Abstract: A device for supervising the cooling of a cooling system of a valve of a high voltage converter station located on high voltage potential level comprises members (31) located on high voltage potential level and adapted to detect the temperature at cooling blocks (32) of the valve on high voltage potential level and send values so detected to first control units (3) for controlling semiconductor components (4) of the valve. The first control units have means (20) for treating said values detected and the first control units are adapted to send data resulting from said treatment to an arrangement (16) for supervising said valve located on low potential level.

Abstract: An enclosure for electronic devices has a wall of a rigid plastic material, with elongated chambers defined therein. The chambers are filled with a material having a high thermal conductivity, or materials having high heat capacity, such as phase change material. Each chamber is located so that the material in the chamber is in thermal contact with the wall at a first location that tends to be at a relatively high temperature, and at a second location that tends to be at a lower temperature. The enclosure may alternatively have heat pipes of metal rather than chambers.

Abstract: An electrolytic capacitor with several conductive layer portions, including some anode layers and some cathode layers in alternating arrangement. A set of insulator layers is interleaved with the conductive layers, and the conductive and insulator layers are laminarly stacked with an anode layer being outermost on one surface. The stack is positioned adjacent a metal heat sink, with an outer insulator layer positioned between and closely contacting the stack and the heat sink. The cathode layers may be connected to the heat sink.

Abstract: The semiconductor device comprises an insulating film in which penetrating holes are formed, a semiconductor chip having electrodes, a wiring pattern adhered by an adhesive over a region including penetrating holes on one side of the insulating film and electrically connected to the electrodes of the semiconductor chip, and external electrodes provided on the wiring pattern through the penetrating holes and projecting from the surface opposite to the surface of the substrate on which the wiring pattern is formed. Part of the adhesive is drawn in to be interposed between the penetrating holes and external electrodes.

Abstract: A cooler which can be fitted on a rear wall or a side wall or a door of a switching cabinet and can be connected thereto via an intake and an inlet aperture of an internal circuit. According to the invention, rain and dustproofing is improved because alongside a central ventilation shaft open at the top, the cooler housing has vertical ventilation chambers open at the top as part of an external circuit hermetically separated from the internal circuit, the top of the switching cabinet and cooler housing is covered by a roofing component spaced therefrom which projects on all sides beyond the control box and the cooler housing and leaves a peripheral ventilation slot opening downwards. The roofing component is divided by two partitions into three chambers which communicate with the ventilation shaft and both ventilation chambers in the cooler housing.

Abstract: An alternating current circuit breaker having an extended fin cantilevered from its housing. A portion of the fin along its extended length is magnetized so that the fin flutters in the magnetic field generated by the alternating current conducted through the breaker. The resulting magnetic resonance vibration establishes forced, convective heat transfer which assists cooling of the breaker.

Abstract: Heat sinks extending rearward from and connected to the risers of a switchgear assembly by the same fasteners which secure the stabs to the risers dissipate the joule heat generated by current flow through the risers and stabs and accommodate for the higher temperature rise permitted in the power circuit breakers engaged by the stabs. The heat sinks are formed by a pair of heat sink members straddling the risers, each of which has an elongated flat body with an extended flat mounting surface on a first face which provides extended surface engagement with a stab. The elongated body projects rearward beyond the stab and a first set of transverse fins project from the first face rearward of the stab toward the first set of fins on the other heat sink member of the pair.

Abstract: Angle members forming the vertically extending supply buses in a meter center have arcuate offsets so that flanges on the ends of horizontally extending tenant buses form tenant stab contacts which are vertically aligned with supply stab contacts on straight sections of the outwardly projecting flanges of the supply bus angle members. Meter socket assemblies have double ended fastenerless meter jaws one pair of which plug onto the supply bus stab contacts and another pair of which plug onto the tenant bus stab contacts, and into which the meters are plugged. The double ended fastenerless meter jaws are fabricated from a pair of elongated flat members having end sections bent back on and diverging from straight center sections, and terminal sections which extend toward each other from the end sections and converge slightly toward the center sections. Spring clips clamp the terminal sections of the pair of elongated members in compliant confronting relationship to form the double ended fastenerless meter jaws.

Abstract: A terminal structure of a vacuum circuit breaker is capable of effectively radiating heat when conducting electricity.

Abstract: An improved arc-resistant switchgear enclosure is disclosed. The disclosed arc-resistant switchgear enclosure provides a cost effective structure to collect and channel the pressure and hot exhaust gases from lower compartments and safely vent these gases through the switchgear enclosure. In preferred embodiments, an internal arc chamber is formed by assembling modules and creating a void within the center of the switchgear enclosure. As multiple compartments or modules for a switchgear enclosure are connected, an arc chamber is created within the enclosure. Upon initiation of an arc fault within a particular compartment, a relief flap or cover for that particular compartment opens to channel the pressure and the gases into the internal arc chamber or directly through the top of the enclosure. Pressure and gases are vented into the internal arc chamber and flow horizontally through the arc chamber until a path to the top of the switchgear enclosure is reached.

Abstract: A temperature control system includes an electro-mechanical subassembly having an enhanced thermal interface, which comprises: an electronic device which has a face that dissipates heat; a heat exchange member which has a face that mates with the heat dissipating face of the electronic device; and, a film of liquid, lying between the mating faces of the heat exchange member and the electronic device, which evaporates without leaving any residue at a temperature that is too low to damage the electronic device. Due to the presence of the liquid film, the thermal resistance between the mating faces of the heat exchange member and the electronic device is reduced by over 1000% from which it otherwise is when film is deleted.

Abstract: A three-phase electrical distribution system includes an elongate housing of substantially square cross-section and a plurality of frames connected between the top and rear walls of the housing. Each frame includes three sections arranged in a stepped manner to locate and mount one power phase busbar by a standoff insulator near the rear wall, a second power phase busbar forwardly and vertically above the first busbar, and a third power phase busbar located vertically above and forwardly of the other busbars to minimize the cross-sectional housing space while spacing such busbars to prevent arcing therebetween or arcing to the housing or to the frames. The ground and neutral busbars are mounted via insulating standoffs to the bottom wall of the housing forwardly of the power busbars. An access opening is located in the bottom wall at various intervals to provide for hookup of power cables to the busbars via an openable front wall spanning between a pair of adjacent frames.

Abstract: A packaging and cooling system for one or more semi-conductor devices provides a casement defining a die chamber carrying a peripherally positioned power board with pre-attached multi-functional power pins communicating to medially positioned dies. The power pins provide not only improved power supply but also provide heat transfer from and mechanical support for the die. The die with an attached power supply plane and heat spreader is flip mounted on the power pins. The casement defines channels for coolant between the power board and dies and outwardly of the heat spreader. A closed cooling system provides a fluidic coolant to an input plenum from which it is sprayed into the die chamber channels for evaporative cooling therein on both sides of contained dies and about the power pins with subsequent recovery and recycling. The asymmetrical architecture within the die chamber allows less restricted thermal expansion of the various components than would result from common symmetrical architecture.

Abstract: An arc resistant enclosure including two compartments having a toggle flap which permits the two compartments to share a single exit path from the enclosure for any pressure and gases produced in either compartment.

Abstract: The disclosed invention aims at providing a semiconductor module structure which has a high ability of absorbing thermal deformation, is excellent in radiating ability and enables an easy maintenance operation. To this end, in the semiconductor module of the invention thermal conductor members are provided, each of which has an area of contact with a semiconductor device or an inner surface of a housing and has opposed heat transfer surfaces. A radiator is formed integrally on the housing. With this structure, large thermal deformation resulting from a high heat production density design can be absorbed, and at the same time heat from semiconductor devices can be efficiently radiated.

Abstract: A light delivery device including an interchangeable handpiece and a semiconductor light source module adapted to releasably attach to the handpiece. The light source module includes a two-dimensional array of light emitting diodes (LED's) disposed on a surface of a fluid-cooled electrically conductive support plate. The device is adapted for uniformly illuminating a tissue surface with phototherapeutic light. The phototherapeutic light is produced by an array of over-driven LED's mounted on the surface of the heat-sinked support. The semiconductor light source employs a multi-layer construction wherein electrically conductive layers are thermally isolated from each other. The device is rugged, inexpensive and can produce high optical power while operating at a temperature well below the temperature at which device failure occurs. The light source module is adapted to be releasably connected to an interchangeable LED handpiece which provides power to the LED's and conducts a coolant fluid.

Abstract: An improved arc-resistant switchgear enclosure is disclosed. The disclosed arc-resistant switchgear enclosure provides a cost effective structure to collect and channel the pressure and hot exhaust gases from lower compartments and safely vent these gases through the switchgear enclosure. In preferred embodiments, an internal arc chamber is formed by assembling modules and creating a void within the center of the switchgear enclosure. As multiple compartments or modules for a switchgear enclosure are connected, an arc chamber is created within the enclosure. Upon initiation of an arc fault within a particular compartment, a relief flap or cover for that particular compartment opens to channel the pressure and the gases into the internal arc chamber or directly through the top of the enclosure. Pressure and gases are vented into the internal arc chamber and flow horizontally through the arc chamber until a path to the top of the switchgear enclosure is reached.

Abstract: The cooling device serves for the cooling of electric and electronic components and of batteries in a switch cabinet, in which case in a housing (101) of the cooling device (100), a first heat exchanger (20) for the formation of a first cooling system (K1) for the chamber accommodating the electric and electronic components and a second heat exchanger (26) for the formation of a second cooling system (K2) that is independent of the first cooling system (K1) for the chamber accommodating the batteries are disposed, wherein both heat exchangers (20,26) are supplied from a common compressor (15).

Abstract: An improved arc-resistant switchgear enclosure is disclosed. The disclosed arc-resistant switchgear enclosure provides a cost effective means to collect and channel the pressure and hot exhaust gases from lower compartments and safely vent these gases through the switchgear enclosure. In preferred embodiments, an internal arc chamber is formed by assembling modules and creating a void within the center of the switchgear enclosure. As multiple compartments or modules for a switchgear enclosure are connected, an arc chamber is created within the enclosure. Upon initiation of an arc fault within a particular compartment, a relief flap or cover for that particular compartment opens to channel the pressure and the gases into the internal arc chamber or directly through the top of the enclosure. Pressure and gases vented into the internal arc chamber flow horizontally through the arc chamber until a path to the top of the switchgear enclosure is reached.

Abstract: A housing is provided with a base part to receive a plurality of equipment units, such as primed circuit boards. To facilitate access to terminal regions of the circuit boards, a two-part cover is securable to the base part, wherein a first cover part has an access opening to the terminal regions, and a ventilated second cover part covers the terminal region in a snap-fit manner. The terminal regions are thus easily accessible for measuring or testing. Preferably, the second cover part is manually releasable, without use of a tool.

Abstract: A highly integrated electronic component comprised of a semiconductor body cast into a plastics enclosure. A multiplicity of metallic terminals protrude from the plastic enclosure, and a heat-conducting plate is cast into the plastic enclosure and is in surface contact with an underside of the semiconductor body. Good heat removal and an increase in the mechanical stability for the terminals are achieved by the heat-conducting plate being substantially planar and bearing both against the underside of the semiconductor body and against the underside of the terminals and by the upper side of the heat-conducting plate having a thin, electrically insulating layer.

Abstract: A valve stack for high voltages includes a number of electrically interconnected valve modules, some of which are disposed one above the other. To prevent a large fire in a valve module from spreading upwards to valve modules positioned above it, fire screens are arranged between valve modules located one above the other.

Abstract: A circuit breaker has a line terminal comprising a pair of vertically spaced resilient terminal strips which extend in the transverse horizontal direction out from the breaker's housing to free ends of the strips, and which strips have formed therein near those ends respective bends disposed opposite each other and vertically projecting away from each other to bound opposite sides of a circular cylindrical cavity defined between those strips. A horizontal rail for conducting current is aligned in its lengthwise direction normal to those strips, and the rail has a flange received in the cavity in electromechanical contact with the strips, and also, a web extending in the transverse horizontal direction from the front flange out beyond the terminal to a rear flange for the rail. The shape, size and mass of the rail promote reduction of the temperature generated at the line terminal by the inrush of current carried by the rail in the presence of a short circuit in the load served by the breaker.