electronic device and a circulating loop connected to two ends of the heat sink. The circulating loop has a water pump attached at the inlet of the heat sink, a first cooling base attached at the outlet of the heat sink, and a second cooling base between the water pump and the heat sink. The second cooling base has a cryogenic chip to provide icy water to the heat sink, such that heat dissipation efficiency is greatly enhanced.

Abstract: An AC inlet with heat-insulation function disposed in an opening of an electronic apparatus is disclosed. The inlet comprises a main body having an indentation portion disposed on a first side thereof, and the indentation portion having at least a conducting terminal and at least a hole, at least a connecting piece disposed on a second side opposite to the first side, and having one end connected with the conducting terminal, at least a conducting element having one end connected with the connecting piece and the other end connected with the circuit system in the electronic apparatus, a heat-insulation element covering the connecting piece and forming a space between the main body and the heat-insulation element, wherein the heat-insulation element has at least an opening for passing the conducting element therethrough. Thereby the air in the space circulates with the external air through the hole in the indentation portion of the main body.

Abstract: The high-power switch (1) according to the invention, with at least one switch pole (2) for guiding and switching an electric current which flows in one current flow direction when the switch is in the closed state, with the at least one switch pole (2) containing an inner conductor (3) which carries the current and containing an outer conductor (4) which is connected to ground potential (G) and carries a return current in the opposite direction to the current, with the outer conductor (4) being in the form of a housing (4) which surrounds the inner conductor (3), is characterized in that a cooling rib arrangement (5) which contains cooling ribs (9) is arranged on the outer conductor (4). At least some of the cooling ribs are advantageously arranged on a separate part of the housing (4), which is not the same as the part (15) of the housing (4) which is at a minimum distance from the inner conductor (3).

Abstract: A thermally conductive sheet includes a polyolefin elastomer mixed with a thermally conductive filler. The amount of volatile organic gas generated from the sheet is not more than 1000 ?g/cm2 per unit surface area. The amount of volatile corrosive gas generated from the sheet is not more than 10 ?g/cm2 per unit surface area. The sheet has a thermal conductivity of 0.5 to 20 W/m·K. This thermally conductive sheet generates fewer volatile substances and can be used even in a closed place.

Abstract: A method and apparatus for cooling an electronics chip with a cooling plate having integrated micro channels and manifold/plenum made in separate single-crystal silicon or low-cost polycrystalline silicon. Forming the microchannels in the cooling plate is more economical than forming the microchannels directly into the back of the chip being cooled. In some embodiments, the microchannels are high-aspect-ratio grooves formed (e.g., by etching) into a polycrystalline silicon cooling base, which is then attached to a cover (to contain the cooling fluid in the grooves) and to the back of the chip.

Abstract: An integrated heat dissipating enclosure to provide heat dissipation for computer, power supply or other electronic products such as an integrated circuit on a motherboard, a central processing unit, or a chip on a video adapter. The enclosure has a frame and a cooling cover. The frame is used to carry various internal components or peripherals of a computer. The cooling cover has a plurality of fins spaced from each other by a space. The fins are connected together by a thermal conductive pipe to form an integrated heat dissipating enclosure.

Abstract: A multi-chip electronic package comprised of a plurality of integrated circuit chips secured together in a stack formation. The chip stack is hermetically sealed in an enclosure. The enclosure comprises a pressurized, thermally conductive fluid, which is utilized for cooling the enclosed chip stack. A process and structure is proposed that allows for densely-packed, multi-chip electronic packages to be manufactured with improved heat dissipation efficiency, thus improving the performance and reliability of the multi-chip electronic package.

Abstract: A self-leveling heat sink includes a spring-arm device having at least one aperture and at least one spring-arm is coupled to a substrate. The substrate has at least one package mounted thereon, so that when the spring-arm device is mounted to the substrate the at least one package passes through the at least one aperture. A heat sink operable to remove heat from the at least one package has at least one heat sink post operable to receive a heat sink clip located at the distal end of each of the at least one spring-arms. Each of the at least one spring-arms extending from an inside edge of the at least one aperture and operable to couple the heat sink to the at least one package.

Abstract: A terminal structure provides interfacing with power electronics circuitry and external circuitry. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the terminal structure and the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Abstract: A control device is for a commercially available switchgear and an electronic power module. Compactness of the device is improved so that it can be used in a switchgear cabinet. To this end, the power module is placed onto the switchgear on the side facing away from its bottom wall and the dimensions of the power module are adapted to the base contour of the switchgear so that the peripheral contour of the power module extends beyond the base contour only slightly, if at all, wherein at least the width of the contactor does not extend beyond it.

Abstract: An electronic apparatus includes a housing and a printed wiring board contained in the housing. The printed wiring board includes a first surface, a second surface and a conductive layer. The first surface has a mounting area, the second surface is located opposite to the first surface in a position corresponding to the mounting area, between the first surface and the second surface. A heat generating component is mounted on the mounting area of the printed wiring board. A reinforcing member is provided on the second surface of the printed wiring board, and is in thermal contact therewith. The heat of the heat generating component is conducted to the reinforcing member through the printed wiring board, and is radiated from the reinforcing member.

Abstract: The aim of the invention is to prevent an unwanted conduction of a flow of gas inside a channel that connects an inner space of an enclosed switchgear (1) to another space. To this end, the channel is closed by means of a closing mechanism according to an increase in pressure in the inner space.

Abstract: A multi-mode modulation and display device of heat dissipating fans of a computer power supply is disclosed. A modulation and display device is installed within a computer power supply. The modes of the modulation and display device are changeable. Thereby, in standby, the noise of the power supply is reduced and as operation in higher temperature, the heat dissipating fan can be driven to be operated with a higher speed. The modulation and display device includes a switching and display module having lamps for displaying the operation condition of fans. Thereby, the condition of the fans can be viewed by and alerted to the uses. Speeds of the fans are adjustable by using a sensor to sense the temperature variation of the environment and using a control unit to actuate the switching and display module so as to change the rotation speed of the heat dissipating fans.

Abstract: An assembly of computer peripherals, which has the functions of (temperature control and fan rotation speed regulation, includes a host casing, a temperature sensing circuit, a fan driver circuit, a liquid crystal display (LCD) driver circuit, an alarm circuit, a fan rotation regulating device for regulating the fan rotation speed within a safe range, a control device for selectively showing the location of the host casing, the hard disk and the microprocessor on the LCD, and a control circuit, all of which are connected to one another. The user controls the fan rotation speed regulating device according to the fan rotation speed value shown on the LCD to optimize the rotation speed of the fan used for the microprocessor and then minimize the noise. Furthermore, the location of the heat source to be sensed can be changed.

Abstract: An induction foil cap sealing system includes a ferrite core having a plurality of openings therethrough and a mounting plate with a plurality of openings therethrough which are aligned with the plurality of openings in the ferrite core. Air is directed to flow through the openings to draw heat away. A litz wire coil is disposed proximate to the ferrite core which produces an electromagnetic field within the ferrite core. The ferrite core and litz wire coil are adapted to direct the electromagnetic field toward abject to heat it.

Abstract: A phase change composition comprises: a matrix comprising an organofunctional silicone wax, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any desired phase change temperature.

Abstract: In an alternator, a voltage control device includes a control circuit IC chip, a radiating fin and a case. The radiating fin 253 has a base 256 that is fixed to the IC chip and radiating portions. The radiating portions protrudes from the base 256 and have substantially U-shaped cross sections, so that tubular air passages are formed between the radiating portions and a fixed surface of the IC chip. Each radiating portion has a central trunk and alternating branches, thereby rows of air passages are formed by the central trunk and rows of branches.

Abstract: An improved integrated circuit package for providing built-in heating or cooling to a semiconductor chip is provided. The improved integrated circuit package provides increased operational bandwidth between different circuit devices, e.g. logic and memory chips. The improved integrated circuit package does not require changes in current CMOS processing techniques. The structure includes the use of a silicon interposer. The silicon interposer can consist of recycled rejected wafers from the front-end semiconductor processing. Micro-machined vias are formed through the silicon interposer. The micro-machined vias include electrical contacts which couple various integrated circuit devices located on the opposing surfaces of the silicon interposer. The packaging includes a Peltier element.

Abstract: A tactical missile includes a heat pipe connecting heat sources with heat sinks within the missile. The system includes a removable external heat dissipation device that connects to the heat pipe while the missile is being tested or reprogrammed. The external heat dissipation device draws heat out of the heat pipe and so maintains the electronic components acceptably cool during extended testing or reprogramming. During the relatively short tactical flight, the heat pipe transfers heat from the electronic components to the heat sinks within the missile. The high heat transfer rate of the heat pipe enables elements such as structural members and propellant to be used as heat sinks, elements not heretofore incorporated into thermal management of the heat generating electronic components.

Abstract: A method for cooling bus bars 12,14 in order to increase their current-carrying capacity while saving space and weight. The method comprises the steps of providing a housing having an interior wall; locating a distribution manifold 20 within the housing, the distribution manifold comprising a hollow bus bar 12,14; communicating to the manifold a supply of an evaporative coolant 18, 18′; and delivering the coolant 18, 18′ outwardly under pressure so that upon exiting the manifold 20, the coolant 18, 18′ undergoes a phase change from the liquid to the vapor state. Heat is extracted from the manifold 20 at least as quickly as heat is generated by the flow of current. The extraction of heat by the flow of coolant 18, 18′ and evaporation maintains or lowers the temperature of the bus bar and enables a given size of bus bar to carry more current without a significant rise in temperature. The invention also includes an apparatus 10 for cooling bus bars 12,14 in an electrical circuit.

Abstract: The invention refers to a telecommunications system comprising a module rack that defines a core bay, a service plane and a rack interface plane where the service plane is transverse to the rack interface plane. The core bay is in part bounded by the service plane and the rack interface plane. The telecommunications system also comprises a series of electronics modules each defining an electronics orientation plane where each of the modules includes two opposed cooling surfaces oriented substantially parallel to the electronics orientation plane. Each of the electronics modules is removably secured within the core bay. The series of the electronics modules forms an array such that their electronics orientation planes are substantially perpendicular to both the rack interface plane and the service plane. The array also defines at least one coolant stream passage across each cooling surface.

Abstract: A cooling system and method for cooling a heat sensitive element in an enclosure, such as a CPU, the cooling system including a high power active cooling unit having at least one Thermo Electric Cooler (TEC) component having a cooling liquid circuit passing through a cold side heat sink therein, the cooling liquid circuit being coupled to a heat sink coupled to the heat sensitive element and having a cooling liquid circuit therethrough; a dedicated power supply; and a controller for controlling the TEC components and the cooling liquid pump.

Abstract: To prevent an operator from being hurt by a hot outside panel of an electronic device when he touches the outside panel with his hand or a portion of his body, the outside panel is improved and an electronic device safe for the operator is provided. There are provided spaces for heat insulation in an outside panel and, by the action of the spaces, the apparent temperature of the outside panel is decreased. Also, ducts are provided in the outside panel, and the temperature of the outside panel itself is decreased by the action of the ducts. Further, a large number of protrusions are provided on the surface of the outside panel, and a heat insulating section is formed at the forward end of each protrusion, so that the apparent temperature is decreased.

Abstract: An electric power distributor mountable on a motor vehicle for distributing power from a power source installed in the motor vehicle to a plurality of electric load units equipped in the vehicle has a plurality of semiconductor operative elements which are incorporated in a power supply circuit from the power source to the electric load units; a control circuit board incorporated with a control circuit for controlling an operation of the semiconductor operative elements; a housing for encasing the semiconductor operative elements and the control circuit board therein; and a heat releasing member provided on an outer surface of the housing to release heat transferred from the semiconductor operative elements outside of the housing.

Abstract: A conductive heat sink is electrically interposed between a fuse and a switching apparatus within a watertight case of a network protector. The heat sink is advantageously configured to conduct current between the switching apparatus and the fuse. During operation, the skin effect causes the electricity conducted by the heat sink to flow primarily through the outer regions of the heat sink, thereby resulting in the generation of heat at the outer regions of the heat sink due to electrical resistance. The heat sink includes a core from which a plurality of fins extend. The fins conduct and convect heat away from the outer regions of the heat sink, which reduces the temperature thereof and correspondingly increases the conductivity of the outer regions of the heat sink.

Abstract: A conductive heat sink is electrically interposed between a fuse and a switching apparatus within a watertight case of a network protector. The heat sink is advantageously configured to conduct current between the switching apparatus and the fuse. During operation, the skin effect causes the electricity conducted by the heat sink to flow primarily through the outer regions of the heat sink, thereby resulting in the generation of heat at the outer regions of the heat sink due to electrical resistance. The heat sink includes a core from which a plurality of fins extend. The fins conduct and convect heat away from the outer regions of the heat sink, which reduces the temperature thereof and correspondingly increases the conductivity of the outer regions of the heat sink.

Abstract: An exhaust chamber for an arc resistant cabinet directs high temperature, expanding gases away from locations where personnel are likely to be present. The exhaust chamber may have an open top, directing gases outward through the center of the exhaust chamber's top. Alternatively, the exhaust chamber may be completely enclosed, directing expanding gases through a duct.

Abstract: Thermal management devices and methods include branching networks comprising flow channels of varying cross-sectional area. The branching networks can be fractal-like in nature with an increase in the total flow area following a flow channel bifurcation. In representative embodiments, the branching networks are defined in a channel pattern that is laminated between cover plates to form a thermal management device. The channel pattern includes bridging portions so that the branching network is defined with a single pattern piece. The branching networks can exhibit radial symmetry or be aligned with respect to one or more axes. Heat exchangers and diffusive mixers that include such networks are also provided.

Abstract: A panel, preferably a ceiling panel, for an arc resistant cabinet defines at least one flap dimensioned and configured to bend outward in response to excessive pressure within the cabinet. The flap is bent into a position wherein it will direct high temperature, expanding gases exiting the cabinet away from areas where personnel are likely to be located. The panel also includes a frame below the flap, thereby permitting the entire panel, including the flap, to support the weight of people working on top of the cabinet.

Abstract: A circuit panel chassis having a plurality of angled slots in a top surface thereof. The angled slots improving flame containment inside the circuit panel chassis while providing for cooling the circuit components of the circuit panel.

Abstract: This invention is directed to the prevention of the deterioration of the accuracy in component mounting by suppressing the temperature rise of the moving member as much as possible by cooling the moving member, which is the heat source of a linear motor. The moving member 48 of the linear motor 14 is configured in the following manner for achieving the objective of this invention. That is, the heat dissipation portion, the axis 17 made of the material with efficient thermal conduction such as aluminum, pierces through the iron core 18 around which coils 20 are wound. The moving member except a part of the axis 17 is molded with synthetic resin, and at one end of the axis 17, the heat dissipation fin 19 which makes heat dissipation area larger is formed. And this heat dissipation fin 19 is placed to face the air exhaust port 67.

Abstract: The section of an electrical high-voltage system has a gas-filled housing of predominantly symmetrical design. Provided in the housing are a conductor extending along a plane of symmetry of the housing, and cooling means for producing a circulation flow which dissipates heat loss from the conductor. The cooling means contains two blowers. The blowers are arranged in the interior of the housing and designed in such a way that, during the operation of the system, two mirror-symmetrical circulation part flows are formed which are bounded by the plane of symmetry. These circulation part flows are in each case guided without recirculation along a housing side wall from the top of the housing or the bottom of the housing. By this means, the heat loss is given up particularly effectively to the housing side walls, and the conductor can be loaded with very high operating currents.

Abstract: The invention concerns a horizontally divided switchgear, including compartments for high voltage and for cable connection. The cable connection compartment is common to one or more switchgear cubicles and is a compartment separated from the high voltage compartment(s) of the cubicle(s). In the switchgear is included one or more switchgear cubicles defined by vertical (12, 13, 14) and horizontal (15, 16) walls. The cubicle is arranged with only high voltage equipment, while connection means (18) for incoming and outgoing current cables are arranged exteriorly underneath the lower horizontal wall (16) of the cubicle. Bushing means (17) for cable conections are arranged in the lower horizontal wall (16).

Abstract: The chip-to-board (or chip-to-MCM) connection assembly and method therefor features a semiconductor chip (31) having a front surface (31f) on which external terminal pads are provided; a board or MCM (32) having a surface (e.g., a recessed surface) at a first side thereof to which the rear surface (31r) of the chip is affixed; and a connection carrier (33), disposed as an overlay, which electrically links the chip and the board or MCM. In this assembly scheme, the connection carrier (e.g., a bump carrier) which is affixed to both the chip and the board or MCM, contains all required signal line tracings (57) to provide the electrical interconnection between the semiconductor chip and the board or MCM. The bump carrier replaces all bond wires (24) and the like and can include support/control circuitry, passive and/or active, associated with, for example, high-speed/high-power IC chips (51).

Abstract: Structure for housing and heat sinking active equipment pieces (3; 2) in a space vehicle, comprising a constraining external container (1; 46) containing a cooling gas or a mixture of gases, means for mechanically holding said boxes (3; 2) into the container (1; 46) and a plurality of channels (32) or empty volumes (18), provided between the external surfaces of the active equipment boxes (3; 2) and the means for mechanically holding said boxes, for the circulation of the cooling gas or mixture of gases. (FIG.

Abstract: A cooling structure for an electric vehicle includes a battery box provided with at least one battery, a blower fan supplying air to cool the batteries, a wind box disposed on the battery box and provided with at least one electric component to be cooled. The wind box is formed with an air passage having a substantially U-shape when viewed from the top, on which the electric component is disposed. The wind box includes an air inlet connected to the blower fan and an air outlet communicating with one end of the battery box, so that the air from the blower fan is supplied to the battery box via the wind box.