Abstract: A thermal cage for managing environmental conditions affecting electronic equipment. The thermal cage can be connectable with a plenum and a supply channel. Additionally, the thermal cage can include a cabinet faulting an enclosure for the electronic equipment and an outlet in fluid communication with the cabinet, wherein the outlet is connectable to the plenum. Furthermore, the thermal cage can include an inlet in fluid communication with the cabinet, wherein the inlet is connectable to the supply channel, and a thermal curtain comprising a plurality of adjustable barriers for directing air flowing through the cabinet to the outlet, wherein the thermal cage is movable.

Abstract: Dehumidifying and re-humidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes a dehumidifying air-to-liquid heat exchanger disposed at an air inlet side of the rack and a re-humidifying structure disposed at an air outlet side of the rack. The dehumidifying air-to-liquid heat exchanger is in fluid communication with a coolant loop for passing chilled coolant through the heat exchanger, and the dehumidifying heat exchanger dehumidifies ingressing air to the electronics rack to reduce a dew point of air flowing through the rack. A condensate collector disposed at the air inlet side collects liquid condensate from the dehumidifying of ingressing air, and a condensate delivery mechanism delivers the condensate to the re-humidifying structure to humidify air egressing from the electronics rack.

Abstract: Dehumidifying and re-humidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes an air-to-liquid heat exchanger disposed at an air inlet side of the rack, wherein air flows through the rack from the air inlet side to an air outlet side. The heat exchanger, which is positioned for ingressing air to pass thereacross before passing through the electronics rack, is in fluid communication with a coolant loop for passing coolant through the heat exchanger, and the heat exchanger dehumidifies ingressing air to the electronics rack to reduce a dew point of air flowing through the rack. A condensate collector disposed at the air inlet side collects liquid condensate from the heat exchanger's dehumidifying of ingressing air, and an evaporator disposed at the air outlet side humidifies air egressing from the electronics rack employing condensate from the condensate collector.

Abstract: An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.

Abstract: The invention relates to a modular assembly for fastening electronic modules carried on board an aircraft, characterized in that it comprises: a frame (10) having a more or less planar vertical front surface, comprising several mechanical fastening interfaces each intended for mechanically fastening an electronic module, at least one electronic module (80) comprising a mechanical fastening interface and which is attached to the front surface of the frame in suspended position via cooperation of the mechanical fastening interface of the said at least one electronic module with one of the mechanical fastening interfaces of the frame.

Abstract: An electronic system enclosure including cooling units to regulate temperature of electrical components therein. In one embodiment, the electronic system enclosure includes field replaceable units which facilitate concurrent maintenance. In this embodiment, air pressure within the electronic system enclosure is maintained while a field replaceable unit is removed. Also in this embodiment, cooling of the remaining electrical components of the electronic system enclosure is continued during removal of a field replaceable unit.

Abstract: An electronic equipment housing (1000) comprises a housing body (300) comprising a conditioning unit (200) housing an air conditioner (210) and an equipment unit (100) adapted to house electrical equipment. A housing plenum (400) is mounted on top of the lower housing body (300), so as to cover and engage the equipment unit (100). The housing plenum (400) has at least one aperture (430) formed in the lower surface (450), wherein the aperture (430) is adapted to allow air to pass from the housing plenum (400) directly into the equipment unit (100) and wherein the housing plenum (400) is in fluid communication with the air conditioner (210). A duct arrangement (500) provides fluid communication between the equipment unit (100) and the air conditioner (210), wherein the duct arrangement (500) is adapted to return air from the equipment unit (100) to the air conditioner (210).

Abstract: A method and system for increasing cooling of an enclosure is provided. The component enclosure includes one or more sidewalls defining a volume, the sidewalls are configured to substantially surround a heat generating component positioned within the volume. The component enclosure further includes a synthetic jet assembly positioned adjacent at least one of the sidewalls. The synthetic jet assembly includes at least one synthetic jet ejector having a jet port. The jet port is aligned at least one of perpendicularly, parallelly, and obliquely with a surface of the at least one sidewall. The synthetic jet assembly is configured to direct a jet of fluid through the port at least one of substantially parallel to the surface, perpendicularly onto the surface, and obliquely toward the surface.

Abstract: An acoustically absorptive apparatus is provided which includes an acoustically absorptive panel and an attachment mechanism. The acoustically absorptive panel is configured to reside along a side of an electronics rack, and includes a multilayer structure to attenuate noise. The attachment mechanism slidably mounts the acoustically absorptive panel to the electronics rack and facilitates sliding of the panel relative to the rack between retracted and extended positions. In the refracted position, the panel is disposed along the side of the rack, and in the extended position, the panel extends beyond a front or back edge of the electronics rack to facilitate attenuating noise emanating from the rack or an aisle alongside a row of multiple racks. In addition, the acoustically absorptive panel hingedly couples along a vertical edge to the attachment mechanism such that the panel is also rotatable outward away from the side of the electronics rack.

Abstract: A cooling device for cooling an electronic component (semiconductor module) includes a cooling tube adapted to be disposed in contact with the electronic component and having an internal coolant flow channel for the passage therethrough of a cooling medium, and a high-pressure tube disposed adjacent to a surface of the cooling tube that faces away from the electronic component, the high-pressure tube having a hollow interior that can be filled with a high-pressure fluid having a pressure higher than that of the cooling medium. An electric power conversion device comprised of a plurality of semiconductor modules and the cooling device as means for cooling the semiconductor modules is also disclosed.

Abstract: Apparatuses, methods, and systems directed to efficient cooling of data centers. Some embodiments of the invention allow encapsulation of cold rows through an enclosure and allow server fans to draw cold air from the cold row encapsulation structure to cool servers installed on the server racks. In other particular embodiments, the systems disclosed can be used to mix outside cool air into the cold row encapsulation structure to cool the servers. In some embodiments, the present invention involves using multiple cold row encapsulation structures to cool the servers installed on the racks.

Abstract: A semiconductor cooling device for transferring heat from a semiconductor die (111). The semiconductor cooling device includes a heat dissipator (112) that may be thermally coupled to a semiconductor module (111) to be cooled for dissipating heat from the semiconductor die (111); a housing (150) in or on which the semiconductor die (111) is mounted; a fluid flow passage (153) for providing a forced fluid flow within the housing (150); and a fluid path (155) arranged to guide the forced fluid flow in a first direction between the fluid flow passage (153) and the heat dissipator (112) and further arranged to guide the fluid flow along the heat dissipator (112) in a second direction different to the first direction. In a particular embodiment, the semiconductor cooling device is used to dissipate heat from an array of LEDs.

Abstract: In at least some embodiments, an apparatus includes a pressurized air source and a tube coupled to the pressurized air source. The apparatus also includes an electronic component that is spot-cooled by moving air between the pressurized air source and the electronic component via the tube.

Abstract: An image display apparatus includes: an image display unit for forming an optical image; and an outer housing for housing the image display unit. The outer housing includes a window for displaying the optical image to the outside. The image display apparatus includes, in the outer housing, a heat insulator placed so as to surround the image display unit and a cooling device for cooling inside the outer housing, and the cooling device has a variable cooling capacity. The image display apparatus is abatable to changes in the ambient temperature and the internal power consumption and the presence or absence of sunlight and can be installed in a variety of outdoor environment, so that a high degree of reliability can be achieved.

Abstract: One embodiment of the present invention uses plasma-driven gas flow to cool down electronic devices. The cooling device may comprise micro heat sink fins assembly, micro plasma actuators assembly, and magnetic circuit assembly. The plasma actuator assembly comprises electrodes and dielectric pieces. Voltages are applied to electrodes to drive the plasma gas flow. A magnetic circuit assembly may be used to provide the magnetic field to couple with plasma actuators to induce the plasma gas flow to cool down the heat sink fins and heat source.

Abstract: A computer enclosure includes a chassis with a plurality of heat generating components installed therein and an airflow guide structure. The airflow guide structure includes a fan and a duct attached to the fan. A pair of airflow outlets aligned with the fan is defined in the duct. The duct includes a plurality of pivot panels pivotally attached at airflow outlets. The pivot panels are configured to guide airflow from the fan to different positions of heat generating components in the chassis.

Abstract: An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.

Abstract: An electronic device cabinet includes a first temperature control system positioned to direct a conditioned airflow into a first electronic device storage zone of the cabinet and a second temperature control system positioned to direct a conditioned airflow into a second electronic device storage zone of the cabinet. The first temperature control system includes a first plurality of vortex tubes having a compressed air inlet and a first cooling air outlet that guides cooling air into the first device storage zone. The second temperature control system includes a second plurality of vortex tubes having a compressed air inlet and a second cooling air outlet that guides cooling air into the second device storage zone. A controller selectively delivers compressed air to respective ones of the first and second temperature control systems upon sensing a demand for cooling in corresponding ones of the first and second electronic device storage zones.

Abstract: A system (50) includes a material layer (52) having an opening (62) extending through it and a pumping device (54) positioned behind the layer (52). A target element (56) is positioned in front of the material layer (52). In a partial cooling mode (124), the pumping device (54) drives a jet (134) of coolant through the opening (62) toward the target (56). Transducers (58, 60), positioned at opposing ends of the opening (62), produce output signals (130, 132) that perturb the jet (134) to partially control its oscillation. The jet (134) spreads from a location (96) on the target element (56) in one direction (142) to provide uniform cooling over a portion (126) of the target element (56) in the direction (142), and the jet (134) non-uniformly spreads in another direction (144) to provide non-uniform cooling over a portion (128) of the target element (56) in the other direction (144).

Abstract: A data center comprising an air humidity- and temperature-conditioned space where heat producing ICT and/or telecom equipment is arranged, a heat wheel and means for supplying recirculation of air heated by the equipment as a first air stream to the heat wheel and the heat wheel being configured to cool the first air stream using a separate second air stream.

Abstract: A cooling method and system is disclosed which utilizes vortex tubes to generate and direct cold air over heat-generating components of an electronic system.

Abstract: A data center system can include a mobile support structure; one or more enclosures for removable electronic equipment where the enclosures are housed by the support structure; a cooling system in fluid communication with the enclosures for cooling of the electronic equipment where the cooling system is housed by the support structure; and a power system operably connected to the electronic equipment and the cooling system for supplying power thereto where the power system comprises a generator housed by the support system. The mobile data center can be moved to remote locations, and the electronic equipment can be placed in communication with a network when at the remote location Other embodiments are disclosed.

Abstract: A control system for providing thermal management of electronic equipment housed in a cabinet enclosure. The system can include a plurality of sensors in proximity to the cabinet enclosure for monitoring a temperature, a pressure and a humidity associated with the electronic equipment; and a controller in communication with the sensors for receiving data from the sensors, where the controller adjusts the temperature, the pressure and the humidity associated with the electronic equipment.

Abstract: A cabinet for a solar power inverter is described. A solar power inverter receives DC current from a solar panel and transforms the DC current into AC current. To cool the inverter equipment, an air inlet receives ambient air drawn into the cabinet by an air pressurizer. The ambient air is urged into a pressurized air plenum, from which two ports channel the air into at least two air paths to flow over the equipment in the cabinet. The equipment in the cabinet is arranged such that the air passes over more heat-sensitive equipment before reaching less heat-sensitive equipment. The equipment in the cabinet can be separated by grounded, metal walls to contain and diminish electromagnetic interference. The equipment may be accessed from a single, front side of the cabinet.

Abstract: A synthetic jet includes an inner wall configured to surround a heat-generating component, a plurality of walls coupled to the inner wall, the inner wall and the plurality of walls configured to enclose a volume surrounding the inner wall, an actuator coupled to one of the plurality of walls and the inner wall. The inner wall has a plurality of orifices formed therein configured to direct a fluid toward the heat-generating component upon activation of the actuator.

Abstract: Systems and methods for cooling electronic devices via enhanced thermal conduction in the gap separating an electronic device from a heat sink are provided. In one embodiment, a system for cooling an electronic device comprises: a heat sink spaced from the integrated circuit by a gap; and a bubbler and an atomizer configured to feed a mixture comprising an atomized liquid and a carrier gas to the gap.

Abstract: An electronic subsystem such as an array of radar transmit/receive microwave modules are associated with (e.g., base mounted to) spaced heat sinks. There is an electronic module on each side of each heat sink and an inflatable bladder or “pneumatic pressure wedge” between adjacent heat sinks biases a pair of electronic modules against their respective heat sinks.

Abstract: A method and an arrangement for discharging an energy storage system for electrical energy, particularly in a vehicle having a hybrid drive line, by means of a first discharge resistor, wherein a coolant such as carbon dioxide gas is provided to the first discharge resistor during discharge of the energy storage system for leading off heat as well as a hybrid vehicle comprising such an arrangement.

Abstract: An airflow direction controlling apparatus includes a frame arranged near an outlet of a fan, at least one blade pivotably mounted to the frame and driven by a motor, at least two thermal sensors for detecting temperatures of at least two electronic components in a computer, and a control module electronically connected to the at least two sensors and the motor. The control module receives the detected temperatures from the sensors, determines if an electronic component is in danger of overheating, and controls the motor to rotate the at least one blade to a desired position where airflow of the fan blows toward the electronic component in danger of overheating, to quickly dissipate the heat generated by the electronic component.

Abstract: A circuit device having superior mechanical strength at the interface between a circuit board and heat sink and superior efficiency for radiating heat from a circuit element to the heat sink through the circuit board. The circuit device includes the metal-based insulation board for installing the circuit element, and the heat sink, over which the insulation board is installed with a paste arranged therebetween. The insulation board has a projection arranged on the surface facing the heat sink along a peripheral portion. At least part of the projection contacts the heat sink through the paste layer.

Abstract: A cabinet adapted with a cooling system is described. Embodiments include electronics cabinets which house electronic equipment. A flow of air is set up in the interior of the cabinet by drawing in ambient air. The incoming air is cooled by an evaporator component of a cooling system. The cooled air cools the electronics and in the process becomes heated air. The heated air serves to cool a condenser component of the cooling system, thereby further heating the heated air. The heated air is then exhausted from the cabinet.

Abstract: An entrainment heatsink system and method using distributed micro jets. Such a system and/or method utilize a pressurized primary flow through arrays of micro nozzles to entrain a much larger secondary flow to carry heat away from the heatsink. The bleed air from an aircraft engine represents an ideal pressurized air source for the primary flow with respect to such a heatsink. As such, the needed high-pressure primary flow is very small and can be delivered via thin air hoses, which has the flexibility to reach constraint spaces. In addition to the entrainment effect, the distributed micro jets also induce a high level of turbulence in the heatsink, significantly enhancing heat transfer and cooling performance.

Abstract: Disclosed is a laminate cell (1) comprising an electric power generating element (2) and a laminate film (7) so arranged as to surround the electric power generating element (2). The laminate cell (1) further comprises a frame member (10) which surrounds and holds the electric power generating element (2) and has a first portion (10f) with a thickness larger than that of the electric power generating element (2).

Abstract: The cooling apparatus comprises an air supply system, a water supply system, and a sprayer, and has a structure such that water and compressed air are mixed and the air is sprayed together with the water converted into mist onto the upper surface of a device attached to a socket of a burn-in board. The heat generated by the device is removed via the mist and air that falls on the upper surface. When a burn-in test is conducted the cooling apparatus adjusts the water and air supply so that the device is cooled to the target temperature.

Abstract: A system and method of reducing consumption of electricity used to cool electronic computer data center, networking, and telecommunications equipment, and to reduce the incidence of thermal failure of electronic components, includes provision of one or more partitions to reduce the volume of the cooled environment supplying coldest possible cooled air from air conditioning systems to a chamber adjacent to racks containing the electronic components, preventing dilution of the supplied cooling airflow by warmer air from outside of the reduced volume environment, and controlling the delivery of cooling air flow through the reduced volume of the cooled environment.

Abstract: A system for restricting mixing of air in a data center includes a plurality of racks, each of the racks having a front face and a back face. The system includes an enclosure for collecting air released from the back faces of the plurality of racks, the enclosure configured to substantially contain the air in an area between the first row and the second row and having a roof panel coupled to the first row of racks and the second row of racks configured to span a distance between the first row of racks and the second row of racks. The enclosure is configured to maintain a first air pressure inside of the enclosure that is substantially equal to a second air pressure outside the enclosure.

Abstract: A data center comprising an air humidity- and temperature-conditioned space where heat producing ICT and/or telecom equipment is arranged, a heat wheel and means for supplying recirculation of air heated by the equipment as a first air stream to the heat wheel and the heat wheel being configured to cool the first air stream using a separate second air stream.

Abstract: A constant-temperature burst-isolation cabinet includes body of cabinet (4), the characters are that the cabinet also includes an air temperature regulator, indoor unit and the outdoor unit of the regulator are installed inside and outside the cabinet (4). Mounting hole for interface is prepared on lateral wall of the cabinet (4), explosion suppression interface (17) is inside mounting hole for the interface. Through throttle decompression element (18), explosion suppression interface (17), and pipe (16), evaporator (8) inlet of indoor unit is connected to condenser (10) outlet of outdoor unit. Through explosion suppression interface (17), and pipe (16), evaporator (8) outlet of indoor unit is connected to compressor (14) inlet of outdoor unit, and through pipe (16), compressor (14) outlet of outdoor unit is connected to condenser (10) inlet. The throttle decompression element (18) is expansion valve or capillary.

Abstract: A system and a method for implementing a cooling apparatus coupled to and configured for cooling a heat-generating device by coupling a cooling gas driver to the cooling apparatus. The cooling apparatus has an upstream cooling chamber closed downstream by a permeable partition through which the cooling gas flows. The cooling gas driver is configured as a centralized or a distributed gas driving facility dedicated to provide a flow of treated cooling gas, such as air, at a high-differential pressure through the cooling apparatus, the cooling gas driver using minimal energy being disposed remote from the cooling apparatus and from the heat generating device. Implementation is achieved by selecting appropriate governing parameters for the cooling apparatus, the partition, and the cooling gas driver, and by computing mutual matching for optimal cooling operation by absorbing heat from and transferring heat away from the heat-generating device.

Abstract: A radiation device for computer or electric appliances includes a heat inhalant block under a CPU of a computer, a heat transmission block positioned next to the heat inhalant block, a bridge block, a cold crystal and a cooling source block sequentially disposed on the top of the heat transmission block with a bridge block engaged therebetween, a transparent cover covering the top of the cooling source block to form a left and a right flow canals therein, a upper heat radiation module superimposed a lower heat radiation module positioned next to the heat transmission block, a fan on the top of the upper heat radiation module, a set of the heat pipes extended from the heat inhalant block to the lower heat radiation module through the heat transmission block, a pair of lateral pipe connected between the bridge block and the lower heat radiation module and a set of the cold pipes connected between the cooling source block and the upper heat radiation module.

Abstract: A cooling device for cooling an electronic component (semiconductor module) includes a cooling tube adapted to be disposed in contact with the electronic component and having an internal coolant flow channel for the passage therethrough of a cooling medium, and a high-pressure tube disposed adjacent to a surface of the cooling tube that faces away from the electronic component, the high-pressure tube having a hollow interior that can be filled with a high-pressure fluid having a pressure higher than that of the cooling medium. An electric power conversion device comprised of a plurality of semiconductor modules and the cooling device as means for cooling the semiconductor modules is also disclosed.

Abstract: Apparatuses, methods, and systems directed to efficient cooling of data centers. Some embodiments of the invention allow encapsulation of cold rows through an enclosure and allow server fans to draw cold air from the cold row encapsulation structure to cool servers installed on the server racks. In other particular embodiments, the systems disclosed can be used to mix outside cool air into the cold row encapsulation structure to cool the servers. In some embodiments, the present invention involves using multiple cold row encapsulation structures to cool the servers installed on the racks.

Abstract: A data center includes an electronic equipment rack having a front face and a back face and a cooling unit positioned adjacent to the rack, the cooling unit having a front face and a back face, the cooling unit being configured to exhaust cooled air from the front face of the cooling unit to cool the rack. The cooling unit is configured to release the cooled air along a substantial portion of a height of the front face of the rack.

Abstract: Disclosed is a laminate cell (1) comprising an electric power generating element (2) and a laminate film (7) so arranged as to surround the electric power generating element (2). The laminate cell (1) further comprises a frame member (10) which surrounds and holds the electric power generating element (2) and has a first portion (10f) with a thickness larger than that of the electric power generating element (2).

Abstract: An apparatus for interfacing with a control system, and in particular a home automation system. In one embodiment, the apparatus comprises an integrated LCD touch screen and motion sensor. The motion sensor is used to illuminate a backlight to the touch screen when a person approaches the apparatus. The sensitivity of the motion sensor may be adjusted through a graphical user interface displayed on the touch screen. In addition, the backlighting may be adjusted so that the illumination is at a specific level with the screen is on, i.e., when the motion sensor has been tripped, and a specific level when the screen is off. The apparatus may further comprise an IR receiver for receiving commands via a remote. In addition, the apparatus may be powered from a local bus or an external power supply. The apparatus may comprise a communications port for receiving customized pages from a computer.

Abstract: An enclosure forms a plurality of tiers vertically stacked in a longitudinal dimension. Each tier is a 1U modular computer system having a computer chassis configured for mounting in the multi-tiered support, and computer components that need cooling within the computer chassis. A cooling system is formed by a plenum pressurized by a blower. The plenum defines a plurality of configurable orifices in the chassis, each directing pressurized air toward a component. The plenum includes adjustable valves to controllably limit airflow through the orifices, and a controller to control the air pressure within the plenum and the orifice flow rates through the valves.

Abstract: A cooling system for cooling a plurality of electronic components comprises a centralized source comprising at least one micro cooler configured to deliver a flow of a cooling medium and a plurality of baffles configured to redistribute the cooling medium over the electronic components. The electronic components are situated in an enclosure.

Abstract: A cooling device for electronic components has a main body, a motor, an adaptor tube, a shaft, a valve assembly, a reservoir, and a delivery tube. The motor is mounted in the main body. The adaptor tube is mounted between the main body and the reservoir and is gradually smaller in diameter from the main body to the reservoir. The shaft connects to the motor, extends into the adaptor tube and has multiple fan blades corresponding to the inside diameter of the adaptor tube. The fan blades blow the air through the adaptor tube into the reservoir to pressurize the air. The pressurized air flows through the delivery tube to contact the electronic component and equalizes to correspond to the atmosphere. The equalizing process of the pressurized air absorbs heat from the electronic component as it expands to cool the electronic component.

Abstract: An airflow direction controlling apparatus includes a frame arranged near an outlet of a fan, at least one blade pivotably mounted to the frame and driven by a motor, at least two thermal sensors for detecting temperatures of at least two electronic components in a computer, and a control module electronically connected to the at least two sensors and the motor. The control module receives the detected temperatures from the sensors, determines if an electronic component is in danger of overheating, and controls the motor to rotate the at least one blade to a desired position where airflow of the fan blows toward the electronic component in danger of overheating, to quickly dissipate the heat generated by the electronic component.

Abstract: A liquid cooling unit includes components such as first and second heat receivers, a heat exchanger, a tank and a pump in an electronic apparatus. The electronic apparatus includes a first enclosure and a second enclosure coupled to the second enclosure for relative movement. The liquid cooling unit is enclosed in the first enclosure. No component of the liquid cooling unit is enclosed in the second enclosure. The liquid cooling unit is thus incorporated in the first enclosure in a facilitated manner. This results in a reduced production cost. The liquid cooling unit can also be removed from the first enclosure in a facilitated manner.