Abstract: An electronically controlled electric fan (10) cooled by pressurized ambient air, includes: a motor (11) furnished with a cover (12), a mechanical assembly rotating a wheel (15) and a casing (13), the motor housing at least its electronic control circuit (14) and includes at least one inlet orifice (I) and one outlet orifice (S) for the pressurized ambient air, a fan wheel (15) and a mechanical assembly rotating this wheel, a motor support (16), the ambient air being suitable for passing through the motor, and its mechanical assembly and the support, the electric fan including: a confinement element (20) placed inside the motor so as to confine the pressurized ambient air between: a heat sink (18) integral with the electronic control circuit (14), and a portion of the motor including no sensitive electronic components.

Abstract: An electronic device includes a targeted area within the electronic device. The targeted area includes a first side and a second side that is different from the first side. A first fan lies along the first side. Also, a second fan lies along the second side. The first fan and the second fan are both inlet fans or are both outlet fans. A method of using an electronic device is provided and includes directing a first fluid flow from the first fan along the targeted area. The method includes directing a second fluid flow from the second fan along the targeted area. The direction of the second fluid flow is different than the direction of the first fluid flow. Also, a turbulent fluid flow is created at least partially based on the first fluid flow, the second fluid flow, or a combination thereof.

Abstract: A nozzle useful for enhancing localized cooling of electronic elements and the like is provided. The nozzle is mountable on a substantially planar face of a substrate. It is conformed to intercept a fluid flowing across said face and redirect it toward the substrate. The nozzle comprises a hood, an output window, and between them, a transition region. The transition region is conformed to turn the flowing fluid toward the substrate and to contract the fluid flow.

Abstract: A data center includes an electronic equipment rack having a front face and a back face and a cooling unit positioned adjacent to the rack, the cooling unit having a front face and a back face, the cooling unit being configured to exhaust cooled air from the front face of the cooling unit to cool the rack. The cooling unit is configured to release the cooled air along a substantial portion of a height of the front face of the rack.

Abstract: An internal air duct for an electronic equipment enclosure comprises a collector that is adapted to receive cool air and at least one riser that has an interior in fluid communication with an interior of the collector. The riser is adapted to be mounted within an electronic equipment enclosure and has a port for routing the cool air received from the collector to an interior of the enclosure.

Abstract: In one embodiment, the cooling system includes both a primary cooling system configured to move a first cooling fluid across a major surface of the circuit boards and a secondary cooling system configured to move a second cooling fluid across at least one primary or targeted component mounted on one of the circuit boards. The secondary cooling system provides enhanced forced convective cooling of the primary component and provides a degree of redundancy for the targeted components. Also disclosed are methods of cooling electronic devices using such cooling systems.

Abstract: An environmental control unit for a personal computer tower case includes an enclosure configured to substantially enclose the tower case and an air conditioning unit configured to draw air from a first region of the enclosure, cool the air to within a selected range of temperatures, and output the air into a second region of the enclosure. The enclosure includes a gasket disposed between an outer wall of the tower case and an inner surface of the enclosure, for preventing circulation of air within the enclosure and around an exterior of the case. The enclosure may also include a port for access to a front side of the personal computer case, and an aperture in a back wall of the enclosure for passage of cables. The aperture is configured to permit passage of the cables while limiting passage of air.

Abstract: The invention relates to a computer rack, frame or system having a direct current power supply positioned at the upper portion of the rack. In one variation, the DC power supply is placed in the highest shelf in the computer rack. In another variation, the DC power supply is placed on top of the computer rack. In yet another variation, a dual column computer rack with a back-to-back configuration is implemented with DC power supplies placed in a top shelf of the one of the computer columns. The DC power supply may comprise of one or more direct current power supply modules configured to provide fail over protection. In another aspect of the invention, the power supply modules are placed in a separate rack and provide direct current to support computers in one or more computer racks.

Abstract: A modular data center, for housing and cooling electronic equipment, includes multiple housings, a first portion of the housings configured to hold heat-producing electronic equipment and a second portion of the housings configured to hold at least one cooling unit, each of the housings of the first portion having a front and a back and configured to hold the heat-producing electronic equipment such that gas is drawn into the equipment from fronts of the equipment, heated by the equipment to become heated gas, and expelled by the electronic equipment is expelled through the backs of the housings, where the housings are disposed and coupled to form a laterally-enclosed arrangement laterally enclosing a hot region and defining a top opening allowing gas to vertically exit the hot region, and where backs of the housings of the first portion are disposed adjacent to the hot region such that the heat-producing equipment, when mounted to the housings, will expel the heated gas into the hot region.

Abstract: A commutate silencer of a computer system is described. The commutate silencer of the computer system is installed at the back end of the computer system, and comprises a shield device, a commutate device and at least one partition. The shield device comprises a first shield and a second shield, in which the first shield comprises an opening, the first shield and the second shield construct a first cavity, and the first cavity includes a plurality of outlets. The commutate device comprises a frame and a plurality of commutate diversion plates, in which the frame construct a second cavity, the diversion plates traverse the second cavity, the second cavity has an inlet and a ventilated opening, and the ventilated opening is connected to the opening of the first shield.

Abstract: A mother board includes a CPU, a suction fan mounted on the CPU for dissipating heat resulting from operation of the CPU, a north bridge chip disposed downstream to the suction fan, a power-consumption component disposed at one side of the CPU, and a ventilation-enhancing member disposed above the chip and capable of diverting an air flow of the suction fan toward the power-consumption component.

Abstract: An enclosure is provided for housing electronic equipment that accommodates the different cooling and ventilating requirements of different types of equipment. The enclosure is constructed and arranged to support cooling airflow in a front-to-back configuration through the enclosure and in a side-to-side configuration from one side to an opposite side of the enclosure. The enclosure can thereby provide within a single enclosure means cooling air for components using front-to-back airflow for cooling, such as information technology (IT) equipment, and for components using side-to-side airflow, such as certain types of telecommunications equipment. The enclosure can thereby support a mix of IT and telecommunications equipment, providing flexibility and adaptability in network room and data center configuration. The enclosure is further configured to separate intake air used by equipment for cooling from exhaust air vented by equipment into its interior during operation.

Abstract: A modular data center, for housing and cooling electronic equipment, includes multiple housings, a first portion of the housings configured to hold heat-producing electronic equipment and a second portion of the housings configured to hold at least one cooling unit, each of the housings of the first portion having a front and a back and configured to hold the heat-producing electronic equipment such that gas is drawn into the equipment from fronts of the equipment, heated by the equipment to become heated gas, and expelled by the electronic equipment is expelled through the backs of the housings, and at least one panel coupled to a pair of the housings to bridge a gap between the pair of the housings, where the housings and the at least one panel are disposed and coupled to form a laterally-enclosed arrangement laterally enclosing a hot region and defining a top opening allowing gas to vertically exit the hot region, and where backs of the housings of the first portion are disposed adjacent to the hot region

Abstract: An enclosure is provided for housing electronic equipment that accommodates the different cooling and ventilating requirements of different types of equipment. The enclosure is constructed and arranged to support cooling airflow in a front-to-back configuration through the enclosure and in a side-to-side configuration from one side to an opposite side of the enclosure. The enclosure can thereby provide within a single enclosure means cooling air for components using front-to-back airflow for cooling, such as information technology (IT) equipment, and for components using side-to-side airflow, such as certain types of telecommunications equipment. The enclosure can thereby support a mix of IT and telecommunications equipment, providing flexibility and adaptability in network room and data center configuration. The enclosure is further configured to separate intake air used by equipment for cooling from exhaust air vented by equipment into its interior during operation.

Abstract: An electronic device has at least one component that is capable of generating a quantity of heat. The electronic device further has an air-moving device and an air duct. The air moving device is capable of creating a flow of air that removes a portion of the quantity of heat. The flow of air enters the air duct. The air duct has a restriction chamber that includes a venturi vent in which the flow of air into the duct and through the restriction chamber creates a new flow of air into the venturi vent. The new flow of air into the venturi vent does not pass over the at least one component in the electronic device.

Abstract: An embodiment of a modular electronic enclosure is provided as including a chassis having a first portion defining a first compartment, and a second portion defining a second compartment. First and second replaceable units are replaceably received within the first and second compartments, respectively. The modular electronic enclosure also has a fan unit that is replaceably received within a compartment defined by the first portion or the second portion. The fan unit is configured to pull in cooling air through the first portion and exhaust pressurized cooling air through the second portion. A method of cooling a modular electronic enclosure defining first and second compartments is also provided.

Abstract: A modular data center includes a plurality of racks, each of the racks having a front face and a back face, wherein the plurality of racks is arranged in a first row and a second row, such that the back faces of racks of the first row are facing the second row, and the back faces of the racks of the second row are facing the first row, a first end panel coupled between a first rack of the first row and a first rack of the second row, the first end panel having a bottom edge and a tope edge, a second end panel coupled between a second rack of the first row and a second rack of the second row, the second end panel having a top edge and a bottom edge, and a roof panel coupled between the top edge of the first panel and the top edge of the second panel.

Abstract: An airflow blocker component of an apparatus in one example is coupled with a support component. The airflow blocker component comprises a flexible flap portion that is bendable away from the support component into a position that directs one or more airflow portions to promote an increased cooling of one or more thermal components.

Abstract: A sealed electronic equipment enclosure with a dedicated cooling system is fitted with movable louvers in the enclosure walls. During normal operation, air pressure developed by the dedicated cooling system keeps the louvers closed and maintains the enclosure sealed to the computer room environment. If the dedicated cooling system fails, the internal air pressure developed by the cooling system is reduced and air movers in the electronic equipment force the louvers open, thereby allowing the air movers to draw cooled air from the computer room into the enclosure. This cooled air prevents the equipment from overheating at least for a time period long enough to allow the dedicated cooling system to be replaced or repaired.

Abstract: A system for cooling at least two electronic components comprises a plurality of graphitic foam products which are each thermally coupled to a corresponding component, a plurality of housings which are each mounted over a corresponding foam product and which each comprise an inlet and an outlet, a source of cooling fluid, and a conduit which is connected between the fluid source and each inlet. In operation, fluid is communicated from the fluid source to each housing through the conduit to thereby cool the components.

Abstract: A cooling solution is provided for a modular data center. The modular data center includes a plurality of racks, each of the racks having a front face and a back face, wherein the plurality of racks is arranged in a first row and a second row, such that the back faces of racks of the first row are facing the second row, and the back faces of the racks of the second row are facing the first row, a first end panel coupled between a first rack of the first row and a first rack of the second row, the first end panel having a bottom edge and a tope edge, a second end panel coupled between a second rack of the first row and a second rack of the second row, the second end panel having a top edge and a bottom edge, and a roof panel coupled between the top edge of the first panel and the top edge of the second panel. Cooling equipment within at least one of the equipment racks draws hot air from between the rows of racks and delivers cooled air out of the front face of one of the racks.

Abstract: A rack-mount server system of a liquid cooling system, in which a heat-generating component such as a CPU is cooled by a coolant has a plurality of server modules with heat-generating components which are cooled by the circulating coolant. The server modules are connected in parallel to a circulation coolant path through which the coolant to cool the server modules is circulated. In the middle of the coolant circulation path is a cooling unit that cools the coolant by radiating its heat to the outside air. Furthermore, a bypass route parallel to the server modules and going around the server modules is provided in the coolant circulation path, and the circulation quantity of the coolant is controlled in the bypass route. Alternatively, the flow quantity of the coolant is controlled in each of the server modules.

Abstract: A cooling system that can be used, for example, for cooling electrical circuit boards housed in an equipment cabinet. The cooling system includes a flow-rate-amplifying pump configured to introduce ambient air into the cabinet. The flow-rate-amplifying pump is a passive device, which has a primary intake and a secondary intake and is designed to produce a large flow of relatively cool ambient air into the cabinet through the primary intake using a small volume of compressed air applied to the secondary intake. In one embodiment, the cooling system has an auxiliary pump driven by a windmill device. Rotation of a propeller in the windmill device is converted into piston oscillation in the auxiliary pump, which oscillation is used to compress air and apply it to the secondary intake of the flow-rate-amplifying pump. A cooling system of the invention can provide efficient cooling while being self-sustaining and generating less noise and/or electrical interference than prior art cooling systems.

Abstract: A semiconductor device wafer-on-support wafer package comprising a plurality of segmentable chip-scale packages and method of constructing, burning-in, and testing same are disclosed. The wafer-on-wafer package can be burned-in and tested at the wafer level prior to segmenting, or singulating, the wafer-on-wafer package into a plurality of individual chip-scale packages. The device wafer includes a plurality of unsingulated semiconductor dice having a plurality of die bond pads being respectively bonded to a plurality of electrically conductive die bond pad connect elements provided on a first surface of the support wafer.

Abstract: A spring element used in a temporary package for testing semiconductors is provided. The spring element is compressed so as to press the semiconductor, either in the form of a bare semiconductor die or as part of a package, against an interconnect structure. The spring element is configured so that it provides sufficient pressure to keep the contacts on the semiconductor in electrical contact with the interconnect structure. Material is added and/or removed from the spring element so that it has the desired modulus of elasticity. The shape of the spring element may also be varied to change the modulus of elasticity, the spring constant, and the force transfer capabilities of the spring element. The spring element also includes conductive material to increase the thermal and electrical conductivity of the spring element.

Abstract: An automated storage library including: an enclosure having a cartridge storage area in an interior of the enclosure; a plurality of media cartridges disposed in the cartridge storage area; and a cooling unit operatively connected to the enclosure for cooling at least the cartridge storage area of the enclosure. Preferably, the enclosure has an exterior wall and the cooling unit is at least partially disposed in the exterior wall. More preferably, the cooling unit is a thermoelectric cooler having a hot side disposed on an exterior of the enclosure and a cold side disposed in the interior of the enclosure.

Abstract: An air flow management system for an Internet Data Center with rows of cabinets, the rows being located on an elevated floor and disposed in pairs wherein the front sides of the two rows face each other. Fresh air is supplied through the elevated floor in order to cool the heat generating elements, and collected after passing through the heat generating elements. The tops of the two front sides of the two rows in each pair of rows are joined by a cover so that the front sides and the cover constitute a tunnel. The volume of fresh air supplied through the elevated floor is controlled by openings whereby the static pressure in each tunnel can be controlled depending upon the heat generated.

Abstract: A heat dissipater structure has a heat sink base with peripheral sides thereof folded upwards from the bottom plate and cut into a plurality of lateral plates at proper angles to form wind channels for current conduction and to define a receiving slot at the center for holding a fan. A convex block is disposed on two opposite lateral plates for easily hooking and assembling a cover body so as to allow the air current inducted by the fan to rapidly dissipate the heat absorbed by the bottom plate outwardly through the wind channels formed by the interference of the lateral plates.

Abstract: A semiconductor clamped-stack assembly (32) has at least two clamped stacks, each of these clamped stacks having a plurality of power semiconductor components (8) and a plurality of heat sinks (6), which are arranged in series along a horizontally extending axial direction (A). According to the invention, power semiconductor components (8) from different clamped stacks are assigned to one another and are located in a common mounting plane, which is perpendicular to the axial directions (A) of the clamped stacks (31). Mutually associated power semiconductor components (8) can be removed from the clamped-stack assembly or, respectively, inserted into the clamped-stack assembly in a common mounting direction, which lies in the mounting plane. Mutually associated power semiconductor components (8) are preferably mounted on a common plate (14). As a result, they can be dismantled when the clamped-stack assembly (32) is loosened, without further power semiconductor components or heat sinks having to be dismantled.

Abstract: An electronic device has at least one component that is capable of generating a quantity of heat. The electronic device further has an air-moving device and an air duct. The air moving device is capable of creating a flow of air that removes a portion of the quantity of heat. The flow of air enters the air duct. The air duct has a restriction chamber that includes a venturi vent in which the flow of air into the duct and through the restriction chamber creates a new flow of air into the venturi vent. The new flow of air into the venturi vent does not pass over the at least one component in the electronic device.

Abstract: An electronic device has at least one component that is capable of generating a quantity of heat. The electronic device further has an air-moving device and an air duct. The air moving device is capable of creating a flow of air that removes a portion of the quantity of heat. The flow of air enters the air duct. The air duct has a restriction chamber that includes a venturi vent in which the flow of air into the duct and through the restriction chamber creates a new flow of air into the venturi vent. The new flow of air into the venturi vent does not pass over the at least one component in the electronic device.

Abstract: An improved structure computer heat dissipater, the heat sink base of which has four lateral walls of appropriate length with a plurality of draft guide ducts cut inward through them. The cut surfaces thereof are utilized as flow direction separators set to a particular angular arrangement to create a predetermined air flow path. Disposed on the bottom plate are thermal dissipation protuberances that collect the concentrated thermal energy developed by the heat generating electronic component in a computer. The air stream drawn in by the fan conveys the heat absorbed by the thermal dissipation protuberances along the air path formed by the flow direction separators and rapidly discharges it through the draft guide ducts.

Abstract: A packaged semiconductor device having high reliability that allows for a large number of pins and that provides good heat removal properties, and that can discharge the high pressure moisture in a gas state from the inside thereof to the exterior. The device includes a strengthening ring arranged around a semiconductor chip that includes a process type electrode and that is mounted on an isolated substrate; a resin to fill spaces between the semiconductor chip and the isolated substrate; and a cap on the semiconductor chip and the strengthening ring, wherein at least one vent is formed perpendicular to the direction of the thickness of the semiconductor chip.

Abstract: A portable computer docking base has incorporated therein a thermoelectric cooling system used to provide auxiliary operating heat dissipation for a portable notebook computer operatively docked to the base. The cooling system includes a thermoelectric (Peltier effect) heat pump unit disposed within the docking base housing and having opposite hot and cold sides. A finned heat sink member is secured to the hot side of the assembly and positioned in the path of fan-generated cooling air, and a heat slug member is secured to the cold side of the assembly and projects outwardly through an exterior wall of the docking base housing into its computer receiving area. When the computer is placed in the receiving area and docked, the cooling system heat slug member is brought into heat conductive contact with a similar heat slug member carried within the computer and thermally coupled to its microprocessor.

Abstract: An apparatus and method for cooling heat generating components within a compartment are disclosed. A cooling assembly isolates heat produced by a processor in a personal computer (“PC”) system and exhausts it from the PC prior to adversely affecting other components within the PC. A fan causes air to blow across the processor having an attached heat sink disposed within the cooling assembly, and the air exits the cooling assembly without adversely affecting the other components surrounding the processor. In one example, an alternative passage is provided for the air.

Abstract: A system for cooling an electronic device comprising a heat sink including a channel having an inlet and an outlet, with the channel coupled to an airflow generation system that generates airflow between the inlet and outlet. Heat is removed from an electronic device by decreasing the cross-sectional area of the channel to provide a throttle at a location adjacent to where the channel traverses the electronic device. A plurality of throttles may be formed in the channel, each for cooling a separate electronic device. An airflow control valve is operably connected to the heat sink for controlling the amount of airflow through the heat sink. A device controller connected to the airflow control valve and the air generation system adjusts the airflow control valve according to temperature measurements collected from the electronic device and controls the operation of the air generation system.

Abstract: A computer for a server or work station which has two air cooling streams one stream leads from outside the chassis across the motherboard and through a vented power supply then directly into the environment and is driven by a fan inside the power supply. This air stream independently and directly removes the major source of heat which is the power supply. The second air stream circulates from outside the chassis through the hard drives and out of openings adjacent the hard drives and is driven by fans positioned between the hard drives and vented openings in the chassis. The efficient heat removal is compatible with an arrangement of components in the chassis such that the overall height is less than 3½. The reduced height and efficient heat removal make the computer ideally suited for mounting in a server chassis with other servers where close spacing is desired.

Abstract: A computer microprocessor has a housing portion with a recess formed in a top side wall thereof, and a die portion inset within the recess. Operating heat from the die is removed by heat dissipation apparatus which automatically adapts to variations in the microprocessor bond line thickness and includes a sheet metal EMI shield wall overlying the microprocessor and having a condensing end portion of a thermosyphoning heat pipe secured to its bottom side, with an evaporating end portion of the heat pipe overlying the die recess and being resiliently deflectable toward a phase change thermal pad mounted on the top side of the die and inset into the housing die recess. A laterally Enlarged heat sink section is integrally formed on the evaporating end portion and has a flat bottom side and an arcuate top side.

Abstract: A system for stabilizing, moderating and/or controlling the temperature of an outdoor enclosure, such as a network interface device, using room-temperature air from the associated building. A fan draws the room temperature (or moderate-temperature) air through a conduit from the interior of the dwelling to the outdoor enclosure. The outdoor enclosure is temperature-stabilized as indoor air flows through it. The air may flow through the same conduit that accommodates the data lines. A power line for the fan may be located in the same conduit. The system may be arranged to prevent insects and contaminants from entering the enclosure.

Abstract: A method (and structure) for cooling a portable computer includes attaching a portable computer to a holder, transferring heat of a heat-generating component disposed within the portable computer to the holder, and releasing the transferred heat to the atmosphere. The portable computer includes a fixture for detachably fixing the portable computer to the holder, a heat release device for releasing heat of a heat-generating component disposed within the portable computer to the outside, and a supporter which supports the fixture and the heat release device.

Abstract: A method and apparatus for measuring and controlling the temperature of a semiconductor device is described. The temperature of a semiconductor device is controlled by measuring the temperature at the semiconductor device and adjusting the temperature by supplying a coolant to the semiconductor device over a coolant line. The amount of coolant which flows to the semiconductor device is controlled by a solenoid switch connected to a valve in the coolant line. A system for measuring and controlling the temperatures of multiple semiconductor devices is also described.

Abstract: A portable computer includes a base having a heat producing electronic component mounted therein. A heat sink, also referred to as a remote heat exchanger, is positioned in the base adjacent to the heat producing component. A heat pipe has a first end permanently bonded to the heat sink and extends to a second end thermally engaged with the heat producing component. The heat sink and heat pipe assembly is rotatable about an axis of the heat sink so as to move the second end of the heat pipe into and out of thermal engagement with the heat producing component.

Abstract: The present invention relates to an improved system and method for cooling electronic devices. The present system is particularly adapted for cooling computer equipment. The system comprises a sealed enclosure which houses one or more heat generating electronic devices; a blower; and a heat exchanger. The sealed enclosure may be pressurized with a gas medium such as dry nitrogen up to a pressure of approximately two atmospheres. The elevated pressure increases the gas density, effectively increasing the mass flow rate and heat carrying capacity of the gas. The blower is also a constant volume device such that it can move the same volume of gas regardless of density. Accordingly, for a given heat load, the size of the blower may be reduced. Or, alternatively, a given blower can cool a device having a higher heat load. Finally, by pressurizing the enclosure, the present invention eliminates the need to size a forced air cooling system based on high elevation requirements.

Abstract: An air circulation control apparatus and method for a system such as a Base Transmission (or Transceiver) System (BTS) provides a control of an ambient air flow between inside and outside of the system. The apparatus includes at least one controller, such as a fan, and a member along an air flow path of the system. The member may be moveably mounted on the inside wall of the system. The controller operates in a forcing mode or a drawing mode to open or close the member so as to allow or not allow the air flow between inside and outside of the system.

Abstract: In a modern computer, heat is removed from the internal power supply unit by means of a fan and ducting for channeling the airflow created by the fan through the circuitry of the power supply unit. The fan draws part of its air supply from the ambient air inside the computer casing and this helps to cool other components of the computer such as the microprocessor. As the power of microprocessors increases, the cooling requirement for this component has increased and heat sinks have been utilised to increase heat transfer to the surrounding air. Whilst further augmentation of heat removal could be achieved by increasing the power of the cooling fan, this would also increase noise levels. The present arrangement provides for increased heat removal without increasing fan power by arranging for the microprocessor heat sink to project into the ducting used to channel cooling air over the circuitry of the power supply unit.

Abstract: There is disclosed herein an electronic control module assembly 30 for use in an internal combustion engine, wherein the engine includes an intake manifold 10 with N air inlet port(s) 14 and a throttle body 20 with N air outlet port(s) 24 where N=(1 or 2). One embodiment of the assembly 30 comprises: (a) a housing 32 having opposed upper and lower mounting surfaces 34/36 and an outer surface 38 about the housing, and N bore(s) 42 through the housing, wherein each bore has an upstream port 44 defined in the upper mounting surface 34 and a downstream port 54 defined in the lower mounting surface 36; (b) an electronic control module 60 for controlling one or more sub-systems of the engine; and (c) means 70 for attaching the electronic control module 60 to the outer surface 38 of the housing 32.

Abstract: This invention relates to a cooling apparatus for at least one electronic component. The cooling apparatus includes a first member which has an inner surface and an outer surface. The outer surface of the first member is adapted for mounting the electronic component thereon at a preselected location. The cooling apparatus also includes a venturi member which is fixedly secured to the inner surface of the first member. The venturi member is positioned to direct a cooling fluid to flow in thermal communication with the inner surface of the first member. The venturi member is also positioned to control a flow velocity of the cooling fluid flowing in thermal communication with a preselected portion of the inner surface of the first member. The preselected portion of the inner surface of the first member is opposite to the preselected location of the outer surface of the first member.

Abstract: A repeater case for high-density subscriber lines includes a repeater base and repeater case housing formed of a fiberglass composite and together forming a sealed enclosure for a pressurized atmosphere. The repeater case housing has a removable cover secured in position by torque bolts, a sealing gasket to sealingly receive the cover, a plurality of high-density subscriber line module slots and a plurality of printed circuit boards mounted to certain of the slots with gaps between adjacent printed circuit boards, the printed circuit boards being adapted to receive respective high-density subscriber line modules. The repeater base has a cable inlet, and each of the plurality of printed circuit boards is provided with a connection to the cable inlet and a connector to electrically receive one of the high-density subscriber line modules. The repeater base also includes an electrically insulating barrier between the cable inlet and the printed circuit boards.

Abstract: A cooling system for cooling computer components generating thermal energy. The cooling system includes a high efficiency heat exchanger attached to the heat producing component and an evaporator. The heat exchanger comprises a hollow body formed of a thermally conductive material having a coolant inlet and a coolant outlet. A periodically lanced metal fin is located within the hollow body and is oriented between the inlet and outlet to provide maximum contact of the coolant along the surface area of the metal fin. An evaporator is attached to the inlet of the heat exchanger to pre-cool the air flow delivered to the heat exchanger and thus the heat generating component.

Abstract: A tamper-resistant climate-controlled enclosure is provided for the outdoor housing of electronic equipment. The box-like structure provides a sealed environment for electronic equipment. The enclosure includes an intrusion alarm, a high temperature alarm and a low temperature alarm. A heater and an air conditioner are provided to maintain the temperature inside the enclosure between 60.degree. F. and 75.degree. F. to ensure that the electronic equipment housed therein works properly. The enclosure is especially useful for housing microcells used to transmit cellular telephone calls.